View BA2903YFVM-CTR_8432075.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

www.rohm.com ? 201 3 rohm co. , ltd. all rights reserved. tsz02201 - 0rfr1g200120 -1-2 tsz22111 ? 14 ? 001 1/ 30 29.sep.2015 rev.005 comparator seri es automotive ground sense comparators ba2903 y xxx -c , ba2901 y xx -c general description ba2903y xxx -c/ ba2901y xx -c , inte grate two or four independent high gain voltage comparator. some features are the wide operating voltage that is 2v to 36v and low supply current. ba2903y xxx -c, ba2901y xx -c are manufactured for automotive requirements of engine control unit , electric power steering, antilock brake system, etc. features ? aec- q100 qualified (note 1) ? s in gle or dual supply operation ? wide op erating supply voltage ? standard comparator p in - assignments ? common - mode input voltage range includes ground level, allowing direct ground sensing ? internal esd protection circuit ? wide temperature range (note1: grade1) key specifications ? o perating supply voltage single supply : +2.0v to +36v split supply : 1.0v to 18v ? s upply current ba2903 y xxx -c 0.6ma(typ.) ba2901 y xx -c 0.8ma(typ.) ? i nput bias current : 50na(typ.) ? i nput offset current : 5na(typ.) ? operating temperature range : - 40 to + 125 special characteristics ? input offset voltage - 40c to 125c : 5 mv (max .) packages w (typ.) x d(typ.) x h(max.) sop8 5.00mm x 6.20mm x 1.71mm sop14 8.70mm x 6.20mm x 1.71mm ssop- b8 3.00mm x 6.40mm x 1.35mm ssop- b14 5.00mm x 6.40mm x 1.35mm mso p8 2.90mm x 4.00mm x 0.90mm application ? engine control unit ? electric power steering (eps) ? anti- lock brak e system (abs) ? automotive electronics selection guide s implified schematic product structure silicon monolithic integrated circuit this product has not designed protection against radioactive rays. figure 1 . s implified schematic (one channel only) +in - in out vcc vee automotive q uad dual 0.8ma 0.6ma supply current ba2903yf -c ba2903yfv -c ba2903yfvm -c ba2901yf -c ba2901yfv -c +125 maximum operating temperature datashee t downloaded from: http:///
www.rohm.com ? 201 3 rohm co., ltd. all rights reserved. tsz02201 - 0rfr1g200120 -1-2 tsz22111 ? 15 ? 001 2/ 30 29.sep.2015 rev.005 ba2903yxxx - c, ba2901 yxx -c datasheet pin configuration ba2903yf - c : sop8 ba2903 yfv - c : ssop-b8 ba2903yfvm - c : msop8 pin no. pin name 1 out1 2 - in1 3 +in1 4 vee 5 +in2 6 - in2 7 out2 8 vcc ba2901yf -c : sop14 ba2901yfv - c : ssop-b14 pin no. pin name 1 out 2 2 out 1 3 vcc 4 - in 1 5 +in 1 6 - in2 7 +in 2 8 - in3 9 + in3 10 - in 4 11 +in4 12 vee 13 out 4 14 out3 package sop8 ssop-b8 msop8 sop14 ssop-b14 ba2903yf -c ba2903yfv -c ba2903yfvm -c ba2901yf -c ba2901yfv -c + - - + 1 2 3 4 ch1 c h2 5 6 7 8 out 1 out2 - in2 +in2 +in1 - in1 vee vcc - + - + - + - + 2 out 1 out2 out3 out4 1 3 4 5 6 7 8 9 10 11 12 13 14 ch 1 ch 2 ch 3 ch 4 vcc - in1 +in1 +in2 - in2 +in3 - in3 vee +in4 - in4 downloaded from: http:///
www.rohm.com ? 201 3 rohm co., ltd. all rights reserved. tsz02201 - 0rfr1g200120 -1-2 tsz22111 ? 15 ? 001 3/ 30 29.sep.2015 rev.005 ba2903yxxx - c, ba2901 yxx -c datasheet ordering information b a 2 9 0 x y x x x - c x x part number ba2903yxx x ba2901yxx package f : sop8 sop14 fv : ssop-b8 : ssop-b14 fvm : msop8 pack aging and forming specification c : for automotive e2: embosse d tape and reel (sop8/sop14/s sop -b8/ ssop- b14) tr: embossed tape and reel (msop8) line - up topr operating supply voltage dual/quad package orderable part number - 40 to + 125 +2.0v to +36v dual sop8 reel of 2500 ba2903yf -ce2 ssop-b8 reel of 2500 ba 290 3 yfv -ce2 msop8 reel of 3000 ba2903yfvm -c tr quad sop14 reel of 2500 ba2901yf -ce2 ssop-b14 reel of 2500 ba2901yfv -ce2 absolute maximum ratings (ta=25 ) parameter symbol ratings unit supply voltage vcc -vee +36 v power d issipation pd sop8 770 *1*6 mw ssop-b8 620 *2*6 msop8 58 0 *3*6 sop14 560 *4*6 ssop-b14 870 *5*6 differential input voltage *7 vid + 36 v input common - mode voltage range vicm (vee- 0.3) to (vee+36) v input current *8 ii - 10 ma operating supply voltage vopr + 2.0 to + 36 ( 1.0 to 1 8) v operating temperature range topr - 40 to +125 storage temperature range ts t g - 55 to +150 maximum junction temperature tjmax +150 note : absolute maximum rating item indicates the condition which must not be exceeded. application if voltage in excess of absolute maximum rating or use out of absolute maxi mum rated temperature environment may cause deterioration of characteristics. *1 to use at temperature above ta 25 reduce 6.2 mw/ . *2 to use at temperature above ta 25 reduce 5. 0 mw/ . *3 to use at temperature above ta 25 reduce 4. 7 mw/ . *4 to use at temperature above ta 25 reduce 4. 5 mw/ . *5 to use at temperature above ta 25 reduce 7.0 mw/ . *6 mounted on a fr4 glass epox y pcb ( 70mm70mm1.6mm ). *7 the voltage difference between inverting input and non - inverting input is the differential input voltage. then input pin voltage is set to more than vee. *8 an excessive input current will flow when input voltages of lesser than v ee - 0.6v are applied. the input current can be set to less than the rated current by adding a limiting resistor. downloaded from: http:///
