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this is information on a product in full production. september 2014 docid023494 rev 5 1/41 m24c16-w m24c16-r m24c16-f 16-kbit serial i2c bus eeprom datasheet - production data features ? compatible with all i 2 c bus modes: ? 400 khz ? 100 khz ? memory array: ? 16 kbit (2 kbytes) of eeprom ? page size: 16 bytes ? single supply voltage: ? m24c16-w: 2.5 v to 5.5 v ? m24c16-r: 1.8 v to 5.5 v ? m24c16-f: 1.7 v to 5.5 v (full temperature range) and 1.6 v to1.7 v (limited temperature range) ? write: ? byte write within 5 ms ? page write within 5 ms ? operating temperature range: ? from -40 c up to +85 c ? random and sequential read modes ? write protect of the whole memory array ? enhanced esd/latch-up protection ? more than 4 million write cycles ? more than 200-year data retention packages ? pdip8 ecopack1 ? ? so8 ecopack2 ? ? tssop8 ecopack2 ? ? ufdfpn8 ecopack2 ? ? wlcsp ecopack2 ? ? ufdfpn5 ecopack2 ? pdip8 (bn) tssop8 (dw) 169 mil width ufdfpn8 (mb, mc) so8 (mn) 150 mil width (mh) ufdfpn5 (cs) unsawn wafer wlcsp www.st.com
contents m24c16-w m24c16-r m24c16-f 2/41 docid023494 rev 5 contents 1 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2 signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.1 serial clock (scl) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.2 serial data (sda) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.3 write control (wc ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.4 v ss (ground) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.5 supply voltage (v cc ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.5.1 operating supply voltage (v cc ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.5.2 power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.5.3 device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.5.4 power-down conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3 memory organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4 device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4.1 start condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4.2 stop condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4.3 data input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4.4 acknowledge bit (ack) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4.5 device addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5 instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5.1 write operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5.1.1 byte write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 5.1.2 page write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 5.1.3 minimizing write delays by polling on ack . . . . . . . . . . . . . . . . . . . . . . 17 5.2 read operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 5.2.1 random address read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5.2.2 current address read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5.2.3 sequential read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 6 initial delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
docid023494 rev 5 3/41 m24c16-w m24c16-r m24c16-f contents 3 7 maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 8 dc and ac parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 9 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 10 part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 11 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
list of tables m24c16-w m24c16-r m24c16-f 4/41 docid023494 rev 5 list of tables table 1. signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 2. device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 table 3. address byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 table 4. absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 table 5. operating conditions (voltage range w) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 table 6. operating conditions (voltage range r) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 table 7. operating conditions (voltage range f, for devices identified by process letter t) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 table 8. operating conditions (voltage ra nge f, for all other devices) . . . . . . . . . . . . . . . . . . . . . . . 22 table 9. ac measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 table 10. input parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 table 11. cycling performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 table 12. memory cell data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 table 13. dc characteristics (m24c16-w, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 table 14. dc characteristics (m24c16-r, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 table 15. dc characteristics (m24c16-f device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 table 16. 400 khz ac characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 table 17. 100 khz ac characteristics (i 2 c standard mode). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 table 18. ufdfpn5 (mlp5) ? package dime nsions (ufdfpn: ult ra thin fine pitch dual flat package, no lead) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 table 19. ufdfpn8 (mlp8) ? package dime nsions (ufdfpn: ult ra thin fine pitch dual flat package, no lead) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 table 20. tssop8 ? 8-lead thin shrink small outline, pa ckage mechanical data. . . . . . . . . . . . . . . . 32 table 21. so8n ? 8-lead plastic small outline, 150 mils body width, package data. . . . . . . . . . . . . . 33 table 22. pdip8 ? 8-pin plastic dip, 0.25 mm lead fram e, package mechanical data. . . . . . . . . . . . 34 table 23. m24c16-fcs5tp/s wlcsp 5 bumps package data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 table 24. ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 table 25. ordering information scheme (unsawn wafer) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 table 26. document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
docid023494 rev 5 5/41 m24c16-w m24c16-r m24c16-f list of figures 5 list of figures figure 1. logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 figure 2. 8-pin package connections, top view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 figure 3. ufdfpn5 package connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 figure 4. m24c16-fcs5tp/s wlcsp connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 figure 5. block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 figure 6. i 2 c bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 figure 7. write mode sequences with wc = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 8. write mode sequences with wc = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 16 figure 9. write cycle polling flowchart using ack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 7 figure 10. read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 figure 11. ac measurement i/o wa veform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 figure 12. maximum rbus value versus bus pa rasitic capacitance (cbus) for an i2c bus at maximum frequency fc = 400 khz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 figure 13. ac waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 figure 14. ufdfpn5 (mlp5) ? package outline (ufdfpn: ultra thin fine pitch dual flat package, no lead) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 figure 15. ufdfpn8 (mlp8) ? package outline (ufdfpn: ultra thin fine pitch dual flat package, no lead) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 figure 16. tssop8 ? 8-lead thin shrink small outline, pa ckage outline . . . . . . . . . . . . . . . . . . . . . . . 32 figure 17. so8n ? 8-lead plastic small outline, 150 mils body width, package outline . . . . . . . . . . . . 33 figure 18. pdip8 ? 8-pin plastic dip, 0.25 mm lead frame, package outline . . . . . . . . . . . . . . . . . . . 34 figure 19. m24c16-fcs5tp/s wlcsp 5 bumps package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
