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this is information on a product in full production. march 2014 docid018958 rev 4 1/17 STGIPN3H60A sllimm?-nano (small low-loss intelligent molded module) ipm, 3 a - 600 v 3-phase igbt inverter bridge datasheet - production data features ? ipm 3 a, 600 v, 3-phase igbt inverter bridge including control ics for gate driving and freewheeling diodes ? optimized for low electromagnetic interference ? v ce(sat) negative temperature coefficient ? 3.3 v, 5 v, 15 v cmos/ttl input comparators with hysteresis an ? d pull-down resistor ? undervoltage lockout ? internal bootstrap diode ? interlocking function ? optimized pinout for easy board layout applications ? 3-phase inverters for motor drives ? dish washers, refrigerator compressors, heating systems, air-conditioning fans, draining and recirculation pumps description this intelligent power module implements a compact, high-performance ac motor drive in a simple, rugged design. it is composed of six igbts with freewheeling diodes and three half- bridge hvics for gate driving, providing low electromagnetic interference (emi) characteristics with optimized switching speed. the package is optimized for thermal performance and compactness in built-in motor applications, or other low power applications where assembly space is limited. sllimm? is a trademark of stmicroelectronics. ndip-26l table 1. device summary order code marking package packaging STGIPN3H60A gipn3h60a ndip-26l tube www.st.com
contents STGIPN3H60A 2/17 docid018958 rev 4 contents 1 internal schematic diagram and pin configuration . . . . . . . . . . . . . . . . 3 2 electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.1 control part . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4 application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4.1 recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
docid018958 rev 4 3/17 STGIPN3H60A internal schematic diagram and pin configuration 17 1 internal schematic diagram and pin configuration figure 1. internal schematic diagram gnd vcc hin lin vboot lvg out hvg gnd vcc hin lin vboot lvg out hvg gnd vcc hin lin vboot lvg out hvg lin u nc hin u vcc u nc lin v hin v vcc v nc nc nc lin w hin w vcc w nc gnd n w w, out w vboot w n v v, out v p vboot v n u u,out u vboot u pin 1 pin 16 pin 17 pin 26 am09917v1
internal schematic diagram and pin configuration STGIPN3H60A 4/17 docid018958 rev 4 table 2. pin description pin symbol description 1 gnd ground 2 nc not connected 3v cc w low voltage power supply w phase 4 hin w high side logic input for w phase 5 lin w low side logic input for w phase 6 nc not connected 7 nc not connected 8 nc not connected 9v cc v low voltage power supply v phase 10 hin v high side logic input for v phase 11 lin v low side logic input for v phase 12 nc not connected 13 v cc u low voltage power supply for u phase 14 hin u high side logic input for u phase 15 nc not connected 16 lin u low side logic input for u phase 17 v boot u bootstrap voltage for u phase 18 p positive dc input 19 u u phase output 20 n u negative dc input for u phase 21 v boot v bootstrap voltage for v phase 22 v v phase output 23 n v negative dc input for v phase 24 v boot w bootstrap voltage for w phase 25 w w phase output 26 n w negative dc input for w phase
docid018958 rev 4 5/17 STGIPN3H60A internal schematic diagram and pin configuration 17 figure 2. pin layout (top view) (*) dummy pin internally connec ted to p (positive dc input).