www.rohm.com ? 201 3 rohm co., ltd. all rights reserved. tsz02201 - 0rfr1g200120 -1-2 tsz22111 ? 15 ? 001 4/ 30 29.sep.2015 rev.005 ba2903yxxx - c, ba2901 yxx -c datasheet electrical characteristics ba2903y xxx -c ( unless otherwise specified vcc=+5v, vee=0v) parameter symbol temperature range limits unit conditions min. typ. max. input offset voltage *9 vio 25 - 2 4 mv out=1.4v full range - - 5 vcc=5 to 36v, out =1.4v input offset current *9 iio 25 - 5 40 na out=1.4v full range - - 50 input bias current *9 ib 25 - 50 250 na out=1.4v full range - - 275 input common - mod e voltage range vicm 25 0 - vcc - 1.5 v - full range 0 - vcc - 2.0 large signal voltage gain av 25 88 100 - db vcc=15v, out=1.4 to 11.4v rl = 15k , vrl = 15v full range 74 - - supply current icc 25 - 0.6 1 ma out=open full range - - 2.5 out=open, vcc=36v output sink current * 10 isink 25 6 16 - ma +in =0v, - in =1v, vol=1.5v o utput saturation voltage (low level output voltage ) vol 25 - 150 400 mv +in =0v, - in =1v, isink=4ma full range - - 700 output leakage current (high level output current ) ileak 25 - 0.1 - na +in =1v, - in =0v, voh=5v full range - - 1 a +in =1v, - in =0 v, voh=36v response time tre 25 - 1.3 - s rl=5.1k , vrl = 5v in =100mv p-p , overdrive=5mv - 0.4 - rl=5.1k , vrl = 5v , in =ttl logic swing, vref=1.4v operable frequency fopr 25 100 - - khz vcc=5v, rl=2k , +in =1.5v, - in =5vp-p (duty 50% rectangular pulse) *9 absolute value * 10 please determine the output current value in consideration of the power dissipati on of the ic under high temperature environm ent. when the output terminal is continuously shorted, output current may be reduced by the tem perature ris e of the ic. ba2901y xx -c ( unless otherwise specified vcc=+5v, vee=0v) parameter symbol temperature range limits unit conditions min. typ. max. input offset voltage * 11 vio 25 - 2 4 mv out=1.4v full range - - 5 vcc=5 to 36v, out=1.4v input offset current * 11 iio 25 - 5 40 na out=1.4v full range - - 50 input bias current * 11 ib 25 - 50 250 na out=1.4v full range - - 275 input common - mod e voltage range vicm 25 0 - vcc - 1.5 v - full range 0 - vcc - 2.0 large signal voltage gain av 25 88 10 0 - db vcc=15v, out=1.4 to 11.4v rl = 15k , vrl = 15v full range 74 - - supply current icc 25 - 0. 8 2 ma out=open full range - - 2.5 out=open, vcc=36v output sink current * 12 isink 25 6 16 - ma +in=0v, - in=1v, vol=1.5v output saturation voltage ( low level output voltage ) vol 25 - 150 400 mv +in=0v, - in=1v, isink=4ma full range - - 700 output leakage current (high level output current ) ileak 25 - 0.1 - na +in=1v, - in=0v, voh=5v full range - - 1 a +in=1v, - in=0v, voh=36v response time tre 25 - 1.3 - s rl=5.1k , vrl = 5v in=100mv p-p , overdrive=5mv - 0.4 - rl=5.1k , vrl = 5v , in=ttl logic swing, vref=1.4v operable frequency fopr 25 100 - - khz vcc=5v, rl=2k , +in=1.5v, - in=5vp -p (duty 50% rectangular pulse) *11 absolute value *12 pl ease determine the output current value in consideration of the power dissipation of the ic under high temperature environmen t. when the output terminal is continuously shorted, output current may be reduced by the tem perature rise of the ic. downloaded from: http:///
www.rohm.com ? 201 3 rohm co., ltd. all rights reserved. tsz02201 - 0rfr1g200120 -1-2 tsz22111 ? 15 ? 001 5/ 30 29.sep.2015 rev.005 ba2903yxxx - c, ba2901 yxx -c datasheet description of electrical characteristics described below are descriptions of the relevant electrical terms used in this datasheet . items and symbols used are also shown. note that item name and symbol and their meaning may differ from thos e on another manufacturers document or general document. 1. absolute maximum ratings absolute maximum rating items indicate the condition which must not be exceeded. application of vol tage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. 1.1 s upply v oltage (vcc -vee) indicates the maximum voltage that can be applied between the positive power s upply terminal and negative power supply terminal without deterioration or destruction of characteristics of internal circuit. 