features very low pro le very fast tripping time high voltage rohs compliant* and halogen free** symmetrical 2018 footprint agency recognition: applications power over ethernet (ieee 802.3 af) port protection automotive electronic control module protection telecom equipment low voltage protection mf-smdf series - ptc resettable fuses *rohs directive 2002/95/ec jan 27 2003 including annex. **to be considered halogen free, each homogenous material can have a maximum concentration of 900 ppm of either bromine or chlo rine. speci cations are subject to change without notice. customers should verify actual device performance in their speci c applications. environmental characteristics operating temperature ......................................... -40 c to +85 c maximum device surface temperature in tripped state ................................................. 125 c passive aging ....................................................... +85 c, 1000 hours ............................................... 5 % typical resistance change humidity aging ..................................................... +85 c, 85 % r.h. 1000 hours ............................. 5 % typical resistance change thermal shock ..................................................... +85 c to -40 c, 20 times ................................. .. 10 % typical resistance change solvent resistance ............................................... mil-std-202, method 215 ................................... no change vibration ............................................................... mil-std-883c, method 2007.1, ......................... . no change .............................................................................. condition a electrical characteristics model v max. volts i max. amps i hold i trip resistance max. time to tr i p tripped power dissipation amperes at 23 c ohms at 23 c amperes at 23 c seconds at 23 c watts at 23 c hold trip r min. r 1max. typ. mf-smdf050 60 10 0.55 1.20 0.200 1.0 2.5 3.0 0.9 MF-SMDF150*** 15 40 1.5 3.00 0.05 0.17 8.0 0.8 1.1 mf-smdf200**** 10 40 2.0 4.00 0.03 0.100 8.0 2.40 1.1 *rohs compliant test procedures and requirements for model mf-smdf series test test conditions accept/reject criteria visual/mech. ......................................................... verify dimensions and materials ......................... .. per mf physical description resistance ............................................................ in still air @ 23 c ................................... ............... rmin r r1max time to trip ........................................................... at speci? ed current, vmax, 23 c ........................ t max. time to trip (seconds) hold current ......................................................... 30 min. at ihold ........................................ ............. no trip trip cycle life ....................................................... vmax, imax, 100 cycles ................................. ....... no arcing or burning trip endurance ..................................................... vmax, 48 hours ............................................ ......... no arcing or burning solderability .......................................................... ansi/j-std-002 ........................................ ........... 95 % min. coverage ul file number .................................................... e174545 http://www.ul.com/ follow link to certi? cations, then ul file no., enter e174545 csa file number .................................................. ca110338 http://directories.csa-international.org/ under ?certi? cation record? and ?file number? enter 110338-0-000 tv certi? cate number ....................................... r 02057213 http://www.tuvdotcom.com/ follow link to ?other certi? cates?, enter file no. 2057213 thermal derating chart - i hold /i trip (amps) model ambient operating temperature -40 c -20 c 0 c 23 c 40 c 50 c 60 c 70 c 85 c mf-smdf050 0.87 / 1.90 0.77 / 1.68 0.67 / 1.46 0.55 / 1.20 0.46 / 1.00 0.41 / 0.89 0.36 / 0.79 0.31 / 0.68 0.23 / 0.50 MF-SMDF150 2.38 / 4.76 2.10 / 4.20 1.82 / 3.64 1.50 / 3.00 1.27 / 2.54 1.13 / 2.26 0.99 / 1.98 0.85 / 1.70 0.64 / 1.28 mf-smdf200 2.95 / 5.90 2.65 / 5.30 2.35 / 4.70 2.00 / 4.00 1.74 / 3.48 1.59 / 3.18 1.44 / 2.88 1.29 / 2.58 1.06 / 2.12 *** ul approved, tv pending. ****agency approval pending.
