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i ntegrated c ircuits d ivision ds-ixd_609-r06 www.ixysic.com 1 features ? 9a peak source/sink drive current ? wide operating voltage range: 4.5v to 35v ? -40c to +125c extended operating temperature range ? logic input withstands negative swing of up to 5v ? matched rise and fall times ? low propagation delay time ? low, 10 ? a supply current ? low output impedance applications ? efficient power mosfet and igbt switching ? switch mode power supplies ? motor controls ? dc to dc converters ? class-d switching amplifiers ? pulse transformer driver description the ixdd609/ixdi609/ixdn609 high-speed gate drivers are especially well suited for driving the latest ixys mosfets and igbts. the ixd_609 high-current output can source and sink 9a of peak current while producing voltage rise and fall times of less than 25ns. the input is cmos compatible, and is virtually immune to latch up. proprietary circuitry eliminates cross-conduction and current ?shoot-through.? low propagation delay and fast, matched rise and fall times make the ixd_609 family ideal for high-frequency and high-power applications. the ixdd609 is configured as a non-inverting driver with an enable, the ixdn609 is configured as a non-inverting driver, and the ixdi609 is configured as an inverting driver. the ixd_609 family is available in a standard 8-pin dip (pi); an 8-pin soic (sia); an 8-pin power soic with an exposed metal back (si); an 8-pin dfn (d2); a 5-pin to-263 (yi); and a 5-pin to-220 (ci). ordering information part number logic configuration package type packing method quantity ixdd609d2tr 8-pin dfn tape & reel 2000 ixdd609si 8-pin power soic with exposed metal back tube 100 ixdd609sitr 8-pin power soic with exposed metal back tape & reel 2000 ixdd609sia 8-pin soic tube 100 ixdd609siatr 8-pin soic tape & reel 2000 ixdd609pi 8-pin dip tube 50 ixdd609ci 5-pin to-220 tube 50 ixdd609yi 5-pin to-263 tube 50 ixdi609si 8-pin power soic with exposed metal back tube 100 ixdi609sitr 8-pin power soic with exposed metal back tape & reel 2000 ixdi609sia 8-pin soic tube 100 IXDI609SIATR 8-pin soic tape & reel 2000 ixdi609pi 8-pin dip tube 50 ixdi609ci 5-pin to-220 tube 50 ixdi609yi 5-pin to-263 tube 50 ixdn609si 8-pin power soic with exposed metal back tube 100 ixdn609sitr 8-pin power soic with exposed metal back tape & reel 2000 ixdn609sia 8-pin soic tube 100 ixdn609siatr 8-pin soic tape & reel 2000 ixdn609pi 8-pin dip tube 50 ixdn609ci 5-pin to-220 tube 50 ixdn609yi 5-pin to-263 tube 50 in en out in out in out ixd_609 9-ampere low-side ultrafast mosfet drivers
i ntegrated c ircuits d ivision ixd_609 2 www.ixysic.com r06 1. specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 pin configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.3 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.4 recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.5 electrical characteristics: t a = 25c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.6 electrical characteristics: t a = - 40c to +125c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.7 thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2. ixd_609 performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 timing diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 characteristics test diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3. block