1.2 differential i nput v oltage (vid) indicates the maximum voltage that can be applied between non - inverting and inverting terminals without damaging the ic. 1.3 input c ommon - mode v oltage r ange (vicm) indicates the maximum voltage that can be applied to the non - inverting and inverting terminals without deterioration or destruction of electrical characteristics. input common - mode voltage range of the maximum ratings does not assure normal operation of ic. for normal operation, use the ic within the input common - mode voltage range characteristics. 1.4 operating and s torage t emperature ra nges ( topr,tstg) the operating temperature range indicates the temperature range within which t he ic can operate. the higher the ambient temperature, the lower the power consumption of the ic. the storage temperature range denotes the range of temperatures the ic can be stored under without causing excessive deterioration of the el ectrical characteristics. 1. 5 power d issipation (pd) indicates the power that can be consumed by the ic when mounted on a specific board at the ambient temperat ure 25 (normal temperature). as for package product, pd is determined by the temperature that can be permitted by the ic in the package (maximum junction tempera ture) and the thermal resistance of the package. 2.electrical characteristics 2.1 input o ffset v oltage (vio) indicates the voltage difference between non - inverting terminal and inverting terminals. it can be translated into the input voltage difference required for setting the output voltage at 0 v. 2. 2 input o ffset c urrent (iio) indicates the difference of input bias current between the non - inverting and inverting terminals. 2. 3 input b ias c urrent (ib) indicates the current that flows into or out of the input terminal. it is defined by the average of input bias currents at the non - inverting and inverting terminals. 2.4 input c ommon - mode v oltage r ange (vicm) indicates the input voltage range where ic normally operates. 2.5 large s ignal v oltage g ain ( av) indicates the amplifying rate (gain) of output voltage against the voltage difference between non - inverting terminal and inverting terminal. it is normally the amplifying rate (gain) with reference to dc v oltage. av = (output voltage) / (differential i nput voltage ) 2.6 supply current (icc) indicates the current that flows within the ic under specified no - load conditions. 2. 7 output s ink c urrent (i sink ) indicates the current flowing into the ic under specific output conditions. 2.8 output s aturation v oltage ( l ow level output voltage ) (vol) indicates the lower limit of output voltage under specific input and output conditions . 2.9 output l eakage c urrent ( high level output current ) (ileak) indicates the current that flows into the ic under specific input and output conditions. 2.1 1 response time (tre) indicate s t he time interval between the application of input and output condition s. 2.10 operable frequency ( fopr ) indicates minimum frequency that ic moves under specific conditions. . downloaded from: http:///
www.rohm.com ? 201 3 rohm co., ltd. all rights reserved. tsz02201 - 0rfr1g200120 -1-2 tsz22111 ? 15 ? 001 6/ 30 29.sep.2015 rev.005 ba2903yxxx - c, ba2901 yxx -c datasheet typical performa nce curves ba2903y xxx -c (*)the data above is measurement value of typical sample, it is not guaranteed. figure 3 . supply current C supply voltage figure 4 . supply current C ambient temperature figure 5 . maximum output voltage C supply voltage (isink=4ma) 0. 0 0. 2 0. 4 0. 6 0. 8 1. 0 1. 2 1. 4 1. 6 0 10 20 30 40 supply current [ma] . supply voltage [v] 0 50 100 150 200 0 10 20 30 40 maximum output voltage [mv] supply voltage [v] 25 125 - 40 36v 5v 2v 25 125 - 40 0. 0 0. 2 0. 4 0. 6 0. 8 1. 0 1. 2 1. 4 1. 6 -50 -25 0 25 50 75 10 0 12 5 15 0 supply current [ma] ambient temperature [ ] figure 2 . derating curve 0 200 400 600 800 1000 0 25 50 75 100 125 150 power dissipation [mw] ambient temperature [ ] ba290 3y fv m-c ba290 3y fv -c ba290 3yf-c downloaded from: http:///
www.rohm.com ? 201 3 rohm co., ltd. all rights reserved. tsz02201 - 0rfr1g200120 -1-2 tsz22111 ? 15 ? 001 7/ 30 29.sep.2015 rev.005 ba2903yxxx - c, ba2901 yxx -c datasheet typical performance curves - continued ba2903y xxx -c (*)the data above is measurement value of typical sample , it is not guaranteed. -8 -6 -4 -2 0 2 4 6 8 0 10 20 30 40 input offset voltage [mv] supply voltage [v] figure 7 . output voltage C output sink cur rent (vcc=5v) figure 8 . output sink current C ambient temperature (out=1.5v) figure 9 . input offset voltage C supply voltage 0 0. 2 0. 4 0. 6 0. 8 1 1. 2 1. 4 1. 6 1. 8 2 0 2 4 6 8 10 12 14 16 18 20 output voltage [v] output sink current [ma] 0 10 20 30 40 -50 -25 0 25 50 75 10 0 12 5 15 0 output sink current [ma] ambient temperature [ ] 25 125 - 40 36v 5v 2v 25 125 - 40 figure 6 . maximum output voltage C ambient temperature (isink=4ma) 36v 5v 2v 0 50 100 150 200 -50 -25 0 25 50 75 100 125 150 maximum output voltage [mv] ambient temperature [ ] downloaded from: http:///
