page 1 comchip t echnology co., l td. CPDVR085V0U rohs device circuit diagram package 1 2 3 4 8 7 6 5 gnd rev :a qw -bp028 features mechanical data -case: sot -383f standard package , molded plastic. -t erminals: nipd, solderable per mil-std-750, method 2026. -marking code: e5u -mounting position: any . -common anode esd protection -iec 61000-4-2 8kv(contact), 15kv(air). -surface mount package. -high component density . 0 . 0 8 6 ( 2 . 2 0 ) 0 . 0 7 9 ( 2 . 0 0 ) 0 . 0 6 7 ( 1 . 7 0 ) 0 . 0 5 9 ( 1 . 5 0 ) 0 . 0 2 4 ( 0 . 6 0 ) 0 . 0 1 8 ( 0 . 4 5 ) 0 . 0 1 2 ( 0 . 3 0 ) t y p . 0 . 0 5 9 ( 1 . 5 0 ) t y p . 0 . 0 0 8 ( 0 . 2 0 ) t y p . dimensions in inches and (millimeters) 0 . 0 1 4 ( 0 . 3 5 ) t y p . 5 6 7 8 4 3 2 1 gnd smd esd protection diode sot -383f(vr8)
page 2 comchip t echnology co., l td. rev :a maximum rating and electrical characteristics (at t a =25c unless otherwise noted) symbol t yp parameter min ma x unit conditions forward voltage v f v i f = 10ma 0.8 junction capacitance diode breakdown voltage v bd v i r = 1ma 120 c t pf v r = 0v ,f = 1mhz 6 leakage current i l ua v r = 5v 0.3 2.0 90 peak pulse power p pp w 200 operation temperature t j 125 o c clamping voltage v c v i pp = 5a,t p =8/20us 9.8 i pp = 16a,t p =8/20us 12.5 storage temperature t stg -55 150 o c esd kv iec 61000-4-2(air) iec 61000-4-2(contact) 20 15 esd capability qw -bp028 smd esd protection diode
page 3 comchip t echnology co., l td. ra ting and characteristic cur ves (CPDVR085V0U) rev :a f=1mhz o t a =25c f i g . 1 - 8 / 2 0 u s p e a k p u l s e c u r r e n t w a v e f o r m a c c . i e c 6 1 0 0 0 - 4 - 5 t ime (us) i p p m 0 % 2 0 % 4 0 % 6 0 % 8 0 % 1 0 0 % 0 1 0 2 0 3 0 4 0 8 us to 100% 20 us to 50us 0 20 40 60 80 120 0 1 2 3 5 4 100 c a p a c i t a n c e b e t w e e n t e r m i n a l s ( p f ) reverse voltage (v) f i g . 5 - c a p a c i t a n c e b e t w e e n t e r m i n a l s c h a r a c t e r i s t i c s c l a m p i n g v o l t a g e , v c ( v ) f i g . 3 - c l a m p i n g v o l a t a g e v s . p e a k p u l s e c u r r e n t peak pulse current,i pp (a) 20 2 0 8 10 12 14 16 4 6 15 10 5 0 8/20us waveform f o r w a r d v o l t a g e , v f ( v ) f i g . 4 - f o r w a r d v o l a t a g e v s . f o r w a r d c u r r e n t forward current,i f (a) 20 0.5 0.0 2.0 2.5 3.0 3.5 1.0 1.5 15 10 5 0 8/20us waveform p o w e r r a t i n g ( % ) o ambient temperature ( c) mounting on glass epoxy pcbs 0 2 0 4 0 6 0 8 0 1 0 0 1 2 0 2 5 5 0 7 5 1 0 0 1 5 0 0 1 2 5 f ig . 2 - p o w e r r a ti n g d e r a ti n g c u r v e qw -bp028 smd esd protection diode
b c d d d 2 d 1 e f p p 0 p 1 t s o t - 3 8 3 f s y m b o l a w w 1 ( m m ) ( i n c h ) 0 . 0 7 7 0 . 0 0 4 0 . 0 9 1 0 . 0 0 4 0 . 0 2 9 0 . 0 0 4 0 . 0 6 1 + 0 . 0 0 4 7 . 0 0 8 0 . 0 4 2 . 3 6 2 m i n . 0 . 5 1 2 0 . 0 0 8 s y m b o l ( m m ) ( i n c h ) 0 . 0 6 9 0 . 0 0 4 0 . 1 3 8 0 . 0 0 2 0 . 1 5 7 0 . 0 0 4 0 . 1 5 7 0 . 0 0 4 0 . 0 7 9 0 . 0 0 4 0 . 0 0 9 0 . 0 0 2 0 . 3 1 5 0 . 0 0 8 0 . 5 3 1 m a x . 1 . 9 6 0 . 1 0 2 . 3 1 0 . 1 0 4 . 0 0 0 . 1 0 1 . 5 5 + 0 . 1 0 3 . 5 0 0 . 0 5 1 . 7 5 0 . 1 0 6 0 . 0 m i n . 1 3 . 0 0 . 2 0 0 . 7 4 0 . 1 0 4 . 0 0 0 . 1 0 2 . 0 0 0 . 1 0 0 . 2 2 0 . 0 5 8 . 0 0 0 . 2 0 1 3 . 5 m a x . 1 7 8 1 page 4 comchip t echnology co., l td. s o t - 3 8 3 f rev :a qw -bp028 smd esd protection diode o 1 2 0 t railer device leader 10 pitches (min) 10 pitches (min) ....... ....... ....... ....... ....... ....... ....... ....... end start d 1 d 2 d w 1 t c direction of feed reel t aping specification i n d e x h o l e d e f b w p p 0 p 1 a
page 5 rev :a comchip t echnology co., l td. CPDVR085V0U e5u marking code suggested p ad layout size (inch) 0.025 (mm) 0.630 0.300 0.500 0.012 0.020 sot -383f(vr8) 0.450 0.018 e 2.150 0.085 a b c d f 1.800 0.071 e5u qw -bp028 smd esd protection diode part number marking code e b a d c f standard packaging c a s e t y p e 3 , 0 0 0 r e e l ( p c s ) reel size (inch) 7 r e e l p a c k (vr8) s o t - 3 8 3 f
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