diagrams & truth tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.1 ixdd609 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.2 ixdi609 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.3 ixdn609 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4. typical performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5. manufacturing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5.1 moisture sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5.2 esd sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5.3 soldering profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5.4 mechanical dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
i ntegrated c ircuits d ivision ixd_609 r06 www.ixysic.com 3 1 specifications 1.1 pin configurations 1.2 pin definitions 1.3 absolute maximum ratings unless stated otherwise, absolute maximum electrical ratings are at 25c absolute maximum ratings are stress rating s. stresses in excess of these ratings c an cause permanent damage to the device. functional operation of the device at condit ions beyond those indicated in the operational sections of this data sheet is not implied. 1.4 recommended operating conditions 1 4 3 2 8 5 6 7 v cc in en gnd v cc out out gnd 1 4 3 2 5 v cc out gnd in en 1 4 3 2 8 5 6 7 v cc in nc gnd v cc out out gnd 1 4 3 2 5 v cc out gnd in nc 1 4 3 2 8 5 6 7 v cc in nc gnd v cc out out gnd 1 4 3 2 5 v cc out gnd in nc ixdd609 d2 / pi / si / sia ixdi609 pi / si / sia ixdn609 pi / si / sia ixdd609 ci / yi ixdi609 ci / yi ixdn609 ci / yi pin name description in logic input en output enable - drive pin low to disable output, and force output to a high impedance state out output - sources or sinks current to turn-on or turn-off a discrete mosfet or igbt out inverted output - sources or sinks current to turn-on or turn-off a discrete mosfet or igbt v cc supply voltage - provides power to the device gnd ground - common ground reference for the device nc not connected parameter symbol minimum maximum units supply voltage v cc -0.3 40 v input voltage v in , v en -5 v cc +0.3 v output current i out - 9a junction temperature t j -55 +150 c storage temperature t stg -65 +150 c parameter symbol range units supply voltage v cc 4.5 to 35 v operating temperature range t a -40 to +125 c
i ntegrated c ircuits d ivision ixd_609 4 www.ixysic.com r06 1.5 electrical characteristics: t a = 25c test conditions: 4.5v < v cc < 35v (unless otherwise noted). 1.6 electrical characteristics: t a = - 40c to +125c test conditions: 4.5v < v cc < 35v unless otherwise noted. parameter conditions symbol minimum typical maximum units input voltage, high 4.5v < v cc < 18v v ih 3.0 - - v input voltage, low 4.5v < v cc < 18v v il --0 . 8 input current 0v < v in < v cc i in -- 1 0 ? a en input voltage, high ixdd609 only v enh 2/3v cc -- v en input voltage, low ixdd609 only v enl -- 1/3v cc output voltage, high - v oh v cc -0.025 -- v output voltage, low - v ol - - 0.025 output resistance, high state v cc =18v, i out =-100ma r oh -0.61 ? output resistance, low state v cc =18v, i out =100ma r ol -0.40.8 output current, continuous limited by package power dissipation i dc -- 2a rise time v cc =18v, c load =10nf t r -2235 ns fall time v cc =18v, c load =10nf t f -1525 on-time propagation delay v cc =18v, c load =10nf t ondly -4060 off-time