www.rohm.com ? 201 3 rohm co., ltd. all rights reserved. tsz02201 - 0rfr1g200120 -1-2 tsz22111 ? 15 ? 001 8/ 30 29.sep.2015 rev.005 ba2903yxxx - c, ba2901 yxx -c datasheet typical performance curves - continued ba2903y xxx -c (*)the data above is measurement value of typical sample , it is not guaranteed. figure 10 . input offset voltage C ambient temperature figure 11 . input bias current C supply voltage figure 13 . in put offset current C supply voltage figure 12 . input bias current C ambient temperature -8 -6 -4 -2 0 2 4 6 8 -50 -25 0 25 50 75 10 0 12 5 15 0 input offset voltage [mv] ambient temperature [ ] 0 20 40 60 80 10 0 12 0 14 0 16 0 0 5 10 15 20 25 30 35 input bias current [na] supply voltage [v] 0 20 40 60 80 10 0 12 0 14 0 16 0 -50 -25 0 25 50 75 10 0 12 5 15 0 input bias current [na] ambient temperature [ ] -50 -40 -30 -20 -10 0 10 20 30 40 50 0 10 20 30 40 input offset current[na] supply voltage [v] 36v 5v 2v 25 125 - 40 36v 5v 2v 25 125 - 40 downloaded from: http:///
www.rohm.com ? 201 3 rohm co., ltd. all rights reserved. tsz02201 - 0rfr1g200120 -1-2 tsz22111 ? 15 ? 001 9/ 30 29.sep.2015 rev.005 ba2903yxxx - c, ba2901 yxx -c datasheet typical performance curves - continued ba2903y xxx -c (*)the data above is measurement value of typical sample , it is not guaranteed. figure 14 . input off set current C ambient temperature figure 15 . large signal voltage gain C supply voltage figure 17 . common mode rejection ratio C supply voltage figure 16 . large signal voltage gain C ambient temperature 60 70 80 90 10 0 11 0 12 0 13 0 14 0 0 10 20 30 40 large singal voltage gain [db] supply voltage [v] -50 -40 -30 -20 -10 0 10 20 30 40 50 -50 -25 0 25 50 75 10 0 12 5 15 0 input offset current [na] ambient temperature [ ] 60 70 80 90 10 0 11 0 12 0 13 0 14 0 -50 -25 0 25 50 75 10 0 12 5 15 0 large singal voltage gain [db] ambient temperature [ ] 40 60 80 10 0 12 0 14 0 16 0 0 10 20 30 40 common mode rejection ratio [db] supply voltage [v] 2v 5v 36v 125 - 40 25 15 v 5v 36v - 40 25 125 downloaded from: http:///
www.rohm.com ? 201 3 rohm co., ltd. all rights reserved. tsz02201 - 0rfr1g200120 -1-2 tsz22111 ? 15 ? 001 10 / 30 29.sep.2015 rev.005 ba2903yxxx - c, ba2901 yxx -c datasheet typical performance curves - continued ba2903y xxx -c (*)the data above is measurement value of typical sample , it is not guaranteed. 0 1 2 3 4 5 -10 0 -80 -60 -40 -20 0 response time (low to high)[ s] over drive voltage [mv] figure 18 . common mode rejection ratio C ambient temperature figure 19 . input offset voltage C input vo ltage (vcc=5v) figure 20 . power supply rejection ratio C ambient temperature figure 21 . response time (low to high) C over drive voltage (vcc=5v, vrl=5v, rl=5.1k) -6 -4 -2 0 2 4 6 -1 0 1 2 3 4 5 input offset voltage [mv] input voltage [v] 0 25 50 75 10 0 12 5 15 0 -50 -25 0 25 50 75 10 0 12 5 15 0 common mode rejection ratio [db] ambient temperature [ ] 60 80 10 0 12 0 14 0 16 0 18 0 20 0 -50 -25 0 25 50 75 10 0 12 5 15 0 power supply rejection ratio [db] ambient temperature [ ] 36v 2v 5v - 40 25 125 - 40 25 125 downloaded from: http:///
www.rohm.com ? 201 3 rohm co., ltd. all rights reserved. tsz02201 - 0rfr1g200120 -1-2 tsz22111 ? 15 ? 001 11 / 30 29.sep.2015 rev.005 ba2903yxxx - c, ba2901 yxx -c datasheet typical performance curves - continued ba2903y xxx -c (*)the data above is measurement value of typical sample , it is not guaranteed. 0 1 2 3 4 5 -50 -25 0 25 50 75 10 0 12 5 15 0 rresponse time (low to high)[ s] ambient temperature [ ] 0 2 4 6 8 10 -50 -25 0 25 50 75 10 0 12 5 15 0 response time (high to low)[ s] ambient temperature [ ] 0 2 4 6 8 10 0 20 40 60 80 10 0 response time (high to low)[ s] over drive voltage [mv] figure 22 . response time (low to high) C ambient temperature (vcc=5v, vrl=5v, rl=5.1k) figure 23 . response time (high to low) C over drive voltage (vcc=5v, vrl=5v, rl=5.1k) figure 24 . response time (high to low) C ambient temperature (vcc=5v, vrl=5v, rl=5.1k) 5mv overdrive 20mv overdrive 100mv overdrive - 40 25 125 5mv o verdrive 20mv overdrive 100mv overdrive downloaded from: http:///
