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efm8 busy bee family efm8bb2 data sheet the efm8bb2, part of the busy bee family of mcus, is a multi- purpose line of 8-bit microcontrollers with a comprehensive feature set in small packages. these devices offer high-value by integrating advanced analog and enhanced high- speed communication peripherals into small packages, making them ideal for space-con- strained applications. with an efficient 8051 core, enhanced pulse-width modulation, and precision analog, the efm8bb2 family is also optimal for embedded applications. efm8bb2 applications include the following: key features ? pipelined 8-bit c8051 core with 50 mhz maximum operating frequency ? up to 22 multifunction, 5 v tolerant i/o pins ? one 12-bit analog to digital converter (adc) ? two low-current analog comparators with build-in dac as reference input ? integrated temperature sensor ? 3-channel pwm / pca with special hardware kill/safe state capability ? five 16-bit timers ? two uarts, spi, smbus/i2c master/slave and i2c slave ? priority crossbar for flexible pin mapping ? motor control ? consumer electronics ? sensor controllers ? medical equipment ? lighting systems ? high-speed communication hub security i/o ports core / memory clock management cip-51 8051 core (50 mhz) high frequency 49 mhz rc oscillator energy management internal ldo regulator brown-out detector power-on reset 8-bit sfr bus serial interfaces timers and triggers analog interfaces spi pin reset timer 0/1/2 pca/pwm watchdog timer adc comparator 0 internal voltage reference 16-bit crc flash program memory (16 kb) ram memory (2304 bytes) debug interface with c2 lowest power mode with peripheral operational: idle normal shutdown suspend snooze 5 v-to 3.3 v ldo regulator timer 3/4 comparator 1 high frequency 24.5 mhz rc oscillator pin wakeup external interrupts general purpose i/o i 2 c / smbus 2 x uart high-speed i2c slave external cmos oscillator low frequency rc oscillator silabs.com | smart. connected. energy-friendly. rev. 1.1
1. feature list the efm8bb2 highlighted features are listed below. ? core: ? pipelined cip-51 core ? fully compatible with standard 8051 instruction set ? 70% of instructions execute in 1-2 clock cycles ? 50 mhz maximum operating frequency ? memory: ? up to 16 kb flash memory, in-system re-programmable from firmware, including 1 kb of 64-byte sectors and 15 kb of 512-byte sectors. ? up to 2304 bytes ram (including 256 bytes standard 8051 ram and 2048 bytes on-chip xram) ? power: ? 5 v-input ldo regulator ? internal ldo regulator for cpu core voltage ? power-on reset circuit and brownout detectors ? i/o: up to 22 total multifunction i/o pins: ? all pins 5 v tolerant under bias ? flexible peripheral crossbar for peripheral routing ? 5 ma source, 12.5 ma sink allows direct drive of leds ? clock sources: ? internal 49 mhz oscillator with accuracy of 1.5% ? internal 24.5 mhz oscillator with 2% accuracy ? internal 80 khz low-frequency oscillator ? external cmos clock option ? timers/counters and pwm: ? 3-channel programmable counter array (pca) supporting pwm, capture/compare, and frequency output modes ? 5 x 16-bit general-purpose timers ? independent watchdog timer, clocked from the low frequen- cy oscillator ? communications and digital peripherals: ? 2 x uart, up to 3 mbaud ? spi? master / slave, up to 12 mbps ? smbus?/i2c? master / slave, up to 400 kbps ? i 2 c high-speed slave, up to 3.4 mbps ? 16-bit crc unit, supporting automatic crc of flash at 256- byte boundaries ? analog: ? 12-bit analog-to-digital converter (adc) ? 2 x low-current analog comparators with adjustable refer- ence ? on-chip, non-intrusive debugging ? full memory and register inspection ? four hardware breakpoints, single-stepping ? pre-loaded uart bootloader ? temperature range -40 to 85 oc ? single power supply of 2.2 to 3.6 v or 3.0 to 5.25 v ? qfn28, qsop24, and qfn20 packages with on-chip power-on reset, voltage supply monitor, watchdog timer, and clock oscillator, the efm8bb2 devices are truly standalone system-on-a-chip solutions. the flash memory is reprogrammable in-circuit, providing nonvolatile data storage and allowing field up- grades of the firmware. the on-chip debugging interface (c2) allows non-intrusive (uses no on-chip resources), full speed, in-circuit debugging using the production mcu installed in the final application. this debug logic supports inspection and modification of memory and registers, setting breakpoints, single stepping, and run and halt commands. all analog and digital peripherals are fully functional while debugging. each device is specified for 2.2 to 3.6 v operation (or up to 5.25 v with the 5 v regulator option) and is available in 28- pin qfn, 20-pin qfn, or 24-pin qsop packages. all package options are lead-free and rohs compliant. efm8bb2 data sheet feature list silabs.com | smart. connected. energy-friendly. rev. 1.1 | 1
2. ordering information efm8 bb2 C 2 f 16 g a C qfn28 r tape and reel (optional) package type revision temperature grade g (-40 to +85) flash memory size C 16 kb memory type (flash) family feature set busy bee 2 family silicon labs efm8 product line figure 2.1. efm8bb2 part numbering all efm8b2 family members have the following features: ? cip-51 core running up to 50 mhz ? three internal oscillators (49 mhz, 24.5 mhz and 80 khz) ? smbus ? i2c slave ? spi ? 2 uarts ? 3-channel programmable counter array (pwm, clock generation, capture/compare) ? 5 16-bit timers ? 2 analog comparators ? 12-bit analog-to-digital converter with integrated multiplexer, voltage reference, and temperature sensor ? 16-bit crc unit ? pre-loaded uart bootloader in addition to these features, each part number in the efm8bb2 family has a set of features that vary across the product line. the product selection guide shows the features available on each family member. table 2.1. product selection guide ordering part number flash memory (kb) ram (bytes) digital port i/os (total) adc0 channels comparator 0 inputs comparator 1 inputs pb-free (rohs compliant) 5-to-3.3 v regulator temperature range package efm8bb22f16g-c-qfn28 16 2304 22 20 10 12 yes yes -40 to +85 oc qfn28 EFM8BB21F16G-C-QSOP24 16 2304 21 20 10 12 yes -40 to +85 oc qsop24 efm8bb21f16g-c-qfn20 16 2304 16 15 10 7 yes -40 to +85 oc qfn20 efm8bb2 data sheet ordering information silabs.com | smart. connected. energy-friendly. rev. 1.1 | 2
3. system overview 3.1 introduction analog peripherals digital peripherals cip-51 8051 controller core system clock configuration amux priority crossbar decoder crossbar control port i/o configuration 16 kb isp flash program memory 256 byte sram sfr bus 2048 byte xram crc 2 comparators sysclk 24.5 mhz 2% oscillator 12/10 bit adc temp sensor vref vdd vdd extclk low-freq. oscillator independent watchdog timer internal reference + - + - uart1 timers 0, 1, 2, 3, 4 3-ch pca i2c / smbus spi port 0 drivers port 1 drivers p0.n port 2 drivers p2.n p1.n cmos oscillator input 49 mhz 1.5% oscillator port 3 drivers p3.n debug / programming hardware power-on reset power net supply monitor voltage regulators vdd vregin gnd c2ck/rstb reset c2d uart0 i2c slave figure 3.1. detailed efm8bb2 block diagram efm8bb2 data sheet system overview silabs.com | smart. connected. energy-friendly. rev. 1.1 | 3