speci cations are subject to change without notice. customers should verify actual device performance in their speci c applications. mf-smdf series - ptc resettable fuses product dimensions dimensions: mm (inches) model abcd min. max. min. max. min. max. min. mf-smdf050 4.72 (0.186) 5.44 (0.214) 4.22 (0.166) 4.93 (0.194) 0.79 (0.031) 1.09 (0.043) 0.30 (0.012) MF-SMDF150 4.72 (0.186) 5.44 (0.214) 4.22 (0.166) 4.93 (0.194) 0.55 (0.022) 0.85 (0.033) 0.30 (0.012) mf-smdf200 4.72 (0.186) 5.44 (0.214) 4.22 (0.166) 4.93 (0.194) 0.55 (0.022) 0.85 (0.033) 0.30 (0.012) packaging: 6000 pcs. per reel. terminal material: electroless ni under immersion au termination pad solderability: standard au nish: meets ansi/j-std-002 category 2. recommended storage: 40 ? max./70 % rh max. a b c top and bottom view side view d recommended pad layout 4.6 ?0.1 (.181 ?.004) 3.4 ?0.1 (.134 ?.004) 1.5 ?0.05 (.059 ?.002) 1.5 ?0.05 (.059 ?.002) typical time to trip at 23 ?c the time to trip curves represent typical performance of a device in a simulated application environment. actual perfor- mance in speci c customer applications may differ from these values due to the in uence of other variables. 0.01 0.1 1 0.001 0.1 1 10 100 10 100 fault current (amps) time to trip (seconds) mf-smdf050 mf-smdf200 MF-SMDF150
speci cations are subject to change without notice. customers should verify actual device performance in their speci c applications. mf-smdf series - ptc resettable fuses how to order mf - smdf 050 - 2 multifuse ? product designator series smdf = 2018 surface mount component hold current, ihold 050, 150, 200 (0.50 - 2.00 amps) packaging packaged per eia 481-1 -2 = tape and reel typical part marking represents total content. layout may vary. mf-smdf series, rev. r, 02/10 160?20 300 250 200 150 100 50 0 10?0 temperature ( c) 120 preheating soldering cooling time (seconds) solder re ow recommendations notes: mf-smdf models cannot be wave soldered. please contact bourns for hand soldering recommendations. if re? ow temperatures exceed the recommended pro? le, devices may not meet the performance requirements. compatible with pb and pb-free solder re? ow pro? les. excess solder may cause a short circuit, especially during hand soldering. please refer to the multifuse ? polymer ptc soldering recommendation guidelines . part identification: 50 = mf-smdf050 15 = MF-SMDF150 20 = mf-smdf200 year code: 5 = 2005 bi-weekly date code: weeks 49-50 = y 505y
mf-smdf series tape dimensions per eia 481-2 w p 0 p 1 p 2 a 0 b 0 b 1 max. d 0 f e 1 e 2 min. t max. t 1 max. k 0 leader min. trailer min. reel dimensions a max. n min. w 1 w 2 max. specifications are subject to change without notice. customers should verify actual device performance in their specific applications. mf-smdf series tape and reel specifications b 1 n(hub dia.) (measured at hub) a t cover tape k 0 t 1 a 0 w 2 (measured at hub) w 1 p 1 b 0 f d 0 p 2 p 0 e 2 e 1 w unit = mm (inches) 16.0 0.3 (0.630 0.012) 4.0 0.1 (0.157 0.004) 8.0 0.1 (0.315 0.004) 2.0 0.1 (0.079 0.004) 5.1 0.15 (0.201 0.006) 5.6 0.23 (0.220 0.009) 7.5 0.10 (0.295 0.004) 1.75 0.10 (0.069 0.004) 1.0 0.15 (0.039 0.015) 1.5 + 0.1/-0.0 (0.059 + 0.004/-0) 16.4 + 2.0/ -0.0 (0.646 + 0.079/-0.0) 12.1 (0.476) 14.25 (0.561) 0.6 (0.024) 0.1 (0.004) 390 (15.35) 160 (6.30) 331 (13.03) 50 (1.97) 22.4 (0.882)
|
