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www.rohm.com tsz02201-0333ad100130-1-2 ?2012 rohm co., ltd. all rights reserved. 1/17 06.aug.2012 rev.001 tsz22111 ? 14? 001 datasheet 4.2v to 18v, 2a 1ch synchronous buck converter integrated fet BD1482EFJ general description the BD1482EFJ is a synchronous step-down switching regulator that integrates 2 low on-resistance n-channel mosfets. it ac hieves 2a continuous output current over a wide input supply range. current mode operation provides fa st transient response and easy phase compensation. features ? low esr output ceramic capacitors are available ? low standby current during shutdown mode ? 380 khz fixed operating frequency ? feedback voltage ? 0.923v 1.5%(ta=25 ), ? 0.923v 2.0%(ta=-25 to 85 ) ? protection circuits ? under voltage lockout protection ? thermal shutdown ? over current protection applications distributed power system pre-regulator for linear regulator key specifications ? input voltage range: 4.2v to 18v ? output voltage range: 0.923v to (vin 0.7)v ? output current: 2.0a (max.) ? switching frequency 380khz(typ.) ? hi-side fet on-resistance: 0.15 (typ.) ? lo-side fet on-resistance: 0.13 (typ.) ? standby current: 15 a (typ.) ? operating temperature range: -40 to +85 package (typ.) (typ.) (max.) htsop-j8 4.90mm x 6.00mm x 1.00mm typical application circuit r_bs protect from vin-bst short destruction. fig.1 typical application circuit c_co1 r_pc 7.5k r_up c_bs 0.1 f 10h c_vc1 10 f c_pc 3300pf r_dw 15k 39k 20 f c_ss 0.1 f l ss en comp fb bst vin gnd sw thermal pad (to be shorted to gnd) vin 12v v out 3.3v r_bs 22 product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays. htsop-j8
www.rohm.com tsz02201-0333ad100130-1-2 ?2012 rohm co., ltd. all rights reserved. 2/17 06.aug.2012 rev.001 tsz22111 ? 15? 001 BD1482EFJ datasheet pin configuration block diagram fig.2 pin configuration fig.3 block diagram pin description pin no. pin name function 1 bst high-side gate drive boost input 2 vin power input 3 sw power switching output 4 gnd ground 5 fb feed back input 6 comp compensation node 7 en enable input 8 ss soft start control input block operation ? vreg a block to generate constant-v oltage for dc/dc boosting. ? vref a block that generates internal reference voltage of 5.1 v (typ.). ? tsd/uvlo tsd (thermal shutdown)/uvlo (under voltage lockout) protection block. the tsd circuit shuts down ic at high temperature. the uvlo circuit shuts down the ic when the vin is low voltage. ? error amp block (err) this is the circuit to compare the reference voltage and the feedback voltage of output voltage. the comp pin voltage resulting from this comparison determines the switching duty. at the time of startup, since the soft start is operated by the ss pin voltage, the c omp pin voltage is limited to the ss pin voltage. ? oscillator block (osc) this block generates the oscillating frequency. ? slope block this block generates the triangular waveform from the clock created by osc. generated tr iangular waveform is sent to the pwm comparator. ? pwm block the comp pin voltage output by the error amp is compared to the slope block's triangular waveform to determine the switching du ty. since the switching duty is limited by the maximum duty ra tio which is determined internally, it does not become 100%. ? drv block a dc/dc driver block. a signal from the pwm is input to drive the power fets. ? ocp block ocp (over current protection) block. the current which flowed into fet is detected and ocp starts at 3.5a (min). after ocp, swi tching is turned off and ss capacitor is discharged. ocp is not latch type but auto restart. ? soft start circuit since the output voltage rises gradually while restricting the current at the time of startup, it is possible to prevent the ou tput voltage overshoot or the rush current. (top view) bst vin sw gnd fb comp en ss
