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rf & protection devices data sheet revision 2.0, 2011-09-15 bga758l7 5-6 ghz lna for wlan
edition 2011-09-15 published by infineon technologies ag 81726 munich, germany ? 2011 infineon technologies ag all rights reserved. legal disclaimer the information given in this docu ment shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infine on technologies hereby disclaims any and all warranties and liabilities of any kind, including witho ut limitation, warranties of non-infrin gement of intellectua l property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon technologies office. infineon technologies compon ents may be used in life-su pport devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safe ty or effectiveness of that de vice or system. life support devices or systems are intended to be implanted in the hu man body or to support an d/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
bga758l7 data sheet 3 revision 2.0, 2011-09-15 trademarks of infineon technologies ag aurix?, c166?, canpak?, ci pos?, cipurse?, econopac k?, coolmos?, coolset?, corecontrol?, crossave?, dave?, easypim?, econobridge?, econ odual?, econopim?, eicedriver?, eupec?, fcos?, hitfet?, hybridpack?, i2rf?, isoface?, isopack?, mipaq?, modstack?, my-d?, novalithic?, optimos?, or iga?, primarion?, prim epack?, primestack?, pro-sil?, profet?, rasic?, reversave?, satric?, sieget?, sindrion?, sipmos?, smartlewis?, solid flash?, tempfe t?, thinq!?, trench stop?, tricore?. other trademarks advance design system? (ads) of agilent te chnologies, amba?, arm?, multi-ice?, keil?, primecell?, realview?, thumb?, vision? of arm limited, uk. autosar? is licensed by autosar development partnership. bluetooth? of bluetooth sig inc. cat-iq? of dect forum. colossus?, firstgps? of trimble navigation ltd. emv? of emvc o, llc (visa holdings in c.). epcos? of epcos ag. flexgo? of microsoft corp oration. flexray? is licensed by flexray consortium. hyperterminal? of hilgraeve incorporated. iec? of commission electrot echnique internationale. irda? of infrared data association corporation. iso? of international organization for standardization. matlab? of mathworks, inc. maxim? of maxim integrated products, inc. microtec?, nucleus? of mentor graphics corporation. mifare? of nx p. mipi? of mipi alliance, inc. mips? of mips technologies, inc., usa. murata? of murata manufacturing co., microwave offi ce? (mwo) of applied wave research inc., omnivision? of omnivision technologies, inc. open wave? openwave systems inc. red hat? red hat, inc. rfmd? rf micro devices, inc. sirius? of sirius sate llite radio inc. solaris? of sun microsystems, inc. spansion? of spansion llc ltd. symbian? of sy mbian software limited. taiyo yuden? of taiyo yuden co. teaklite? of ceva, inc. t ektronix? of tektroni x inc. toko? of toko kabushiki kaisha ta. unix? of x/open company limited. verilog?, palladium? of cadence design systems, inc. vlynq? of texas instruments inco rporated. vxworks?, wind river? of wind river systems, inc. zetex? of diodes zetex limited. last trademarks update 2011-02-24 revision history page or item subjects (major changes since previous revision) revision 2.0, 2011-09-15 all ?preliminary? status removed 8 ambient temperature range extended: t a = -40 .. +85c revision 1.0, 2010-02-22 all preliminary data sheet all new document layout 7, 8, 10 electrical characteristics adjusted
bga758l7 table of contents data sheet 4 revision 2.0, 2011-09-15 table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 list of figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 list of tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1 maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.1 electrical parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.2 digital signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3 application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 table of contents