3.2 power all internal circuitry draws power from the vdd supply pin. external i/o pins are powered from the vio supply voltage (or vdd on devi- ces without a separate vio connection), while most of the internal circuitry is supplied by an on-chip ldo regulator. control over the device power can be achieved by enabling/disabling individual peripherals as needed. each analog peripheral can be disabled when not in use and placed in low power mode. digital peripherals, such as timers and serial buses, have their clocks gated off and draw little power when they are not in use. table 3.1. power modes power mode details mode entry wake-up sources normal core and all peripherals clocked and fully operational idle ? core halted ? all peripherals clocked and fully operational ? code resumes execution on wake event set idle bit in pcon0 any interrupt suspend ? core and peripheral clocks halted ? hfosc0 and hfosc1 oscillators stopped ? regulators in normal bias mode for fast wake ? timer 3 and 4 may clock from lfosc0 ? code resumes execution on wake event 1. switch sysclk to hfosc0 2. set suspend bit in pcon1 ? timer 4 event ? spi0 activity ? i2c0 slave activity ? port match event ? comparator 0 falling edge stop ? all internal power nets shut down ? 5 v regulator remains active (if enabled) ? internal 1.8 v ldo on ? pins retain state ? exit on any reset source 1. clear stopcf bit in reg0cn 2. set stop bit in pcon0 any reset source snooze ? core and peripheral clocks halted ? hfosc0 and hfosc1 oscillators stopped ? regulators in low bias current mode for energy sav- ings ? timer 3 and 4 may clock from lfosc0 ? code resumes execution on wake event 1. switch sysclk to hfosc0 2. set snooze bit in pcon1 ? timer 4 event ? spi0 activity ? i2c0 slave activity ? port match event ? comparator 0 falling edge shutdown ? all internal power nets shut down ? 5 v regulator remains active (if enabled) ? internal 1.8 v ldo off to save energy ? pins retain state ? exit on pin or power-on reset 1. set stopcf bit in reg0cn 2. set stop bit in pcon0 ? rstb pin reset ? power-on reset 3.3 i/o digital and analog resources are externally available on the devices multi-purpose i/o pins. port pins p0.0-p2.3 can be defined as gen- eral-purpose i/o (gpio), assigned to one of the internal digital resources through the crossbar or dedicated channels, or assigned to an analog function. port pins p3.0 and p3.1 can be used as gpio. additionally, the c2 interface data signal (c2d) is shared with p3.0. the port control block offers the following features: ? up to 22 multi-functions i/o pins, supporting digital and analog functions. ? flexible priority crossbar decoder for digital peripheral assignment. ? two drive strength settings for each port. ? two direct-pin interrupt sources with dedicated interrupt vectors (int0 and int1). ? up to 20 direct-pin interrupt sources with shared interrupt vector (port match). efm8bb2 data sheet system overview silabs.com | smart. connected. energy-friendly. rev. 1.1 | 4
3.4 clocking the cpu core and peripheral subsystem may be clocked by both internal and external oscillator resources. by default, the system clock comes up running from the 24.5 mhz oscillator divided by 8. the clock control system offers the following features: ? provides clock to core and peripherals. ? 24.5 mhz internal oscillator (hfosc0), accurate to 2% over supply and temperature corners. ? 49 mhz internal oscillator (hfosc1), accurate to 1.5% over supply and temperature corners. ? 80 khz low-frequency oscillator (lfosc0). ? external cmos clock input (extclk). ? clock divider with eight settings for flexible clock scaling: ? divide the selected clock source by 1, 2, 4, 8, 16, 32, 64, or 128. ? hfosc0 and hfosc1 include 1.5x pre-scalers for further flexibility. 3.5 counters/timers and pwm programmable counter array (pca0) the programmable counter array (pca) provides multiple channels of enhanced timer and pwm functionality while requiring less cpu intervention than standard counter/timers. the pca consists of a dedicated 16-bit counter/timer and one 16-bit capture/compare mod- ule for each channel. the counter/timer is driven by a programmable timebase that has flexible external and internal clocking options. each capture/compare module may be configured to operate independently in one of five modes: edge-triggered capture, software timer, high-speed output, frequency output, or pulse-width modulated (pwm) output. each capture/compare module has its own associated i/o line (cexn) which is routed through the crossbar to port i/o when enabled. ? 16-bit time base ? programmable clock divisor and clock source selection ? up to three independently-configurable channels ? 8, 9, 10, 11 and 16-bit pwm modes (center or edge-aligned operation) ? output polarity control ? frequency output mode ? capture on rising, falling or any edge ? compare function for arbitrary waveform generation ? software timer (internal compare) mode ? can accept hardware kill signal from comparator 0 efm8bb2 data sheet system overview silabs.com | smart. connected. energy-friendly. rev. 1.1 | 5
timers (timer 0, timer 1, timer 2, timer 3, and timer 4) several counter/timers are included in the device: two are 16-bit counter/timers compatible with those found in the standard 8051, and the rest are 16-bit auto-reload timers for timing peripherals or for general purpose use. these timers can be used to measure time inter- vals, count external events and generate periodic interrupt requests. timer 0 and timer 1 are nearly identical and have four primary modes of operation. the other timers offer both 16-bit and split 8-bit timer functionality with auto-reload and capture capabilities. timer 0 and timer 1 include the following features: ? standard 8051 timers, supporting backwards-compatibility with firmware and hardware. ? clock sources include sysclk, sysclk divided by 12, 4, or 48, the external clock divided by 8, or an external pin. ? 8-bit auto-reload counter/timer mode ? 13-bit counter/timer mode ? 16-bit counter/timer mode ? dual 8-bit counter/timer mode (timer 0) timer 2, timer 3 and timer 4 are 16-bit timers including the following features: ? clock sources for all timers include sysclk, sysclk divided by 12, or the external clock divided by 8. ? lfosc0 divided by 8 may be used to clock timer 3 and timer 4 in active or suspend/snooze power modes. ? timer 4 is a low-power wake source, and can be chained together with timer 3 ? 16-bit auto-reload timer mode ? dual 8-bit auto-reload timer mode ? external pin capture ? lfosc0 capture ? comparator 0 capture watchdog timer (wdt0) the device includes a programmable watchdog timer (wdt) running off the low-frequency oscillator. a wdt overflow forces the mcu into the reset state. to prevent the reset, the wdt must be restarted by application software before overflow. if the system experiences a software or hardware malfunction preventing the software from restarting the wdt, the wdt overflows and causes a reset. following a reset, the wdt is automatically enabled and running with the default maximum time interval. if needed, the wdt can be disabled by system software or locked on to prevent accidental disabling. once locked, the wdt cannot be disabled until the next system reset. the state of the rst pin is unaffected by this reset. the watchdog timer has the following features: ? programmable timeout interval ? runs from the low-frequency oscillator ? lock-out feature to prevent any modification until a system reset 3.6 communications and other digital peripherals universal asynchronous receiver/transmitter (uart0) uart0 is an asynchronous, full duplex serial port offering modes 1 and 3 of the standard 8051 uart. enhanced baud rate support allows a wide range of clock sources to generate standard baud rates. received data buffering allows uart0 to start reception of a second incoming data byte before software has finished reading the previous data byte. the uart module provides the following features: ? asynchronous transmissions and receptions ? baud rates up to sysclk/2 (transmit) or sysclk/8 (receive) ? 8- or 9-bit data ? automatic start and stop generation ? single-byte buffer on transmit and receive efm8bb2 data sheet system overview silabs.com | smart. connected. energy-friendly. rev. 1.1 | 6
