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MIC2876 4.8a i sw , synchronous boost regulator with bi - directional load disconnect general description the MIC2876 is a compact and highly - efficient 2mhz synchr onous boost regulator with a 4.8 a switch. it features a bi - directional load disconnect function which prevents any leakage current between the input and output when the device is disabled. the MIC2876 operates in bypass mode automatically when the input voltage is greater than the target output voltage. at light loads, the boost converter goes to the pfm m ode to improve the efficiency. the MIC2876 also features an integrated anti - ringing switch to minimize emi. the MIC2876 is available in a 8 - pin 2mm 2mm thin dfn ( tdfn ) package, with a junction temperature range of ? 40 c to +125 c. datasheets and support documentation are available on micrel?s web site at : www.micrel.com . features ? input voltage range: 2.5v to 5.5v ? fully - integrated, high - efficiency, 2mhz synchronous boost regulator ? bi - d irectional true load disconne ct ? integrated anti - ringing switch ? up to 95% efficiency ? <1a shutdown current ? bypass mode for v in v out ? overcurrent p rotection and thermal shutdown ? fixed and adjustable output versions ? 8 - pin 2mm 2mm tdfn package applications ? tablet and smartphones ? usb otg and hdmi hosts ? portable power reserve supplies ? high - current parallel lithium cell applications ? portable equipment simplified application schematics MIC2876 (adjustable output) MIC2876 (fixed output) micrel inc. ? 2180 fortune drive ? san jose, ca 95131 ? usa ? tel +1 (408) 944 - 0800 ? fax + 1 (408) 474 - 1000 ? http://www.micrel.com october 20, 2014 revision 1.0
micrel, inc. MIC2876 ordering information part number mark code output voltage temperature range package ( 1 , 2 ) MIC2876 - 4.75ymt 7 6 f 4.75v ? 40 c to + 125 c 8 -p in 2mm 2mm tdfn MIC2876 - 5.0ymt 76g 5.00v ? 40 c to + 125 c 8 -p in 2mm 2mm tdfn MIC2876 - 5.25ymt 76h 5.25v ? 40 c to + 125 c 8 -p in 2mm 2mm tdfn MIC2876 - 5.5ymt 76j 5.50v ? 40 c to + 125 c 8 -p in 2mm 2mm tdfn MIC2876 - aymt 76a adjustable ? 40 c to + 125 c 8 -p in 2mm 2mm tdfn note s : 1. tdfn is a rohs - compliant package. lead finish is pb free and matte tin . mold compound is halogen free . 2. = tdfn pin 1 identifier pin configuration 8 - pin 2mm 2mm tdfn (mt) fixed output (top view) 8 - pin 2mm 2mm tdfn (mt) adjustable output (top view) pin description pin number fixed output pin number adjustable output pin name pin function 1 1 sw boost converter switch n ode: connect the inductor between in and sw pins . 2 2 pgnd power ground: the power grou nd for the synchronous boost dc -to -dc converter power stage. 3 3 in supply input: connect at least 1f ceramic capacitor between in and agnd pins . 4 4 agnd analog ground: the analog ground for the regulator control loop. 5 ? outs output voltage sense pin : f or output voltage regulation in fixed voltage version . connect to the boost converter output. ? 5 fb feedback pin : f or output voltage regulation in adjustable version . connect to the feedback resistor divider. 6 6 en boost converter enable: when this pin is driven low, the ic enter s shutdown mode. the en pin has an internal 2.5m? pull - down resistor . the output is disabled when this pin is left f loating. october 20, 2014 2 revision 1.0
micrel, inc. MIC2876 pin description (continued) pin number fixed output pin number adjustable output pin name pin function 7 7 /pg open drain power good output (active low): the /pg pin is high impedance when the output voltage is below the power good threshold, and becomes low once the output is above the power good threshold. the /pg pin has typical r ds(on) = 90 and requires a pull up resistor of 1m? . connect /pg pin to agnd when the /pg signal is not used. 8 8 out boost converter output. ep ep epad exposed heat sink pad. connect to agnd for best thermal performance. october 20, 2014 3 revision 1.0
micrel, inc. MIC2876 absolute maximum ratings ( 3 ) in, en, out, fb, /pg to pgnd ...................... ? 0.3 v to +6v agnd to pgnd . .......................................... ? 0.3v to +0.3v power dissipation .................................. internally limited (5) lead temperature (soldering, 10s) ............................ 260c storage temperature (t s ) ......................... ? 65c to +150 c esd rating ( 6) human body model .............................................. 1.5 kv machine model ...................................................... 200v operating ratings ( 4 ) supply voltage (v in ) ..................................... + 2.5 v to + 5.5 v output voltage (v out ) ......................................... up to 5.5v enable voltage (v en ) .............................................. 