bga758l7 list of figures data sheet 5 revision 2.0, 2011-09-15 figure 1 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 figure 2 application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 3 drawing of application board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 4 cross-section of application board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 5 package outline tslp-7-8 (side and bottom view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 6 marking layout (top view). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 7 footprint tslp-7-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 list of figures
bga758l7 list of tables data sheet 6 revision 2.0, 2011-09-15 table 1 pin definition and function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 2 maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 3 thermal resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 4 electrical characteristics: t a =25c, v cc =3.3v, v pon,on =3.3v, v pon,off =0v, f = 5.5 ghz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 5 digital control parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 table 6 bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 list of tables
tslp-7-8 1 2 3 6 5 4 7 product name marking package bga758l7 ba tslp-7-8 5-6 ghz lna for wlan bga758l7 data sheet 7 revision 2.0, 2011-09-15 features ?gain, | s 21 | 2 = 12.5 db at 5.5 ghz ? high linearity, input p -1db = -3.5 dbm at 5.5 ghz ? low noise figure, nf = 1.3 db at 5.5 ghz ? internal output matching on chip ? ac coupled rf output port ? temperature compensated internal biasing circuit ? digital on/off switch on chip ? low external part count ? 1 kv hbm esd protection for in-pin ? 2 kv hbm esd protection for all other pins ? b7hfm silicon germ anium technology ? tiny tslp-7-8 leadless package ? pb-free (rohs compliant) package application ? low noise amplifier for wlan application figure 1 block diagram bga 758 l7_blockdiagram .vsd pon vcc out in gnd bias biasing & logic circuitry
bga758l7 features data sheet 8 revision 2.0, 2011-09-15 description the bga758l7 is a 5 - 6 ghz silicon germanium low noise amplifier mmic in tiny ts lp-7-8 package. the lna delivers a gain of 12.5 db while giving an excellent noise figure of 1.3 db in the application configuration described in chapter 3 . the supply current of 7.0 ma is chosen to maintain a high input compression point of -3.5 dbm. the temperature compensated internal biasing circuit prov ides stable current conditions over temperature range. output matching is done by on chip matching circuits in combination wi th the bonding wire inductances. the application circuit requires only three external elements. with only one additional external element an ultra lo w noise figure of 1.1 db can be achieved. for detailed information please refer to infineon bga758l7 application note. pin definition and function table 1 pin definition and function pin no. name function 1 pon power on control 2in rf input 3biasdc bias 4 n.c. not connected 5 vcc dc supply 6 out rf output 7 gnd rf ground and dc ground for bias and logic circuity
bga758l7 maximum ratings data sheet 9 revision 2.0, 2011-09-15 1 maximum ratings attention: stresses above the max. values listed here may cause permanent damage to the device. exposure to absolute maximum rating conditions for extended periods may affect device reliability. maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. thermal resistance table 2 maximum ratings parameter symbol values unit note / test condition min. typ. max. voltage at pin vcc v cc -0.3?4v 1) 1) all voltages refer to gnd-node unless otherwise noted voltage at pin in v in -0.3 ? 0.9 v ? voltage at pin bias v bias -0.3 ? 0.9 v ? voltage at pin out v out -0.3 ? v cc + 0.3 v ? voltage at pin pon v pon -0.3 ? v cc + 0.3 v ? voltage at pin gnd v gnd -0.3 ? 0.3 v ? current into pin vcc i cc ??12ma? rf input power p in ??0dbm? total power dissipation, t s < 120c 2) 2) t s is measured on the ground lead at the soldering point p tot ??48mw? junction temperature t j ??150c? ambient temperature range t a -40 ? 85 c ? storage temperature range t stg -65 ? 150 c ? esd capability all pins v esd-hbm ? ? 1000 v according to jesd22a-114 esd capability all pins, excluding pin in v esd-hbm ? ? 2000 v according to jesd22a-114, w/o pin in esd capability all pins v esd-mm ? ? 100 v according to jesd22a-115 table 3 thermal resistance parameter symbol value unit junction - soldering point 1) 1) for calculation of r thja please refer to application note thermal resistance r thjs 615 k/w