propagation delay v cc =18v, c load =10nf t offdly -4260 enable to output-high delay time (ixdd609 only) v cc =18v t enoh -2560 disable to high impedance state delay time (ixdd609 only) v cc =18v t dold -3560 enable pull-up resistor - r en -200-k ? power supply current v cc =18v, v in =3.5v i cc -12m a v cc =18v, v in =0v -<110 ? a v cc =18v, v in =v cc -<110 parameter conditions symbol minimum maximum units input voltage, high 4.5v < v cc < 18v v ih 3.3 - v input voltage, low 4.5v < v cc < 18v v il -0 . 6 5 input current 0v < v in < v cc i in - 1 0 ? a output voltage, high - v oh v cc -0.025 - v output voltage, low - v ol - 0.025 output resistance, high state v cc =18v, i out =-100ma r oh -2 ? output resistance, low state v cc =18v, i out =100ma r ol -1 . 5 output current, continuous limited by package power dissipation i dc - 1a rise time v cc =18v, c load =10nf t r -4 0 ns fall time v cc =18v, c load =10nf t f -3 0 on-time propagation delay v cc =18v, c load =10nf t ondly -7 5 off-time propagation delay v cc =18v, c load =10nf t offdly -7 5 enable to output-high delay time ixdd609 only, v cc =18v t enoh -7 5 disable to high impedance state delay time ixdd609 only, v cc =18v t dold -7 5 power supply current v cc =18v, v in =3.5v i cc -2 . 5m a v cc =18v, v in =0v -150 ? a v cc =18v, v in =v cc -1 5 0
i ntegrated c ircuits d ivision ixd_609 r06 www.ixysic.com 5 1.7 thermal characteristics 2 ixd_609 performance 2.1 timing diagrams 2.2 characteristics test diagram package parameter symbol rating units d2 (8-pin dfn) thermal resistance, junction-to-ambient ? ja 35 c/w ci (5-pin to-220) 36 pi (8-pin dip) 125 si (8-pin power soic) 85 sia (8-pin soic) 120 yi (5-pin to-263) 46 ci (5-pin to-220) thermal resistance, junction-to-case ? jc 3 c/w si (8-pin power soic) 10 yi (5-pin to-263) 2 10% 90% t ondly t offdly t r t f v ih v il in out 10% 90% t ondly t offdly t f t r v ih v il in out en in out gnd v cc v cc + - v in 0.1 f10 f tektronix current probe 6302 c load v cc
i ntegrated c ircuits d ivision ixd_609 6 www.ixysic.com r06 3 block diagrams & truth tables 3.1 ixdd609 3.2 ixdi609 3.3 ixdn609 in en out 0 1 or open 0 1 1 or open 1 x0 z in out 0 1 1 0 gnd in en v cc out in v cc gnd out in out 0 0 1 1 in v cc gnd out
i ntegrated c ircuits d ivision ixd_609 r06 www.ixysic.com 7 4 typical perform ance characteristics supply volta g e (v) 0 5 10 15 20 25 30 35 rise time (ns) 0 10 20 30 40 50 60 70 rise time vs. supply volta g e (input=0-5v, f=10khz, t a =25oc) c l =10nf c l =5.4nf c l =1.5nf supply volta g e (v) 0 5 10 15 20 25 30 35 fall time (ns) 0 10 20 30 40 50 60 fall time vs. supply volta g e (input=0-5v, f=10khz, t a =25oc) c l =10nf c l =5.4nf c l =1.5nf temperature (oc) -40 -20 0 20 40 60 8 0 100 120 140 rise & fall times (ns) 5 6 7 8 9 10 11 rise and fall times vs. temperature (v in =0-5v, v cc =18v, f=10khz, c l =2.5nf) t r t f load capacitance (pf) 0 2000 4000 6000 8 000 10000 rise time (ns) 0 10 20 30 40 50 60 70 rise time vs. load capacitance v cc =4.5v v cc =8v v cc =12v v cc =18v v cc =25v v cc =30v v cc =35v load capacitance (pf) 0 2000 4000 6000 8 000 10000 fall time (ns) 0 10 20 30 40 50 60 fall time vs. load capacitance v cc =4.5v v cc =8v v cc =12v v cc =18v v cc =25v v cc =30v v cc =35v supply volta g e (v) 0 5 10 15 20 25 30 35 propa g ation delay (ns) 0 50 100 150 200 propa g ation delay