electrical ratings STGIPN3H60A 6/17 docid018958 rev 4 2 electrical ratings 2.1 absolute maximum ratings table 3. inverter part symbol parameter value unit v ces each igbt collector emitter voltage (v in (1) = 0) 1. applied between hin i , lin i and g nd for i = u, v, w. 600 v i c (2) 2. calculated according to the iterative formula: each igbt continuous collector current at t c = 25 c 3a i cp (3) 3. pulse width limited by max junction temperature. each igbt pulsed collector current 18 a p tot each igbt total dissipation at t c = 25 c 8 w table 4. control part symbol parameter min. max. unit v out output voltage applied between out u , out v , out w - gnd v boot -18 v boot + 0.3 v v cc low voltage power supply - 0.3 18 v v boot bootstrap voltage - 0.3 618 v v in logic input voltage applied between hin i , lin i and g nd for i = u, v, w - 0.3 v cc + 0.3 v v out/dt allowed output slew rate 50 v/ns table 5. total system symbol parameter value unit v iso isolation withstand voltage applied between each pin and heatsink plate (ac voltage, t = 60 sec.) 1000 v t j power chips operating junction temperature -40 to 150 c t c module case operating temperature -40 to 125 c i c t c () t jmax () t c ? r thj c ? v ce sat () max () t jmax () i c t c () , () ------------------------------------------------------------------------------------------------------- =
docid018958 rev 4 7/17 STGIPN3H60A electrical ratings 17 2.2 thermal data table 6. thermal data symbol parameter value unit r thja thermal resistance junction-ambient 50 c/w
electrical characteristics STGIPN3H60A 8/17 docid018958 rev 4 3 electrical characteristics t j = 25 c unless otherwise specified. note: t on and t off include the propagation delay time of the internal drive. t c(on) and t c(off) are the switching time of igbt itself under the internally given gate driving condition. figure 3. switching time test circuit table 7. inverter part symbol parameter test conditions min. typ. max. unit v ce(sat) collector-emitter saturation voltage v cc = v boot = 15 v, v in (1) = 0 - 5 v, i c = 1 a - 2.15 2.6 v v cc = v boot = 15 v, v in (1) = 0 - 5 v, i c = 1 a, t j = 125 c -1.65 i ces collector-cut off current (v in (1) = 0 ?logic state?) v ce = 550 v, v cc = v boot = 15 v - 250 a v f diode forward voltage v in (1) = 0 ?logic state?, i c = 1 a - 1.7 v inductive load switching time and energy t on turn-on time v dd = 300 v, v cc = v boot = 15 v, v in (1) = 0 - 5 v, i c = 1 a (see figure 4 ) -275 ns t c(on) crossover time (on) - 90 t off turn-off time - 890 t c(off) crossover time (off) - 125 t rr reverse recovery time - 50 e on turn-on switching losses - 18 j e off turn-off switching losses - 13 1. applied between hin i , lin i and g nd for i = u, v, w (lin inputs are active-low). vboot>vcc l ic vce vcc input 0 1 bus lin hin vcc lvg hvg out boot gnd
docid018958 rev 4 9/17 STGIPN3H60A electrical characteristics 17 figure 4. switching time definition 3.1 control part v ce i c i c v in t on t c(on) v in(on) 10% i c 90% i c 10% v ce (a) turn-on (b) turn-off t rr 100% i c 100% i c v in v ce t off t c(off) v in(off) 10% v ce 10% i c am09223v1 table 8. low voltage power supply (v cc = 15 v unless otherwise specified) symbol parameter test conditions min. typ. max. unit v ccthon undervoltage turn-on threshold 9.1 9.6 10.1 v v ccthoff undervoltage turn-off threshold 7.9 8.3 8.8 v v cchys undervoltage hystereses 0.9 v i qccu undervoltage quiescent supply current v cc < 7.9 v 250 330 a i qcc quiescent current v cc = 15 v 350 450 a
electrical characteristics STGIPN3H60A 10/17 docid018958 rev 4 table 9. bootstrapped voltage (v cc = 15 v unless otherwise specified) symbol parameter test conditions min. typ. max. unit v boot_thon undervoltage turn-on threshold 8.5 9.5 10.5 v v boot_thoff undervoltage turn-off threshold 7.2 8.3 9.2 v v boothys undervoltage hystereses 0.9 v i qboot quiescent current 250 a r ds(on) bootstrap driver on-resistance v cc > 12.5 v 125 table 10. logic inputs (v cc = 15 v unless otherwise specified) (1) 1. see figure 5: dead time and interlocking definition . symbol parameter test conditions min. typ. max. unit v il low level logic input voltage 1.1 v v ih high level logic input voltage 1.8 v i il low level logic input current v in (2) = 0 2. applied between hin i , lin i and g nd for i = u, v, w -1 a i ih high level logic input current v in (1) = 15 v 20 70 a dt dead time 320 ns figure 5. dead time and interlocking definition dt dt dt lin hin lvg hvg interlocking function am03794v1