bga758l7 electrical characteristics data sheet 10 revision 2.0, 2011-09-15 2 electrical characteristics 2.1 electrical parameter table 4 electrical characteristics 1) : t a =25c, v cc =3.3v, v pon,on =3.3v, v pon,off =0v, f = 5.5 ghz 1) measured on application board according to application sch ematic on page 12, including pcb losses (unless noted otherwise) parameter symbol values unit note / test condition min. typ. max. pass band frequency range f bw 5.0? 6.0ghz gain | s 21 | 2 ? 12.5 ? db gain flatness g ? 0.3 ? db in any 50 mhz instantaneous bandwidth reverse isolation |s 12 |? 21 ? db noise figure 2) 2) pcb losses subtracted nf ?1.3?db input return loss rl in ?18?db50 output return loss rl out ?20?db50 input power at 1db compression point p -1db ? -3.5 ? dbm maximum gain out of band | s 21 | ? -3 ? db dc - 1.7 ghz ?1?db1.7 - 2.0ghz ?6?db2.3 - 2.7ghz ? 12 ? db 3.3 - 3.9 ghz ?4?db9.0 - 10ghz ?3?db10 - 18ghz minimum input 1db compression out of band p -1db ? -4 ? dbm 0.8 - 1.0 ghz ?-12?dbm1.7 - 2.0ghz ? -9 ? dbm 2.3 - 4.0 ghz ? -8 ? dbm 4.4 - 4.5 ghz ?0?dbm9.0 - 10ghz turn-on time t on ?0.2? s measured from on signal turns on (90%) to the point were lna output power stabilizes to within 0.5 db of final value supply current at v cc i cc 5.07.09.0ma shutdown current i off ?6 a v pon = 0 v stability factor k ? >1 ? unconditional stable for all frequencies
bga758l7 electrical characteristics data sheet 11 revision 2.0, 2011-09-15 2.2 digital signals table 5 digital control parameter parameter symbol va lues unit note / test condition min. typ. max. power on control voltage range v pon -0.3 ? v cc v? control voltage for power on v pon,on 2? v cc v? control voltage for power off v pon,off -0.3 ? 1.1 v ? capacitance at power on pin c in ?1?pf? input current at power on pin i pon ?10? a v pon = 3.3 v
bga758l7 application information data sheet 12 revision 2.0, 2011-09-15 3 application information application board configuration figure 2 application schematic a list of all application notes is available at http://goto.infineon.com/smallsignaldiscretes-appnotes . table 6 bill of materials name value package manufacturer function c1 2.7 pf 0402 various dc blocking c2 1 nf 0402 various supply voltage filtering l1 3.9 nh 0402 murata lqw type bias feed and input matching n1 tslp-7-8 infineon 5-6 ghz lna bga758 l7_application _schematic.vsd n1 bga758l7 pon, 1 in,2 bi as , 3 out,6 vcc, 5 gnd,4 gnd,7 c2 pon rfin rfout vcc c1 l1
bga758l7 application information data sheet 13 revision 2.0, 2011-09-15 figure 3 drawing of application board figure 4 cross-section of application board bga758l7_application_board.vsd bga 758l7 _cross_section.vsd gnd 2 cu 35 m gnd 1 cu 35 m top- layer cu 35 m fr4 800 m rogers 4003 200 m core via 500 m m icro- via 150 m
bga758l7 package information data sheet 14 revision 2.0, 2011-09-15 4 package information figure 5 package outline tslp-7-8 (side and bottom view) figure 6 marking layout (top view) 0.05 1.26 0.5 0.035 1.16 0.035 1) 6 x 0.2 0.035 1.4 0.05 1) 2) 1) 0.31 0.05 max. 0.2 min. +0.01 -0.02 tslp-7-8-po v01 1 2 3 7 5 46 pin 1 marking 1) dimension applies to plated terminals 2) dimension of 0.02 min. is guaranteed b a 0.96 0.48 1.1 0.03 b 0.03 b 0.03 a 0.05 b 0.05 a (0.05) 2) (0.05) top view bottom view 6 x 0.2 0.035 1) 1.6 4 8 1.7 0.4 pin 1 marking tslp-7-8-tp v01
bga758l7 package information data sheet 15 revision 2.0, 2011-09-15 figure 7 footprint tslp-7-8 smd stencil apertures copper solder mask vias 1.21 0.51 0.25 0.45 0.2 0.25 0.25 0.23 0.23 0.25 0.25 0.25 0.23 0.23 0.25 0.2 0.25 1.21 0.51 1.35 0.25 0.45 0.2 0.2 0.25 1.35 tslp-7-8-fp v01
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