document number: 61046 revision 28-mar-03 www.vishay.com 116 MTT vishay electro-films chip resistor arrays vishay electro-films ?france +33.4.93.37.28.24 fax: +33.4.93.37.27.31 ?germany +49.9287.710 fax: +49 9287.70435 ?israel +9 72.3.557.0945 fax: +972.3.558.9121 ?italy + 39.2.300.11911 fax: +39.2.300.11999 ?japan +81.3.5464.6411 fax: +81.3.5464.6433 ?singapore +65.788.6668 fax: +65. 788.0988 ?sweden +46.8.594.70590 fax: +46.8.594.70581 ?uk +44 191 514 8237 fax: +44 1953 457 722 ?usa: (401) 738-9150 fax: (401) 738 -4389 thin film multi-tap resistors features selectable values by wire bonding resistance range: 1.1k ? to 275k ? chip size: 0.038 inches square resistor material tantalum nitride, self-passivating oxidized silicon substrate for good power dissipation ideally suited for hybrid prototyping the MTT multi-tap resistors offer nineteen taps allowing the user to select specified increments and a wide range of values. the desired resistance value is obtained by bonding the wires to the appropriate pads. these chips are manufactured using vishay electro-films (efi) sophisticated thin film equipment and manufacturing technology. the MTT s are 100% electrically tested and visually inspected to mil-std-883. standard electrical specifications temperature coefficient of resistance, value and tolerances applications the MTT series of multi-tap resistor chips are designed to satisfy the requirements of prototype development and circuit trimming in hybrid packages through selective wire-bonding. total resistance range 1.1k ? , 2.75k ? , 5.5k ? , 11k ? , 27.5k ? , 55k ? , 110k ? , 275k ? 10 resistors between pads 1 and 11 each 9.1% of total resistance 10 resistors between pads 11 and 21 each 0.91% of total resistance standard tolerances 1%, 5%, 10%, 20% of total resistance of all 20 resistors tcr 250ppm/ c parameter tcr tracking between elements 5ppm/ c noise, mil-std-202, method 308 - 30db typical moisture resistance, mil-std-202, method 106 0.5% maximum ? r/r stability, 1000 hours, + 125 c, 125mw 0.5% maximum ? r/r operating temperature range - 55 c to + 125 c thermal shock, mil-std-202 method 107, test condition f 0.25% maximum ? r/r high temperature exposure 150 c, 100 hours 0.5% maximum ? r/r dielectric voltage breakdown 200v insulation resistance 10 12 minimum operating voltage 100v maximum dc power rating at + 70 c, (derated to zero at 175 c) 250mw, total r 5 x rated power short-time overload, + 25 c, 5 seconds 0.25% maximum ? r/r example: when the total resistance value is 55k ? , the resistors between pads 11 and 21 are 500 ? each, and the resistors between pads 1 and 11 are 5k ? each. product may not be to scale
www.vishay.com 117 MTT vishay electro-films document number: 61046 revision 28-mar-03 chip resistor arrays vishay electro-films ?france +33.4.93.37.28.24 fax: +33.4.93.37.27.31 ?germany +49.9287.710 fax: +49 9287.70435 ?israel +9 72.3.557.0945 fax: +972.3.558.9121 ?italy + 39.2.300.11911 fax: +39.2.300.11999 ?japan +81.3.5464.6411 fax: +81.3.5464.6433 ?singapore +65.788.6668 fax: +65. 788.0988 ?sweden +46.8.594.70590 fax: +46.8.594.70581 ?uk +44 191 514 8237 fax: +44 1953 457 722 ?usa: (401) 738-9150 fax: (401) 738 -4389 mechanical specifications in inches dimensions in inches example: 100% visualled, 55k ? , 10%, 250ppm/ c tcr, aluminum pads, class h p/n: w MTT 002 5500 1 k inspection product process resistance multiplier tolerance /packaging family code value code code w = 100% visually 002 = class h use first 4 a = 0.1 k = 10% inspected parts 008 = class k significant digits 0 = 1 m = 20% in matrix tray per see process code of the resistance (r t ) 1 = 10 l = 25% mil-std-883 table 2 = 100 n = 50% x = sample, commercial visually inspected parts in matrix trays (4% aql) ordering information options: gold back for eutectic die attach gold bonding pads 15k? minimum thickness other values available on request, consult application engineer parameter chip size 0.038 x 0.038 0.002 (0.762 x 0.762mm) chip thickness 0.010 0.002 (0.254 0.05mm) chip substrate material oxidized silicon, 10k? minimum sio 2 resistor material tantalum nitride, self-passivating bonding pads 0.004 x 0.004 (0.10 x 0.10mm) number of pads 21 pad material 10k? minimum aluminum backing none, lapped semiconductor silicon 0.038 0.038 0.009 0.004 0.004 0.004 0.004 0.009 typical range 11k ? - 275k ? typical range 1.0k ? - 5.5k ? thin film multi-tap resistors 21 1 1 21 schematic 21 1 r rr r 10r 10r 10r 10r r 10r 10r 10r 10r 10r 10r r rr r r r t = 110r
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