description m24c16-w m24c16-r m24c16-f 6/41 docid023494 rev 5 1 description the m24c16 is a 16-kbit i 2 c-compatible eeprom (electri cally erasable programmable memory) organized as 2 k 8 bits. the m24c16-w can be accessed (read and write) with a supply voltage from 2.5 v to 5.5 v, the m24c16-r can be accessed (read and write) with a supply voltage from 1.8 v to 5.5 v, and the m24c16-f can be accessed either with a supply voltage from 1.7 v to 5.5 v (over the full temperature range) or with an extended supply voltage from 1.6 v to 1.7 v. all these devices operate with a clock frequency of 400 khz. figure 1. logic diagram figure 2. 8-pin package connections, top view table 1. signal names signal name function direction sda serial data i/o scl serial clock input wc write control input v cc supply voltage - v ss ground - -36 3$! 6 ## -xxx 7# 3#, 6 33 -36 3$! 6 33 3#, 7# .# .# 6 ## .#
docid023494 rev 5 7/41 m24c16-w m24c16-r m24c16-f description 40 figure 3. ufdfpn5 package connections 1. see section 9: package mechanical data for package dimensions, and how to identify pin 1 figure 4. m24c16-fcs5tp/s wlcsp connections -36 3$! 3#, 7# 6 ## 6 33 6 33 4opview markingside "ottomview padsside !"#$ 89:7 06y9 ^> { ^ s s ^^ 3,1$ 0dunlqjvlgh wrsylhz %xpsvlgh erwwrpylhz ^> ^ s s ^^ t t
signal description m24c16-w m24c16-r m24c16-f 8/41 docid023494 rev 5 2 signal description 2.1 serial clock (scl) the signal applied on the scl input is used to strobe the data available on sda(in) and to output the data on sda(out). 2.2 serial data (sda) sda is an input/output used to transfer data in or data out of the device. sda(out) is an open drain output that may be wire-or?ed with other open drain or open collector signals on the bus. a pull-up resistor must be co nnected from serial data (sda) to v cc ( figure 12 indicates how to calculate the value of the pull-up resistor). 2.3 write control (wc ) this input signal is useful for protecting the entire contents of the memory from inadvertent write operations. write operations are disa bled to the entire memory array when write control ( wc ) is driven high. write operations are enabled when write control ( wc ) is either driven low or left floating. when write control ( wc ) is driven high, device select and address bytes are acknowledged, data bytes are not acknowledged. 2.4 v ss (ground) v ss is the reference for the v cc supply voltage. 2.5 supply voltage (v cc ) 2.5.1 operating supply voltage (v cc ) prior to selecting the memory and issuing instructions to it, a valid and stable v cc voltage within the specified [v cc (min), v cc (max)] range must be applied (see operating conditions in section 8: dc and ac parameters ) . in order to secure a stab le dc supply voltage, it is recommended to decouple the v cc line with a suitable capacitor (usually of the order of 10 nf to 100 nf) close to the v cc /v ss package pins. this voltage must remain stable and valid unt il the end of the transmission of the instruction and, for a write instructio n, until the completion of the internal write cycle (t w ). 2.5.2 power-up conditions the v cc voltage has to rise continuously from 0 v up to the minimum v cc operating voltage (see operating conditions in section 8: dc and ac parameters ) and the rise time must not vary faster than 1 v/s.
docid023494 rev 5 9/41 m24c16-w m24c16-r m24c16-f signal description 40 2.5.3 device reset in order to prevent inadvertent write operations during power-up, a power-on-reset (por) circuit is included. at power-up, the device does not re spond to any instruction until v cc has reached the internal reset threshold voltage. this threshold is lower than the minimum v cc operating voltage (see operating conditions in section 8: dc and ac parameters ). when v cc passes over the por threshold, the device is reset and enters the standby power mode; however, the device must not be accessed until v cc reaches a valid and stable dc voltage within the specified [v cc (min), v cc (max)] range (see operating conditions in section 8: dc and ac parameters ). in a similar way, during power-down (continuous decrease in v cc ), the device must not be accessed when v cc drops below v cc (min). when v cc drops below the threshold voltage, the device stops responding to any instruction sent to it. 2.5.4 power-down conditions during power-down (continuous decrease in v cc ), the device must be in the standby power mode (mode reached after decoding a stop condition, assuming that there is no internal write cycle in progress).
memory organization m24c16-w m24c16-r m24c16-f 10/41 docid023494 rev 5 3 memory organization the memory is organized as shown below. figure 5. block diagram -36 7# #ontrollogic (ighvoltage generator )/shiftregister !ddressregister andcounter $ata register page 8decoder 9decoder 3#, 3$!
docid023494 rev 5 11/41 m24c16-w m24c16-r m24c16-f device operation 40 4 device operation the device supports the i 2 c protocol. this is summarized in figure 6 . any device that sends data on to the bus is defined to be a transmitter, and any device that reads the data to be a receiver. the device that controls the data transfer is known as the bus master, and the other as the slave device. a dat a transfer can only be initia ted by the bus master, which will also provide the serial clock for synchronization. the device is always a slave in all communications. figure 6. i 2 c bus protocol 3#, 3$! 3#, 3$! 3$! 34!24 #ondition 3$! )nput 3$! #hange !)" 34/0 #ondition -3" !#+ 34!24 #ondition 3#, -3" !#+ 34/0 #ondition
device operation m24c16-w m24c16-r m24c16-f 12/41 docid023494 rev 5 4.1 start condition start is identified by a falling edge of serial da ta (sda) while serial clock (scl) is stable in the high state. a start condition must prece de any data transfer instruction. the device continuously monitors (except during a writ e cycle) serial data (sda) and serial clock (scl) for a start condition. 4.2 stop condition stop is identified by a rising edge of serial da ta (sda) while serial clock (scl) is stable and driven high. a stop condition terminates communication between the device and the bus master. a read instruction that is followed by noack can be fo llowed by a stop condition to force the device into the standby mode. a stop condition at the end of a write instruction triggers the internal write cycle. 4.3 data input during data input, the device samples serial da ta (sda) on the rising edge of serial clock (scl). for correct device operation, serial data (sda) must be stable during the rising edge of serial clock (scl), and the serial data (sda) signal must change only when serial clock (scl) is driven low. 4.4 acknowledge bit (ack) the acknowledge bit is used to indicate a succ essful byte transfer. the bus transmitter, whether it be bus master or slave device, releas es serial data (sda) after sending eight bits of data. during the 9 th clock pulse period, the receiver pulls serial data (sda) low to acknowledge the receipt of the eight data bits.