universal asynchronous receiver/transmitter (uart1) uart1 is an asynchronous, full duplex serial port offering a variety of data formatting options. a dedicated baud rate generator with a 16-bit timer and selectable prescaler is included, which can generate a wide range of baud rates. a received data fifo allows uart1 to receive multiple bytes before data is lost and an overflow occurs. uart1 provides the following features: ? asynchronous transmissions and receptions. ? dedicated baud rate generator supports baud rates up to sysclk/2 (transmit) or sysclk/8 (receive). ? 5, 6, 7, 8, or 9 bit data. ? automatic start and stop generation. ? automatic parity generation and checking. ? four byte fifo on transmit and receive. ? auto-baud detection. ? lin break and sync field detection. ? cts / rts hardware flow control. serial peripheral interface (spi0) the serial peripheral interface (spi) module provides access to a flexible, full-duplex synchronous serial bus. the spi can operate as a master or slave device in both 3-wire or 4-wire modes, and supports multiple masters and slaves on a single spi bus. the slave-select (nss) signal can be configured as an input to select the spi in slave mode, or to disable master mode operation in a multi-master environment, avoiding contention on the spi bus when more than one master attempts simultaneous data transfers. nss can also be configured as a firmware-controlled chip-select output in master mode, or disabled to reduce the number of pins required. additional general purpose port i/o pins can be used to select multiple slave devices in master mode. ? supports 3- or 4-wire master or slave modes. ? supports external clock frequencies up to 12 mbps in master or slave mode. ? support for all clock phase and polarity modes. ? 8-bit programmable clock rate (master). ? programmable receive timeout (slave). ? four byte fifo on transmit and receive. ? can operate in suspend or snooze modes and wake the cpu on reception of a byte. ? support for multiple masters on the same data lines. system management bus / i2c (smb0) the smbus i/o interface is a two-wire, bi-directional serial bus. the smbus is compliant with the system management bus specifica- tion, version 1.1, and compatible with the i 2 c serial bus. the smbus module includes the following features: ? standard (up to 100 kbps) and fast (400 kbps) transfer speeds ? support for master, slave, and multi-master modes ? hardware synchronization and arbitration for multi-master mode ? clock low extending (clock stretching) to interface with faster masters ? hardware support for 7-bit slave and general call address recognition ? firmware support for 10-bit slave address decoding ? ability to inhibit all slave states ? programmable data setup/hold times ? transmit and receive buffers to help increase throughput in faster applications efm8bb2 data sheet system overview silabs.com | smart. connected. energy-friendly. rev. 1.1 | 7
i2c slave (i2cslave0) the i2c slave interface is a 2-wire, bidirectional serial bus that is compatible with the i2c bus specification 3.0. it is capable of transfer- ring in high-speed mode (hs-mode) at speeds of up to 3.4 mbps. firmware can write to the i2c interface, and the i2c interface can autonomously control the serial transfer of data. the interface also supports clock stretching for cases where the core may be tempora- rily prohibited from transmitting a byte or processing a received byte during an i2c transaction. this module operates only as an i2c slave device. the i2c module includes the following features: ? standard (up to 100 kbps), fast (400 kbps), fast plus (1 mbps), and high-speed (3.4 mbps) transfer speeds ? support for slave mode only ? clock low extending (clock stretching) to interface with faster masters ? hardware support for 7-bit slave address recognition 16-bit crc (crc0) the cyclic redundancy check (crc) module performs a crc using a 16-bit polynomial. crc0 accepts a stream of 8-bit data and posts the 16-bit result to an internal register. in addition to using the crc block for data manipulation, hardware can automatically crc the flash contents of the device. the crc module is designed to provide hardware calculations for flash memory verification and communications protocols. the crc module supports the standard ccitt-16 16-bit polynomial (0x1021), and includes the following features: ? support for ccitt-16 polynomial ? byte-level bit reversal ? automatic crc of flash contents on one or more 256-byte blocks ? initial seed selection of 0x0000 or 0xffff 3.7 analog 12-bit analog-to-digital converter (adc0) the adc is a successive-approximation-register (sar) adc with 12-, 10-, and 8-bit modes, integrated track-and hold and a program- mable window detector. the adc is fully configurable under software control via several registers. the adc may be configured to measure different signals using the analog multiplexer. the voltage reference for the adc is selectable between internal and external reference sources. ? up to 20 external inputs. ? single-ended 12-bit and 10-bit modes. ? supports an output update rate of 200 ksps samples per second in 12-bit mode or 800 ksps samples per second in 10-bit mode. ? operation in low power modes at lower conversion speeds. ? asynchronous hardware conversion trigger, selectable between software, external i/o and internal timer sources. ? output data window comparator allows automatic range checking. ? support for burst mode, which produces one set of accumulated data per conversion-start trigger with programmable power-on set- tling and tracking time. ? conversion complete and window compare interrupts supported. ? flexible output data formatting. ? includes an internal fast-settling reference with two levels (1.65 v and 2.4 v) and support for external reference and signal ground. ? integrated temperature sensor. efm8bb2 data sheet system overview silabs.com | smart. connected. energy-friendly. rev. 1.1 | 8
low current comparators (cmp0, cmp1) analog comparators are used to compare the voltage of two analog inputs, with a digital output indicating which input voltage is higher. external input connections to device i/o pins and internal connections are available through separate multiplexers on the positive and negative inputs. hysteresis, response time, and current consumption may be programmed to suit the specific needs of the application. the comparator includes the following features: ? up to 10 (cmp0) or 12 (cmp1) external positive inputs ? up to 10 (cmp0) or 12 (cmp1) external negative inputs ? additional input options: ? internal connection to ldo output ? direct connection to gnd ? direct connection to vdd ? dedicated 6-bit reference dac ? synchronous and asynchronous outputs can be routed to pins via crossbar ? programmable hysteresis between 0 and 20 mv ? programmable response time ? interrupts generated on rising, falling, or both edges ? pwm output kill feature 3.8 reset sources reset circuitry allows the controller to be easily placed in a predefined default condition. on entry to this reset state, the following occur: ? the core halts program execution. ? module registers are initialized to their defined reset values unless the bits reset only with a power-on reset. ? external port pins are forced to a known state. ? interrupts and timers are disabled. all registers are reset to the predefined values noted in the register descriptions unless the bits only reset with a power-on reset. the contents of ram are unaffected during a reset; any previously stored data is preserved as long as power is not lost. the port i/o latch- es are reset to 1 in open-drain mode. weak pullups are enabled during and after the reset. for supply monitor and power-on resets, the rstb pin is driven low until the device exits the reset state. on exit from the reset state, the program counter (pc) is reset, and the system clock defaults to an internal oscillator. the watchdog timer is enabled, and program execution begins at location 0x0000. reset sources on the device include the following: ? power-on reset ? external reset pin ? comparator reset ? software-triggered reset ? supply monitor reset (monitors vdd supply) ? watchdog timer reset ? missing clock detector reset ? flash error reset 3.9 debugging the efm8bb2 devices include an on-chip silicon labs 2-wire (c2) debug interface to allow flash programming and in-system debug- ging with the production part installed in the end application. the c2 interface uses a clock signal (c2ck) and a bi-directional c2 data signal (c2d) to transfer information between the device and a host system. see the c2 interface specification for details on the c2 protocol. efm8bb2 data sheet system overview silabs.com | smart. connected. energy-friendly. rev. 1.1 | 9