www.rohm.com ? 201 3 rohm co., ltd. all rights reserved. tsz02201 - 0rfr1g200120 -1-2 tsz22111 ? 15 ? 001 12 / 30 29.sep.2015 rev.005 ba2903yxxx - c, ba2901 yxx -c datasheet typical performance curves ba2901y xx -c (*)the data above is measurement value of typical sample , it i s not guaranteed. 0 200 400 600 800 1000 0 25 50 75 100 125 150 power dissipation [mw] ambient temperature [ ] figure 27 . supply current C ambient temperature figure 25 . derating curve figure 26 . supply current C supply voltage ba2901yf -c ba2901yfv -c figure 28 . maximum output voltage C supply voltage (isink=4ma) 0 50 100 150 200 0 10 20 30 40 maximum output voltage [mv] supply voltage [v] 25 125 - 40 25 125 - 40 0.0 0.5 1.0 1.5 2.0 0 10 20 30 40 supply current [ma] supply voltage [v] 2v 5v 36v 0.0 0.5 1.0 1.5 2.0 -50 -25 0 25 50 75 100 125 150 supply current [ma] ambient temperature [ ] downloaded from: http:///
www.rohm.com ? 201 3 rohm co., ltd. all rights reserved. tsz02201 - 0rfr1g200120 -1-2 tsz22111 ? 15 ? 001 13 / 30 29.sep.2015 rev.005 ba2903yxxx - c, ba2901 yxx -c datasheet 0 50 100 150 200 -50 -25 0 25 50 75 100 125 150 maximum output voltage [mv] ambient temperature [ ] typical performance curves - continued ba2901y xx -c (*)the data above is measurement value of typical sample, it is not guaranteed. -8 -6 -4 -2 0 2 4 6 8 0 10 20 30 40 input offset voltage [mv] supply voltage [v] figure 29. maximum output voltage C ambient temperature (isink=4ma) figure 30. output voltage C outp ut sink current (vcc=5v) figure 31. output sink current C ambient temperature (out=1.5v) figure 32. input offset voltage C supply voltage 0 0. 2 0. 4 0. 6 0. 8 1 1. 2 1. 4 1. 6 1. 8 2 0 2 4 6 8 10 12 14 16 18 20 output voltage [v] output sink current [ma] 0 10 20 30 40 -50 -25 0 25 50 75 10 0 12 5 15 0 output sink current [ma] ambient temperature [ ] 25 125 - 40 36v 5v 2v 25 125 - 40 36v 5v 2v downloaded from: http:///
www.rohm.com ? 201 3 rohm co., ltd. all rights reserved. tsz02201 - 0rfr1g200120 -1-2 tsz22111 ? 15 ? 001 14 / 30 29.sep.2015 rev.005 ba2903yxxx - c, ba2901 yxx -c datasheet typical performance curves - continued ba2901y xx -c (*)the data above is measurement value of typical sample , it is not guaranteed. figure 33. input offset voltage C ambient temperature figure 34. input bias current C supply voltage figure 36. input offset current C supply voltage figure 35. input bias current C ambient temperature -8 -6 -4 -2 0 2 4 6 8 -50 -25 0 25 50 75 10 0 12 5 15 0 input offset voltage [mv] ambient temperature [ ] 0 20 40 60 80 10 0 12 0 14 0 16 0 0 5 10 15 20 25 30 35 input bias current [na] supply voltage [v] 0 20 40 60 80 10 0 12 0 14 0 16 0 -50 -25 0 25 50 75 10 0 12 5 15 0 input bias current [na] ambient temperature [ ] -50 -40 -30 -20 -10 0 10 20 30 40 50 0 10 20 30 40 input offset current[na] supply voltage [v] 36v 5v 2v 25 125 - 40 36v 5v 2v 25 125 - 40 downloaded from: http:///
www.rohm.com ? 201 3 rohm co., ltd. all rights reserved. tsz02201 - 0rfr1g200120 -1-2 tsz22111 ? 15 ? 001 15 / 30 29.sep.2015 rev.005 ba2903yxxx - c, ba2901 yxx -c datasheet typical performance curves - contin ued ba2901y xx -c (*)the data above is measurement value of typical sample, it is not guaranteed. figure 37. input offset current C ambient temperature figure 38. large signal voltage gain C supply voltage figure 40. common mode rejection ratio C supply voltage figure 39. large signal voltage gain C ambient temperature 60 70 80 90 10 0 11 0 12 0 13 0 14 0 0 10 20 30 40 large singal voltage gain [db] supply voltage [v] -50 -40 -30 -20 -10 0 10 20 30 40 50 -50 -25 0 25 50 75 10 0 12 5 15 0 input offset current [na] ambient temperature [ ] 60 70 80 90 10 0 11 0 12 0 13 0 14 0 -50 -25 0 25 50 75 10 0 12 5 15 0 large singal voltage gain [db] ambient temperature [ ] 40 60 80 10 0 12 0 14 0 16 0 0 10 20 30 40 common mode rejection ratio [db] supply voltage [v] 2v 5v 36v 125 - 40 25 15 v 5v 36v - 40 25 125 downloaded from: http:///
www.rohm.com ? 201 3 rohm co., ltd. all rights reserved. tsz02201 - 0rfr1g200120 -1-2 tsz22111 ? 15 ? 001 16 / 30 29.sep.2015 rev.005 ba2903yxxx - c, ba2901 yxx -c datasheet typical performance curves - continued ba2901y xx -c (*)the data above is measurement value of typical sample, it is not guaranteed. 0 1 2 3 4 5 -10 0 -80 -60 -40 -20 0 response time (low to high)[ s] over drive voltage [mv] - 40 25 125 figure 41. common mode rejection ratio C ambient temperature figure 42. input offset voltage C input voltage (vcc=5v) figure 43. power supply rej ection ratio C ambient temperature figure 44. response time (low to high) C over drive voltage (vcc=5v, vrl=5v, rl=5.1k) -6 -4 -2 0 2 4 6 -1 0 1 2 3 4 5 input offset voltage [mv] input voltage [v] 0 25 50 75 10 0 12 5 15 0 -50 -25 0 25 50 75 10 0 12 5 15 0 common mode rejection ratio [db] ambient temperature [ ] 60 80 10 0 12 0 14 0 16 0 18 0 20 0 -50 -25 0 25 50 75 10 0 12 5 15 0 power supply rejection ratio [db] ambient temperature [ ] 36v 2v 5v - 40 25 125 downloaded from: http:///