0v to v in junction temperature (t j ) ........................ ? 40c to + 12 5c package thermal resistance 8 - pin 2mm 2mm tdfn ( ja ) .......................... 90c/w electrical characteristics ( 7 ) v in = 3.6v, v out = 5v, c in = 4.7 f, c out = 22 f , l = 1 h t a = 25c, bold values indicate ? 40c t j +125c, unless otherwise noted . symbol parameter condition min. typ. max. unit power supply v in supply voltage range 2.5 5.5 v v uvlo r uvlo rising threshold 2.32 2.49 v v uvloh uvlo hysteresis 200 mv i vin quiescent current non - switching 1 09 a i vinsd v in shutdown current v en = 0v, v in = 5.5v, v out = 0v 1 3 a i voutsd v out shut down current v en = 0v, v in = 0.3 v, v out = 5.5 v 2 5 a v out output voltage v in 5. 5 v v fb feedback voltage adjustable version, i out = 0a 0 .8865 0.9 0.9135 v voltage accuracy fixed version, i out = 0a ? 1.5 +1.5 % line regulation 2.5v < v in < 4.5v, i out = 500ma 0.3 %/v load regulation i out = 200ma to 1200ma 0.2 %/a d max maximum duty cycle 92 % d min minimum duty cycle 6.5 % i ls low - side switch current limit ( 8 ) v in = 2.5 v 3.8 4.8 5.8 a pmos switch on - resistance v in = 3.0v, i sw = 200ma, v out = 5.0v 79 m ? nmos v in = 3.0v, i sw = 200ma, v out = 5.0v 82 i sw switch leakage current v en = 0v, v in = 5.5v 0.2 5 a f osc oscillator frequency 1.6 2 2.4 mhz t sd overtemperature shutdown threshold 155 c overtemperature shutdown hysteresis 15 c notes: 3. exceeding the absolute maximum ratings may damage the device. 4. the device is not guaranteed to function outside its operating ratings. 5. the maximum allowable power dissipation of any t a (ambient temperature) is p d(max) = (t j(max) ? t a ) / ja . exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regu lator will go into thermal shutdown 6. devices are esd sensitive. handling precautions are recommended. human body model, 1.5k ? in series with 100pf. 7. specification for packaged product only. 8. guaranteed by design and characterization. october 20, 2014 4 revision 1.0
micrel, inc. MIC2876 electrical characteristics ( 7 ) (continued) v in = 3.6v, v out = 5v, c in = 4.7 f, c out = 22 f , l = 1 h t a = 25c, bold values indicate ? 40c t j +125c, unless otherwise noted. symbol parameter condition min. typ. max. unit soft - start t ss soft - start time v out = 5.0v 1.1 ms en , /pg control pins v en en threshold voltage boost converter and chip logic on 1.5 v boost converter and chip logic off 0.4 en pin current v in = v en = 3.6v 1.5 3 a v / pg - thr power - good thershold (rising) 0.9 0 v out v v / pg - thf power - good thershold (falling) 0.83 v out v october 20, 2014 5 revision 1.0
micrel, inc. MIC2876 typical characteristics 50 60 70 80 90 100 0.001 0.010 0.100 1.000 efficiency (%) load current (a) efficiency vs. load current v out = 5.0v l = 1h c out = 22 f v in = 2.5v v in = 3.0v v in = 3.6v 4.90 4.95 5.00 5.05 5.10 0.0 0.5 1.0 1.5 2.0 output voltage (v) load current (a) output voltage vs. load current t a = ? 40 t a = 25 t a = 125 adjustable r2 = 910k ? r3 = 200k ? v in = 3.5v v out = 5.0v l = 1h c out = 22 f 4.60 4.80 5.00 5.20 5.40 2.5 3.0 3.5 4.0 4.5 5.0 output voltage (v) input voltage(v) output voltage vs. input voltage adjustable r2 = 910k ? r3 = 200k ? v out = 5.0v l = 1h c out = 22 f i out = 500ma t a = ? 40 t a = 25 t a = 125 1.96 1.98 2.00 2.02 2.04 -50 -25 0 25 50 75 100 125 150 oscillator frequency (mhz) temperature ( v in = 3.6v v out = 5.0v l = 1h c out = 22 f i out = 0a 1.00 1.50 2.00 2.50 3.00 3.50 4.00 -50 -25 0 25 50 75 100 125 150 shut down current (a) temperature ( v en = 0v v in = 0.3v v out = 5.5v adjustable r2 = 910k ? r3 = 200k ? 0.896 0.898 0.900 0.902 0.904 -50 -25 0 25 50 75 100 125 150 feedback voltage (v) temperature ( adjustable v out = 5.0v r2 = 910k ? r3 = 200k ? 2.00 2.10 2.20 2.30 2.40 -50 -25 0 25 50 75 100 125 150 input voltage (v) temperature ( rising falling 0.60 0.80 1.00 1.20 -50 -25 0 25 50 75 100 125 150 enable threshold voltage (v) temperature ( rising falling 3.80 4.00 4.20 4.40 4.60 4.80 -50 -25 0 25 50 75 100 125 150 /pg threshold voltage (v) temperature ( rising falling adjustable r2 = 910k ? r3 = 200k ? v out = 5.0v october 20, 2014 6 revision 1.0
micrel, inc. MIC2876 functional characteristics october 20, 2014 7 revision 1.0
micrel, inc. MIC2876 functional characteristics (continued) october 20, 2014 8 revision 1.0
micrel, inc. MIC2876 functional diagram simplified adjustable output functional diagram simplified fixed output functional diagram october 20, 2014 9 revision 1.0