docid023494 rev 5 13/41 m24c16-w m24c16-r m24c16-f device operation 40 4.5 device addressing to start communication between the bus master and the slave device, the bus master must initiate a start conditio n. following this, the bus master s ends the device select code, shown in table 2 (on serial data (sda), most significant bit first). the 8 th bit is the read/ write bit (r w ). this bit is set to 1 for read and 0 for write operations. if a match occurs on the device select code, the corresponding device gives an acknowledgment on serial data (sda) during the 9 th bit time. if the de vice does not match the device select code, it de selects itself from the bus, and goes into standby mode. table 2. device select code device type identifier (1) 1. the most significant bit, b7, is sent first. chip enable address rw b7 b6 b5 b4 b3 b2 b1 b0 1010a10a9a8rw
instructions m24c16-w m24c16-r m24c16-f 14/41 docid023494 rev 5 5 instructions 5.1 write operations following a start condition the bus master sends a device select code with the r/ w bit (r w ) reset to 0. the device acknowledges this, as shown in figure 7 , and waits for the address byte. the device responds to each address byte with an acknowledge bit, and then waits for the data byte. when the bus master generates a stop condit ion immediately after a data byte ack bit (in the ?10 th bit? time slot), either at the end of a byte write or a page write, the internal write cycle t w is triggered. a stop condition at any othe r time slot does not trigger the internal write cycle. after the stop condition and the successful completion of an internal write cycle (t w ), the device internal address counter is automatically incremented to point to the next byte after the last modified byte. during the internal write cycle, serial data (s da) is disabled internally, and the device does not respond to any requests. if the write control input (wc) is driven high, the write instruction is not executed and the accompanying data bytes are not acknowledged, as shown in figure 8 . table 3. address byte a7 a6 a5 a4 a3 a2 a1 a0
docid023494 rev 5 15/41 m24c16-w m24c16-r m24c16-f instructions 40 5.1.1 byte write after the device select code and the address by te, the bus master sends one data byte. if the addressed location is write-protected, by write control ( wc ) being driven high, the device replies with noack, and the location is not modified. if, instead, the addressed location is not write-protected, the device replies with ack. the bus master terminates the transfer by generating a stop condition, as shown in figure 7 . figure 7. write mode sequences with wc = 0 (data write enabled) 3top 3tart "yte7rite $ev3elect "yteaddress $atain 7# 3tart 0age7rite $ev3elect "yteaddress $atain $atain 7# $atain !)c 0age7rite contgd 7#contgd 3top $atain. !#+ 27 !#+ !#+ !#+ !#+ !#+ !#+ 27 !#+ !#+
instructions m24c16-w m24c16-r m24c16-f 16/41 docid023494 rev 5 5.1.2 page write the page write mode allows up to 16 bytes to be written in a single write cycle, provided that they are all located in the same page in the memory: that is, the most significant memory address bits, a10/a4, are the same. if more bytes are se nt than will fit up to the end of the page, a ?roll-over? occurs, i.e. the by tes exceeding the page end are written on the same page, from location 0. the bus master sends from 1 to 16 bytes of data, each of which is acknowledged by the device if write control ( wc ) is low. if write control ( wc ) is high, the contents of the addressed memory location are not modified, an d each data byte is followed by a noack, as shown in figure 8 . after each transferred byte, the internal page address counter is incremented. the transfer is terminated by the bu s master generating a stop condition. figure 8. write mode sequences with wc = 1 (data write inhibited) 3top 3tart "yte7rite $evselect "yteaddress $atain 7# 3tart 0age7rite $evselect "yteaddress $atain $atain 7# $atain !)d 0age7rite contgd 7#contgd 3top $atain. !#+ !#+ ./!#+ 27 !#+ !#+ ./!#+ ./!#+ 27 ./!#+ ./!#+
docid023494 rev 5 17/41 m24c16-w m24c16-r m24c16-f instructions 40 5.1.3 minimizing write delays by polling on ack the maximum write time (t w ) is shown in ac characteristics tables in section 8: dc and ac parameters , but the typical time is shorter. to ma ke use of this, a polling sequence can be used by the bus master. the sequence, as shown in figure 9 , is: ? initial condition: a write cycle is in progress. ? step 1: the bus master issues a start condi tion followed by a device select code (the first byte of the new instruction). ? step 2: if the device is bu sy with the internal write cycl e, no ack will be returned and the bus master goes back to step 1. if t he device has terminated the internal write cycle, it responds with an ack, indicating th at the device is ready to receive the second part of the instruction (the first byte of this instruction having been sent during step 1). figure 9. write cycle polling flowchart using ack t?]??o ]v??}p??? $,h e?? k???]}v]? ???]vp?z uu}?? ^???}v]?]}v ]?o? ]?zzta < ???v z^ ek z^ ek z^??? ^?}? ?(}??z t?]????]}v 'hylfhvhohfw zlwk5: ^v??? vz]< z^ ek 6wduw&rqglwlrq }v?]v?z t?]?}???]}v }v?]v?z zv}uz}???]}v )luvwe\whrilqvwuxfwlrq zlwk5: douhdg\ ghfrghge\wkhghylfh