docid018958 rev 4 11/17 STGIPN3H60A application information 17 4 application information figure 6. typical application circuit
application information STGIPN3H60A 12/17 docid018958 rev 4 4.1 recommendations ? input signals hin, lin are active-high logic. a 500 k (typ.) pull-down resistor is built-in for each high side input. if an external rc filter is used for noise immunity, attention should be given to the variation of the input signal level. ? to prevent input signal oscillation, the wiring of each input should be as short as possible. ? by integrating an application-specific type hvic inside the module, direct coupling to the mcu terminals without an opto-coupler is possible. ? each capacitor should be located as close as possible to the pins of the ipm. ? low inductance shunt resistors should be used for phase leg current sensing. ? electrolytic bus capacitors should be mounted as close to the module bus terminals as possible. additional high frequency ceramic capacitors mounted close to the module pins will further improve performance. note: for further details refer to an4043. table 11. recommended operating conditions symbol parameter test conditions min. typ. max. unit v pn supply voltage applied between p-nu, nv, nw 300 500 v v cc control supply voltage applied between v cc - gnd 12 15 17 v v bs high side bias voltage applied between v booti - out i for i = u, v, w 11.5 17 v t dead blanking time to prevent arm-short for each input signal 1.5 s f pwm pwm input signal -40c < t c < 100c -40c < t j < 125c 25 khz t c case operation temperature 100 c
docid018958 rev 4 13/17 STGIPN3H60A package mechanical data 17 5 package mechanical data in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com. ecopack is an st trademark. figure 7. ndip-26l drawing b1,b3 b,b2 c c1 base metal with plating section f-f&g-g d e eb1 eb2 e b d1 a3 e1 d2 a1 a4 pin 1 pin 16 pin 1 pin 26 pin 17 pin 26 pin 17 l a a2 ff gg b2 d3 pin 16 0.075 0.075 pin#1 id 8278949b
package mechanical data STGIPN3H60A 14/17 docid018958 rev 4 table 12.ndip-26l mechanical data dim. mm. min. typ. max. a 4.40 a1 0.80 1.00 1.20 a2 3.00 3.10 3.20 a3 1.70 1.80 1.90 a4 5.70 5.90 6.10 b 0.53 0.72 b1 0.52 0.60 0.68 b2 0.83 1.02 b3 0.82 0.90 0.98 c 0.46 0.59 c1 0.45 0.50 0.55 d 29.05 29.15 29.25 d1 0.50 0.77 1.00 d2 0.35 0.53 0.70 d3 29.55 e 12.35 12.45 12.55 e 1.70 1.80 1.90 e1 2.40 2.50 2.60 eb1 16.10 16.40 16.70 eb2 21.18 21.48 21.78 l 1.24 1.39 1.54
docid018958 rev 4 15/17 STGIPN3H60A package mechanical data 17 figure 8. ndip-26l tube dimensions (dimensions are in mm.) note: base quantity 17 pcs, bulk quantity 476 pcs. antistatic s 03 pvc am10474v1 8313150_a
revision history STGIPN3H60A 16/17 docid018958 rev 4 6 revision history table 13. document revision history date revision changes 23-jun-2011 1 initial release. 09-jan-2012 2 document status promoted from preliminary data to datasheet. added figure 8 on page 15 . 03-jul-2012 3 modified: min. and max. value table 4 on page 6 . added: table 11 on page 12 . 14-mar-2014 4 updated figure 3: switching time test circuit . updated section 5: package mechanical data .
docid018958 rev 4 17/17 STGIPN3H60A 17 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statem ents and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or register ed trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2014 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - swed en - switzerland - united kingdom - united states of america www.st.com

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