micrel, inc. MIC2876 functional description input (in) the input supply provides power to the internal mosfets gate drive rs and control circuitry for the boost regulator. the operating input voltage range is from 2.5v to 5.5v. a 1f low - esr ceramic i nput capacitor should be connected from in to agnd as close to MIC2876 as possible to ensure a clean supply voltage for the device. a minimum voltage rating of 10v is recommended for the input capacitor. switch node ( sw ) the MIC2876 has internal low - sid e and synchronous mosfet switches. the switch node (sw) between the internal mosfet switches connects directly to one end of the inductor and provides the current path during switching cycles. the other end of the inductor is connected to the input supply voltage. due to the high - speed switching on this pin, the switch node should be routed away from sensitive nodes wherever possible. ground path ( agnd ) t he ground path (agnd) is for the internal biasing and control circuitry. agnd should be connected to t he pcb pad for the package exposed pad. the current loop of the analog ground should be separated from that of the power ground (pgnd). agnd sho uld be connected to pgnd at a single point. power ground ( pgnd ) the power ground (pgnd) is the ground path for t he high current in the boost switch es . the current loop for the power ground should be as short as possible and separate from the agnd loop as applicable. boost converter output ( out ) a low - esr ceramic capacitor of 22f (for operation with v in 5.0v), or 66f (for operation with v in > 5.0v) should be connected from vout and pgnd as close as possible to the MIC2876 . a minimum voltage rating of 10v is recommended for the output capacitor. enable ( en ) enable pin of the MIC2876. a logic high on th is pin enables the MIC2876. when this pin is driven low, the MIC2876 enter s the shutdown mode. when the en pin is left floating, it is pulled - do wn internally by a built - in 2.5m resistor. feedback/output voltage sense ( fb/outs ) feedback or output voltage sense pin for the boost converter. for the fixed voltage version, this pin should be connected to the out pin. for the adjustable version, connect a resistor div ider to set the output voltage (s ee ? output voltage prog ramming ? for more information ) . power - good output ( /pg ) the o pen- drain active - low power - good output (/pg) is low when the ou tput voltage is above the power - good threshold. a pull - up resistor of 1m ? is recommended. exposed heat sink pad ( ep) the e xposed heat sink pad , or epad (ep), should be c onnect ed to agnd for best thermal performance. october 20, 2014 1 0 revision 1.0
micrel, inc. MIC2876 application information general description the MIC2876 is a 2mhz, current - mode , pwm , synchronous boost converter with an operating input voltage range of 2.5v to 5.5v. at light l oad, the converter enters pulse - skipping mode to maintain high efficiency over a wide range of load current. the maximum peak current in the boost switch is limited to 4.8a (typical). bi - d irectional output disconnect the power stage of the MIC2876 consists of a nmos transistor as the main switch and a pmos transistor as the synchronous rectifier. a control circu it turns off the back gate diode of the pmos to isolate the output from the input supply when the chip is disabled (v en = 0v). an ? always on ? maximum supply selector s witches the cathode of the back gate diode to either the in or the out ( whichever of the t wo has the higher voltage ) . as a result, the output of the MIC2876 is bi - directionally isolated from the input as long as the device is disabled. the maximum supply selector and hence the output disconnect function requires only 0.3v at the in pin to operate. integrated anti - ringing switch the MIC2876 includes an anti - ri nging switch that eliminates the ringing on the sw node of a conventional boost converter operating in the discontinuous conduction mode (dcm). at the end of a switching cycle during dcm operation, both the nmos and pmos are turned off. the anti - ringing sw itch in the MIC2876 clamps the sw pin voltage to in to dissipate the remaining energy stored in the inductor and the parasitic elements of the power switches. automatic bypass mode ( when v in > v out ) the MIC2876 automatically operates in bypass mode when t he input voltage is higher than the target output voltage. in bypass mode, the nmos is turned off while the pmos is fully turned - on to provide a very low impedance path from in to out. soft - s tart the MIC2876 integrates an internal soft - start circuit to li mit the inrush current during start - up. when the device is enabled, the pmos is turned - on slowly to charge the output cap acitor to a voltage close to the input voltage. then, the device begins boost switching cycles to gradually charge up the output voltag e to the target v out . output voltage programming the MIC2876 has an adjustable version that allows the output voltage to be set by an external resistor divider r2 and r3. the typical feedback voltage is 900mv, the recommended maximum and minimum output vo ltage is 5.5v and 3.2v , respectively. the current through the resistor divider should be significantly larger than the current in to the fb pin (typically 0.01 a ). it is recommended that the total resistance of r2 + r3 should be around 1m?. the appropriate r2 and r3 values for the desired output voltage are calculated as in equation 1 : ? ? ? ? ? ? ? = 1 v 9 . 