instructions m24c16-w m24c16-r m24c16-f 18/41 docid023494 rev 5 5.2 read operations read operations are performed independently of the state of the write control ( wc ) signal. after the successful completion of a read oper ation, the device internal address counter is incremented by one, to point to the next byte address. for the read instructions, after each byte read (data out), the device waits for an acknowledgment (data in) during the 9th bit time. if the bus master does not acknowledge during this 9th time, the device terminates t he data transfer and switches to its standby mode. figure 10. read mode sequences 3tart $evselect
"yteaddress 3tart $evselect $ataout !)b $ataout. 3top 3tart #urrent !ddress 2ead $evselect $ataout 2andom !ddress 2ead 3top 3tart $evselect
$ataout 3equential #urrent 2ead 3top $ataout. 3tart $evselect
"yteaddress 3equential 2andom 2ead 3tart $evselect
$ataout 3top !#+ 27 ./!#+ !#+ 27 !#+ !#+ 27 !#+ !#+ !#+ ./!#+ 27 ./!#+ !#+ !#+ 27 !#+ !#+ 27 !#+ ./!#+
docid023494 rev 5 19/41 m24c16-w m24c16-r m24c16-f instructions 40 5.2.1 random address read a dummy write is first performed to load the address into this address counter (as shown in figure 10 ) but without sending a stop condition. then, the bus master sends another start condition, and repeats the device select code, with the r w bit set to 1. the device acknowledges this, and outputs the contents of the addressed byte. the bus master must not acknowledge the byte, and terminates the transfer with a stop condition. 5.2.2 current address read for the current address read operation, following a start condition, the bus master only sends a device select code with the r/ w bit set to 1. the device acknowledges this, and outputs the byte addressed by the inter nal address counter. the counter is then incremented. the bus master terminates the transfer with a stop condition , as shown in figure 10 , without acknowledging the byte. 5.2.3 sequential read this operation can be used after a current address read or a random address read. the bus master does acknowledge the data byte output, and sends additional clock pulses so that the device continues to output the next by te in sequence. to terminate the stream of bytes, the bus master must not acknowledge the last byte, and must generate a stop condition, as shown in figure 10 . the output data comes from consecutive addresses, with the internal address counter automatically incremented after each byte ou tput. after the last memory address, the address counter ?rolls-over?, and the device continues to output data from memory address 00h.
initial delivery state m24c16-w m24c16-r m24c16-f 20/41 docid023494 rev 5 6 initial delivery state the device is delivered with all the memory ar ray bits set to 1 (each byte contains ffh).
docid023494 rev 5 21/41 m24c16-w m24c16-r m24c16-f maximum rating 40 7 maximum rating stressing the device outside the ratings listed in table 4 may cause permanent damage to the device. these are stress ratings only, and o peration of the device at these, or any other conditions outside those indicated in the operat ing sections of this specification, is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. table 4. absolute maximum ratings symbol parameter min. max. unit ambient operating temperature ?40 130 c t stg storage temperature ?65 150 c t lead lead temperature during soldering see note (1) 1. compliant with jedec std j-std-020d (for small b ody, sn-pb or pb-free assembly), the st ecopack? 7191395 specification, and the european directive on re strictions of hazardous substances (rohs directive 2011/65/eu of july 2011). c pdip-specific lead temperature during soldering - 260 (2) 2. t lead max must not be applied for more than 10 s. c i ol dc output current (sda = 0) - 5 ma v io input or output range ?0.50 6.5 v v cc supply voltage ?0.50 6.5 v v esd electrostatic pulse (human body model) (3) 3. positive and negative pulses applied on different co mbinations of pin connections, according to aec- q100-002 (compliant with jedec std jesd22-a114, c1=100 pf, r1=1500 ). - 3000 (4) 4. 4000 v for devices identified by process letters s or g. v
dc and ac parameters m24c16-w m24c16-r m24c16-f 22/41 docid023494 rev 5 8 dc and ac parameters this section summarizes the operating and measurement conditions, and the dc and ac characteristics of the device. table 5. operating conditions (voltage range w) symbol parameter min. max. unit v cc supply voltage 2.5 5.5 v t a ambient operating temperature ?40 85 c f c operating clock frequency - 400 khz table 6. operating conditions (voltage range r) symbol parameter min. max. unit v cc supply voltage 1.8 5.5 v t a ambient operating temperature ?40 85 c f c operating clock frequency - 400 khz table 7. operating conditions (volta ge range f, for devices identified by process letter t) symbol parameter min. max. u nit v cc supply voltage 1.60 1.65 1.70 5.5 v t a ambient operating temperature: read -40 -40 -40 85 c ambient operating temperature: write 0 -20 -40 85 f c operating clock frequency - - - 400 khz table 8. operating conditions (voltage range f, for all other devices) symbol parameter min. max. u nit v cc supply voltage 1.7 5.5 v t a ambient operating temperature -20 85 c f c operating clock frequency - 400 khz