www.rohm.com ? 201 3 rohm co., ltd. all rights reserved. tsz02201 - 0rfr1g200120 -1-2 tsz22111 ? 15 ? 001 17 / 30 29.sep.2015 rev.005 ba2903yxxx - c, ba2901 yxx -c datasheet typical performance curves - continued ba2901y xx -c (*)the data above is measurement value of typical sample , it is not guaranteed. 0 1 2 3 4 5 -50 -25 0 25 50 75 10 0 12 5 15 0 rresponse time (low to high)[ s] ambient temperature [ ] 0 2 4 6 8 10 -50 -25 0 25 50 75 10 0 12 5 15 0 response time (high to low)[ s] ambient temperature [ ] 0 2 4 6 8 10 0 20 40 60 80 10 0 response time (high to low)[ s] over drive voltage [mv] figure 45. response time (low to high) C ambient temperature (vcc=5v, vrl=5v, rl=5.1k) figure 46. response time (high to low) C over drive voltage (vcc=5v, vrl=5v, rl=5.1k) figure 47. response time (high to low) C ambient temperature (vcc=5v, vrl=5v, rl=5.1k) 5mv overdrive 20mv overdrive 100mv overdrive - 40 25 125 5mv overdrive 20mv overdrive 100mv overdrive downloaded from: http:///
www.rohm.com ? 201 3 rohm co., ltd. all rights reserved. tsz02201 - 0rfr1g200120 -1-2 tsz22111 ? 15 ? 001 18 / 30 29.sep.2015 rev.005 ba2903yxxx - c, ba2901 yxx -c datasheet power dissipation power dissipation (total loss) indicates the power that the ic can consume at ta=25c (normal temperature) . as the ic consumes power, it heats up, causing its temperature to be higher than the amb ient temperature. the allowable temperature that the ic can accept is limited. this depends on the circuit configuration, man ufacturing process, and consumable power. power dissipation is determined by the allowable temperature within the ic (maximum junct ion temperature) and the thermal resistance of the package used (heat dissipation capability). maximum jun ction temperature is typically equal to the maximum storage temperature. the heat generated through the consumption of power by the ic radiates from t he mold resin or lead frame of the package. thermal resistance, represented by the symbol jac/w, indicates this heat dissipation capability. similarly, the temper ature of an ic inside its package can be estimated by thermal resistance. figure 5 0. (a) shows the model of the thermal resistance of the package. the equation below shows how to comput e for the thermal resistance (ja), given the ambient temperature (ta) , junction temperature (tj), and power dissipation (pd). ja = (tj max - ta) / pd /w ????? ( ) the derating curve in figure 48. (b) indicates the power that the ic can consume with reference to ambient temperature. power consumption of the ic begins to attenuate at certain temperatures. t his gradient is determined by thermal resistance (ja), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc. this may also vary even when the same of package is used. thermal redu ction curve indicates a reference value measured at a specified condition. figure 49. (c),(d ) shows an example of the derating curve for ba2903yxxx - c, ba 2901yxx -c. ( *1 3) ( *1 4) ( *1 5) ( *1 6) ( *1 7) unit 6.2 5. 0 4. 7 7.0 4. 5 mw/ when using the unit above ta=25 , subtract the value above per degree . permissible dissipation is the value when fr4 glass epoxy board 70mm70mm1.6mm( cooper foil area below 3%) is mounted. (a) thermal resistance (b) derating curve figure 48 . thermal resistance and derating (c) ba2 903y (d) ba2901y figure 49 . derating curve ?? ta [ ] ? ? tj [ ] M p [w] ambient temperature chip surface temperature power dissipation pd [w] 0 50 75 100 125 150 25 p1 p2 pd (max) lsi M [w] ' ja2 ' ja1 tj ' (max) ja2 < ja1 ?? ta [ ] ja2 ja1 tj (max) ambient temperature power dissipation of lsi ja=(tjmax - ta)/pd /w 0 200 400 600 800 1000 0 25 50 75 100 125 150 power dissipation [mw] ambient temperature [ ] ba290 1y fv - c(*16) ba290 1yf- c(*17) 0 200 400 600 800 1000 0 25 50 75 100 125 150 power dissipation [mw] ambient temperature [ ] ba290 3y fv m- c(*15) ba290 3y fv - c(*14) ba290 3yf- c(*13) downloaded from: http:///
www.rohm.com ? 201 3 rohm co., ltd. all rights reserved. tsz02201 - 0rfr1g200120 -1-2 tsz22111 ? 15 ? 001 19 / 30 29.sep.2015 rev.005 ba2903yxxx - c, ba2901 yxx -c datasheet application information null method condition for test circ uit 1 vcc,vee,ek,vicm unit v parameter vf s1 s2 s3 v cc vee ek vicm calculation input offset voltage vf1 on on on 5 36 0 - 1.4 0 1 input offset current vf2 off off on 5 0 - 1.4 0 2 input bias current vf3 off on on 5 0 - 1.4 0 3 vf4 on off 5 0 - 1.4 0 l arge signal voltage gain vf5 on on on 15 0 - 1.4 0 4 vf6 15 0 - 11.4 0 - calculation - 1. input offset voltage (vio) 2. input offset current (iio) 3. input bias current (ib) 4. large signal voltage gain ( av ) figure 50 . test circuit 1 (one channel only) [v] rs / rf + 1 vf1 vio = [a] rs) / rf + (1 ri vf1 - vf2 iio = [a] rs) / rf + (1 ri 2 vf3 - vf4 ib = [db] vf6 - vf5 rf/rs) +(1 ek log 20 av = vicm vf rl 0.1 f 500k 500k rf=50k rs=50 ri=10k ek null dut v sw1 sw2 1000pf sw3 vcc vee - 15v +15v ri=10k rs=50 50k vrl downloaded from: http:///