vs. supply volta g e (v in =0-5v, f=1khz, c l =5.4nf) t offdly t ondly input volta g e (v) 246 8 10 12 propa g ation delay (ns) 0 20 40 60 80 100 120 140 160 180 propa g ation delay vs. input volta g e (v in =5v, v cc =12v, f=1khz, c l =5.4nf) t ondly t offdly temperature (oc) -40 -20 0 20 40 60 8 0 100 120 140 propa g ation delay (ns) 30 35 40 45 50 55 propa g ation delay vs. temperature (v cc =18v, f=1khz, c l =5.4nf) t ondly t offdly temperature (oc) -40 -20 0 20 40 60 8 0 100 120 140 input threshold volta g e (v) 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 input threshold volta g e vs. temperature (v cc =18v, c l =2.5nf) min v ih max v il supply volta g e (v) 0 5 10 15 20 25 30 35 input threshold (v) 1.0 1.5 2.0 2.5 3.0 3.5 input threshold vs. supply volta g e min v ih max v il supply volta g e (v) 0 5 10 15 20 25 30 35 enable threshold (v) 0 5 10 15 20 25 enable threshold vs. supply volta g e min v enh max v enl
i ntegrated c ircuits d ivision ixd_609 8 www.ixysic.com r06 load capacitance (pf) 1000 10000 supply current (ma) 0 100 200 300 400 500 supply current vs. load capacitance (v cc =18v) f=2mhz f=1mhz f=500khz f=100khz f=50khz f=10khz f=1khz load capacitance (pf) 1000 10000 supply current (ma) 0 50 100 150 200 250 300 supply current vs. load capacitance (v cc =12v) f=2mhz f=1mhz f=500khz f=100khz f=50khz f=10khz f=1khz load capacitance (pf) 1000 10000 supply current (ma) 0 50 100 150 200 supply current vs. load capacitance (v cc =8v) f=2mhz f=1mhz f=500khz f=100khz f=50khz f=10khz f=1khz frequency (khz) 1 10 100 1000 10000 supply current (ma) 0.1 1 10 100 1000 supply current vs. frequency (v cc =18v) c l =10nf c l =5.4nf c l =1.5nf frequency (khz) 1 10 100 1000 10000 supply current (ma) 0.1 1 10 100 1000 supply current vs. frequency (v cc =12v) c l =10nf c l =5.4nf c l =1.5nf frequency (khz) 1 10 100 1000 10000 supply current (ma) 0.01 0.1 1 10 100 1000 supply current vs. frequency (v cc =8v) c l =10nf c l =5.4nf c l =1.5nf temperature (oc) -40 -20 0 20 40 60 8 0 100 120 140 supply current (ma) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 quiescent supply current vs. temperature v in =3.5v v in =5v v in =10v v in =0v & 18v temperature (oc) -40 -20 0 20 40 60 8 0 100 120 140 supply current (ma) 0.35 0.40 0.45 0.50 0.55 0.60 0.65 dynamic supply current vs. temperature (v in =5v, v cc =18v, f=1khz, c l =1.5nf) supply volta g e (v) 0 5 10 15 20 25 30 35 output source current (a) 0 -5 -10 -15 -20 -25 -30 output source current vs. supply volta g e (f=422hz, c l =66nf) supply volta g e (v) 0 5 10 15 20 25 30 35 output sink current (a) 0 5 10 15 20 25 30 output sink current vs. supply volta g e (f=422hz, c l =66nf)
i ntegrated c ircuits d ivision ixd_609 r06 www.ixysic.com 9 temperature (oc) -40 -20 0 20 40 60 8 0 100 120 140 output source current (a) -9.0 -9.5 -10.0 -10.5 -11.0 -11.5 -12.0 output source current vs. temperature (v cc =18v, f=422hz, c l =66nf) temperature (oc) -40 -20 0 20 40 60 8 0 100 120 140 output sink current (a) 10.0 10.5 11.0 11.5 12.0 12.5 13.0 13.5 14.0 output sink current vs. temperature (v cc =18v, f=422hz, c l =66nf) supply volta g e (v) 0 5 10 15 20 25 30 35 output resistance () 0.0 0.5 1.0 1.5 high state output resistance vs. supply volta g e (i out = -10ma) supply volta g e (v) 0 5 10 15 20 25 30 35 output resistance () 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 low state output resistance vs. supply volta g e (i out = +10ma )