docid023494 rev 5 23/41 m24c16-w m24c16-r m24c16-f dc and ac parameters 40 figure 11. ac measure ment i/o waveform table 9. ac measurement conditions symbol parameter min. max. unit c bus load capacitance 100 pf - scl input rise/fall time, sda input fall time - 50 ns - input levels 0.2 v cc to 0.8 v cc v - input and output timing reference levels 0.3 v cc to 0.7 v cc v table 10. input parameters symbol parameter (1) 1. characterized only, not tested in production. test condition min. max. unit c in input capacitance (sda) - - 8 pf c in input capacitance (other pins) - - 6 pf z l input impedance (wc ) v in < 0.3 v cc 30 - k z h v in > 0.7 v cc 500 - k table 11. cycling performance symbol parameter test condition max. unit ncycle write cycle endurance t a 25 c, v cc (min) < v cc < v cc (max) 4,000,000 (1) 1. cycling performance for products iden tified by process letter t (previou s products were specified with 1 million cycles at 25 c). write cycle t a = 85 c, v cc (min) < v cc < v cc (max) 1,200,000 table 12. memory ce ll data retention parameter test condition min. unit data retention (1) 1. the data retention behavior is checked in production, while the data retent ion limit defined in this table is extracted from characteriza tion and qualification results. t a = 55 c 200 (2) 2. for products identified by process letter t (previous products were specified with a data retention of 40 years at 55c). year -36 6 ## 6 ## 6 ## 6 ## )nputandoutput 4imingreferencelevels )nputvoltagelevels
dc and ac parameters m24c16-w m24c16-r m24c16-f 24/41 docid023494 rev 5 table 13. dc characteristics (m24c16-w, device grade 6) symbol parameter test conditions (in addition to those in table 5 and table 9 ) min. max. unit i li input leakage current (scl, sda) v in = v ss or v cc , device in standby mode - 2a i lo output leakage current sda in hi-z, external voltage applied on sda: v ss or v cc - 2a i cc supply current (read) v cc = 5.5 v, f c = 400 khz - 1 ma v cc = 2.5 v, f c = 400 khz - 1 ma i cc0 supply current (write) value overaged over t w , 2.5 v v cc 5.5 v -1 (1) 1. characterized only (not tested in production) fo r devices identified by process letter t. i cc0(max) is lower than 0.5 ma when writing data with an ambient temperature greater than 25 c. ma i cc1 standby supply current device not selected (2) , v in = v ss or v cc , v cc = 2.5 v 2. the device is not selected after power-up, after a read instruction (after the stop condition), or after the completion of the internal write cycle t w (t w is triggered by the correct decoding of a write instruction). -2 (3) 3. 1 a for previous devices ident ified by process letters g or s. a device not selected (2) , v in = v ss or v cc , v cc = 5.5 v -3 (3) a v il input low voltage (scl, sda, wc ) - ?0.45 0.3 v cc v v ih input high voltage (scl, sda, wc) -0.7 v cc v cc +1 v v ol output low voltage i ol = 2.1 ma, v cc = 2.5 v or i ol = 3 ma, v cc = 5.5 v -0.4v
docid023494 rev 5 25/41 m24c16-w m24c16-r m24c16-f dc and ac parameters 40 table 14. dc characteristics (m24c16-r, device grade 6) symbol parameter test conditions (1) (in addition to those in table 6 and table 9 ) 1. if the application uses the voltage range r device with 2.5 v v cc 5.5 v and -40 c < t a < +85 c, please refer to table 13 instead of this table. min. max. unit i li input leakage current (scl, sda) v in = v ss or v cc , device in standby mode - 2a i lo output leakage current sda in hi-z, external voltage applied on sda: v ss or v cc - 2a i cc supply current (read) v cc = 1.8 v, f c = 400 khz - 0.8 ma i cc0 supply current (write) value overaged over t w , v cc 2.5 v -1 (2) 2. characterized only (not tested in production) fo r devices identified by process letter t. i cc0(max) is lower than 0.5 ma when writing data with an ambient temperature greater than 25 c. ma i cc1 standby supply current device not selected (3) , v in = v ss or v cc , v cc = 1.8 v 3. the device is not selected after power-up, after a re ad instruction (after the stop condition), or after the completion of the internal write cycle t w (t w is triggered by the correct decoding of a write instruction). -1a v il input low voltage (scl, sda, wc ) 2.5 v v cc ?0.45 0.3 v cc v v cc < 2.5 v ?0.45 0.25 v cc v v ih input high voltage (scl, sda) v cc < 2.5 v 0.75 v cc 6.5 v input high voltage (wc ) v cc < 2.5 v 0.75 v cc v cc + 0.6 v v ol output low voltage i ol = 0.7 ma, v cc = 1.8 v - 0.2 v
dc and ac parameters m24c16-w m24c16-r m24c16-f 26/41 docid023494 rev 5 table 15. dc characteristic s (m24c16-f device grade 6) symbol parameter test conditions (1) (in addition to those in table 7 , table 8 and table 9 ) 1. if the application uses the voltage range f device with 2.5 v v cc 5.5 v, please refer to table 13 instead of this table. min. max. unit i li input leakage current (scl, sda) v in = v ss or v cc , device in standby mode - 2a i lo output leakage current v out = v ss or v cc, sda in hi-z - 2 a i cc supply current (read) v cc = 1.6 v (2) or 1.7 v, f c = 400 khz 2. 1.6 v for devices identi fied by process letter t. -0.8ma i cc0 supply current (write) value overaged over t w , v cc 2.5 v -1 (3) 3. characterized only (not tested in production) for devices identified by process letter t. i cc0(max) is lower than 0.5 ma when writing data with an ambient temperature greater than 25 c. ma i cc1 standby supply current device not selected (4) , v in = v ss or v cc , v cc 1.8 v 4. the device is not selected after power-up, after a re ad instruction (after the stop condition), or after the completion of the internal write cycle t w (t w is triggered by the correct decoding of a write instruction). -1a v il input low voltage (scl, sda, wc ) 2.5 v v cc ?0.45 0.3 v cc v v cc < 2.5 v ?0.45 0.25 v cc v v ih input high voltage (scl, sda) v cc < 2.5 v 0.75 v cc 6.5 v input high voltage (wc ) v cc < 2.5 v 0.75 v cc v cc +0.6 v v ol output low voltage i ol = 0.7 ma, v cc 1.8 v - 0.2 v