0 v 3 r 2 r out eq. 1 october 20, 2014 11 revision 1.0
micrel, inc. MIC2876 component selection inductor inductor selection is a trade - off between efficiency, stability, cost, size, and rated current. since the boost converter is compensated internally, the recommended inductance is limited from 1h to 2.2h to ensure system stability and presents a good balance between these considerations. a large inductance v alue reduce s the peak - to - peak inductor ripple current hence the output ripple voltage. this also reduces both the dc loss and the transition loss at the same inductor?s dc resistance (dcr) . however, the dcr of an inductor usually increases with the inducta nce in the same package size. this is due to the longer windings required for an increase in inductance. since the majority of the input current pass es through the inductor, the higher the dcr the lower the efficiency is , and more significantly at higher l oad currents. on the other hand, inductor with smaller dcr but the same inductance usually has a larger size. the saturation current rating of the selected inductor must be higher than the maximum peak inductor current to be encountered and should be at le ast 20% to 30% higher than the average inductor current at maximum output current. input capacitor to the device supply a ceramic capacitor of 1 f or larger with low esr is recommended to reduce the input voltage ripple to ensure a clean supply voltage for the device. the input capacitor should be placed as close as possible to the MIC2876 in and agnd pin s with short trace s t o ensure good noise performance. x5r or x7r type ceramic capacitors are recommended for better tolerance over temperature. the y5v and z5u type temperature rating ceramic capacitors are not recommended due to their large reduction in capacitance over temperature and increased resistance at high frequencies. t he use of t hese reduces their ability to filter out high - frequency noise. the rated voltage of th e input capacitor should be at least 20% higher than the maximum operating input voltage over the operating temperature range. input capacitor to the power path a ceramic capacitor of a 4.7 f of larger with low esr is recommended to reduce the input voltag e fluctuation at the voltage supply of the high - current power path. an input capacitor should be place d close to the v in supply to the power inductor and pgnd for good device performance at heavy load condition . x5r - or x7r - type ceramic capacitors are reco mm ended for better tolerance over temperature. the y5v and z5u type temperature rating ceramic capacitors are not recommended due to their large reduction in capacitance over temperature and increased resistance at high frequencies. these reduce their a bility to filter out high - frequency noise. the rated voltage of the input capacitor should be at least 20% higher than the maximum operating input voltage over the operating temperature range. output capacitor output capacitor selection is also a trade - off between performance, size, and cost. increasing output capacitor will lead to an improved transient response, however, the size and cost also increase. for operation with v in 5.0v, a minimum of 22 f output c apacitor with esr less than 10m? is required. for operation with v in > 5.0v, a minimum of 66 f output capacitor with esr less than 10m? is required. x5r or x7r type ceramic capacitors are recommended for better tolerance over temperature. additional capaci tors can be added to improve the transient response, and to reduce the ripple of the output when the MIC2876 operates in and out of bypass mode. the y5v and z5u type ceramic capacitors are not recommended due to their wide variation in capacitance over te mperature and increased resistance at high frequencies. the rated voltage of the output capacitor should be at least 20% higher than the maximum operating output voltage over the operating temperature range. 0805 size ceramic capacitor is recommended for s maller esl at output capacitor which contributes smaller voltage spik e at the output voltage of high - frequency switching boost converter. october 20, 2014 12 revision 1.0