3.10 bootloader all devices come pre-programmed with a uart bootloader. this bootloader resides in the code security page and last page of code flash; it can be erased if it is not needed. the byte before the lock byte is the bootloader signature byte. setting this byte to a value of 0xa5 indicates the presence of the boot- loader in the system. any other value in this location indicates that the bootloader is not present in flash. when a bootloader is present, the device will jump to the bootloader vector after any reset, allowing the bootloader to run. the boot- loader then determines if the device should stay in bootload mode or jump to the reset vector located at 0x0000. when the bootloader is not present, the device will jump to the reset vector of 0x0000 after any reset. 0x0000 0x3fff 0x4000 0xf7ff 0xf800 0xfbbf 0xfbc0 0xffc0 0xffff 0xfc00 0xffbf 16 kb code (32 x 512 byte pages) reserved nonvolatile data code security page 64 bytes read-only reserved bootloader vector reset vector bootloader bootloader 0xfbfe 0xfbff lock byte bootloader signature byte figure 3.2. flash memory map with bootloader16 kb devices efm8bb2 data sheet system overview silabs.com | smart. connected. energy-friendly. rev. 1.1 | 10
4. electrical characteristics 4.1 electrical characteristics all electrical parameters in all tables are specified under the conditions listed in table 4.1 recommended operating conditions on page 11 , unless stated otherwise. 4.1.1 recommended operating conditions table 4.1. recommended operating conditions parameter symbol test condition min typ max unit operating supply voltage on vdd v dd 2.2 3.6 v operating supply voltage on vre- gin v regin 3.0 5.25 v system clock frequency f sysclk 0 50 mhz operating ambient temperature t a -40 85 c note: 1. all voltages with respect to gnd. 2. gpio levels are undefined whenever vdd is less than 1 v. efm8bb2 data sheet electrical characteristics silabs.com | smart. connected. energy-friendly. rev. 1.1 | 11
4.1.2 power consumption table 4.2. power consumption parameter symbol test condition min typ max unit digital core supply current normal mode-full speed with code executing from flash i dd f sysclk = 49 mhz 2 9.1 10 ma f sysclk = 24.5 mhz 2 4.3 4.9 ma f sysclk = 1.53 mhz 2 600 a f sysclk = 80 khz 3 145 a idle mode-core halted with periph- erals running i dd f sysclk = 49 mhz 2 6.15 6.75 ma f sysclk = 24.5 mhz 2 2.8 3.2 ma f sysclk = 1.53 mhz 2 440 a f sysclk = 80 khz 3 130 a suspend mode-core halted and high frequency clocks stopped, supply monitor off. i dd lfo running 125 a lfo stopped 120 a snooze mode-core halted and high frequency clocks stopped. regulator in low-power state, sup- ply monitor off. i dd lfo running 25 a lfo stopped 20 a stop modecore halted and all clocks stopped,internal ldo on, supply monitor off. i dd 120 a shutdown modecore halted and all clocks stopped,internal ldo off, supply monitor off. i dd 0.2 a analog peripheral supply currents high-frequency oscillator 0 i hfosc0 operating at 24.5 mhz, t a = 25 c 105 a high-frequency oscillator 1 i hfosc1 operating at 49 mhz, t a = 25 c 865 a low-frequency oscillator i lfosc operating at 80 khz, t a = 25 c 4 a efm8bb2 data sheet electrical characteristics silabs.com | smart. connected. energy-friendly. rev. 1.1 | 12
parameter symbol test condition min typ max unit adc0 always-on 4 i adc 800 ksps, 10-bit conversions or 200 ksps, 12-bit conversions normal bias settings v dd = 3.0 v 820 1200 a 250 ksps, 10-bit conversions or 62.5 ksps 12-bit conversions low power bias settings v dd = 3.0 v 405 580 a adc0 burst mode, 10-bit single conversions, external reference i adc 200 ksps, v dd = 3.0 v 370 a 100 ksps, v dd = 3.0 v 185 a 10 ksps, v dd = 3.0 v 20 a adc0 burst mode, 10-bit single conversions, internal reference, low power bias settings i adc 200 ksps, v dd = 3.0 v 485 a 100 ksps, v dd = 3.0 v 245 a 10 ksps, v dd = 3.0 v 25 a adc0 burst mode, 12-bit single conversions, external reference i adc 100 ksps, v dd = 3.0 v 505 a 50 ksps, v dd = 3.0 v 255 a 10 ksps, v dd = 3.0 v 50 a adc0 burst mode, 12-bit single conversions, internal reference i adc 100 ksps, v dd = 3.0 v, normal bias 950 a 50 ksps, v dd = 3.0 v, low power bias 415 a 10 ksps, v dd = 3.0 v, low power bias 80 a internal adc0 reference, always- on 5 i vreffs normal power mode 680 790 a low power mode 160 210 a temperature sensor i tsense 70 120 a comparator 0 (cmp0, cmp1) i cmp cpmd = 11 0.5 a cpmd = 10 3 a cpmd = 01 8.5 a cpmd = 00 22.5 a comparator reference i cpref 1.2 a voltage supply monitor (vmon0) i vmon 15 20 a efm8bb2 data sheet electrical characteristics silabs.com | smart. connected. energy-friendly. rev. 1.1 | 13
parameter symbol test condition min typ max unit 5v regulator i vreg normal mode (susen = 0, biasenb = 0) 245 340 a suspend mode (susen = 1, biasenb = 0) 60 100 a bias disabled (biasenb = 1) 2.5 10 a disabled (biasenb = 1, reg1enb = 1) 2.5 na note: 1. currents are additive. for example, where i dd is specified and the mode is not mutually exclusive, enabling the functions increa- ses supply current by the specified amount. 2. includes supply current from internal ldo regulator, supply monitor, and high frequency oscillator. 3. includes supply current from internal ldo regulator, supply monitor, and low frequency oscillator. 4. adc0 always-on power excludes internal reference supply current. 5. the internal reference is enabled as-needed when operating the adc in burst mode to save power. 4.1.3 reset and supply monitor table 4.3. reset and supply monitor parameter symbol test condition min typ max unit vdd supply monitor threshold v vddm 1.95 2.05 2.15 v power-on reset (por) threshold v por rising voltage on vdd 1.2 v falling voltage on vdd 0.75 1.36 v vdd ramp time t rmp time to v dd > 2.2 v 10 s reset delay from por t por relative to v dd > v por 3 10 31 ms reset delay from non-por source t rst time between release of reset source and code execution 50 s rst low time to generate reset t rstl 15 s missing clock detector response time (final rising edge to reset) t mcd f sysclk >1 mhz 0.625 1.2 ms missing clock detector trigger frequency f mcd 7.5 13.5 khz vdd supply monitor turn-on time t mon 2 s efm8bb2 data sheet electrical characteristics silabs.com | smart. connected. energy-friendly. rev. 1.1 | 14
4.1.4 flash memory table 4.4. flash memory parameter symbol test condition min typ max units write time 1 ,2 t write one byte, f sysclk = 24.5 mhz 19 20 21 s erase time 1 ,2 t erase one page, f sysclk = 24.5 mhz 5.2 5.35 5.5 ms v dd voltage during programming 3 v prog 2.2 3.6 v endurance (write/erase cycles) n we 20k 100k cycles note: 1. does not include sequencing time before and after the write/erase operation, which may be multiple sysclk cycles. 2. the internal high-frequency oscillator 0 has a programmable output frequency, which is factory programmed to 24.5 mhz. if user firmware adjusts the oscillator speed, it must be between 22 and 25 mhz during any flash write or erase operation. it is recommended to write the hfo0cal register back to its reset value when writing or erasing flash. 3. flash can be safely programmed at any voltage above the supply monitor threshold (v vddm ). 4. data retention information is published in the quarterly quality and reliability report. 4.1.5 power management timing table 4.5. power management timing parameter symbol test condition min typ max units idle mode wake-up time t idlewk 2 3 sysclks suspend mode wake-up time t sus- pendwk sysclk = hfosc0 clkdiv = 0x00 170 ns snooze mode wake-up time t sleepwk sysclk = hfosc0 clkdiv = 0x00 12 s efm8bb2 data sheet electrical characteristics silabs.com | smart. connected. energy-friendly. rev. 1.1 | 15