i ntegrated c ircuits d ivision ixd_609 10 www.ixysic.com r06 5 manufacturing information 5.1 moisture sensitivity all plastic encapsulated semiconductor packages are susc eptible to moisture ingression. ixys integrated circuits division clas sified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as establ ished by the listed specificati ons could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . 5.2 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . 5.3 soldering profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. device moisture sensitivity level (msl) rating ixd_609 all versions msl 1 device maximum temperature x time maximum reflow cycles ixd_609ci 245c for 30 seconds - ixd_609yi 245c for 30 seconds 3 ixd_609pi 250c for 30 seconds - ixd_609si / ixd_609sia / ixd_609d2 260c for 30 seconds 3
i ntegrated c ircuits d ivision ixd_609 r06 www.ixysic.com 11 5.4 mechanical dimensions 5.4.1 sia (8-pin soic) 5.4.2 si (8-pin power soic with exposed metal back) note: the exposed metal pad on the back of the si package should be connected to gnd. it is not suitable for carrying current. dimensions mm (inches) pcb land pattern pin 1 pin 8 3.937 0.254 (0.155 0.010) 5.994 0.254 (0.236 0.010) 0.406 0.076 (0.016 0.003) 4.928 0.254 (0.194 0.010) 1.270 ref (0.050) 1.346 0.076 (0.053 0.003) 0.051 min - 0.254 max (0.002 min - 0.010 max) 0.559 0.254 (0.022 0.010) 0.762 0.254 (0.030 0.010) 1.27 (0.050) 5.40 (0.213) 1.55 (0.061) 0.60 (0.024) recommended pcb land pattern dimensions mm (inches) 1.346 0.076 (0.053 0.003) 0.051 min - 0.254 max (0.002 min - 0.010 max) 4.928 0.254 (0.194 0.010) pin 1 0.406 0.076 (0.016 0.003) 5.994 0.254 (0.236 0.010) 3.937 0.254 (0.155 0.010) 1.270 ref (0.050) 0.762 0.254 (0.030 0.010) 7o 2.540 0.254 (0.100 0.010) 3.556 0.254 (0.140 0.010) 1.27 (0.050) 5.40 (0.209) 1.55 (0.061) 0.60 (0.024) 2.75 (0.108) 3.80 (0.150)
i ntegrated c ircuits d ivision ixd_609 12 www.ixysic.com r06 5.4.3 tape & reel information for si and sia packages 5.4.4 yi (5-pin to-263) dimensions mm (inches) note: tape dimensions not sho wn comply with jedec standard eia-481-2 embossment emb ossed carrier top co v er tape thickness 0.102 max. (0.004 max.) 330.2 dia. (13.00 dia.) k 0 = 2.10 (0.083) w=12.00 (0.472) b 0 =5.30 (0.209) user direction of feed a 0 =6.50 (0.256) p=8.00 (0.315) dimensions mm min / mm max (inches min / inches / max) n otes: 1. all metal s u rfaces are solder-plated except trimmed area. 2. n o. 3 lead is connected to n o. 6 lead ( b ottom heat sink) internally. 8.636 / 9.144 (0.340 / 0.360) 14.605 / 15. 875 (0.575 / 0.625) 9.652 / 10.312 (0.380 / 0.406) 1.70 bsc (0.067 bsc) 1 2 3 4 5 0.737 / 0. 889 (0.029 / 0.035) 1.143 / 1.651 (0.045 / 0.065) 4.318 / 4.597 (0.170 / 0.1 81) 1.143 / 1.397 (0.045 / 0.055) 2.286 / 2.794 (0.090 / 0.110) 0o - 8o 6.858 min (0.270 min) 6.223 min (0.245 min) 6 3.95 (0.156) 3.65 (0.144) 6.35 (0.250) 1.00 (0.039) 1.70 (0.067) 10.40 (0.409) 9.30 (0.366) recommended pcb pattern 0.000 / 0.305 (0.000 / 0.012)