www.rohm.com tsz02201-0333ad100130-1-2 ?2012 rohm co., ltd. all rights reserved. 3/17 06.aug.2012 rev.001 tsz22111 ? 15? 001 BD1482EFJ datasheet absolute maximum ratings (ta = 25 ) parameter symbol ratings unit supply voltage vin 20 v switch voltage v sw 20 v power dissipation for htsop-j8 pd 3760 *1 mw package thermal resistance ja *2 ja 29.27 /w package thermal resistance jc *2 jc 3.75 /w operating temperature ra nge topr -40 to +85 storage temperature range tstg -55 to +150 maximum junction temperature tjmax 150 bst voltage v bst v sw +7 v en voltage v en 20 v all other pins v oth 20 v *1 derating in done 30.08 mw/ for operating above ta R 25 (mount on 4-layer 70.0mm 70.0mm 1.6mm board) *2 mount on 4-layer 50mm x 30mm x 1.6mm application board operating ratings (ta= -40 to 85 ) parameter symbol ratings unit min typ max supply voltage v in 4.2 12 18 v sw voltage v sw -0.5 - 18 v output current i sw3 - - 2 a output voltage range v range 0.923 - v in x 0.7 v electrical characteristics (unless otherwise specified vin=12v ta=25 ) parameter symbol limits unit conditions min typ max error amplifier block fb input bias current i fb - 0.02 2 a feedback voltage1 v fb1 0.910 0.923 0.938 v voltage follower feedback voltage2 v fb2 0.906 0.923 0.942 v ta=-25 to 85 sw block high-side fet on-resistance r onh - 0.15 - ? i sw = -0.8a low-side fet on-resistance r onl - 0.13 - ? i sw = 0.8a high/low-side fet leak current i leakn - 0 10 a v in = 18v, v sw = 0v / 18v switch current limit i limit3 3.5 - - a maximum duty cycle m duty - 90 - % v fb = 0v general enable sink current i en 45 90 135 a v en = 12v enable threshold voltage v en 0.6 1.2 1.4 v under voltage lockout threshold v uvlo 3.5 3.75 4.0 v v in rising under voltage lockout hysteresis v hys - 0.3 - v soft start current i ss 5 10 15 a v ss = 0 v soft start time t ss - 22 - ms c ss = 0.1 f operating frequency f osc 300 380 460 khz circuit current i cc - 1.2 3 ma v fb = 1.5v, v en = 12v standby current i qui - 15 27 a v en = 0v
www.rohm.com tsz02201-0333ad100130-1-2 ?2012 rohm co., ltd. all rights reserved. 4/17 06.aug.2012 rev.001 tsz22111 ? 15? 001 BD1482EFJ datasheet typical performance curves (unless otherwise specified, vin= 12v ta = 25 ) fig.4 circuit current (no switching) fig.5 stand by current (ic not active) fig.7 feedback voltage fig.6 input bias current 0.905 0.915 0.925 0.935 0.945 -40 -20 0 20 40 60 80 feedback voltage[v] temp[]
www.rohm.com tsz02201-0333ad100130-1-2 ?2012 rohm co., ltd. all rights reserved. 5/17 06.aug.2012 rev.001 tsz22111 ? 15? 001 BD1482EFJ datasheet typical performance curves (unless otherwise specified, vin= 12v ta = 25 ) (continued) fig.8 hi,low-side on-resistance fig.9 operating frequency fig.10 step down efficiency (vin= 12v v out = 3.3v l=10h) fig.11 overcurrent protection (v out is shorted to gnd) 360 365 370 375 380 385 390 -40-20 0 204060 8 0 temp (c) fosc ( khz) 50 55 60 65 70 75 80 85 90 95 0 500 1000 1500 2000 efficiency[%] io[m a]
www.rohm.com tsz02201-0333ad100130-1-2 ?2012 rohm co., ltd. all rights reserved. 6/17 06.aug.2012 rev.001 tsz22111 ? 15? 001 BD1482EFJ datasheet typical performance curves (unless otherwise specified, vin= 12v ta = 25 ) (continued) fig.15 transient response (vin= 12v vout= 3.3v l= 10h cout =22f iout= 0.2-2.0a) fig.14 output ripple voltage (vin= 12v vout= 3.3v l= 10h cout =22f iout= 1.0a ) fig.12 soft start time fig.13 transient response (vin= 12v vout= 3.3v l= 10h cout =22f iout= 0.2-1.0a ) vout iout vout-max: +37.5mv vout-min: -43.5mv vout: 50mv/div iout: 1.0a/div 500usec/div vout vout: 20mv/div S : +22.8mv vout iout vout-max: +87mv vout-min: -98mv vout: 100mv/div iout: 1.0a/div 500usec/div
www.rohm.com tsz02201-0333ad100130-1-2 ?2012 rohm co., ltd. all rights reserved. 7/17 06.aug.2012 rev.001 tsz22111 ? 15? 001 BD1482EFJ datasheet typical performance curves (unless otherwise specified, vin= 12v ta = 25 ) (continued) fig.17 start up waveform (vin= 12v vout= 3.3v l= 10h css= 0.1f) fig.16 output ripple voltage (vin= 12v vout= 3.3v l= 10h cout =22f iout= 2.0a ) vout iout vout: 20mv/div iout: 1.0a/div S : +23.2mv 1usec/div 22ms tss vout iout en vout: 1.0v/div iout: 1.0a/div en: 10v/div 5msec/div