micrel, inc. MIC2876 pow er dissipation as with all power devices, the ultimate current rating of the output is l imited by the thermal properties of the device package and the pcb on which the device is mounte d. there is a simple, ohm?s law - type relationship between thermal resistance, power dissipation , and temperature which are analogous to an electrical circuit ( figure 1 ) : figure 1 . series electrical resistance circuit from this simple circuit we can calculate v x if we know i source , v z and the resistor values, r xy and r yz using equation 2 : v x = i source (r xy + r yz ) + v z eq. 2 thermal circuits can be considered using this same rule and can be drawn similarly by replacing current sources with power dissipation (in watts), resistance with thermal resistance (in c/w) and voltage sources with temperature (in c). figure 2 . series thermal resistance circuit now replacing the variables in the equation for v x , we can find the junction temperature (t j ) from the power dissipation, ambient temperature and the known thermal resistance of the pcb ( ca ) and the package ( jc ). t j = p diss ( jc + ca ) + t a eq. 3 as can be seen in the diagram, total thermal resistance ja = jc + ca . t his can also be written as in equation 4 : t j + p diss ( ja ) + t a eq. 4 given that all of the power losses (minus the inductor losses) are effectively in the converter are dissipated within the MIC2876 package, p diss can be calculated thusly : linear mode: dcr i 1 1 p p 2 out out diss ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? = ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? = ? + = efficiency taken from efficiency curves and dcr = inductor dcr. jc and ja are found in the operating ratings section of the data sheet. october 20, 2014 13 revision 1.0
micrel, inc. MIC2876 where the real board area differs from 1? square, ca (the pcb thermal resistance) , values for various pcb copper areas can be taken from figure 3 . ( note : figure 3 taken from des igning with low dropout voltage regulators available from micrel?s web site at: www.micrel.com .) figure 3 . determining pc board area for a given pcb thermal resistance figure 3 shows the total area of a round or square pad, centered on the device. the solid trace represents the area of a square, single - sided, horizon tal, solder masked, copper pc board trace heat sink, measured in square millimeters. no airflow is assumed. the dashed line shows pc boards trace heat sink covered in black oil - based paint and with 1.3m/sec (250 feet per minute) airflow. this approaches a ?best case? pad heat sink. conservative design dictates using the solid trace data, which indicates that a maximum pad size of 5000 mm 2 is needed. this is a pad 71mm 71mm (2.8 inches per side). october 20, 2014 14 revision 1.0
micrel, inc. MIC2876 pcb layout guidelines pcb layout is critical to achieve reliable, stable and efficient performance. a ground plane is required to control emi and minimize the inductance in power, signal and return paths. the following guidelines should be followed to ensure proper operation of the device: i c (integrated circuit) ? place the ic close to the point - of - load. ? use fat traces to route the input and output power lines. ? analog grounds and power ground should be kept separate and connected at a single location at the pcb pad for exposed pad of the ic. ? p lace as much as thermal vias on the pcb pad for exposed pad and connected it to the ground plane to ensure a good pcb thermal resistance can be achieved. in decoupling capacitor ? the in decoupling capacitor must be placed close to the in pin of the ic and p referably connected directly to the pin and not through any via. the capacitor must be located right at the ic. ? the in decoupling capacitor should be connected as close as possible to agnd. ? the in terminal is noise sensitive and the placement of capacitor is very critical. vin power path bulk capacitor ? the v in power path bulk capacitor should be placed and connected close to the v in supply to the power inductor and the pgnd of the ic. ? use either x5r or x7r temperature rating ceramic capacitors. do not us e y5v or z5u type ceramic capacitors. inductor ? keep both the inductor connections to the switch node (sw) and input power line short and wide enough to handle the switching current. keep the areas of the switching current loops small to minimize the emi pr oblem. ? do not route any digital lines underneath or close to the inductor. ? keep the switch node (sw) away from the noise sensitive pins. ? to minimize noise, place a ground plane underneath the inductor. output capacitor ? use wide and short traces to conne ct the output capacitor as close as possible to the out and pgnd pins without going through via holes to minimize the switching current loop during the main switch off cycle and the switching noise. ? use either x5r or x7r temperature rating ceramic capacito rs. do not use y5v or z5u type ceramic capacitors . figure 4 . suggested pcb routing october 20, 2014 15 revision 1.0