i ntegrated c ircuits d ivision ixd_609 r06 www.ixysic.com 13 5.4.5 pi (8-pin dip) 5.4.6 ci (5-pin to-220) dimensions mm (inches) pcb hole pattern 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) 9.144 0.508 (0.360 0.020) 0.457 0.076 (0.018 0.003) 9.652 0.381 (0.380 0.015) 7.239 typ. (0.285) 7.620 0.254 (0.300 0.010) 4.064 typ (0.160) 0.813 0.102 (0.032 0.004) 8-0.800 dia. (8-0.031 dia.) 2.540 0.127 (0.100 0.005) 7.620 0.127 (0.300 0.005) 7.620 0.127 (0.300 0.005) 6.350 0.127 (0.250 0.005) 3.302 0.051 (0.130 0.002) pin 1 0.254 0.0127 (0.010 0.0005) n otes: 1. this dra wing will meet all dimensions req uirement of jedec ou tlines ts-001aa and 5-lead v ersion to-220ab. 2. mo u nting hole diameter: 3.53 / 3.96 (0.139 / 0.156) 3. the metal ta b is connected to pin 3 (g nd). finished hole diameter = 1.45mm (0.057 in.) recommended hole pattern 1.70mm (0.067 in.) 25.27 / 26.54 (0.995 / 1.045) 11.94 / 12.95 (0.470 / 0.510) 14.73 / 15.75 (0.580 / 0.620) 9.91 / 10.54 (0.390 / 0.415) 1.70 bsc (0.067 bsc) 0.64 / 1.02 (0.025 / 0.040) 8.64 / 9.40 (0.340 / 0.370) 4.32 / 4. 83 (0.170 / 0.190) 1.14 / 1.40 (0.045 / 0.055) 0.38 / 0.64 (0.015 / 0.025) 2.29 / 2.92 (0.090 / 0.115) dimensions mm min / mm max (inches min / inches / max) 12.387 (0.487) 6.299 (0.248) 7.823 (0.308) 12.70 / 14.73 (0.50 / 0.5 8) 7.620 (0.300) 6.502 (0.256) 1 2 3 4 5 3
i ntegrated c ircuits d ivision ixd_609 14 www.ixysic.com r06 5.4.7 d2 (8-pin dfn) 5.4.8 tape & reel information for d2 package dimensions mm min / mm max (inches min / inches max) 5.00 bsc (0.197 bsc) 4.00 bsc (0.157 bsc) 0.80 / 1.00 (0.031 / 0.039) 0.10 (0.004) 0.95 bsc (0.037 bsc) 0.74 / 0.83 (0.029 / 0.033) 0.30 / 0.45 (0.012 / 0.018) 3.03 / 3.10 (0.119 / 0.122) 2.53 / 2.60 (0.100 / 0.102) 0.35 / 0.45 x 45o (0.014 / 0.018 x 45o) pin 1 pin 1 pin 8 0.20 ref (0.008 ref) recommended pcb land pattern 4.50 (0.177) 0.45 (0.018) 1.20 (0.047) 3.10 (0.122) 2.60 (0.102) 0.95 (0.037) 0.35 x 45o (0.014 x 45o) n ote: the exposed metal pad on the b ack of the d2 package should be connected to gn d. pad is not s uitab le for carrying c urrent. k 0 =1.90 0.10 b 0 =5.40 0.10 5o max a 0 =4.25 0.10 5o max 0.30 0.05 (0.05) (0.05) r0.75 typ 8.00 0.10 2.00 0.05 4.00 0.10 see note #2 12.00 0.30 5.50 0.05 1.75 0.10 ?1.50 (min) ?1.55 0.05 n otes: 1. a 0 & b 0 measured at 0.3mm a bo v e b ase of pocket. 2. 10 pitches c um ulativ e tol. 0.2mm 3. ( ) reference dimensions only. 4. unless other w ise specified, all dimensions in millimeters. embossment emb ossed carrier top co v er tape thickness 0.102 max. (0.004 max.) 330.2 dia. (13.00 dia.) for additional information please vi sit our website at: www.ixysic.com ixys integrated circuits division makes no representations or wa rranties with respect to the a ccuracy or completeness of the co ntents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity ar e expressed or implied. except as set forth in ixys integrated circuits division?s standard terms and condit ions of sale, ixys integrated circuits division assumes no liability whatsoever, a nd disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringem ent of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of ixys integrated circuits division?s product may resul t in direct physical harm, injury, or death to a person or severe property or environmental damage. ixys integrated circuits divisi on reserves the right to discontinue or make changes to its pr oducts at any time without notice. specification: ds-ixd_609-r06 ?copyright 2014, ixys in tegrated circuits division all rights reserved. printed in usa. 9/25/2014

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