www.rohm.com tsz02201-0333ad100130-1-2 ?2012 rohm co., ltd. all rights reserved. 8/17 06.aug.2012 rev.001 tsz22111 ? 15? 001 BD1482EFJ datasheet application information typical application circuit r_bs protect from vin-bst short destruction. fig.18 application circuit symbol maker part no input capacitor c_vc1 tdk c3225jb1e106k 10f/25v output capacitor c_co1 tdk c3216jb1c106m 10f/16v inductor l tdk slf10165-100m3r8 10h/3.8a c_bs 0.1 f v out 3.3v r_bs 22 c_co1 r_up 10h c_vc1 10 f c_pc 3300pf r_dw 15k 39k 20 f c_ss 0.1 f l ss en comp fb bst vin gnd sw thermal pad (to be shorted to gnd) vin 12v r_pc 7.5k
www.rohm.com tsz02201-0333ad100130-1-2 ?2012 rohm co., ltd. all rights reserved. 9/17 06.aug.2012 rev.001 tsz22111 ? 15? 001 BD1482EFJ datasheet selecting application components (1) output lc filter constant selection (buck converter) the output lc filter is requir ed to supply constant current to the output load. a larger val ue inductance at this filter results in less inductor ripple current ( ? i l ) and less output ripple voltage. however, the larger value inductors tend to have less fast load transient-response, a larger physical size , a lower saturation current and higher series resistance. a smaller value inductance has almost opposite characte ristics above.so choosing the inductor ripple current ( ? i l ) between 20 to 40% of the averaged inductor current (equ ivalent to the output load current) is a good compromise. fig.19 fig.20 setting ? i l = 30% x averaged inductor current (2a) = 0.6 [a] l = v out ? (v in - v out ) x 1 = 10 [h] v in x f osc x ? i l where v in = 12v, v out = 3.3v, f osc = 380 khz, ; f osc is a switching frequency also the inductor should have the higher saturation current than i outmax + ? i l / 2. the output capacitor c out affects the output ripple-voltage. choose the large capacitor to achieve the small ripple-voltage enough to meet the application requirement. output ripple voltage ? v rpl is calculated by the following equation. ? v rpl = ? i l ? ( r esr + 1 ) [v] 8x c out x f osc where r esr is a parasitic series resistance in output capacitor. setting c out = 20f, r esr = 10m ? v rpl = 0.6 x (10m + 1 / (8 x 20u x 380k)) = 15.8mv (2) loop compensation choosing compensation capacitor c cmp and resistor r cmp the current-mode buck converter has 2-poles and 1-zero system . choosing the compensation resistor and capacitor is important for a good load-transient response and good stability. the example of dc/dc converter application bode plot is shown below. the compensation resistor r cmp will decides the cross over frequency f crs (the frequency that the total dc-dc loop-gain falls to 0db). setting the higher cross over frequency achieves good res ponse speed, however less stability. while setting the lower cross over frequency shows good stability but worse response speed. the 1/10 of switching frequency for the cross over fr equency shows a good performance at most applications. i l t i outmax + ? i l /2 should not reach the rated value level i lr inductor averaged current v out l v in c out
www.rohm.com tsz02201-0333ad100130-1-2 ?2012 rohm co., ltd. all rights reserved. 10/17 06.aug.2012 rev.001 tsz22111 ? 15? 001 BD1482EFJ datasheet phase margin 180 90 180 90 0 0 a (a) gbw(b) f f gain [db] phase f crs ( i ) choosing phase compensation resistor r cmp the compensation resistor r cmp can be on following formula. r cmp = 2 x v out x f crs x c out [ ] v fb x g mp x g ma where v out ; output voltage, f crs ; cross over frequency, c out ; output capacitor, v fb ; internal feedback voltage ( 0.923v (typ) ), g mp ; current sense gain ( 7.8a/v (typ) ) , g ma ; error amplifier trans-conductance ( 300a/v (typ) ) setting v out = 3.3v, f crs = 38khz, c out = 20f; r cmp = 2 x 3.3 x 38k x 20u = 7.30k ~= 7.5k [ ] 0.923 x 7.8 x 300u ( ii ) choosing phase compensation capacitor c cmp for the stability of dc/dc converter, canceling the phase delay that derives from output capacitor c out and resistive load r out by inserting the phase advance. the phase advance can be added by the zero on compensation resistor r cmp and capacitor c cmp . making fz= f crs / 6 gives a first-order estimate of c cmp . compensation capacitor c cmp = 1 [f] 2 x r cmp x fz setting fz= f crs /6 = 6.3khz; compensation capacitor c cmp = 1 = 3.54n ~= 3.3n [f] 2 x 7.5k x 6.3k however, the best values of zero and f crs are different between applications. after calculation above formula and confirmation actual application, please decide values finally. ( iii ) the condition of the loop compensation stability the stability of dc/dc converter is important. to secure t he operating stability, please check the loop compensation has the enough phase-margin. for the condition of loop co mpensation stability, the phase-delay must be less than 150 degree where gain is 0 db. feed forward capacitor c rup boosts phase margin over a limited frequency range and is sometimes used to improve loop response. c rup will be more effective if r up >> r up ||r dw fig.21 fig.22 (3) design of feedback resistance constant set the feedback resistance as shown below. fig.23 v out = r1 + r2 ? 0.923 [v] r2 v out r1 r2 err 0.923v fb v out r up c cm p co mp r cm p fb r dw 0.923v c rup
www.rohm.com tsz02201-0333ad100130-1-2 ?2012 rohm co., ltd. all rights reserved. 11/17 06.aug.2012 rev.001 tsz22111 ? 15? 001 BD1482EFJ datasheet soft start function an adjustable soft-start function to prevent high inrush current during start-up is available. the soft-start time is set by th e external capacitor connected to ss pin. the soft start time is given by; t ss [s] = 2.2 x css / i ss setting c ss = 0.1f; t ss = 2.2 x 0.1 / 10 = 22 [ms] please confirm the overshoot of the output voltage and inrush current when deciding the ss capacitor value. en function the en terminal control ic?s shut down. leaving en terminal open makes ic shutdown. to start the ic, en terminal should be connected to vin or the other power source output. when the en voltage exceed 1.2v (typ.), the ic start operating. the ic also has the hysteresis voltage 0.2v (typ.) of en when en voltage falls down. (attention1) chattering happens if standing lowering speed is slow when standing of en pin is lowered. the reverse current in which the input side and the pressure operation are done from the output side is generated when chattering operates with the output voltage remained, and there is a case to destruction. please set to stand within 100us when you control on/off by the en signal. this necessity doesn't exist when en pin is connected with vin and en is not controlled. the control by open drain mosfet shown in a left chart is recommended. (attention 2) in case the output voltage is used in a setting of more than 5v, when en signal is turned off, please start up en again after output voltage is discharged enough. if en is turned on although output voltage isn?t discharged enough, bst circuit doesn?t operate normally. as the result, the ic is not oper ated, in the worst case, it is destroyed. ren on/off signal en vin en 124 k ? (typ.) 254 k ? (typ.) c ss ss + + - comp i ss 10a erramp fig.24 fig.25
www.rohm.com tsz02201-0333ad100130-1-2 ?2012 rohm co., ltd. all rights reserved. 12/17 06.aug.2012 rev.001 tsz22111 ? 15? 001 BD1482EFJ datasheet c in fet c out l v out vin layout pattern consideration two high pulsing current flowing loops exist in the buck regulat or system. the first loop, when fet is on, starts from the input capacitors, to the vin terminal, to the sw terminal, to t he inductor, to the output capacitors, and then returns to the input capacitor through gnd. the second loop, when fet is of f, starts from the low fet, to the inductor, to the output capacitor, and then returns to the low fet through gnd. to reduce the noise and improve the efficiency, please minimize these two loop area. especially input capa citor, output capacitor and low fet should be connected