2014-01-17 rev.2.0 TJ150F04M3L 1 mosfets silicon p-channel mos (u-mos ) TJ150F04M3L TJ150F04M3L TJ150F04M3L TJ150F04M3L start of commercial production 2012-04 1. 1. 1. 1. applications applications applications applications ? automotive ? relay drivers ? dc-dc converters ? motor drivers 2. 2. 2. 2. features features features features (1) low drain-source on-resistance: r ds(on) = 2.2 m ? (typ.) (v gs = -10 v) (2) low leakage current: i dss = -10 a (max) (v ds = -40 v) (3) enhancement mode: v th = -2.0 to -3.0 v (v ds = -10 v, i d = -1 ma) 3. 3. 3. 3. packaging and internal circuit packaging and internal circuit packaging and internal circuit packaging and internal circuit 1: gate 2: drain (heatsink) 3: source 4. 4. 4. 4. absolute maximum ratings (note) (t absolute maximum ratings (note) (t absolute maximum ratings (note) (t absolute maximum ratings (note) (t a a a a = 25 = 25 = 25 = 25 unless otherwise specified) unless otherwise specified) unless otherwise specified) unless otherwise specified) characteristics drain-source voltage gate-source voltage drain current (dc) drain current (pulsed) power dissipation single-pulse avalanche energy avalanche current channel temperature storage temperature (t c = 25 ) (note 1) (note 1) (note 2) (note 3) (note 3) symbol v dss v gss i d i dp p d e as i ar t ch t stg rating -40 -20/+10 -150 -450 300 455 -150 175 -55 to 175 unit v a w mj a note: using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook ("handling precautions"/"derating concept and methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). to-220sm(w)
2014-01-17 rev.2.0 TJ150F04M3L 2 5. 5. 5. 5. thermal characteristics thermal characteristics thermal characteristics thermal characteristics characteristics channel-to-case thermal resistance symbol r th(ch-c) max 0.5 unit /w note 1: ensure that the channel temperature does not exceed 175 . note 2: v dd = -25 v, t ch = 25 (initial), l = 21 h, r g = 25 ? , i ar = -150 a note 3: the definitions of the absolute maximum channel and storage temperatures are qualified per aec-q101. note: this transistor is sensitive to electrostatic discharge and should be handled with care.
2014-01-17 rev.2.0 TJ150F04M3L 3 6. 6. 6. 6. electrical characteristics electrical characteristics electrical characteristics electrical characteristics 6.1. 6.1. 6.1. 6.1. static characteristics (t static characteristics (t static characteristics (t static characteristics (t a a a a = 25 = 25 = 25 = 25 unless otherwise specified) unless otherwise specified) unless otherwise specified) unless otherwise specified) characteristics gate leakage current drain cut-off current drain-source breakdown voltage drain-source breakdown voltage gate threshold voltage drain-source on-resistance (note 4) symbol i gss i dss v (br)dss v (br)dsx v th r ds(on) test condition v gs = -16/+10 v, v ds = 0 v v ds = -40 v, v gs = 0 v i d = -10 ma, v gs = 0 v i d = -10 ma, v gs = 10 v v ds = -10 v, i d = -1 ma v gs = -6 v, i d = -75 a v gs = -10 v, i d = -75 a min -40 -30 -2.0 typ. 2.5 2.2 max 10 -10 -3.0 4.2 2.8 unit a v m ? note 4: if a reverse bias is applied between gate and source, this device enters v (br)dsx mode. note that the drain- source breakdown voltage is lowered in this mode. 6.2. 6.2. 6.2. 6.2. dynamic characteristics (t dynamic characteristics (t dynamic characteristics (t dynamic characteristics (t a a a a = 25 = 25 = 25 = 25 unless otherwise specified) unless otherwise specified) unless otherwise specified) unless otherwise specified) characteristics input capacitance reverse transfer capacitance output capacitance switching time (rise time) switching time (turn-on time) switching time (fall time) switching time (turn-off time) symbol c iss c rss c oss t r t on t f t off test condition v ds = -10 v, v gs = 0 v, f = 1 mhz see fig. 6.2.1 min typ. 12000 1100 2350 10 25 440 1870 max unit pf ns fig. fig. fig. fig. 6.2.1 6.2.1 6.2.1 6.2.1 switching time test circuit switching time test circuit switching time test circuit switching time test circuit 6.3. 6.3. 6.3. 