t gl220 3 ka - band 1 w vpin limiter preliminary datasheet: rev - 0 6 - 17 - 14 - 1 of 6 - disclaimer: subject to change without notice ? 2013 triquint www.triquint.com applications ? receive chain protection ? commercial and military radar product features ? frequency range: 30 - 38 ghz ? insertion loss : < 1 db ? peak power handling : 1 w ? flat leakage: 20 dbm at p in < 30 dbm ? spike leakage: 2 0 db m at p in < 30 dbm ? return loss: > 12 db ? passive (no dc bias required) ? integrated dc block on input and output ? chip dimensions : 1.35 x 1.15 x 0.1 mm functional block diagram p in configuration p in no. symbol 1 rf in 2 rf out notes: 1. rf input and output ports are not interchangeable. general description the triquint tgl2203 is a wideband mmic gaas vpin limiter capable of protecting sensitive receive channel components against high power incident signals . the tgl220 3 does not require dc bias and achieves a low insertion loss a ll in a small form factor. these features allow for simple integration with mi nimal impact to system performance. the tgl220 3 operates from 30 to 38 ghz and ac hieves low insertion loss of 1 db and a return loss of > 12 db ; i t can limit up to 1 w incident power with a low fl at leakage of 20 dbm. the tgl220 3 is ideally suited to support both commercial and defense related applications. le ad - free and rohs compliant. ordering information part eccn description tgl2203 ear99 ka - band 1 w vpin limiter
t gl220 3 ka - band 1 w vpin limiter preliminary datasheet: rev - 0 6 - 17 - 14 - 2 of 6 - disclaimer: subject to change without notice ? 2013 triquint www.triquint.com absolute maximum ratings parameter value incident power, cw or pulsed, 50 ? , 25 c 2 w mounting temperature (30 seconds) 320 c storage temperature ?40 to 150 c operation of this device outside the parameter ranges given above may cause permanent damage. these are stress ratings only, and functional operation of the device at these conditions is not implied. recommended operating conditions parameter value passive C n o bias electrical specifications are measured at specified test conditions. specifications are not guaranteed over all recommended operating conditions. electrical specifications test conditions unless otherwise noted: t = 25c parameter conditions min typ max units operational frequency range 30 38 ghz insertion loss < 1 db input return loss 12 db output return loss 12 db flat leakage power p in < 30 dbm 20 dbm spike leakage 33 ghz, pulsed, pw = 1 s, 10% dc 20 db m insertion loss temperature coefficient 0.00 4 db/ c
t gl220 3 ka - band 1 w vpin limiter preliminary datasheet: rev - 0 6 - 17 - 14 - 3 of 6 - disclaimer: subject to change without notice ? 2013 triquint www.triquint.com typical performance 8 10 12 14 16 18 20 10 12 14 16 18 20 22 24 26 28 30 output power (dbm) input power (dbm) output power vs. input power vs. freq. temp = 25 c, cw 35 ghz 34 ghz 33 ghz 36 ghz 8 10 12 14 16 18 20 10 12 14 16 18 20 22 24 26 28 30 output power (dbm) input power (dbm) output power vs. input power vs. freq. temp = 25 c, pulse: pw=5s, dc=50% 35 ghz 34 ghz 33 ghz 36 ghz 8 10 12 14 16 18 20 10 12 14 16 18 20 22 24 26 28 30 output power (dbm) input power (dbm) output power vs. input power vs. freq. 35 ghz 34 ghz 33 ghz temp = 25 c, pulse: pw=1s, dc=10% 36 ghz -30 -27 -24 -21 -18 -15 -12 -9 -6 24 26 28 30 32 34 36 38 40 s11 (db) frequency (ghz) input return loss vs. freq. vs. temp. cw 85 c 25 c - 40 c -30 -27 -24 -21 -18 -15 -12 -9 -6 24 26 28 30 32 34 36 38 40 s22 (db) frequency (ghz) output return loss vs. freq. vs. temp. cw 85 c 25 c - 40 c -2.0 -1.8 -1.6 -1.4 -1.2 -1.0 -0.8 -0.6 -0.4 -0.2 0.0 24 26 28 30 32 34 36 38 40 s21 (db) frequency (ghz) insertion loss vs. frequency vs. temp. cw 85 c 25 c - 40 c