to gnd plain. pcb layout may affect the thermal perf ormance, noise and efficiency greatly. so please take extra care when designing pcb layout patterns. ? the thermal pad on the back side of ic ha s the great thermal conduction to the ch ip. so using the gnd plain as broad and wide as possible can help thermal dissipation. and a lot of thermal via for helping the spread of heat to the different layer is also effective. ? the input capacitors should be connected as close as possible to the vin terminal. ? when there is unused area on pcb, please arrange the copper foil plain of dc nodes, such as gnd, vin and vout for helping heat dissipation of ic or circumference parts. ? to avoid the noise influence from ac combination with the ot her line, keep the switching line such as sw not extend as much as possible, and trace shortly and thickly to coil. ? keep sensitive signal traces such as trace connected fb and comp away from sw pin. ? the inductor and the output capacitors should be placed close to sw pin as much as possible. bst vin sw en gnd c out l v out c in fig.26 current loop in buck regulator system fig.27 the example of pcb layout pattern
www.rohm.com tsz02201-0333ad100130-1-2 ?2012 rohm co., ltd. all rights reserved. 13/17 06.aug.2012 rev.001 tsz22111 ? 15? 001 BD1482EFJ datasheet i/o equivalent circuit diagram 1.bst 3.sw 5.fb 6.comp 7.en 8.ss fig.28 i/o equivalent circuit power dissipation vin vin sw reg vin vin vin vin vin 150 0 50 75 100 125 2000 4000 1000 3000 25 power dissipation: pd [mw] ambient temperature: ta [c] (1)820mw (2)1100mw (3)2110mw (4)3760mw 0 htsop-j8 package on 70 ? 70 ? 1.6 mm glass epoxy pcb (1) 1-layer board (backside copper foil area 0 mm ? 0 mm) (2) 2-layer board (backside copper foil area 15 mm ? 15 mm) (3) 2-layer board (backside copper foil area 70 mm ? 70 mm) (4) 4-layer board (backside copper foil area 70 mm ? 70 mm)
www.rohm.com tsz02201-0333ad100130-1-2 ?2012 rohm co., ltd. all rights reserved. 14/17 06.aug.2012 rev.001 tsz22111 ? 15? 001 BD1482EFJ datasheet operational notes 1) absolute maximum ratings use of the ic in excess of absolute maximum ratings such as the applied voltage or oper ating temperature range may result in ic damage. assumptions should not be made re garding the state of the ic (short mode or open mode) when such damage is suffered. a physical safety measure such as a fuse should be implemented when use of the ic in a special mode where the absolute maximum ratings may be exceeded is anticipated. 2) gnd potential ensure a minimum gnd pin potential in all operating conditions. 3) setting of heat use a thermal design that allows for a sufficient margin in light of the power dissipation (pd) in actual operating conditions. 4) pin short and mistake fitting use caution when orienting and positioning the ic for mounting on printed circ uit boards. improper mounting may result in damage to the ic. shorts between output pi ns or between output pins and the powe r supply and gnd pins caused by the presence of a foreign object ma y result in dama ge to the ic. 5) actions in strong magnetic field use caution when using the ic in the pres ence of a strong magnetic field as doi ng so may cause the ic to malfunction. 6) testing on application boards when testing the ic on an application board, connecting a capacito r to a pin with low impedance subjects the ic to stress. always discharge capacitors after each process or step. ground the ic during assembly steps as an antistatic measure, and use similar caution when transporting or storing the ic. always turn the ic's power supply off before connecting it to or removing it from a jig or fixtur e during the inspection process. 7) ground wiring patterns when using both small signal and large current gnd patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. be careful not to change the gnd wiring patterns of any external components. 