micrel, inc. MIC2876 typical application schematic s MIC2876 - aymt typical application schematic ? MIC2876 - 5.0ymt typical application schematic ? MIC2876 - aymt typical application schematic ? > MIC2876 - 5.0ymt typical application schematic ? > october 20, 2014 16 revision 1.0
micrel, inc. MIC2876 bill of materials item part number manufacturer description qty. c1 c1608x5r1a475k080ac tdk ( 9 ) capacitor 4.7f, 10v, 10%, x5r, 0603 1 c2 lmk212bj226mg - t taiyo yuden ( 10) capacitor 22f, 10v, 20%, x5r, 0805 (v in 5.00v) 1 capacitor 22f, 10v, 20%, x5r, 0805 (v in > 5.00v , in parallel ) 3 c3 grm188r61a105ka61j murata ( 11) capacitor 1f, 10v, 10%, x5r, 0603 1 l1 pimb042t - 1r0ms -39 cyntec ( 12 ) inductor 1h, 4.5a, smd, 4 . 2mm 4 . 0mm 1.8mm 1 r1 erj - 3geyj105v panasonic ( 13 ) resistor 1m, 5%, 0603 1 r2 1 - 1879417- 8 te ( 14) resistor 910k, 0.1 %, 0603 1 r3 era - 3aeb204v panasonic resistor 200k, 0.1 %, 0603 1 r4 erj - 3geyj103v panasonic resistor 10k, 5%, 0603 1 ui MIC2876 - xxxymt micrel, inc. ( 15) 4.8a i sw , synchronous boost regulator with bi -d irectional load disconnect 1 notes: 9. tdk : www.tdk.com . 10. taiyo yuden : www.t - yuden.com . 11. murata : www.murata.com . 12. cyntec: www.cyntec.com . 13. panasonic: www.panasonic.com . 14. te: www.te.com . 15. micrel , inc.: www.micrel.com . october 20, 2014 17 revision 1.0
micrel, inc. MIC2876 pcb layout recommendations top layer bottom layer october 20, 2014 18 revision 1.0
micrel, inc. MIC2876 package information and recommended landing pattern ( 15) 8 - pin 2mm 2mm tdfn ( mt ) note: 16. package information is correct as of the publication date. for updates and most current information, go to www.micrel.com . october 20, 2014 19 revision 1.0
micrel, inc. MIC2876 micrel, inc. 2180 fortune drive san jose, ca 95131 usa tel +1 (408) 944 - 0800 fax +1 (408) 474- 1000 web http://www.micrel.com micrel, inc. is a leading global manufacturer of ic solutions for the worldwide high - performance linear and power, lan, and timing & communications markets. the company?s products include advanced mixed - signal, analog & power semiconductors; high - performance communication, clock management, mems - based clock oscillators & crystal - less clock generators, ethernet switches, and physical layer transceiver ics. company customers include leading manufacturers of enterprise, consumer, industrial, mobile, telecommunications, automotive, and computer products. corporation headquarters and state - of - the - art wafer fabrication facilities are located in san jose, ca, with regional sales and support offices and advanced technology design cen ters situated throughout the americas, europe, and asia. additionally, the company maintains an extensive network of distributors and reps worldwide. micrel makes no representations or warranties with respect to the accuracy or completeness of the inf orm ation furnished in this data sheet. this information is not intended as a warranty and micrel does not assume responsibility for its use. micrel reserves the right to change circuitry, specifications and descriptions at any time without notice. no license , whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this document. e xcept as provided in micrel?s terms and conditions of sale for such products, micrel assumes no liability whatsoever, and micrel disclaims any express or implied warranty relating to the sale and/or use of micrel products including liability or warrantie s relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright , or other intellectual p roperty right. micrel products are not designed or authorized for use as components in life support appliances, devices or systems where mal function of a product can reasonably be expected to result in personal injury. life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. a purchaser?s use or sale of micrel products for use in life support appliances, devices or systems is a purchaser?s own risk and purchaser agrees to fully indemnify micrel for any damages resulting from such use or sale. ? 20 14 micrel, incorporated. october 20, 2014 20 revision 1.0

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