4.1.6 internal oscillators table 4.6. internal oscillators parameter symbol test condition min typ max unit high frequency oscillator 0 (24.5 mhz) oscillator frequency f hfosc0 full temperature and supply range 24 24.5 25 mhz power supply sensitivity pss hfos c0 t a = 25 c 0.5 %/v temperature sensitivity ts hfosc0 v dd = 3.0 v 40 ppm/c high frequency oscillator 1 (49 mhz) oscillator frequency f hfosc1 full temperature and supply range 48.25 49 49.75 mhz power supply sensitivity pss hfos c1 t a = 25 c 0.02 %/v temperature sensitivity ts hfosc1 v dd = 3.0 v 45 ppm/c low frequency oscillator (80 khz) oscillator frequency f lfosc full temperature and supply range 75 80 85 khz power supply sensitivity pss lfosc t a = 25 c 0.05 %/v temperature sensitivity ts lfosc v dd = 3.0 v 65 ppm/c 4.1.7 external clock input table 4.7. external clock input parameter symbol test condition min typ max unit external input cmos clock frequency (at extclk pin) f cmos 0 50 mhz external input cmos clock high time t cmosh 9 ns external input cmos clock low time t cmosl 9 ns efm8bb2 data sheet electrical characteristics silabs.com | smart. connected. energy-friendly. rev. 1.1 | 16
4.1.8 adc table 4.8. adc parameter symbol test condition min typ max unit resolution n bits 12 bit mode 12 bits 10 bit mode 10 bits throughput rate (high speed mode) f s 12 bit mode 200 ksps 10 bit mode 800 ksps throughput rate (low power mode) f s 12 bit mode 62.5 ksps 10 bit mode 250 ksps tracking time t trk high speed mode 230 ns low power mode 450 ns power-on time t pwr 1.2 s sar clock frequency f sar high speed mode, reference is 2.4 v internal 6.25 mhz high speed mode, reference is not 2.4 v internal 12.5 mhz low power mode 4 mhz conversion time t cnv 10-bit conversion, sar clock = 12.25 mhz, system clock = 24.5 mhz. 1.1 s sample/hold capacitor c sar gain = 1 5 pf gain = 0.5 2.5 pf input pin capacitance c in 20 pf input mux impedance r mux 550 voltage reference range v ref 1 v dd v input voltage range 1 v in gain = 1 0 v ref v gain = 0.5 0 2xv ref v power supply rejection ratio psrr adc 70 db dc performance integral nonlinearity inl 12 bit mode 1 2.3 lsb 10 bit mode 0.2 0.6 lsb differential nonlinearity (guaran- teed monotonic) dnl 12 bit mode -1 0.7 1.9 lsb 10 bit mode 0.2 0.6 lsb offset error e off 12 bit mode, vref = 1.65 v -3 0 3 lsb 10 bit mode, vref = 1.65 v -2 0 2 lsb offset temperature coefficient tc off 0.004 lsb/c efm8bb2 data sheet electrical characteristics silabs.com | smart. connected. energy-friendly. rev. 1.1 | 17
parameter symbol test condition min typ max unit slope error e m 12 bit mode 0.02 0.1 % 10 bit mode 0.06 0.24 % dynamic performance 10 khz sine wave input 1 db below full scale, max throughput, using agnd pin signal-to-noise snr 12 bit mode 61 66 db 10 bit mode 53 60 db signal-to-noise plus distortion sndr 12 bit mode 61 66 db 10 bit mode 53 60 db total harmonic distortion (up to 5th harmonic) thd 12 bit mode 71 db 10 bit mode 70 db spurious-free dynamic range sfdr 12 bit mode -79 db 10 bit mode -70 db note: 1. absolute input pin voltage is limited by the v dd supply. 4.1.9 voltage reference table 4.9. voltage reference parameter symbol test condition min typ max unit internal fast settling reference output voltage (full temperature and supply range) v reffs 1.65 v setting 1.62 1.65 1.68 v 2.4 v setting, v dd > 2.6 v 2.35 2.4 2.45 v temperature coefficient tc reffs 50 ppm/c turn-on time t reffs 1.5 s power supply rejection psrr ref fs 400 ppm/v external reference input current i extref sample rate = 800 ksps; vref = 3.0 v 8 a efm8bb2 data sheet electrical characteristics silabs.com | smart. connected. energy-friendly. rev. 1.1 | 18
4.1.10 temperature sensor table 4.10. temperature sensor parameter symbol test condition min typ max unit offset v off t a = 0 c 757 mv offset error 1 e off t a = 0 c 17 mv slope m 2.85 mv/c slope error 1 e m 70 v/ linearity 0.5 c turn-on time 1.8 s note: 1. represents one standard deviation from the mean. 4.1.11 5 v voltage regulator table 4.11. 5v voltage regulator parameter symbol test condition min typ max unit input voltage range 1 v regin 3.0 5.25 v output voltage on vdd 2 v regout output current = 1 to 100 ma regulation range (vregin 4.1 v) 3.1 3.3 3.6 v output current = 1 to 100 ma dropout range (vregin < 4.1 v) v regin C v dropout v output current 2 i regout 100 ma dropout voltage v dropout output current = 100 ma 0.8 v note: 1. input range to meet the output voltage on vdd specification. if the 5v voltage regulator is not used, vregin should be tied to vdd. 2. output current is total regulator output, including any current required by the device. efm8bb2 data sheet electrical characteristics silabs.com | smart. connected. energy-friendly. rev. 1.1 | 19
4.1.12 comparators table 4.12. comparators parameter symbol test condition min typ max unit response time, cpmd = 00 (highest speed) t resp0 +100 mv differential, v cm = 1.65 v 110 ns -100 mv differential, v cm = 1.65 v 160 ns response time, cpmd = 11 (low- est power) t resp3 +100 mv differential, v cm = 1.65 v 1.2 s -100 mv differential, v cm = 1.65 v 4.5 s positive hysteresis mode 0 (cpmd = 00) hys cp+ cphyp = 00 0.4 mv cphyp = 01 8 mv cphyp = 10 16 mv cphyp = 11 32 mv negative hysteresis mode 0 (cpmd = 00) hys cp- cphyn = 00 -0.4 mv cphyn = 01 -8 mv cphyn = 10 -16 mv cphyn = 11 -32 mv positive hysteresis mode 3 (cpmd = 11) hys cp+ cphyp = 00 1.5 mv cphyp = 01 4 mv cphyp = 10 8 mv cphyp = 11 16 mv negative hysteresis mode 3 (cpmd = 11) hys cp- cphyn = 00 -1.5 mv cphyn = 01 -4 mv cphyn = 10 -8 mv cphyn = 11 -16 mv input range (cp+ or cp-) v in -0.25 v dd +0.25 v input pin capacitance c cp 7.5 pf internal reference dac resolution n bits 6 bits common-mode rejection ratio cmrr cp 70 db power supply rejection ratio psrr cp 72 db input offset voltage v off t a = 25 c -10 0 10 mv input offset tempco tc off 3.5 v/ efm8bb2 data sheet electrical characteristics silabs.com | smart. connected. energy-friendly. rev. 1.1 | 20
4.1.13 port i/o table 4.13. port i/o parameter symbol test condition min typ max unit output high voltage (high drive) v oh i oh = -7 ma, v dd 3.0 v v dd - 0.7 v i oh = -3.3 ma, 2.2 v v dd < 3.0 v v dd x 0.8 v output low voltage (high drive) v ol i ol = 13.5 ma, v dd 3.0 v 0.6 v i ol = 7 ma, 2.2 v v dd < 3.0 v v dd x 0.2 v output high voltage (low drive) v oh i oh = -4.75 ma, v dd 3.0 v v dd - 0.7 v i oh = -2.25 ma, 2.2 v v dd < 3.0 v v dd x 0.8 v output low voltage (low drive) v ol i ol = 6.5 ma, v dd 3.0 v 0.6 v i ol = 3.5 ma, 2.2 v v dd < 3.0 v v dd x 0.2 v input high voltage v ih v dd - 0.6 v input low voltage v il 0.6 v pin capacitance c io 7 pf weak pull-up current (v in = 0 v) i pu v dd = 3.6 -30 -20 -10 a input leakage (pullups off or ana- log) i lk gnd < v in < v dd -1.1 1.1 a input leakage current with v in above v dd i lk v dd < v in < v dd +2.0 v 0 5 150 a 4.2 thermal conditions table 4.14. thermal conditions parameter symbol test condition min typ max unit thermal resistance ja qfn-20 packages 60 c/w qfn-28 packages 26 c/w qsop-24 packages 65 c/w note: 1. thermal resistance assumes a multi-layer pcb with any exposed pad soldered to a pcb pad. efm8bb2 data sheet electrical characteristics silabs.com | smart. connected. energy-friendly. rev. 1.1 | 21
4.3 absolute maximum ratings stresses above those listed in table 4.15 absolute maximum ratings on page 22 may cause permanent damage to the device. this is a stress rating only and functional operation of the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. exposure to maximum rating conditions for extended periods may affect device reliability. for more information on the available quality and reliability data, see the quality and reliability monitor report at http://www.silabs.com/ support/quality/pages/default.aspx . table 4.15. absolute maximum ratings parameter symbol test condition min max unit ambient temperature under bias t bias -55 125 c storage temperature t stg -65 150 c voltage on vdd v dd gnd-0.3 4.2 v voltage on vregin v regin gnd-0.3 5.8 v voltage on i/o pins or rstb v in v dd > 3.3 v gnd-0.3 5.8 v v dd < 3.3 v gnd-0.3 v dd +2.5 v total current sunk into supply pin i vdd 400 ma total current sourced out of ground pin i gnd 400 ma current sourced or sunk by any i/o pin or rstb i io -100 100 ma operating junction temperature t j -40 105 c note: 1. exposure to maximum rating conditions for extended periods may affect device reliability. efm8bb2 data sheet electrical characteristics silabs.com | smart. connected. energy-friendly. rev. 1.1 | 22
4.4 typical performance curves figure 4.1. typical operating supply current using hfosc0 figure 4.2. typical operating supply current using hfosc1 efm8bb2 data sheet electrical characteristics silabs.com | smart. connected. energy-friendly. rev. 1.1 | 23
