small signal product - meet iec61000-4-2 (esd) 15kv (air), 8kv (contact) - meet iec61000-4-4 (eft) rating. 40a (5/50ns) - meet iec61000-4-5 (lightning) rating. 5a (8/20 s) - protects two directional i/o lines - working voltage: 5v - pb free version and rohs compliant - packing code with suffix "g" means green compound (halogen-free) - case: msop-10 small outline plastic package - weight: 12 0.5 mg - marking code: r0544 symbol unit p pp w i pp a t j , t stg o c symbol unit v rwm v v (br) v i r a c j pf document number: ds_s1501024 version: b15 v i pp = 5 a -20 junction capacitance v r = 0 v , f = 1.0 mhz 1 reverse leakage current v r = 5 v -1 clamping voltage i pp = 1 a v c -15 reverse stand-off voltage - 5 reverse breakdown voltage i r = 1 ma 6- kv esd per iec 61000-4-2 (contact) 8 junction and storage temperature range -55 to +150 parameter min max peak pulse power (tp=8/20 s waveform) 125 peak pulse current (tp=8/20 s) 5 esd per iec 61000-4-2 (air) v esd 15 - terminal: matte tin plat ed, lead free., solderable per mil-std-202, method 208 guaranteed - high temperature soldering guaranteed : 260c/10s maximum ratings and electrical characteristics (t a =25c unless otherwise noted) parameter value TESDO5V0A taiwan semiconductor ultra low capacitance esd protection array features msop-10 mechanical data
small signal product (t a =25c unless otherwise noted) document number: ds_s1501024 version: b15 tesdo5v0 a taiwan semiconductor ratings and characteristics curves 0.01 0.1 1 10 0.1 1 10 100 1000 peak pulse power ppp (kw) fig. 1 non-repetitive peak pulse power vs. pulse time pulse duration ( s) 0 10 20 30 40 50 60 70 80 90 100 110 0 5 10 15 20 25 30 percent of i pp time (us) fig. 2 pulse waveform td = ipp / 2 0 25 50 75 100 125 150 0 20 40 60 80 100 120 140 160 180 power rating (%) ambient temperature( o c) fig. 3 admissible power dissipation curve 0.0 0.2 0.4 0.6 0.8 1.0 012345 normalized capacitance (pf) reverse voltage (v) fig. 4 typical junction capacitance f = 1.0 mhz waveform parameters: tr = 8 s , td = 20 s e -1 0 4 8 12 16 20 012345 clamping voltage (v) peak pulse current (a) fig. 5 clamping voltage vs. peak pulse current waveform parameters: tr = 8 s , td = 20 s
package outline dimensions min max min max a 2.90 3.10 0.114 0.122 b 2.90 3.10 0.114 0.122 c 0.17 0.27 0.007 0.011 d e f - 1.11 - 0.044 suggest pad layout a b c d e f note: 1. the suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. document number: ds_s1501024 version: b15 1.60 0.063 4.90 ref 0.193 ref 2.50 0.098 5.70 0.224 4.10 0.161 0.30 0.012 0.50 0.020 dim. unit (mm) unit (inch) 0.50 ref 0.020 ref dim. unit (mm) unit (inch) typ. typ. tesdo5v0 a taiwan semiconductor small signal product order information (example) msop-10 TESDO5V0A rog green compound ? code packing ? code part ? no.
small signal product applications information designed for protection of high-speed interfaces such as hdmi ultra low capacitance between the pairs while being rated to handle >8kv, esd contact discharges and >15kv air discharge each device is in a leadless package that is less than 1.1mm wide designed such that the traces flow straight through the device. the narrow package and flow-through design reduces discontinui ties and minimizes impact on signal integrity TESDO5V0A is ultra low capacitance esd protction array designed to protect high speed data interfaces the combination of small size, low capacitance, and high level of esd protection makes them a flexible solution for applicatio ns of high speed interface, ex hdmi, displayporttm, mddi, and esata interfaces circuit board layout recommendations for hdmi application the pcb traces are used to connect the pin pairs for each line (pin 1 to pin 10, pin 2 to pin 9, pin 4 to pin 7, pin 5 to pin6 ) signal line enters at pin 1 and exits at pin 10 and pcb trace connects pin 1 and 10 together. ground is connected at pins 3 an d 8. one large ground pad should be used in lieu of two separate pads. document number: ds_s1501024 version: b15 tesdo5v0 a taiwan semiconductor
small signal product assumes no responsibility or liability for any errors or inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_s1501024 version: b15 tesdo5v0 a taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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