1 / 3 www.asb.co.kr november 2008 p lerow tm aln2313 r2 internally matched lna module the plerow tm aln - series is the compactly designed surface - mount module for the use of the lna with or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation term inals , catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementa tion to the application system environment. the surface - mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production leve l. parameter unit specifications min typ max frequency range mhz 2300 2326 gain db 19 20 gain flatness db ? 0.2 ? 0.3 noise figure db 1.1 1.15 output ip3 (1) dbm 36 38 s11 / s22 (2) db - 18 / - 10 output p1db dbm 20 2 1 switching time (3) ? sec - supply current ma 120 140 supply voltage v 5 impedance ? 50 max. rf input power dbm c.w 23 ~ 25 (before fail) package type & size mm surface mount type, 10wx10lx3.8h operating temperature is - 40 ? c to +85 ? c. 1) oip3 is measured wi th two tones at an output power of 7 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage from 0 v to v s . pin number function 2 rf in 4 +vcc 6 rf out other s ground ou t line drawing (unit: mm) feature s s 21 = 20.2 db @ 2300 mhz = 19.8 db @ 2326 mhz nf of 1.1 db ove r frequency unconditionally stable single 5v supply high oip3 @ low current n ote: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the left side. description (recommended footprint) aln2313r2 asb inc. (top view) (bottom view) ? 0.4 plated thru holes to ground plane plerow (side view) solder stencil area c o u pl er website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion c o u pl er c o u pl er c o u pl er c o u pl er 2 - stage single type specifications (in pr o duction) typ. @ t = 25 ? c, v s = 5 v, freq. = 2313 mhz, z o.sys = 50 ohm
2 / 3 www.asb.co.kr november 2008 p lerow tm aln2313 r2 internally matched lna module s - param e ters noise figure oip3 p1db 2300~2326 mhz +5 v typical performance (measured) application circuit s - parameters & k fa c tor
3 / 3 www.asb.co.kr november 2008 p lerow tm aln2313 r2 internally matched lna module 1) the tantal capacitor is optional and for bypassing the ac noi se introduced from the dc supply. the capacitance value may be dete r mined by customer s dc supply status. 2) so - called dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and blocking the d c component in the signal. the dc blocking capacitors are included inside the lna module. therefore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the appli cation fr e quency. recommended soldering reflow process evaluation board layout + - aln out in c1 c2 tantal c a pacitor v dc 20~40 sec 260 ? c 200 ? c 150 ? c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) size 25 x 25mm in out (for aln - r series C 10x10mm) +vcc
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