figure 4.3. typical operating supply current using lfosc figure 4.4. typical adc0 and internal reference supply current in burst mode efm8bb2 data sheet electrical characteristics silabs.com | smart. connected. energy-friendly. rev. 1.1 | 24
figure 4.5. typical adc0 supply current in normal (always-on) mode efm8bb2 data sheet electrical characteristics silabs.com | smart. connected. energy-friendly. rev. 1.1 | 25
figure 4.6. typical v oh curves figure 4.7. typical v ol curves efm8bb2 data sheet electrical characteristics silabs.com | smart. connected. energy-friendly. rev. 1.1 | 26
5. typical connection diagrams 5.1 power figure 5.1 connection diagram with voltage regulator used on page 27 shows a typical connection diagram for the power pins of the efm8bb2 devices when the 5 v-to-3.3 v regulator is in use. efm8bb2 device voltage regulator vregin gnd 4.7 f and 0.1 f bypass capacitors required for each power pin placed as close to the pins as possible. 3.3 v (out) 2.7-5.25 v (in) vdd figure 5.1. connection diagram with voltage regulator used figure 5.2 connection diagram with voltage regulator not used on page 27 shows a typical connection diagram for the power pins of the efm8bb2 devices when the internal 5 v-to-3.3 v regulator is not used. efm8bb2 device voltage regulator 2.2-3.6 v (in) gnd 4.7 f and 0.1 f bypass capacitors required for each power pin placed as close to the pins as possible. vregin vdd figure 5.2. connection diagram with voltage regulator not used efm8bb2 data sheet typical connection diagrams silabs.com | smart. connected. energy-friendly. rev. 1.1 | 27
5.2 debug the diagram below shows a typical connection diagram for the debug connections pins. the pin sharing resistors are only required if the functionality on the c2d (a gpio pin) and the c2ck (rstb) is routed to external circuitry. for example, if the rstb pin is connec- ted to an external switch with debouncing filter or if the gpio sharing with the c2d pin is connected to an external circuit, the pin shar- ing resistors and connections to the debug adapter must be placed on the hardware. otherwise, these components and connections can be omitted. for more information on debug connections, see the example schematics and information available in an127: "pin sharing techniques for the c2 interface." application notes can be found on the silicon labs website ( http://www.silabs.com/8bit-appnotes ) or in simplicity studio. efm8bb2 device external system (if pin sharing) 1 k 1 k (if pin sharing) c2ck 1 k 1 k debug adapter 1 k vdd c2d gnd figure 5.3. debug connection diagram 5.3 other connections other components or connections may be required to meet the system-level requirements. application note an203: "8-bit mcu printed circuit board design notes" contains detailed information on these connections. application notes can be accessed on the silicon labs website ( www.silabs.com/8bit-appnotes ). efm8bb2 data sheet typical connection diagrams silabs.com | smart. connected. energy-friendly. rev. 1.1 | 28
6. pin definitions 6.1 efm8bb2x-qfn28 pin definitions 28 27 26 25 1 2 3 4 8 9 10 11 21 20 19 18 p0.1 p0.0 gnd n/c p3.1 rstb / c2ck p3.0 / c2d p2.3 p1.1 p1.2 p1.3 p1.4 p0.2 p0.3 p0.4 p0.5 gnd 24 23 22 p0.7 p1.0 12 13 14 p2.2 p2.1 p2.0 5 6 7 17 16 15 n/c vdd vregin p1.5 p1.6 p1.7 p0.6 28 pin qfn (top view) figure 6.1. efm8bb2x-qfn28 pinout efm8bb2 data sheet pin definitions silabs.com | smart. connected. energy-friendly. rev. 1.1 | 29
table 6.1. pin definitions for efm8bb2x-qfn28 pin number pin name description crossbar capability additional digital functions analog functions 1 p0.1 multifunction i/o yes p0mat.1 int0.1 int1.1 adc0.1 cmp0p.1 cmp0n.1 agnd 2 p0.0 multifunction i/o yes p0mat.0 int0.0 int1.0 adc0.0 cmp0p.0 cmp0n.0 vref 3 gnd ground 4 n/c no connection 5 n/c no connection 6 vdd supply power input / 5v regulator output 7 vregin 5v regulator input 8 p3.1 multifunction i/o 9 rst / c2ck active-low reset / c2 debug clock 10 p3.0 / c2d multifunction i/o / c2 debug data 11 p2.3 multifunction i/o yes p2mat.3 adc0.23 cp1p.12 cp1n.12 12 p2.2 multifunction i/o yes p2mat.2 adc0.22 cp1p.11 cp1n.11 13 p2.1 multifunction i/o yes p2mat.1 adc0.21 cp1p.10 cp1n.10 14 p2.0 multifunction i/o yes p2mat.0 adc0.20 cp1p.9 cp1n.9 15 p1.7 multifunction i/o yes p1mat.7 adc0.15 cp1p.7 cp1n.7 efm8bb2 data sheet pin definitions silabs.com | smart. connected. energy-friendly. rev. 1.1 | 30
pin number pin name description crossbar capability additional digital functions analog functions 16 p1.6 multifunction i/o yes p1mat.6 i2c0_scl adc0.14 cp1p.6 cp1n.6 17 p1.5 multifunction i/o yes p1mat.5 i2c0_sda adc0.13 cp1p.5 cp1n.5 18 p1.4 multifunction i/o yes p1mat.4 adc0.12 cp1p.4 cp1n.4 19 p1.3 multifunction i/o yes p1mat.3 adc0.11 cp1p.3 cp1n.3 20 p1.2 multifunction i/o yes p1mat.2 adc0.10 cp1p.2 cp1n.2 21 p1.1 multifunction i/o yes p1mat.1 adc0.9 cp1p.1 cp1n.1 cmp0p.10 cmp0n.10 22 p1.0 multifunction i/o yes p1mat.0 adc0.8 cp1p.0 cp1n.0 cmp0p.9 cmp0n.9 23 p0.7 multifunction i/o yes p0mat.7 int0.7 int1.7 adc0.7 cmp0p.7 cmp0n.7 24 p0.6 multifunction i/o yes p0mat.6 cnvstr int0.6 int1.6 adc0.6 cmp0p.6 cmp0n.6 25 p0.5 multifunction i/o yes p0mat.5 int0.5 int1.5 uart0_rx adc0.5 cmp0p.5 cmp0n.5 efm8bb2 data sheet pin definitions silabs.com | smart. connected. energy-friendly. rev. 1.1 | 31
pin number pin name description crossbar capability additional digital functions analog functions 26 p0.4 multifunction i/o yes p0mat.4 int0.4 int1.4 uart0_tx adc0.4 cmp0p.4 cmp0n.4 27 p0.3 multifunction i/o yes p0mat.3 extclk int0.3 int1.3 adc0.3 cmp0p.3 cmp0n.3 28 p0.2 multifunction i/o yes p0mat.2 int0.2 int1.2 adc0.2 cmp0p.2 cmp0n.2 center gnd ground efm8bb2 data sheet pin definitions silabs.com | smart. connected. energy-friendly. rev. 1.1 | 32
6.2 efm8bb2x-qsop24 pin definitions p0.2 p0.1 p0.0 gnd vdd rstb / c2ck p3.0 / c2d p1.7 p0.4 p0.5 p0.6 p0.7 p1.0 p1.1 p1.2 p1.3 p1.4 p1.5 p1.6 2 1 4 3 5 6 7 24 pin qsop (top view) 8 9 10 11 12 23 24 21 22 20 19 18 17 16 15 14 13 p0.3 p2.0 p2.1 p2.2 p2.3 figure 6.2. efm8bb2x-qsop24 pinout table 6.2. pin definitions for efm8bb2x-qsop24 pin number pin name description crossbar capability additional digital functions analog functions 1 p0.3 multifunction i/o yes p0mat.3 extclk int0.3 int1.3 adc0.3 cmp0p.3 cmp0n.3 2 p0.2 multifunction i/o yes p0mat.2 int0.2 int1.2 adc0.2 cmp0p.2 cmp0n.2 efm8bb2 data sheet pin definitions silabs.com | smart. connected. energy-friendly. rev. 1.1 | 33
pin number pin name description crossbar capability additional digital functions analog functions 3 p0.1 multifunction i/o yes p0mat.1 int0.1 int1.1 adc0.1 cmp0p.1 cmp0n.1 agnd 4 p0.0 multifunction i/o yes p0mat.0 int0.0 int1.0 adc0.0 cmp0p.0 cmp0n.0 vref 5 gnd ground 6 vdd supply power input 7 rstb / c2ck active-low reset / c2 debug clock 8 p3.0 / c2d multifunction i/o / c2 debug data 9 p2.3 multifunction i/o yes p2mat.3 adc0.23 cmp1p.12 cmp1n.12 10 p2.2 multifunction i/o yes p2mat.2 adc0.22 cmp1p.11 cmp1n.11 11 p2.1 multifunction i/o yes p2mat.1 adc0.21 cmp1p.10 cmp1n.10 12 p2.0 multifunction i/o yes p2mat.0 adc0.20 cmp1p.9 cmp1n.9 13 p1.7 multifunction i/o yes p1mat.7 adc0.15 cmp1p.7 cmp1n.7 14 p1.6 multifunction i/o yes p1mat.6 i2c0_scl adc0.14 cmp1p.6 cmp1n.6 15 p1.5 multifunction i/o yes p1mat.5 i2c0_sda adc0.13 cmp1p.5 cmp1n.5 efm8bb2 data sheet pin definitions silabs.com | smart. connected. energy-friendly. rev. 1.1 | 34
pin number pin name description crossbar capability additional digital functions analog functions 16 p1.4 multifunction i/o yes p1mat.4 adc0.12 cmp1p.4 cmp1n.4 17 p1.3 multifunction i/o yes p1mat.3 adc0.11 cmp1p.3 cmp1n.3 18 p1.2 multifunction i/o yes p1mat.2 adc0.10 cmp1p.2 cmp1n.2 19 p1.1 multifunction i/o yes p1mat.1 adc0.9 cmp1p.1 cmp1n.1 cmp0p.10 cmp0n.10 20 p1.0 multifunction i/o yes p1mat.0 adc0.8 cmp1p.0 cmp1n.0 cmp0p.9 cmp0n.9 21 p0.7 multifunction i/o yes p0mat.7 int0.7 int1.7 adc0.7 cmp0p.7 cmp0n.7 22 p0.6 multifunction i/o yes p0mat.6 cnvstr int0.6 int1.6 adc0.6 cmp0p.6 cmp0n.6 23 p0.5 multifunction i/o yes p0mat.5 int0.5 int1.5 uart0_rx adc0.5 cmp0p.5 cmp0n.5 24 p0.4 multifunction i/o yes p0mat.4 int0.4 int1.4 uart0_tx adc0.4 cmp0p.4 cmp0n.4 efm8bb2 data sheet pin definitions silabs.com | smart. connected. energy-friendly. rev. 1.1 | 35