8) regarding input pin of the ic this monolithic ic contains p+ isolati on and p substrate layers between adjacent el ements in order to keep them isolated. p/n junctions are formed at the intersection of these p layers with the n layers of other elements to create a variety of parasitic elements. for example, when the resistors and transis tors are connected to the pins as sh own in fig.29, a parasitic diode or a transistor operates by invertin g the pin voltage and gnd voltage. the formation of parasitic elements as a result of the relationships of the potentials of different pins is an inevitable resul t of the ic's architecture. the operation of parasitic elements can cause interference with circuit operation as well as ic malfunction and damage. for these reasons, it is necessary to use caution so that the ic is not used in a way that will trigger the operation of parasitic elements such as by the application of voltages lo wer than the gnd (p substrate) voltage to input and output pins. fig.29 example of a simple monolithic ic architecture 9) overcurrent protection circuits an overcurrent protection circuit designed according to the out put current is incorporated fo r the prevention of ic damage that may result in the event of load s horti ng. this protection circuit is effe ctive in preventing damage due to sudden and unexpected accidents. however, the ic s hould not be used in applications characte rized by the continuous operation or transitioning of the protection circuits. at the time of thermal designing, keep in mind that the current capacity has negative characteristics to temperatures. (pin a) gnd n p n n p+ p+ resistor parasitic elements p gnd n p n n p+ p+ parasitic elements p substrate ( pin b ) c b e transistor (npn) n gnd parasitic elements ( pin b ) gnd c b e parasitic elements gnd ( pin a )
www.rohm.com tsz02201-0333ad100130-1-2 ?2012 rohm co., ltd. all rights reserved. 15/17 06.aug.2012 rev.001 tsz22111 ? 15? 001 BD1482EFJ datasheet 10) thermal shutdown circuit (tsd) this ic incorporates a built-in tsd circ uit for the protection from thermal destruc tion. the ic should be used within the specified power dissipation range. however, in the event that the ic continues to be operated in excess of its power dissipation limits, the attendant rise in the chip's junction temperature tj will trigger the tsd circuit to turn off all outpu t power elements. operation of the tsd circuit presumes that the ic's absolute maximum ratings have been exceeded. application designs should never make use of the tsd circuit. 11) en control speed chattering happens if standing lowering speed is slow when standing of en pin is lowered. the reverse current in which the input side and the pressure operation are done from the output side is gener ated when chattering operates with the output voltage remained, and there is a ca se to destruction. please set to stand within 100s when you control on/off by the en signal. status of this document the japanese version of this document is fo rmal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority.
www.rohm.com tsz02201-0333ad100130-1-2 ?2012 rohm co., ltd. all rights reserved. 16/17 06.aug.2012 rev.001 tsz22111 ? 15? 001 BD1482EFJ datasheet ordering information b d 1 4 8 2 e f j - e2 package efj: htsop-j8 packaging and forming specification e2: embossed tape and reel physical dimension tape and reel information marking diagram (unit : mm) htsop-j8 0.08 s 0.08 m s 1.0max 0.850.05 1.27 0.080.08 0.42 +0.05 - 0.04 1.050.2 0.650.15 4 + 6 ? 4 0.17 +0.05 - 0.03 234 568 (max 5.25 include burr) 7 1 0.545 (3.2) 4.90.1 6.00.2 (2.4) 3.90.1 1pin mark ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin htsop-j8 (top view) bd1482 part number marking lot number 1pin mark
www.rohm.com tsz02201-0333ad100130-1-2 ?2012 rohm co., ltd. all rights reserved. 17/17 06.aug.2012 rev.001 tsz22111 ? 15? 001 BD1482EFJ datasheet revision history date revision changes 06.aug.2012 001 new release
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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