6.3. gate charge characteristics (t gate charge characteristics (t gate charge characteristics (t gate charge characteristics (t a a a a = 25 = 25 = 25 = 25 unless otherwise specified) unless otherwise specified) unless otherwise specified) unless otherwise specified) characteristics total gate charge (gate-source plus gate-drain) gate-source charge 1 gate-drain charge symbol q g q gs1 q gd test condition v dd -32 v, v gs = -10 v, i d = -150 a min typ. 390 280 110 max unit nc 6.4. 6.4. 6.4. 6.4. source-drain characteristics (t source-drain characteristics (t source-drain characteristics (t source-drain characteristics (t a a a a = 25 = 25 = 25 = 25 unless otherwise specified) unless otherwise specified) unless otherwise specified) unless otherwise specified) characteristics reverse drain current (dc) reverse drain current (pulsed) diode forward voltage reverse recovery time reverse recovery charge (note 5) (note 5) symbol i dr i drp v dsf t rr q rr test condition i dr = -150 a, v gs = 0 v i dr = -150 a, v gs = 0 v di dr /dt = 50 a/ s min typ. 90 104 max -150 -450 1.2 unit a v ns nc note 5: ensure that the channel temperature does not exceed 175 .
2014-01-17 rev.2.0 TJ150F04M3L 4 7. 7. 7. 7. marking (note) marking (note) marking (note) marking (note) fig. fig. fig. fig. 7.1 7.1 7.1 7.1 marking marking marking marking note: a line under a lot no. identifies the indication of product labels. not underlined: [[pb]]/includes > mcv underlined: [[g]]/rohs compatible or [[g]]/rohs [[pb]] please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of product. the rohs is the directive 2011/65/eu of the european parliament and of the council of 8 june 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment.
2014-01-17 rev.2.0 TJ150F04M3L 5 8. 8. 8. 8. moisture-proof packing moisture-proof packing moisture-proof packing moisture-proof packing this device is packed in a moisture-proof laminated aluminum bag. 8.1. 8.1. 8.1. 8.1. precautions for transportation and storage (note) precautions for transportation and storage (note) precautions for transportation and storage (note) precautions for transportation and storage (note) (1) avoid excessive vibration during transportation. (2) do not toss or drop the packed devices to avoid ripping of the bag. (3) after opening the moisture-proof bag, the devices should be assembled within two weeks in an environment of 5 to 30 and rh70% or below. perform reflow at most twice. (4) the moisture-proof bag may be stored unopened for up to 24 months at 5 to 30 and rh90% or below. (5) if, upon opening the bag, the moisture indicator card shows humidity of 30% or above (the color of the 30% dot has changed from blue to pink) or the expiration date has passed, the devices should be baked as follows: baking conditions: 125 for 48 hours. note: since the tape materials are not heat-proof, devices should be placed on either heat-proof trays or aluminum magazines when baking. the humidity indicator shows an approximate ambient humidity at 25 . if the ambient humidity is below 30%, the color of all the indicator dots is blue. if, upon opening the bag, the color of the 30% dot has changed from blue to pink, the devices should be baked before assembly. fig. fig. fig. fig. 8.1.1 8.1.1 8.1.1 8.1.1 humidity indicator humidity indicator humidity indicator humidity indicator
2014-01-17 rev.2.0 TJ150F04M3L 6 9. 9. 9. 9. characteristics curves (note) characteristics curves (note) characteristics curves (note) characteristics curves (note) fig. fig. fig. fig. 9.1 9.1 9.1 9.1 i i i i d d d d - v - v - v - v ds ds ds ds fig. fig. fig. fig. 9.2 9.2 9.2 9.2 i i i i d d d d - v - v - v - v ds ds ds ds fig. fig. fig. fig. 9.3 9.3 9.3 9.3 i i i i d d d d - v - v - v - v gs gs gs gs fig. fig. fig. fig. 9.4 9.4 9.4 9.4 v v v v ds ds ds ds - v - v - v - v gs gs gs gs fig. fig. fig. fig. 9.5 9.5 9.5 9.5 r r r r ds(on) ds(on) ds(on) ds(on) - i - i - i - i d d d d fig. fig. fig. fig. 9.6 9.6 9.6 9.6 r r r r ds(on) ds(on) ds(on) ds(on) - t - t - t - t a a a a