6.3 efm8bb2x-qfn20 pin definitions 20 19 18 17 2 3 4 5 7 8 9 10 15 14 13 12 20 pin qfn (top view) p0.1 p0.0 gnd vdd rstb / c2ck p2.0 / c2d p0.6 p0.7 p1.0 p1.1 gnd p1.2 p0.2 p0.3 p0.4 p0.5 gnd 1 6 11 16 p1.6 p1.5 p1.4 p1.3 figure 6.3. efm8bb2x-qfn20 pinout table 6.3. pin definitions for efm8bb2x-qfn20 pin number pin name description crossbar capability additional digital functions analog functions 1 p0.1 multifunction i/o yes p0mat.1 int0.1 int1.1 adc0.1 cmp0p.1 cmp0n.1 agnd 2 p0.0 multifunction i/o yes p0mat.0 int0.0 int1.0 adc0.0 cmp0p.0 cmp0n.0 vref efm8bb2 data sheet pin definitions silabs.com | smart. connected. energy-friendly. rev. 1.1 | 36
pin number pin name description crossbar capability additional digital functions analog functions 3 gnd ground 4 vdd supply power input 5 rstb / c2ck active-low reset / c2 debug clock 6 p2.0 / c2d multifunction i/o / c2 debug data yes 7 p1.6 multifunction i/o yes p1mat.6 adc0.14 cmp1p.6 cmp1n.6 8 p1.5 multifunction i/o yes p1mat.5 adc0.13 cmp1p.5 cmp1n.5 9 p1.4 multifunction i/o yes p1mat.4 adc0.12 cmp1p.4 cmp1n.4 10 p1.3 multifunction i/o yes p1mat.3 i2c0_scl adc0.11 cmp1p.3 cmp1n.3 11 p1.2 multifunction i/o yes p1mat.2 i2c0_sda adc0.10 cmp1p.2 cmp1n.2 12 gnd ground 13 p1.1 multifunction i/o yes p1mat.1 adc0.9 cmp1p.1 cmp1n.1 cmp0p.10 cmp0n.10 14 p1.0 multifunction i/o yes p1mat.0 adc0.8 cmp1p.0 cmp1n.0 cmp0p.9 cmp0n.9 15 p0.7 multifunction i/o yes p0mat.7 int0.7 int1.7 adc0.7 cmp0p.7 cmp0n.7 efm8bb2 data sheet pin definitions silabs.com | smart. connected. energy-friendly. rev. 1.1 | 37
pin number pin name description crossbar capability additional digital functions analog functions 16 p0.6 multifunction i/o yes p0mat.6 cnvstr int0.6 int1.6 adc0.6 cmp0p.6 cmp0n.6 17 p0.5 multifunction i/o yes p0mat.5 int0.5 int1.5 uart0_rx adc0.5 cmp0p.5 cmp0n.5 18 p0.4 multifunction i/o yes p0mat.4 int0.4 int1.4 uart0_tx adc0.4 cmp0p.4 cmp0n.4 19 p0.3 multifunction i/o yes p0mat.3 extclk int0.3 int1.3 adc0.3 cmp0p.3 cmp0n.3 20 p0.2 multifunction i/o yes p0mat.2 int0.2 int1.2 adc0.2 cmp0p.2 cmp0n.2 center gnd ground efm8bb2 data sheet pin definitions silabs.com | smart. connected. energy-friendly. rev. 1.1 | 38
7. qfn28 package specifications 7.1 qfn28 package dimensions figure 7.1. qfn28 package drawing table 7.1. qfn28 package dimensions dimension min typ max a 0.70 0.75 0.80 a1 0.00 0.05 a3 0.20 ref b 0.20 0.25 0.30 d 4.90 5.00 5.10 d2 3.15 3.25 3.35 e 0.50 bsc e 4.90 5.00 5.10 e2 3.15 3.25 3.35 l 0.45 0.55 0.65 aaa 0.15 bbb 0.10 ddd 0.05 efm8bb2 data sheet qfn28 package specifications silabs.com | smart. connected. energy-friendly. rev. 1.1 | 39
dimension min typ max eee 0.08 note: 1. all dimensions shown are in millimeters (mm) unless otherwise noted. 2. dimensioning and tolerancing per ansi y14.5m-1994. 3. this drawing conforms to jedec solid state outline mo-220. 4. recommended card reflow profile is per the jedec/ipc j-std-020 specification for small body components. efm8bb2 data sheet qfn28 package specifications silabs.com | smart. connected. energy-friendly. rev. 1.1 | 40
7.2 qfn28 pcb land pattern x1 x2 y2 y1 c2 c1 e c0.35 figure 7.2. qfn28 pcb land pattern drawing table 7.2. qfn28 pcb land pattern dimensions dimension min max c1 4.80 c2 4.80 e 0.50 x1 0.30 x2 3.35 y1 0.95 efm8bb2 data sheet qfn28 package specifications silabs.com | smart. connected. energy-friendly. rev. 1.1 | 41
dimension min max y2 3.35 note: 1. all dimensions shown are in millimeters (mm) unless otherwise noted. 2. this land pattern design is based on the ipc-7351 guidelines. 3. all metal pads are to be non-solder mask defined (nsmd). clearance between the solder mask and the metal pad is to be 60 m minimum, all the way around the pad. 4. a stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 5. the stencil thickness should be 0.125 mm (5 mils). 6. the ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads. 7. a 2 x 2 array of 1.2 mm square openings on a 1.5 mm pitch should be used for the center pad. 8. a no-clean, type-3 solder paste is recommended. 9. the recommended card reflow profile is per the jedec/ipc j-std-020 specification for small body components. 7.3 qfn28 package marking pppppppp tttttt yyww # efm8 figure 7.3. qfn28 package marking the package marking consists of: ? pppppppp C the part number designation. ? tttttt C a trace or manufacturing code. ? yy C the last 2 digits of the assembly year. ? ww C the 2-digit workweek when the device was assembled. ? # C the device revision (a, b, etc.). efm8bb2 data sheet qfn28 package specifications silabs.com | smart. connected. energy-friendly. rev. 1.1 | 42
8. qsop24 package specifications 8.1 qsop24 package dimensions figure 8.1. qsop24 package drawing table 8.1. qsop24 package dimensions dimension min typ max a 1.75 a1 0.10 0.25 b 0.20 0.30 c 0.10 0.25 d 8.65 bsc e 6.00 bsc e1 3.90 bsc e 0.635 bsc l 0.40 1.27 theta 0o 8o efm8bb2 data sheet qsop24 package specifications silabs.com | smart. connected. energy-friendly. rev. 1.1 | 43
dimension min typ max aaa 0.20 bbb 0.18 ccc 0.10 ddd 0.10 note: 1. all dimensions shown are in millimeters (mm) unless otherwise noted. 2. dimensioning and tolerancing per ansi y14.5m-1994. 3. this drawing conforms to jedec outline mo-137, variation ae. 4. recommended card reflow profile is per the jedec/ipc j-std-020 specification for small body components. efm8bb2 data sheet qsop24 package specifications silabs.com | smart. connected. energy-friendly. rev. 1.1 | 44
8.2 qsop24 pcb land pattern figure 8.2. qsop24 pcb land pattern drawing table 8.2. qsop24 pcb land pattern dimensions dimension min max c 5.20 5.30 e 0.635 bsc x 0.30 0.40 y 1.50 1.60 note: 1. all dimensions shown are in millimeters (mm) unless otherwise noted. 2. this land pattern design is based on the ipc-7351 guidelines. 3. all metal pads are to be non-solder mask defined (nsmd). clearance between the solder mask and the metal pad is to be 60 m minimum, all the way around the pad. 4. a stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 5. the stencil thickness should be 0.125 mm (5 mils). 6. the ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads. 7. a no-clean, type-3 solder paste is recommended. 8. the recommended card reflow profile is per the jedec/ipc j-std-020 specification for small body components. efm8bb2 data sheet qsop24 package specifications silabs.com | smart. connected. energy-friendly. rev. 1.1 | 45
8.3 qsop24 package marking pppppppp # ttttttyyww efm8 figure 8.3. qsop24 package marking the package marking consists of: ? pppppppp C the part number designation. ? tttttt C a trace or manufacturing code. ? yy C the last 2 digits of the assembly year. ? ww C the 2-digit workweek when the device was assembled. ? # C the device revision (a, b, etc.). efm8bb2 data sheet qsop24 package specifications silabs.com | smart. connected. energy-friendly. rev. 1.1 | 46
9. qfn20 package specifications 9.1 qfn20 package dimensions figure 9.1. qfn20 package drawing table 9.1. qfn20 package dimensions dimension min typ max a 0.70 0.75 0.80 a1 0.00 0.02 0.05 a3 0.20 ref b 0.18 0.25 0.30 c 0.25 0.30 0.35 d 3.00 bsc d2 1.6 1.70 1.80 e 0.50 bsc efm8bb2 data sheet qfn20 package specifications silabs.com | smart. connected. energy-friendly. rev. 1.1 | 47
dimension min typ max e 3.00 bsc e2 1.60 1.70 1.80 f 2.50 bsc l 0.30 0.40 0.50 k 0.25 ref r 0.09 0.125 0.15 aaa 0.15 bbb 0.10 ccc 0.10 ddd 0.05 eee 0.08 fff 0.10 note: 1. all dimensions shown are in millimeters (mm) unless otherwise noted. 2. dimensioning and tolerancing per ansi y14.5m-1994. 3. the drawing complies with jedec mo-220. 4. recommended card reflow profile is per the jedec/ipc j-std-020 specification for small body components. efm8bb2 data sheet qfn20 package specifications silabs.com | smart. connected. energy-friendly. rev. 1.1 | 48