docid023494 rev 5 27/41 m24c16-w m24c16-r m24c16-f dc and ac parameters 40 table 16. 400 khz ac characteristics symbol alt. parameter min. max. unit f c f scl clock frequency - 400 khz t chcl t high clock pulse width high 600 - ns t clch t low clock pulse width low 1300 - ns t ql1ql2 (1) 1. characterized only, not tested in production. t f sda (out) fall time 20 (2) 2. with c l = 10 pf. 300 ns t xh1xh2 t r input signal rise time (3) 3. there is no min. or max. values for the input signal rise and fall times. it is however recommended by the i2c specification that the input signal rise and fa ll times be more than 20 ns and less than 300 ns when f c < 400 khz. (3) ns t xl1xl2 t f input signal fall time (3) (3) ns t dxch t su:dat data in set up time 100 - ns t cldx t hd:dat data in hold time 0 - ns t clqx (4) 4. the min value for t clqx (data out hold time) of the m24xxx devices offers a safe timing to bridge the undefined region of the falling edge scl. t dh data out hold time 100 - ns t clqv (5) 5. t clqv is the time (from the falling edge of scl) requi red by the sda bus line to reach either 0.3 v cc or 0.7 v cc , assuming that r bus c bus time constant is within the values specified in figure 13. t aa clock low to next data valid (access time) - 900 ns t chdl t su:sta start condition setup time 600 - ns t dlcl t hd:sta start condition hold time 600 - ns t chdh t su:sto stop condition set up time 600 - ns t dhdl t buf time between stop condition and next start condition 1300 - ns t w t wr write time - 5 ms t ns (1) - pulse width ignored (input filter on scl and sda) - single glitch - 100 ns
dc and ac parameters m24c16-w m24c16-r m24c16-f 28/41 docid023494 rev 5 table 17. 100 khz ac characteristics (i 2 c standard mode) (1) 1. values recommended by the i 2 c bus standard-mode specification for a robust design of the i 2 c bus application. note that the m24x xx devices decode correctly fast er timings as specified in table 16: 400 khz ac characteristics . symbol alt. parameter min. max. unit f c f scl clock frequency - 100 khz t chcl t high clock pulse width high 4 - s t clch t low clock pulse width low 4.7 - s t xh1xh2 t r input signal rise time - 1 s t xl1xl2 t f input signal fall time - 300 ns t ql1ql2 (2) 2. characterized only. t f sda fall time - 300 ns t dxch t su:dat data in setup time 250 - ns t cldx t hd:dat data in hold time 0 - ns t clqx (3) 3. to avoid spurious start and stop conditions, a minimum delay is plac ed between scl=1 and the falling or rising edge of sda. t dh data out hold time 200 - ns t clqv (4) 4. t clqv is the time (from the falling edge of scl) requ ired by the sda bus line to reach either 0.3 v cc or 0.7 v cc , assuming that rbus cbus time const ant is within the values specified in figure 13 . t aa clock low to next data valid (access time) - 3450 ns t chdl (5) 5. for a restart condition, or following a write cycle. t su:sta start condition setup time 4.7 - s t dlcl t hd:sta start condition hold time 4 - s t chdh t su:sto stop condition setup time 4 - s t dhdl t buf time between stop condition and next start condition 4.7 - s t w t wr write time - 5 ms t ns (2) - pulse width ignored (input filter on scl and sda), single glitch - 100 ns
docid023494 rev 5 29/41 m24c16-w m24c16-r m24c16-f dc and ac parameters 40 figure 12. maximum r bus value versus bus parasitic capacitance (c bus ) for an i 2 c bus at maximum frequency f c = 400 khz figure 13. ac waveforms aib "uslinecapacitorp& "uslinepull upresistor k )#bus master -xxx 2 bus 6 ## # bus 3#, 3$! 2 bus # bus ns (ere2 bus # bus ns k ? p& 4he2x#timeconstant mustbebelowthens timeconstantlinerepresented ontheleft bus bus 6&/ 6'$2xw 6&/ 6'$,q 'dwdydolg w&/49 w&/4; w&+'+ 6wrs frqglwlrq w&+'/ 6wduw frqglwlrq :ulwhf\foh w: $,m 'dwdydolg w4/4/ 6'$,q w&+'/ 6wduw frqglwlrq w';&+ w&/'; 6'$ ,qsxw 6'$ &kdqjh w&+'+ w'+'/ 6wrs frqglwlrq 6wduw frqglwlrq w;+;+ 6&/ w&+&/ w'/&/ w&/&+ w;+;+ w;/;/ w;/;/ w&+&/
package mechanical data m24c16-w m24c16-r m24c16-f 30/41 docid023494 rev 5 9 package mechanical data in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack ? is an st trademark. for die information concerning the m24c16 deliv ered in unsawn wafer, please contact your nearest st sales office. figure 14. ufdfpn5 (mlp5) ? package outline (ufdfpn: ultra thin fine pitch dual flat package, no lead) 1. on the bottom side, pin 1 is identified by the specif ic pad shape and, on the top side, pin 1 is defined from the orientation of the marking: when reading the ma rking, pin 1 is below the upper left package corner. table 18. ufdfpn5 (mlp5) ? package dimensions (ufdfpn: ultra thin fine pitch dual flat package, no lead) symbol millimeters inches (1) 1. values in inches are converted fr om mm and rounded to four decimal digits. typ min max typ min max a 0.550 0.500 0.600 0.0217 0.0197 0.0236 a1 ? 0 0.050 ? 0 0.0020 b 0.220 0.180 0.260 0.0087 0.0071 0.0102 d 1.700 1.600 1.800 0.0669 0.0630 0.0709 d1 1.500 1.400 1.600 0.0591 0.0551 0.0630 e 1.400 1.300 1.500 0.0551 0.0512 0.0591 e1 0.220 0.180 0.260 0.0087 0.0071 0.0102 e 0.400 ? ? 0.0157 ? ? l 0.550 0.500 0.600 0.0217 0.0197 0.0236 k 0.400 ? ? 0.0157 ? ? 7rsylhz pdunlqjvlgh ' ( 6lghylhz $ $ $8.b0(b9 %rwwrpylhz sdgvvlgh ' ( e n / h 3lq 3lq