2014-01-17 rev.2.0 TJ150F04M3L 7 fig. fig. fig. fig. 9.7 9.7 9.7 9.7 i i i i dr dr dr dr - v - v - v - v ds ds ds ds fig. fig. fig. fig. 9.8 9.8 9.8 9.8 capacitance - v capacitance - v capacitance - v capacitance - v ds ds ds ds fig. fig. fig. fig. 9.9 9.9 9.9 9.9 v v v v th th th th - t - t - t - t a a a a fig. fig. fig. fig. 9.10 9.10 9.10 9.10 dynamic input/output characteristics dynamic input/output characteristics dynamic input/output characteristics dynamic input/output characteristics fig. fig. fig. fig. 9.11 9.11 9.11 9.11 p p p p d d d d - t - t - t - t c c c c (guaranteed maximum) (guaranteed maximum) (guaranteed maximum) (guaranteed maximum)
2014-01-17 rev.2.0 TJ150F04M3L 8 fig. fig. fig. fig. 9.12 9.12 9.12 9.12 r r r r th th th th /r /r /r /r th(ch-c) th(ch-c) th(ch-c) th(ch-c) - t - t - t - t w w w w (guaranteed maximum) (guaranteed maximum) (guaranteed maximum) (guaranteed maximum) fig. fig. fig. fig. 9.13 9.13 9.13 9.13 safe operating area safe operating area safe operating area safe operating area (guaranteed maximum) (guaranteed maximum) (guaranteed maximum) (guaranteed maximum) fig. fig. fig. fig. 9.14 9.14 9.14 9.14 e e e e as as as as - t - t - t - t ch ch ch ch (guaranteed maximum) (guaranteed maximum) (guaranteed maximum) (guaranteed maximum) fig. fig. fig. fig. 9.15 9.15 9.15 9.15 test circuit/waveform test circuit/waveform test circuit/waveform test circuit/waveform note: the above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted.
2014-01-17 rev.2.0 TJ150F04M3L 9 package dimensions package dimensions package dimensions package dimensions unit: mm weight: 1.07 g (typ.) package name(s) toshiba: 2-10w1s nickname: to-220sm(w)
2014-01-17 rev.2.0 TJ150F04M3L 10 restrictions on product use restrictions on product use restrictions on product use restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collectively "toshiba"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "product") without notice. ? this document and any information herein may not be reproduced without prior written permission from toshiba. even with toshiba's written permission, reproduction is permissible only if reproduction is without alteration/omission. ? though toshiba works continually to improve product's quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and application notes for product and the precautions and conditions set forth in the "toshiba semiconductor reliability handbook" and (b) the instructions for the application with which the product will be used with or for. customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. toshiba assumes no liability for customers' product design or applications. toshiba assumes no liability for customers' product design or applications. toshiba assumes no liability for customers' product design or applications. toshiba assumes no liability for customers' product design or applications. ? product is neither intended nor warranted for use in equipments or systems that require product is neither intended nor warranted for use in equipments or systems that require product is neither intended nor warranted for use in equipments or systems that require product is neither intended nor warranted for use in equipments or systems that require extraordinarily high levels of quality and/or reliability, and/or a malfunction or failure of which may extraordinarily high levels of quality and/or reliability, and/or a malfunction or failure of which may extraordinarily high levels of quality and/or reliability, and/or a malfunction or failure of which may extraordinarily high levels of quality and/or reliability, and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage and/or serious public impact cause loss of human life, bodily injury, serious property damage and/or serious public impact cause loss of human life, bodily injury, serious property damage and/or serious public impact cause loss of human life, bodily injury, serious property damage and/or serious public impact ("unintended use"). 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