t gl220 3 ka - band 1 w vpin limiter preliminary datasheet: rev - 0 6 - 17 - 14 - 4 of 6 - disclaimer: subject to change without notice ? 2013 triquint www.triquint.com assembly drawing mechanical information and pad description unit: millimeters thickness: 0.10 die x, y size tolerance: 0.050 chip edge to bond pad dimensions are shown to center of pad ground is backside of die pad number symbol description pad size 1 rf in input; matched to 50 . 0.100 x 0.200 2 rf out output; matched to 50 . 0.100 x 0.200 notes: 1. rf input and output ports are not interchangeable. in out 1 2 rf in rf out 0.000 0.322 0.524 0.723 1.150 0.000 1.350 1 2 0.092 0.322 0.524 0.723 0.000 1.150 1.258
t gl220 3 ka - band 1 w vpin limiter preliminary datasheet: rev - 0 6 - 17 - 14 - 5 of 6 - disclaimer: subject to change without notice ? 2013 triquint www.triquint.com assembly notes component placement and adhesive attachment assembly notes: ? vacuum pencils and/or vacuum collets are the preferred method of pick up. ? air bridges must be avoided during placement. ? the force impact is critical during auto placement. ? solder or organic adhesive attachment can be used for tgl220 3 . ? curing should be done in a convection oven; proper exhaust is a safety concern. solder attachment reflow process assembly notes: ? use ausn (80/20) solder and limit exposure to temperatures above 300c to 3 to 4 minutes, maximum. ? an alloy station or conveyor furnace with reducing atmosphere should be used. ? do not use any kind of flux. ? coefficient of thermal expansion matching is critical for long - term reliability. ? devices must be stored in a dry nitrogen atmosphere. organic adhesive attachment assembly notes: ? the organics such as epoxy or polyimide can be used. ? epoxies cure at temperatures of 100 to 200c. interconnect process assembly notes : ? thermosonic ball bonding is the preferred interconnect technique. ? force, time, and ultrasonics are critical parameters. ? aluminum wire should not be used. ? devices with small pad sizes should be bonded with 0.0007 - inch wire.
t gl220 3 ka - band 1 w vpin limiter preliminary datasheet: rev - 0 6 - 17 - 14 - 6 of 6 - disclaimer: subject to change without notice ? 2013 triquint www.triquint.com product compliance information esd sensitivity ratings caution! esd - sensitive device esd rating: tbd value: tbd test: human body model (hbm) standard: jedec standard jesd22 - a114 solderability compatible with the latest version of j - std - 020 lead free solder, 260 c. msl rating tbd at 260 c convection reflow the part is rated moisture sensitivity level tbd jedec standard ipc/jedec j - std - 020. solderability rohs compliance this part is compliant with eu 2002/95/ec rohs directive (restrictions on the use of certain hazardous substances in electrical and electronic equipment). this product also has the following attributes: ? lead free ? halogen free (chlorine, bromine) ? antimony free ? tbbp - a (c 15 h 12 br 4 0 2 ) free ? pfos free ? svh c free eccn us department of commerce: ear99 contact information for the latest specifications, additional product information, worldwide sales and distribution locations, and information about triquint: web: www.triquint.com tel: +1. 972 . 994 . 8465 email: info - sales@triquint.com fax: +1. 972 . 994 . 8504 for technical questions and application information: email: info - products@triquint.com important notice the information contained herein is believed to be reliable. triquint makes no warranties regarding the information contained herein. triquint assumes no responsibility or liability whatsoever for any of the information contained herein. triquint assumes no responsibility or liability whatsoever for the use of the information contained herein. the information contained herein is provided "as i s, where is" and with all faults, and the entire risk associated with such information is entirely with the user. all information contained herein is subject to change without notice. customers should obtain and verify the latest relevant information bef ore placing orders for triquint products. the information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. triquint products are not warranted or authorized for use as critical components in medical, life - saving, or life - sustaining applications, or other applications where a failure would rea sonably be expected to cause severe personal injury or death.
|