docid023494 rev 5 31/41 m24c16-w m24c16-r m24c16-f package mechanical data 40 figure 15. ufdfpn8 (mlp8) ? package outline (ufdfpn: ultra thin fine pitch dual flat package, no lead) 1. drawing is not to scale. 2. the central pad (the area e2 by d2 in the above illustration) must be either connected to v ss or left floating (not connected) in the end application. table 19. ufdfpn8 (mlp8) ? package dimensions (ufdfpn: ultra thin fine pitch dual flat package, no lead) symbol millimeters inches (1) 1. values in inches are converted fr om mm and rounded to four decimal digits. typ min max typ min max a 0.550 0.450 0.600 0.0217 0.0177 0.0236 a1 0.020 0.000 0.050 0.0008 0.0000 0.0020 b 0.250 0.200 0.300 0.0098 0.0079 0.0118 d 2.000 1.900 2.100 0.0787 0.0748 0.0827 d2 (rev mc) ? 1.200 1.600 ? 0.0472 0.0630 e 3.000 2.900 3.100 0.1181 0.1142 0.1220 e2 (rev mc) ? 1.200 1.600 ? 0.0472 0.0630 e 0.500 ? ? 0.0197 ? ? k (rev mc) ? 0.300 ? ? 0.0118 ? l ? 0.300 0.500 ? 0.0118 0.0197 l1 ? ? 0.150 ? ? 0.0059 l3 ? 0.300 ? ? 0.0118 ? eee (2) 2. applied for exposed die paddle and terminals. exclude embedding part of exposed die paddle from measuring. ? 0.080 ? ? 0.0031 ? $ % :7?-%e6 ! ! eee , e b $ , % , 0in +
package mechanical data m24c16-w m24c16-r m24c16-f 32/41 docid023494 rev 5 figure 16. tssop8 ? 8-lead thin shrink small outline, package outline 1. drawing is not to scale. table 20. tssop8 ? 8-lead thin shrink small outline, package mechanical data symbol millimeters inches (1) 1. values in inches are converted from mm and rounded to four decimal digits. typ. min. max. typ. min. max. a ? ? 1.200 ? ? 0.0472 a1 ? 0.050 0.150 ? 0.0020 0.0059 a2 1.000 0.800 1.050 0.0394 0.0315 0.0413 b ? 0.190 0.300 ? 0.0075 0.0118 c ? 0.090 0.200 ? 0.0035 0.0079 cp ? ? 0.100 ? ? 0.0039 d 3.000 2.900 3.100 0.1181 0.1142 0.1220 e 0.650 ? ? 0.0256 ? ? e 6.400 6.200 6.600 0.2520 0.2441 0.2598 e1 4.400 4.300 4.500 0.1732 0.1693 0.1772 l 0.600 0.450 0.750 0.0236 0.0177 0.0295 l1 1.000 ? ? 0.0394 ? ? ? 0 8 ? 0 8
docid023494 rev 5 33/41 m24c16-w m24c16-r m24c16-f package mechanical data 40 figure 17. so8n ? 8-lead plas tic small outline, 150 mils body width, package outline 1. drawing is not to scale. table 21. so8n ? 8-lead pl astic small outline, 150 mils body width, package data symbol millimeters inches (1) 1. values in inches are converted fr om mm and rounded to four decimal digits. typ min max typ min max a ? ? 1.750 ? ? 0.0689 a1 ? 0.100 0.250 ? 0.0039 0.0098 a2 ? 1.250 ? ? 0.0492 ? b ? 0.280 0.480 ? 0.0110 0.0189 c ? 0.170 0.230 ? 0.0067 0.0091 ccc ? ? 0.100 ? ? 0.0039 d 4.900 4.800 5.000 0.1929 0.1890 0.1969 e 6.000 5.800 6.200 0.2362 0.2283 0.2441 e1 3.900 3.800 4.000 0.1535 0.1496 0.1575 e 1.270 ? ? 0.0500 ? ? h ? 0.250 0.500 ? 0.0098 0.0197 k ? 0 8 ? 0 8 l ? 0.400 1.270 ? 0.0157 0.0500 l1 1.040 ? ? 0.0409 ? ? 62$ ( fff e h $ ' f ( k[? $ n pp / / $ *$8*(3/$1(
package mechanical data m24c16-w m24c16-r m24c16-f 34/41 docid023494 rev 5 figure 18. pdip8 ? 8-pin plastic dip, 0.25 mm lead frame, package outline 1. drawing is not to scale. 2. not recommended for new designs. table 22. pdip8 ? 8-pin plastic dip, 0.25 mm lead frame, package mechanical data symbol millimeters inches (1) 1. values in inches are converted from mm and rounded to four decimal digits. typ. min. max. typ. min. max. a ? ? 5.33 ? ? 0.2098 a1 ? 0.38 ? ? 0.0150 ? a2 3.30 2.92 4.95 0.1299 0.1150 0.1949 b 0.46 0.36 0.56 0.0181 0.0142 0.0220 b2 1.52 1.14 1.78 0.0598 0.0449 0.0701 c 0.25 0.20 0.36 0.0098 0.0079 0.0142 d 9.27 9.02 10.16 0.3650 0.3551 0.4000 e 7.87 7.62 8.26 0.3098 0.3000 0.3252 e1 6.35 6.10 7.11 0.2500 0.2402 0.2799 e 2.54 ? ? 0.1000 ? ? ea 7.62 ? ? 0.3000 ? ? eb ? ? 10.92 ? ? 0.4299 l 3.30 2.92 3.81 0.1299 0.1150 0.1500 0$)0 " ! ! ! , be $ % c e! b e" %
docid023494 rev 5 35/41 m24c16-w m24c16-r m24c16-f package mechanical data 40 figure 19. m24c16-fcs5tp/s wlcsp 5 bumps package outline 1. drawing is not to scale. "ump $etail! rotatedby? 7aferbackside 3ideview /rientationreference /rientationreference $etail! "umpside ! ! e e e ! " # ' & ! % $ b #j?-%?6 bbb : x : : 8 ccc- 9 ? ? ddd-
package mechanical data m24c16-w m24c16-r m24c16-f 36/41 docid023494 rev 5 table 23. m24c16-fcs5tp/s wlcsp 5 bumps package data symbol millimeters inches (1) 1. values in inches are converted fr om mm and rounded to four decimal digits. typ min max typ min max a 0.545 0.490 0.600 0.0215 0.0192 0.0236 a1 0.190 ? ? 0.0075 ? ? a2 0.355 ? ? 0.0140 ? ? b 0.270 ? ? 0.0106 ? ? d 1.255 ? 1.370 0.0494 ? 0.0539 e 1.210 ? 1.325 0.0476 ? 0.0522 e 0.400 ? ? 0.0157 ? ? e1 0.693 ? ? 0.0273 ? ? e2 0.346 ? ? 0.0136 ? ? f 0.405 ? ? 0.0159 ? ? g 0.281 ? ? 0.0111 ? ? n (number of terminals) 5 aaa 0.110 ? ? 0.0043 ? ? bbb 0.110 ? ? 0.0043 ? ? ccc 0.110 ? ? 0.0043 ? ? ddd 0.060 ? ? 0.0024 ? ? eee 0.060 ? ? 0.0024 ? ?
docid023494 rev 5 37/41 m24c16-w m24c16-r m24c16-f part numbering 40 10 part numbering table 24. ordering information scheme example: m24c16 w mc 6 t p /s device type m24 = i 2 c serial access eeprom device function c16 = 16 kbit (2 k x 8 bit) operating voltage w = v cc = 2.5 v to 5.5 v r = v cc = 1.8 v to 5.5 v f = v cc = 1.6 v or 1.7 v to 5.5 v package bn = pdip8 mn = so8 (150 mil width) dw = tssop8 (169 mil width) mc = ufdfpn8 (mlp8) mh = ufdfpn5 (mlp5) cs = wlcsp (chip scale package) (1) 1. ordering information = m24c16-fcs5tp/s device grade 5 = consumer: device tested with standard test flow over ?20 to 85c 6 = industrial: device tested with standard test flow over ?40 to 85 c option t = tape and reel packing blank = tube packing plating technology p or g = ecopack ? (rohs compliant) process /s = manufacturing technology code (2) 2. the process letter is used only when ordering wlc sp packages, the process lette r is not specified when ordering any other package. thes e process letters appear on the device package (marking) and on the shipment box. please contact your nearest st sales office for further information.
part numbering m24c16-w m24c16-r m24c16-f 38/41 docid023494 rev 5 table 25. ordering information scheme (unsawn wafer) (1) 1. for all information concerning the m24c16 delivered in unsawn wafer, please contact your nearest st sales office. example: m24c16 - f t w 20 i / 90 device type m24 = i 2 c serial access eeprom device function c16 = 16 kbit (2 x 8 bit) operating voltage f = v cc = 1.7 v to 5.5 v process t = f8h delivery form w = unsawn wafer wafer thickness 20 = non-backlapped wafer wafer testing i = inkless test device grade 0c to 85c
docid023494 rev 5 39/41 m24c16-w m24c16-r m24c16-f revision history 40 11 revision history table 26. document revision history date revision changes 05-oct-2012 1 initial release resulting from splitting datasheet m24c16 revision 17 as follows: ? m24c16-125 datasheet for aut omotive products (range 3) ? m24c16-w m24c16-r m24c16-f (this datasheet) for standard products range updated in section 8: dc a nd ac parameters : ? esd value in table 5: operating conditions (voltage range w) ? extended temperature range in table 14: operating conditions (voltage range f) ?i cc standby in table 13: dc characteristics (m24c16-w, device grade 6) added dimensions in table 23: m24c16-fcs5tp/s wlcsp 5 bumps package data and figure 19: m24c16-fcs5tp/s wlcsp 5 bumps package outline . 19-mar-2013 2 reformatted document. added ufdfpn5 package. rephrased text in section 6: initial delivery state . renamed figure 15 and table 43 . modified note 1 under table 9 . 10-jul-2013 3 updated: ? features : cycling performance and data retention. ? table 12: memory cell data retention ? note (1) under table 4: absolute maximum ratings . added table 20: cycling performance .
revision history m24c16-w m24c16-r m24c16-f 40/41 docid023494 rev 5 09-oct-2013 4 replaced ?wlcsp? by ?m24c16-fcs5tp/s wlcsp? across the doc- ument. added: table 7: operating conditions (voltage range f, for devices identified by process letter t) and table 8: operating conditions (volt- age range f, for all other devices) . updated: ? ?single supply voltage? in features ? section 1: description ? table 14: dc characteristics (m24c16-r, device grade 6) and table 15: dc characteristics (m24c16-f device grade 6) ? figure 13: ac waveforms (third waveform) ? table 24: ordering information scheme : added note 1 for wlcsp package. 15-sep-2014 5 added reference to unsawn wafer availability on: ? cover page, ? section 9 ? table 25 ? note 2 on table 12 updated figure 4 removed figure 5 and table 9 related to revision 4. updated: ? note 1 on ta ble 11 and table 12 ?i li parameter on table 13 ?i li parameter on table 14 ?i li parameter on table 15 ? table 24 table 26. document revision history (continued) date revision changes
docid023494 rev 5 41/41 m24c16-w m24c16-r m24c16-f 41 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2014 stmicroelectronics ? all rights reserved

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