9.2 qfn20 pcb land pattern figure 9.2. qfn20 pcb land pattern drawing table 9.2. qfn20 pcb land pattern dimensions dimension min max c1 3.10 c2 3.10 c3 2.50 c4 2.50 e 0.50 x1 0.30 x2 0.25 0.35 x3 1.80 y1 0.90 y2 0.25 0.35 y3 1.80 efm8bb2 data sheet qfn20 package specifications silabs.com | smart. connected. energy-friendly. rev. 1.1 | 49
dimension min max note: 1. all dimensions shown are in millimeters (mm) unless otherwise noted. 2. dimensioning and tolerancing is per the ansi y14.5m-1994 specification. 3. this land pattern design is based on the ipc-7351 guidelines. 4. all metal pads are to be non-solder mask defined (nsmd). clearance between the solder mask and the metal pad is to be 60 m minimum, all the way around the pad. 5. a stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 6. the stencil thickness should be 0.125 mm (5 mils). 7. the ratio of stencil aperture to land pad size should be 1:1 for the perimeter pads. 8. a 2 x 2 array of 0.75 mm openings on a 0.95 mm pitch should be used for the center pad to assure proper paste volume. 9. a no-clean, type-3 solder paste is recommended. 10. the recommended card reflow profile is per the jedec/ipc j-std-020 specification for small body components. 9.3 qfn20 package marking pppp pppp tttttt yyww # figure 9.3. qfn20 package marking the package marking consists of: ? pppppppp C the part number designation. ? tttttt C a trace or manufacturing code. ? yy C the last 2 digits of the assembly year. ? ww C the 2-digit workweek when the device was assembled. ? # C the device revision (a, b, etc.). efm8bb2 data sheet qfn20 package specifications silabs.com | smart. connected. energy-friendly. rev. 1.1 | 50
10. revision history 10.1 revision 1.1 december 16, 2015 updated 3.2 power to properly reflect that a comparator falling edge wakes the device from suspend and snooze. added note 2 to table 4.1 recommended operating conditions on page 11 . added 5.2 debug . 10.2 revision 1.0 updated any tbd numbers in and adjusted various specifications. updated voh and vol graphs in figure 4.6 typical v oh curves on page 26 and figure 4.7 typical v ol curves on page 26 and upda- ted the voh and vol specifications in table 4.13 port i/o on page 21 . added more information to 3.10 bootloader . updated part numbers to revision c. 10.3 revision 0.3 updated qfn20 packaging and landing diagram dimensions. updated qfn28 d and e minimum value. updated some characterization tbd values. updated the 5 v-to-3.3 v regulator electrical characteristics table. added stop mode to the power modes table in 3.2 power . 10.4 revision 0.2 initial release. efm8bb2 data sheet revision history silabs.com | smart. connected. energy-friendly. rev. 1.1 | 51
table of contents 1. feature list ................................ 1 2. ordering information ............................ 2 3. system overview .............................. 3 3.1 introduction ............................... 3 3.2 power ................................ 4 3.3 i/o .................................. 4 3.4 clocking ................................ 5 3.5 counters/timers and pwm ......................... 5 3.6 communications and other digital peripherals ................... 6 3.7 analog ................................ 8 3.8 reset sources ............................. 9 3.9 debugging ............................... 9 3.10 bootloader .............................. 10 4. electrical characteristics .......................... 11 4.1 electrical characteristics .......................... 11 4.1.1 recommended operating conditions ..................... 11 4.1.2 power consumption ........................... 12 4.1.3 reset and supply monitor ......................... 14 4.1.4 flash memory ............................. 15 4.1.5 power management timing ........................ 15 4.1.6 internal oscillators ............................ 16 4.1.7 external clock input ........................... 16 4.1.8 adc ................................ 17 4.1.9 voltage reference ............................ 18 4.1.10 temperature sensor .......................... 19 4.1.11 5 v voltage regulator .......................... 19 4.1.12 comparators ............................. 20 4.1.13 port i/o ............................... 21 4.2 thermal conditions ............................ 21 4.3 absolute maximum ratings ......................... 22 4.4 typical performance curves ......................... 23 5. typical connection diagrams ........................ 27 5.1 power ................................ 27 5.2 debug ................................ 28 5.3 other connections ............................ 28 6. pin definitions .............................. 29 6.1 efm8bb2x-qfn28 pin definitions ....................... 29 6.2 efm8bb2x-qsop24 pin definitions ...................... 33 6.3 efm8bb2x-qfn20 pin definitions ....................... 36 table of contents 52
7. qfn28 package specifications ........................ 39 7.1 qfn28 package dimensions ........................ 39 7.2 qfn28 pcb land pattern ......................... 41 7.3 qfn28 package marking .......................... 42 8. qsop24 package specifications ....................... 43 8.1 qsop24 package dimensions ........................ 43 8.2 qsop24 pcb land pattern ......................... 45 8.3 qsop24 package marking ......................... 46 9. qfn20 package specifications ........................ 47 9.1 qfn20 package dimensions ........................ 47 9.2 qfn20 pcb land pattern ......................... 49 9.3 qfn20 package marking .......................... 50 10. revision history ............................. 51 10.1 revision 1.1 .............................. 51 10.2 revision 1.0 .............................. 51 10.3 revision 0.3 .............................. 51 10.4 revision 0.2 .............................. 51 table of contents .............................. 52 table of contents 53
disclaimer silicon laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the silicon laboratories products. characterization data, available modules and peripherals, memory s izes and memory addresses refer to each specific device, and "typical" parameters provided can and do vary in different applications. application examples described herein are for illustrative purposes only. silicon laboratories reserves the right to make changes without further notice and limitation to product information, specifications, and descriptio ns herein, and does not give warranties as to the accuracy or completeness of the included information. silicon laboratories shall have no liability for the consequences of use of the in formation supplied herein. this document does not imply or express copyright licenses granted hereunder to design or fabricate any integrated circuits. the products must not be used w ithin any life support system without the specific written consent of silicon laboratories. a "life support system" is any product or system intended to support or sustain life a nd/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. silicon laboratories products are generally not intended for military applic ations. silicon laboratories products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. trademark information silicon laboratories inc., silicon laboratories, silicon labs, silabs and the silicon labs logo, cmems?, efm, efm32, efr, energ y micro, energy micro logo and combinations thereof, "the world?s most energy friendly microcontrollers", ember?, ezlink?, ezmac?, ezradio?, ezradiopro?, dspll?, isomodem ?, precision32?, proslic?, siphy?, usbxpress? and others are trademarks or registered trademarks of silicon laboratories inc. arm, cortex, cortex-m3 and thumb are trademarks or registered trademarks of arm holdings. keil is a registered trademark of arm limited. all other products or brand names mentioned herein are trademarks of their respective holders. http://www.silabs.com silicon laboratories inc. 400 west cesar chavez austin, tx 78701 usa simplicity studio one-click access to mcu and wireless tools, documentation, software, source code libraries & more. available for windows, mac and linux! iot portfolio www.silabs.com/iot sw/hw www.silabs.com/simplicity quality www.silabs.com/quality support and community community.silabs.com

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