www.rohm.com ? 201 3 rohm co., ltd. all rights reserved. tsz02201 - 0rfr1g200120 -1-2 tsz22111 ? 15 ? 001 20 / 30 29.sep.2015 rev.005 ba2903yxxx - c, ba2901 yxx -c datasheet switch condition for test circuit 2 sw no. sw 1 sw 2 sw 3 sw 4 sw 5 sw 6 sw 7 supply current off off off off off off off output sink current vol=1.5v off on on off off off on output saturation voltage isink=4ma off on on off on on off output leakage current voh=36v off on on off off off on response time rl=5.1k, vrl=5v on off on on off off off figure 51 . test circuit 2 (one channel only) figure 52 . response time 0v +100mv v in tre (low to high) v cc/2 ?R v out 0v v cc ?R overdrive voltage overdrive voltage 0v -100mv v in ?R tre (high to low) v cc/2 v out 0v v cc ?R input wave i nput wave output wave output wave sw1 sw2 sw3 sw5 sw6 sw7 a v a vin- vin+ vrl rl vol/voh vcc vee sw4 downloaded from: http:///
www.rohm.com ? 201 3 rohm co., ltd. all rights reserved. tsz02201 - 0rfr1g200120 -1-2 tsz22111 ? 15 ? 001 21 / 30 29.sep.2015 rev.005 ba2903yxxx - c, ba2901 yxx -c datasheet application e xample reference voltage is - in while the input volta ge (vin) i s higher that the reference voltage, the output voltage remains high. in case the input voltage becomes lower than the reference voltage, the output voltage will turn low . reference voltage is +in while the input v oltage (vin) is smaller that the reference voltage, the output voltage remains high . in case the input voltage becomes high er than the reference voltage, the output voltage will turn low . + - reference voltage reference voltage vref vin vcc vee vrl rl out vin vref vee vcc vrl rl out ?R ?R hi gh out reference voltage time input voltage wave v in low time output voltage wave ?R ?R ?R high ?R out v in reference voltage time input voltage wave output voltage wave time low + - downloaded from: http:///
www.rohm.com ? 201 3 rohm co., ltd. all rights reserved. tsz02201 - 0rfr1g200120 -1-2 tsz22111 ? 15 ? 001 22 / 30 29.sep.2015 rev.005 ba2903yxxx - c, ba2901 yxx -c datasheet operational notes 1. reverse connection of power supply connectin g the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. furthermore, connect a capacit or to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when us ing electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small - signal and large - current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuatio ns in the small - signal ground caused by large currents. also ensure that the ground traces of external components do not cause variat ions on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding this absolute maximum rating, incr ease the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approxi mately obtained. the electrical characteristics are guaranteed under the conditions of each parame ter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable an d inrush current may flow instantaneously due to the internal powering sequence and delays, especially i f the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application b oards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the in spection process. to prevent damage from static discharge, ground the ic during ass embly and use similar precautions during transport and storage. 10. inter- pin short and mountin g errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humid envi ronment) and unintentional solder bridge deposited in between pins during assembly to name a few. downloaded from: http:///
www.rohm.com ? 201 3 rohm co., ltd. all rights reserved. tsz02201 - 0rfr1g200120 -1-2 tsz22111 ? 15 ? 001 23 / 30 29.sep.2015 rev.005 ba2903yxxx - c, ba2901 yxx -c datasheet operational notes C continued 11. unused circuits when there are unu sed comparators, it is recommended that they are connected as in figure 53. ,setting the non - inverting input terminal to a potential within the in - phase input voltage range (vicm). 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p - n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figur e below): when gnd > pin a and gnd > pin b, the p - n junction operates as a parasitic diode. when gnd > pin b, the p - n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasit ic dio des can result in mutual interference among circuits, operational faults, or physical damage. theref ore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) shou ld be avoided. figure 54. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant consideri ng the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. input voltage applying vee +36v to the input terminal is possible without causing deterioration of the electr ical characteristics or destruction, regardless of the supply voltage. however, this does not ensure normal circui t operation. please note that the circuit operates normally only when the input voltage is within the common m ode input voltage range of the electric characteristics. 15. power supply (single / split) the comparator operates when the voltage supplied is between vcc and vee. t herefore, the single supply comparator can be used as a split supply comparator as well. 16. terminal short - circuits when the output and vcc terminals are shorted, excessive output current may flow, resulting i n undue heat generation and, subsequently, destructi on. 17. ic handling applying mechanical stress to the ic by deflecting or bending the board may cause fluctuations in the electrical characteristics due to piezo resistance effects. figure 53 . example of application circuit for unused comparator please keep this potential in vicm vcc -1 .5v vicm vee vcc v ee open vicm downloaded from: http:///
www.rohm.com ? 201 3 rohm co., ltd. all rights reserved. tsz02201 - 0rfr1g200120 -1-2 tsz22111 ? 15 ? 001 24 / 30 29.sep.2015 rev.005 ba2903yxxx - c, ba2901 yxx -c datasheet physical dimension , tape and reel information package name sop8 (unit : mm) pkg : sop8 drawing no. : ex11 2- 5001 -1 (max 5.35 (include.burr)) downloaded from: http:///
www.rohm.com ? 201 3 rohm co., ltd. all rights reserved. tsz02201 - 0rfr1g200120 -1-2 tsz22111 ? 15 ? 001 25 / 30 29.sep.2015 rev.005 ba2903yxxx - c, ba2901 yxx -c datasheet physi cal dimension , tape and reel information package name sop14 (unit : mm) pkg : sop14 drawing no. : ex113 - 5001 (max 9.05 (include.burr)) downloaded from: http:///
www.rohm.com ? 201 3 rohm co., ltd. all rights reserved. tsz02201 - 0rfr1g200120 -1-2 tsz22111 ? 15 ? 001 26 / 30 29.sep.2015 rev.005 ba2903yxxx - c, ba2901 yxx -c datasheet physical dimension , tape and reel information package name ssop - b8 downloaded from: http:///
www.rohm.com ? 201 3 rohm co., ltd. all rights reserved. tsz02201 - 0rfr1g200120 -1-2 tsz22111 ? 15 ? 001 27 / 30 29.sep.2015 rev.005 ba2903yxxx - c, ba2901 yxx -c datasheet physical dimension , tape and reel information package name ssop - b14 downloaded from: http:///
www.rohm.com ? 201 3 rohm co., ltd. all rights reserved. tsz02201 - 0rfr1g200120 -1-2 tsz22111 ? 15 ? 001 28 / 30 29.sep.2015 rev.005 ba2903yxxx - c, ba2901 yxx -c datasheet physical dimension , tape and reel informati on package name msop8 downloaded from: http:///
www.rohm.com ? 201 3 rohm co., ltd. all rights reserved. tsz02201 - 0rfr1g200120 -1-2 tsz22111 ? 15 ? 001 29 / 30 29.sep.2015 rev.005 ba2903yxxx - c, ba2901 yxx -c datasheet marking diagram s product name package type marking ba2903y f-c sop8 2903y fv -c ssop-b8 03y fvm-c msop8 2903y ba2901y f-c sop14 ba2901yf fv -c ssop-b14 2901y sop8(top view) part number marking lot number 1pin mark ssop- b8(top view) part number marking lot number 1pin mark sop14(top view) part number marking lot number 1pin mark ssop- b14(top view) part number marking lot number 1pin mark msop8(top view) part number marking lot number 1pin mark downloaded from: http:///
www.rohm.com ? 201 3 rohm co., ltd. all rights reserved. tsz02201 - 0rfr1g200120 -1-2 tsz22111 ? 15 ? 001 30 / 30 29.sep.2015 rev.005 ba2903yxxx - c, ba2901 yxx -c datasheet land pattern data revision history d ate revision changes 11.apr .2012 001 new release 21 .j an .2013 002 land pattern data inserted. 11 .m ar .2013 003 input offset voltage, input offset current limit (temp=25 ) changed. description of physical dimension , tape and reel information changed. 8.ma y.2013 004 sop8, ssop - b8, msop8 power dissipation corrected. ssop- b8, ssop - b14 corrected. 29 .sep .201 5 00 5 correction s, postscript (operational notes),changing the notation package land pitch e land space mie land length R? 2 land width b2 sop8 sop14 1.27 4.60 1.10 0.76 ssop-b8 ssop-b14 0.65 4.60 1.20 0.35 msop8 0.65 2.62 0.99 0.35 sop8, ssop - b8, msop8 sop14, ssop -b14 all dimensions in mm e b 2 mie l2 downloaded from: http:///
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

▲Up To Search▲

Price & Availability of BA2903YFVM-CTR

	To Download BA2903YFVM-CTR Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .