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  tgc2610 - sm 10 ghz C 15.4 ghz downconverter preliminary datasheet: rev d 8 - 13 - 14 - 1 of 17 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com applications ? vsat ? point - to - point radio ? test equipment & sensors 28 - pin 5x5 mm qfn package product features ? C ? C ? C ? ? ? ? noise figure: 2.5 db ? functional block diagram pin configuration pin no. label 1, 2, 4, 6, 7, 8, 12, 14, 15, 16, 18, 20, 21, 22, 23, 25, 26, 27, 28 gnd 3 rf i n 5 vgx 9 lo i n 10, 11 nc 13 vdlo 17 ifout_ l sb 19 ifout_u sb 24 vdlna general description the triquint tgc 2610 - sm is a k u - band image reject downc onverter. the tgc 2610 - sm operates over an rf frequency range of 10 to 15.4 ghz and lo from 6 to 19 ghz with if outputs from dc to 4 ghz. this part is designed using triquints phemt C ordering information part no. eccn description tgc2610 - sm ear99 10 ghz C standar d t/r size = 500 pieces on a 7 reel
tgc2610 - sm 10 ghz C 15.4 ghz downconverter preliminary datasheet: rev d 8 - 13 - 14 - 2 of 17 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com recommended operating conditions parameter min typ max units operating temperature range - 40 +25 +85 c vdrf 3 4 5 v idrf 88 ma vdlo 3 4 5 v idlo 71 ma vgx see note lo input power 0 4 8 db m electrical specifications are measured at specified test conditions. specifications are not guaranteed over all recommended operating conditions. note: vgx is connected to 23 ohm resistor to ground absolute maximum ratings parameter rating vdlna 6 v vdlo 6 v idrf 140 ma idlo 150 ma vgx 0 v power dissipation, pdiss 1.7 w rf input power, cw, t = 25 c 16 dbm channel temperature, tch 200 c mounting temperature (30 sec ) 260 c storage temperature - 65 to 125 c operation of this device outside the parameter ranges given above may cause permanent damage. electrical specifications test conditions unless otherwise noted: : if input power = - 20 dbm, lo input power = 4 dbm, vdlo = 4 v, idlo = 65 ma, vdrf = 4 v, idrf = 58 ma . parameter conditions min typ max units rf frequency range 10 15.4 ghz lo frequency range 6 19 ghz if frequency range 0 4 ghz lo input power 0 4 8 db m drain current, lo (idlo) 70 ma drain current, rf (idrf) 90 ma conversion gain 14 db input third order intercept point (iip3) 2 dbm image rejection (imr) 18 db noise figure 2 db notes: 1.
tgc2610 - sm 10 ghz C 15.4 ghz downconverter preliminary datasheet: rev d 8 - 13 - 14 - 3 of 17 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com specifications thermal and reliability information parameter conditions rating thermal resistance, jc , measured to back of package tbase = 85 c jc = 75.5 c/w channel temperature (tch), and median lifetime (tm) tbase = 85 c vd = 4 v id = 16 0 m a lo power = 4dbm pdiss = 0.6 4 w tch = 133 c tm = 1.8 e +9 hours
tgc2610 - sm 10 ghz C 15.4 ghz downconverter preliminary datasheet: rev d 8 - 13 - 14 - 4 of 17 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com typical performance if input power = - 25 dbm, vdlo = 4 v, idlo = 65 ma, vdrf = 4 v, idrf = 85 ma . data taken with external if hybrid . charts are individual chart tabs in excel paste from excel as enhanced metafile, 2.3 x 3.4 inches, lock aspect ratio unchecked 4 6 8 10 12 14 16 18 10 11 12 13 14 15 16 conversion gain (db) frequency (ghz) conversion gain vs. rf vs. if lsb, 25 c 3ghz 2ghz 1ghz 4ghz 4 6 8 10 12 14 16 18 10 11 12 13 14 15 16 conversion gain (db) frequency (ghz) conversion gain vs. rf vs. if usb, 25 c 3ghz 2ghz 1ghz 4ghz 4 6 8 10 12 14 16 18 10 11 12 13 14 15 16 conversion gain (db) frequency (ghz) conversion gain vs. rf vs. lo power lsb, 25 c 8 dbm 4 dbm 0 dbm 4 6 8 10 12 14 16 18 10 11 12 13 14 15 16 conversion gain (db) frequency (ghz) conversion gain vs. rf vs. lo power usb, 25 c 8 dbm 4 dbm 0 dbm 4 6 8 10 12 14 16 18 1.0 1.5 2.0 2.5 3.0 3.5 4.0 conversion gain (db) frequency (ghz) conversion gain vs. if vs. rf lsb, 25 c 15.5ghz 13.5ghz 10.5ghz 4 6 8 10 12 14 16 18 1.0 1.5 2.0 2.5 3.0 3.5 4.0 conversion gain (db) frequency (ghz) conversion gain vs. if vs. rf usb, 25 c 15ghz 13ghz 10ghz
tgc2610 - sm 10 ghz C 15.4 ghz downconverter preliminary datasheet: rev d 8 - 13 - 14 - 5 of 17 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com typical performance if input power = - 25 dbm, vdlo = 4 v, idlo = 65 ma, vdrf = 4 v, idrf = 85 ma. data taken with external if hybrid . 20 22 24 26 28 30 32 34 36 38 40 10 11 12 13 14 15 16 lo - if isolation (db) frequency (ghz) lo to if isolation vs. rf lsb, 25 c 20 22 24 26 28 30 32 34 36 38 40 10 11 12 13 14 15 16 lo - if isolation (db) frequency (ghz) lo to if isolation vs. rf usb, 25 c 20 23 26 29 32 35 38 41 44 47 50 10 11 12 13 14 15 16 lo - rf isolation (db) frequency (ghz) lo to rf isolation vs. rf lsb, 25 c 20 23 26 29 32 35 38 41 44 47 50 10 11 12 13 14 15 16 lo - rf isolation (db) frequency (ghz) lo to rf isolation vs. rf lsb, 25 c -5 0 5 10 15 20 10 11 12 13 14 15 16 rf - if isolation (db) frequency (ghz) rf to if isolation vs. rf vs. if lsb, 25 c 3ghz 2ghz 1ghz 4ghz -5 0 5 10 15 20 10 11 12 13 14 15 16 rf - if isolation (db) frequency (ghz) rf to if isolation vs. rf vs. if usb, 25 c 3ghz 2ghz 1ghz 4ghz
tgc2610 - sm 10 ghz C 15.4 ghz downconverter preliminary datasheet: rev d 8 - 13 - 14 - 6 of 17 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com typical performance if input power = - 25 dbm, vdlo = 4 v, idlo = 65 ma, vdrf = 4 v, idrf = 85 ma. data taken with external if hybrid . -10 -8 -6 -4 -2 0 2 4 6 8 10 10 11 12 13 14 15 16 input third order intercept point (dbm) frequency (ghz) input ip3 vs. rf vs. if lsb, 25 c 3ghz 2ghz 1ghz 4ghz -10 -8 -6 -4 -2 0 2 4 6 8 10 10 11 12 13 14 15 16 input third order intercept point (dbm) frequency (ghz) input ip3 vs. rf vs. if usb, 25 c 3ghz 2ghz 1ghz 4ghz -10 -8 -6 -4 -2 0 2 4 6 8 10 10 11 12 13 14 15 16 input third order intercept point (dbm) frequency (ghz) input ip3 vs. rf vs. lo power lsb, 25 c 8 dbm 4 dbm 0 dbm -10 -8 -6 -4 -2 0 2 4 6 8 10 10 11 12 13 14 15 16 input third order intercept point (dbm) frequency (ghz) input ip3 vs. rf vs. lo power usb, 25 c 8 dbm 4 dbm 0 dbm -15 -13 -11 -9 -7 -5 -3 10 11 12 13 14 15 16 input p1db compression pt (dbm) frequency (ghz) input p1db compression pt. vs. rf vs. if lsb, 25 c 3ghz 2ghz 1ghz 4ghz -15 -13 -11 -9 -7 -5 -3 10 11 12 13 14 15 16 input p 1 db compression pt (dbm) frequency (ghz) input p1db compression pt. vs. rf vs. if usb, 25 c 3 ghz 2 ghz 1 ghz 4 ghz
tgc2610 - sm 10 ghz C 15.4 ghz downconverter preliminary datasheet: rev d 8 - 13 - 14 - 7 of 17 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com typical performance if input power = - 25 dbm, vdlo = 4 v, idlo = 65 ma, vdrf = 4 v, idrf = 85 ma. data taken with external if hybrid . 10 14 18 22 26 30 34 38 42 46 50 10 11 12 13 14 15 16 image rejection (db) frequency (ghz) image rejection vs. rf vs. if lsb, 25 c 3ghz 2ghz 1ghz 4ghz 10 13 16 19 22 25 28 31 34 37 40 10 11 12 13 14 15 16 image rejection (db) frequency (ghz) image rejection vs. rf vs. if usb, 25 c 3ghz 2ghz 1ghz 4ghz 0 2 4 6 8 10 12 14 16 18 20 10 11 12 13 14 15 16 17 conversion gain (db) frequency (ghz) conversion gain vs. rf vs. temperature if=1ghz, usb, 25 c - 40 c 25 c 85 c 0 2 4 6 8 10 12 14 16 18 20 10 11 12 13 14 15 16 17 conversion gain (db) frequency (ghz) conversion gain vs. rf vs. temperature if=2ghz, usb, 25 c - 40 c 25 c 85 c 0 2 4 6 8 10 12 14 16 18 20 10 11 12 13 14 15 16 17 conversion gain (db) frequency (ghz) conversion gain vs. rf vs. temperature if=3ghz, usb, 25 c - 40 c 25 c 85 c 0 2 4 6 8 10 12 14 16 18 20 10 11 12 13 14 15 16 17 conversion gain (db) frequency (ghz) conversion gain vs. rf vs. temperature if=4ghz, usb, 25 c - 40 c 25 c 85 c
tgc2610 - sm 10 ghz C 15.4 ghz downconverter preliminary datasheet: rev d 8 - 13 - 14 - 8 of 17 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com typical performance if input power = - 25 dbm, vdlo = 4 v, idlo = 65 ma, vdrf = 4 v, idrf = 85 ma. data taken with external if hybrid . 0 4 8 12 16 20 24 6 8 10 12 14 16 18 20 lo return loss (db) frequency (ghz) lo return loss vs. frequency 25 c 0 4 8 12 16 20 24 8 9 10 11 12 13 14 15 16 17 18 rf return loss (db) frequency (ghz) rf return loss vs. frequency 25 c 0 4 8 12 16 20 24 0 1 2 3 4 5 6 7 8 if return loss (db) frequency (ghz) if return loss vs. frequency 25 c if port 2 if port 1 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 10 11 12 13 14 15 16 noise figure (db) frequency (ghz) noise figure vs. rf vs. if lsb, 25 c 3ghz 2ghz 1ghz 0 0.5 1 1.5 2 2.5 3 3.5 4 10 11 12 13 14 15 16 noise figure (db) frequency (ghz) noise figure vs. rf vs. if usb, 25 c 3ghz 2ghz 1ghz 4ghz
tgc2610 - sm 10 ghz C 15.4 ghz downconverter preliminary datasheet: rev d 8 - 13 - 14 - 9 of 17 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com m x n spurious outputs for lsb, if = 2.0 ghz m x f lo 0 1 2 3 4 5 n x f rf - 5 -- 99 99 99 99 99 - 4 -- 99 99 99 99 99 - 3 -- 99 61 48 99 99 - 2 -- 99 33 48 99 99 - 1 -- 0 35 29 99 99 0 -- 17 10 46 99 99 1 15 15 45 53 99 99 2 40 57 53 99 99 99 3 47 52 99 99 99 99 4 53 55 99 99 99 99 5 58 99 99 99 99 99 m x n spurious outputs for usb, if = 2.0 ghz m x f lo 0 1 2 3 4 5 n x f rf - 5 -- 99 99 99 99 99 - 4 -- 99 99 71 99 99 - 3 -- 99 99 56 99 99 - 2 -- 99 38 32 99 99 - 1 -- 0 21 27 99 99 0 -- 11 12 23 99 99 1 12 22 33 45 99 99 2 48 56 55 55 99 99 3 56 52 59 99 99 99 4 54 55 99 99 99 99 5 51 99 99 99 99 99 typical performance if input power = - 20 dbm, vdlo = 4 v, idlo = 71 ma, vdrf = 4 v, idrf = 88 ma , lo power = 4 dbm. data taken with external if hybrid . spur tables spur tables are m ? f lo + n ? f rf mixer spurious products for - 2 0 dbm rf input power. desired if is at | 1 lo C
tgc2610 - sm 10 ghz C 15.4 ghz downconverter preliminary datasheet: rev d 8 - 13 - 14 - 10 of 17 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com p in configuration and description pin no. label description 1, 2, 4, 6, 7, 8, 12, 14, 15, 16, 18, 20, 21, 22, 23, 25, 26, 27, 28 gnd internal grounding; must be grounded on pcb. 3 rf i n rf in put matched to 50 ohms, ac coupled. 5 vgx mixer gate voltage. bias network is required; see application circuit on page 1 1 as an example. 9 lo i n lo input, matched to 50 ohms, ac coupled. 10, 11 nc no internal connection; must be grounded on pcb. 13 vdlo lo drain voltage. bias network is required; see application circuit on page 1 1 as an example. 17 ifout_ l sb if output matched to 50 ohms, dc coupled. 19 ifout_u sb if output matched to 50 ohms, dc coupled. 24 vdlna lna drain voltage. bias network is required; see application circuit on page 1 1 as an example.
tgc2610 - sm 10 ghz C 15.4 ghz downconverter preliminary datasheet: rev d 8 - 13 - 14 - 11 of 17 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com application circuit bias - up procedure bias - down procedure turn vdlo to 4 v turn off rf and lo signal s turn vdlna to 4 v turn vdlna to 0 v vgx is connected to 23 ohm resistor to ground turn vdlo to 0 v apply lo and rf signal s 1 8 5 4 25 22 18 24 23 6 7 3 2 9 16 17 lo input 2610 yyww xxxx 19 20 21 27 26 10 11 12 13 14 15 28 rf input vdlo if output usb lsb r1 50 ohm if output vdlna vgx c1 100 pf 23 ohm off board c2 100 pf c3 100 pf c4 0.01 uf c5 0.01 uf c6 0.01 uf c7 1 uf c8 1 uf c9 1 uf x1 r4 0 ohm r3 0 ohm r2 50 ohm x1
tgc2610 - sm 10 ghz C 15.4 ghz downconverter preliminary datasheet: rev d 8 - 13 - 14 - 12 of 17 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com application circuit pc board layout board material is ro4003 0.008 thickness with ? oz copper cladding. . bill of material ref des value description manufacturer part number c1, c2, c3 10 0 pf cap, 0402, 50v, 5%, npo various c4, c5, c6 0.01 f cap, 0 603 , 25v, 5%, cog various c7, c8, c9 1 f cap, 0805, 25v, 5%, x5r various u1 ku - band downconverter triquint tgc2610 - sm l sb configuration r 1 50 ohm res, 0402, 0.05w, 5%, smd various r 4 0 ohm res, 0402, 0.01w, smd various r2 , r 3 dnp x1 2 - way 90 power combiner/splitter mini - circuit qcn - 2 5+ or qcn - 45+
tgc2610 - sm 10 ghz C 15.4 ghz downconverter preliminary datasheet: rev d 8 - 13 - 14 - 13 of 17 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com mechanical information package marking and dimensions all dimensions are in millimeters. the tg c2610 - sm will be marked with the yyww designator and a lot code marked below the part designator. the yy represents the last two digits of the year the part was manufactured, the ww is the work week, and the xxxx is an auto - generated number. this package is lead - free/rohs - compliant w ith a copper alloy base (cda194), and the plating material on the leads is nipdau. it is compatible with a lead - free (maximum 260 c reflow temperature) soldering process .
tgc2610 - sm 10 ghz C 15.4 ghz downconverter preliminary datasheet: rev d 8 - 13 - 14 - 14 of 17 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com mechanical information pcb mounting pattern n otes : 1. the pad pattern shown has been developed and tested for optimized assembly at triquint semiconductor. the pcb land pattern has been developed to accommodate lead and package tolerances. since surface mount processes vary from company to company, ca reful process development is recommended. 2. ground vias are critical for the proper performance of this device. vias should have a final plated thru diameter of .25 mm (.010). 0.508 0.508
tgc2610 - sm 10 ghz C 15.4 ghz downconverter preliminary datasheet: rev d 8 - 13 - 14 - 15 of 17 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com tape and reel information standard t/r size = 500 pieces on a 7
tgc2610 - sm 10 ghz C 15.4 ghz downconverter preliminary datasheet: rev d 8 - 13 - 14 - 16 of 17 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com product compliance information esd sensitivity ratings caution! esd - sensitive device esd rating: class 1b value: 500 v and < 1000 v solderability compatible with lead - free (260c max imum reflow temperature) soldering processes. package lead plating: nipdau. the use of no - clean solder to avoid washing after soldering is recommended. this package is not compatible with solder containing lead. rohs compliance this part is compliant with eu 2002/95/ec rohs directive (restrictions on the use of certain hazardous substances in electrical and electronic equipment). this product also has the following attributes: ? ? ? ? 15 h 12 br 4 0 2 ) free ? ? msl rating msl rating: level 3 test: 260c convection reflow standard: jedec standard ipc/jedec j - std - 020 recommended solder temperature profile
tgc2610 - sm 10 ghz C 15.4 ghz downconverter preliminary datasheet: rev d 8 - 13 - 14 - 17 of 17 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com contact information for the latest specifications, additional product information, worldwide sales and distribution locations, and information about triquint: web: www.triquint.com tel: +1.972.994.8465 email: info - sales@tqs.com fax: +1.972.994.8504 for technical questions and application information: email: info - networks@tqs.com important no tice the information contained herein is believed to be reliable. triquint makes no warranties regarding the information contained herein. triquint assumes no responsibility or liability whatsoever for any of the information contained herein. triquint assumes no responsibility or liability whatsoever for the use of the information contained herein. the information contained herein is provid ed "as is, where is" and with all faults, and the entire risk associated with such information is entirely with the user. all information contained herein is subject to change without notice. customers should obtain and verify the latest relevant informa tion before placing orders for triquint products. the information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with r egard to such information itself or anything described by such information. triquint products are not warranted or authorized for use as critical components in medical, life - saving, or life - sustaining applications, or other applications where a failure w ould reasonably be expected to cause severe personal injury or death.


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