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product structure silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays 1/34 tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com cv tsz22111 ? 14 ? 001 21.nov.2014 rev.004 datashee t input voltage 3.5 v to 36 v output sw current 4 a / 2.5a / 1.25a 1ch step-down switching regulator BD906XX series general description BD906XX series is a step-down switching regulator with integrated power mos fet and have the capability to withstand high input voltage, providing a free setting function of operating frequency with external resistor. this switching regulator features a wide input voltage range (3.5v to 36v, absolute maximum 42v) and operating temperature range (-40 c to +125 c). furthermore, an external synchronization input pin enables synchronous operation with external clock. features ? integrated pch power mos fet ? low dropout: 100 % on duty cycle ? external synchronization enabled ? soft start function: 1.38 ms (f = 500 khz) ? current mode control ? over current protection ? low supply voltage error prevention ? thermal shut down protection ? short circuit protection ? high power hrp7 package mounted ? compact and high power htsop-j8 package mounted ? aec-q100 qualified ? load dump up to 42v. applications ? automotive battery powered supplies (cluster panels, car multimedia) ? industrial / consumer supplies ? other electronic equipment key specifications ? input voltage range: 3.5 v to 36 v (initial startup is over 3.9 v) ? output voltage range: 0.8v to v in ? output switch current: 4 a / 2.5 a / 1.25 a (max) ? switching frequency: 50 khz to 600 khz ? reference voltage accuracy: 2% (-40 c to +125 c) ? shutdown circuit current: 0 a (typ) ? operating temperature ra nge: -40 c to +125 c package w(typ) x d(typ) x h(max) hrp7 9.395mm x 10.540mm x 2.005mm htsop-j8 4.90 mm x 6.00 mm x 1.00 mm hrp7 htsop-j8 typical application circuit
datasheet d a t a s h e e t 2/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 lineup product name hrp7 bd90640hfp-c bd90620hfp-c - htsop-j8 bd90640efj-c bd 90620efj-c bd90610efj-c output switch current 4 a 2.5 a 1.25 a input maximum ratings 42 v input range (note 1) 3.5 v to 36 v power mos fet on resistance 0.16 ? power dissipation hrp7 (note 2) 6.98 w htsop-j8 (note 3) 3.10 w (note 1) initial startup is over 3.9 v (note 2) reduce by 56 mw / c, when mounted on 4-layer pcb of 114.3 mm 76.2 mm 1.6 mm. 2,3 inner layers and copper foil area on the reverse side of pcb 74.2 mm 74.2 mm (note 3) reduce by 25 mw / c, when mounted on 4-layer pcb of 114.3 mm 76.2 mm 1.6 mm. 2,3 inner layers and copper foil area on the reverse side of pcb 74.2 mm 74.2 mm
datasheet d a t a s h e e t 3/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 pin configuration hpr7 htsop-j8 pin description pin no. symbol function pin no symbol function 1 vc error amp output 1 rt frequency setting resistor connection 2 vin power supply input 2 sw switching output 3 fb output voltage feedback 3 en/sync enable / synchronizing pulse input 4 gnd gnd 4 gnd gnd 5 rt frequency setting resistor connection 5 vc error amp output 6 sw switching output 6 vin (note 1) power supply input 7 en/sync enable / synchronizing pulse input 7 pvin (note 1) power supply input fin - gnd 8 fb output voltage feedback (note 1) vin and pvin must be shorted. hpr7 htsop-j8 block diagram hpr7 htsop-j8 1. rt 2. sw 3. en / sync 4. gnd 8. fb 7. pvin 6. vin 5. vc 1. vc 2. vin 3. fb 4. gnd 5. rt 6. sw 7. en/sync fin. 0.55v 0.55v
datasheet d a t a s h e e t 4/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 description of blocks ? error-amp the error-amp block is an error amplifie r and its inputs are the reference voltag e 0.8 v (typ) and the ?fb? pin voltage. (refer to recommended examples on p.16 to 17). the output ?vc? pin controls the switching duty, the output voltage is set by ?fb? pin with external resistors. moreover, the exte rnal resistor and capacitor are required to comp pin as phase compensation circuit (refer to phase comp ensation setting method on p.16 to 17). ? soft start the function of the soft start block is to prevent the overshoot of the output voltage v o through gradually increasing the input of the error amplifier when the power supply turn s on, which also results to the gradual increase of the switching duty. the soft start time is set to 1.38 ms (f = 500 khz). the soft start time is changed by setting of the switching frequency. (refer to p.17) ? en / sync the ic is in normal operation when the voltage on the ?en / sy nc? pin is more than 2.6v. the ic is shut down when the voltage on the ?en / sync? pin is less than 0.8v. furthermore , external synchronization is possible when pulses are applied to the ?en / sync? pin. the frequency range of the ex ternal synchronization is within 20 % of the oscillation frequency and is limited by the external resistance connected to the rt pin. ex) when r rt is 27 k ? (f = 500 khz), the frequency range of the ex ternal synchronization is 400 khz to 600 khz. ? osc (oscillator) this circuit generates the clock pulses that are input to sl ope block. the oscillation frequency is determined by the current going through the external resistor rt at constant voltage of ca. 0.8v. the frequency can be set in the range between 50khz to 600khz (refer to p.16 figure 13). the out put of the osc block send clock signals to pwm_latch. moreover the generated pulses of the osc block are also used as clock of the counter of ss and scp_latch blocks. ? slope this block generates saw tooth waves using the clock ge nerated by the osc block. t he generated saw tooth waves are combined with the current sense and sent to the cur_comp. ? cur_comp (current comparator) the cur_comp block compares the signals between the ?vc? pin and the combined signals from the slope block and current sense. the output signals ar e sent to the pwm_latch block. ? pwm_latch the pwm_latch block is a latch circuit. the osc block output (set) and cur_comp blo ck output (reset) are the inputs of this block. the pwm_latch block outputs pwm signals. ? tsd (thermal shutdown) the tsd block prevents thermal destruction / thermal runaway of the ic by turning off the output when the temperature of the chip reaches more than 150 c. when the chip temperat ure falls to a specified level, the switching will resume. however, since the tsd is designed to protect the ic, t he chip temperature should be provided with the thermal shutdown detection temperature of less than approximately 150 c. ? ocp (over current protection) ocp is activated when the voltage betwe en the drain and source (on-resistanc e load current) of the p-ch power mosfet when it is on, exceeds the refer ence voltage which is internally set within the ic. this ocp is a self-return type. when ocp is activated, the duty will be small, and the output voltage will decrease. however, this protection circuit is only effective in preventing destruction from sudden accide nt. it does not support the co ntinuous operation of the protection circuit (e.g. if a load, which significantly exceeds the output current capacitance, is connected). ? scp (short circuit protection) and scp-latch while ocp is activated, and if the output voltage falls below 70 %, scp will be ac tivated. when scp is active, the output will be turned off after a period of 1024 pulse. it extends t he time that the output is o ff to reduce the average output current. in addition, during start-up of t he ic, this feature is mask ed until it reaches a certain output voltage to prevent th e start-up failure. ? uvlo (under voltage lock-out) uvlo is a protection circuit that prevent s low voltage malfunction. it prevents ma lfunction of the internal circuit from sudden rise and fall of power supply voltage. it monitors the v in power supply voltage and the internal regulator voltage. if v in is less than the thre shold voltage 3.24 v (typ), t he pch power mos fet output is off and the soft-start circuit will be restarted. this threshold voltage has a hysteresis of 280 mv (typ). ? drv (driver) this circuit drives the gate electrode of the pch power mos fet output. it r educes the increase of the pch power mos fet?s on-resistance by switching the driving voltage when the power supply voltage drop.
datasheet d a t a s h e e t 5/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 absolute maximum ratings (ta = 25 c) parameter symbol rating unit power supply voltage v in pv in -0.3 to +42 v en / sync pin voltage v en / sync -0.3 to v in v rt, vc, fb pin voltage v rt v vc v fb -0.3 to +7 v power dissipation (note1) hrp7 (note2) pd hfp 6.98 w htsop-j8 (note3) pd efj 3.10 storage temperature range tstg -55 to +150 c maximum junction temperature tjmax 150 c (note 1) do not however exceed pd. (note 2) reduce by 56 mw / c, when mounted on 4-layerpcb of 114.3mm 76.2mm 1.6mm 2,3 inner layers and copper foil area on the reverse side of pcb 74.2 mm 74.2 mm (note 3) reduce by 25 mw / c, when mounted on 4-layerpcb of 114.3mm 76.2mm 1.6mm 2,3 inner layers and copper foil area on the reverse side of pcb 74.2 mm 74.2 mm caution : exceeding the absolute maximum rating for supply voltage, operating temperature or ot her parameters can result in damages to or destruction of the chip. in this event it also becomes impo ssible to determine the cause of the dam age (e.g. short circuit, open circuit, etc). th erefore, if any special mode is being considered with values expected to exceed the absolu te maximum ratings, implementing physical safety measures, su ch as adding fuses, should be considered. recommended operating conditions parameter symbol limit unit min max operating power supply voltage (note 1) v in, pv in 3.5 36 v operating temperature range topr -40 +125 c output switch current (note2) bd90640hfp/efj-c i swopr40 - 4 a bd90620hfp/efj-c i swopr20 - 2.5 a bd90610efj-c i swopr10 - 1.25 a output voltage v o 0.8 v in v min pulse width t onmin 250 - ns oscillation frequency f sw 50 600 khz oscillation frequency set resistance r rt 22 330 k ? synchronous operation frequency range f sync 50 600 khz synchronous operation frequency f sync - rt -20 +20 % external clock pulse duty d sync 10 90 % capacitance of input capacitor c in 2.4 (note 3) - f (note 1) initial startup is over 3.9 v. (note 2) the limits include output dc current and output ripple current. (note 3) ceramic capacitor is recommended. the capacitor value including temperat ure change, dc bias change, and aging change m ust be larger than minimum value (refer to p.14). also, the ic might not function pr operly when the pcb layout or the position of the capacitor is not good. please check ?notes on the pcb layout? on page 24.
datasheet d a t a s h e e t 6/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 electrical characteristics (unless otherwise specified, ta = - 40 c to +125 c, v in = 13.2 v, v en / sync = 5 v) parameter symbol limit unit conditions min typ max whole chip shutdown circuit current i sdn - 0 5 a v en / sync = 0 v, ta < 105 c circuit current i in - 2.2 3.3 ma io = 0 a, v fb = 2 v sw block power mosfet on resistance r on - 0.16 0.32 ? i sw = 30 ma operating output switch current of overcurrent protection (note 1) bd90640hfp/efj-c i swlimit40 4.0 6.4 - a bd90620hfp/efj-c i swlimit20 2.5 4.3 - a bd90610efj-c i swlimit10 1.25 2.20 - a output leak current i olk - 0 5 a v in = 36 v, v en/sync = 0 v, ta < 105 c error amp block reference voltage 1 v ref1 0.792 0.800 0.808 v v vc = v fb , ta = 25 c reference voltage 2 v ref2 0.784 0.800 0.816 v v vc = v fb reference voltage input regulation ? v ref - 0.5 - % 3.5 v v in 36 v input bias current i b -1.0 - 1.0 a vc sink current i vcsink -76.5 -54.0 -31.5 a v vc = 1.25 v, v fb = 1.3 v vc source current i vcsource 31.5 54.0 76.5 a v vc = 1.25 v, v fb = 0.3 v trans conductance g ea 135 270 540 a / v i vc = 10 a, v vc = 1.25 v soft start time t ss 1.13 1.38 1.63 ms r rt = 27 k ? current sense part trans conductance g cs - 5.2 - a / v oscillator block oscillating frequency f sw 450 500 550 khz r rt = 27 k ? frequency input regulation ? f sw - 1 - % 3.5 v v in 36 v enable / sync input block threshold voltage v en / sync 0.8 1.9 2.6 v sync current i en / sync - 23 50 a v en/sync = 5 v uvlo uvlo on mode voltage v uvlo_on - 3.24 3.50 v uvlo off mode voltage v uvlo_off - 3.52 3.90 v uvlo hysteresis v uvlo_hys - 280 - mv (note 1) the limit include output dc current and output ripple current.
datasheet d a t a s h e e t 7/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 typical performance curves 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 5 10 15 20 25 30 35 40 circuit current :i in [ma] input voltage : v in [v] 0 1 2 3 4 5 6 7 8 9 10 0 5 10 15 20 25 30 35 40 switch current limit : i sw [a] input voltage : v in [v] figure 1. shutdown circuit current vs input voltage figure 2. circuit current vs input voltage figure 3. power mosfet on resistance vs ambient temperature figure 4. switch current limit vs input voltage from top bd90640hfp/efj-c bd90620hfp/efj-c bd90610efj-c ta = 25 c 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 5 10 15 20 25 30 35 40 shutdown circuit current : i sdn [a] input voltage : v in [v] from top ta = 125 c ta = 25 c ta = -40 c 0.00 0.05 0.10 0.15 0.20 0.25 0.30 -40-20 0 20406080100120 power mosfet on resistance : r on [ ? ] ambient temperature : ta [ ? c] from top v in = 3.5v v in = 13.2v ? ta = 125 c ta = 25 c ta = -40 c
datasheet d a t a s h e e t 8/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 784 788 792 796 800 804 808 812 816 -40-20 0 20406080100120 reference voltage : v ref [v] ambient temperature : ta[ ? c] figure 5. leak current vs ambient temperature figure 6. reference voltage vs ambient temperature figure 7. input bias current vs ambient temperature figure 8. ss time vs ambient temperature 0.0 0.2 0.4 0.6 0.8 1.0 -40-20 0 20406080100120 leak current : i olk [ a] ambient temperature : ta [ ? c] v in = 13.2 v v in = 13.2 v 0.0 0.2 0.4 0.6 0.8 1.0 -40-20 0 20406080100120 input bias current :i b [ a] ambient temperature : ta [ ? c] v in = 13.2 v v fb = 0.8 v 1.13 1.18 1.23 1.28 1.33 1.38 1.43 1.48 1.53 1.58 1.63 -40-20 0 20406080100120 soft start time : t ss [ s] ambient temperature : ta[ ? c] r rt =27k ?
datasheet d a t a s h e e t 9/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 0 10 20 30 40 50 60 70 80 90 100 0123 efficiency [%] output current : io[a] 450 460 470 480 490 500 510 520 530 540 550 -40-20 0 20406080100120 oscillation frequency : f sw [khz] ambient temperature : ta[ ? c] figure 10. en / sync threshold voltage vs ambient temperature figure 9. oscillation freque ncy vs ambient temperature 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 -40-20 0 20406080100120 en / sync threshold voltage : v en/sync [v] ambient temperature : ta [ ? c] v in =13.2v r rt =27k ? figure 12. efficiency vs output current 0 50 100 150 200 250 300 350 400 450 0 5 10 15 20 25 30 35 40 en / sync current : i en / sync [ a] en / sync voltage : v en / sync [v] from top ta = 125 c ta = 25 c ta = -40 c figure 11. en / sync current vs en / sync voltage from top v o = 8.8 v v o = 5 v v o = 3.3 v v in = 13.2 v f sw = 500 khz ta = 25 c bd90640hfp/efj-c io<3.79a bd90620hfp/efj-c io<2.29a bd90610efj-c io<1.04a
datasheet d a t a s h e e t 10/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 timing chart ? basic operation ? over current protection operation sw vo v c internal soft start i l t off * output voltage short to gnd auto reset (soft start operation) fb t ss * t off t ss terminal output voltage short release normal pulse repetition at the following over current detect level short current detect level t off * t off * t off = 1024 / f sw [s] ex)f sw = 500[khz] t off = 2.048[ms] t ss = 1.38 [ms] (typ)
datasheet d a t a s h e e t 11/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 external synchronizing function in order to activate the external synchronizing function, connec t the frequency-setting resistor to the rt pin and then input a synchronizing signal to the en / sync pin. the external synchronizing operation frequency is limited by the external resistance of r rt pin. the allowable setting limit is within 20 % of the oscillation frequency. ex) when r rt is 27 k ? (f = 500 khz), the frequency range of the ex ternal synchronization is 400 khz to 600 khz. furthermore, the pulse wave?s low voltage should be under 0. 8 v and the high voltage over 2.6 v (when the high voltage is over 11 v the en / sync input current increases), and the slew rate (rise and fall) under 20 v / s. the duty of external sync pulse should be configured between 10 % and 90%. the frequency will synchronize with the external synchronizi ng operation frequency after three external sync pulses is sensed. eternal sync sample circuit
datasheet d a t a s h e e t 12/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 continuous operation discontinuous operation selection of components externally connected necessary parameters in designing the power supply are as follows: parameter symbol specification case input voltage v in 6 v to 18 v output voltage v o 5 v output ripple voltage ? v pp 20 mv p-p input range i o min 1.0 a / typ 1.5 a / max 2.0 a switching frequency f sw 500 khz operating temperature range topr -40 c to +105 c application sample circuit (1) setting the in ductor(l) value when the switching regulator supplies elec tric current continuously to the load, the lc filter is necessary for the smoothness of the output voltage. the ? i l that flows to the inductor becomes small when an inductor with a large inductance value is selected. consequently , the voltage of the output ripple al so becomes small. it is the trade-off between the size and the cost of the inductor. the inductance value of the inductor is shown in the following equation: l ? [h] where: is the maximum input voltage ? is the inductor ripple current ? i l is set to approximately 30 % of i o . if avoid discontinuous operation, ? i l is set to make sw continuously pulsing (i l keeps continuously flowing) usually. the condition of the continuous operation is shown in the following equation: [a] where: is the load current
datasheet d a t a s h e e t 13/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 a i o i l t i swlimit ( min ) i l peak the smaller the ? i l , the inductor core loss (iron loss) and loss due to esr of the output capacitor, and ? v pp will be reduced. ? v pp is shown in the following equation. ? ? ? [v] ????? (a) where: is the equivalent series re sistance of output capacitor is the output condenser capacity generally, even if ? il is somewhat large, ? v pp of the target is satisfied becaus e the ceramic capacitor has super-low esr. in that case, it is also possible to use it by the di scontinuous operation. the inductance value can be set small as an advantage. it contributes to the miniaturization of the set because of the large rated curr ent, small inductor is possible if the inductance value is small. the disadvant ages are the increase in core losses in the inductor, the decrease in maximum output current, and the deteriorati on of the response. when other capacitors (e lectrolytic capacitor, tantalum capacitor, and electro conductive polymer etc.) are used for output capacitor c o , check the esr from the manufacturer's data sheet and determine the ? il to fit within the acceptable range of ? v pp . especially in the case of electrolytic capacitor, because the capacity decrease at t he low temperature is remarkable, ? v pp increases. when using capacitor at the low temperature, it is necessary to note this. the maximum output electric current is lim ited to the overcurrent protection work ing current as shown in the following equation. ? [a] where: i o max is the maximum output current i swlimit min is the ocp operation current (min) in current mode control, when the ic is operating in duty 50 % and in the condition of continuous operation,the sub-harmonic oscillation may happen. the slope compensation ci rcuit is integrated into the ic in order to prevent sub-harmonic oscillation. the sub-harmoni c oscillation depends on the rate of increase of output switch current. if the inductor value is too small, the sub-harm onic oscillation may happen. and if the in ductor value is too large, the feedback loop may not achieve stability. the inductor value which pr events sub-harmonic oscillation is shown in the following equation. l [h] d 6 10 where: d is the switching pulse duty. rs is the coefficient of current sense 4.0 a / a m is the slope of slope compensation current the shielded type (closed magnetic circuit type) is the reco mmended type of inductor. open magnetic circuit type can be used for low cost applications if noise issues are not concerned. but in this case, an influence other parts by magnetic field radiation is considered. an enoug h space layout between each parts should be noted. for ferrite core inductor type, please note that magnetic saturation may occur. it is necessary not to saturate the core in all cases. precautions must be taken into account on the gi ven provisions of the current rating because it differs according to each manufacturer. please confirm the rated current at t he maximum ambient temperature of t he application to the manufacturer.
datasheet d a t a s h e e t 14/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 (2) set of output capacitor c o value the output capacitor is selected on the basis of esr that is required fr om the equation (a). ? v pp can be reduced by using a capacitor with a small esr. the ceramic capacitor is the best option that meets th is requirement. the ceramic capacitor contributes to the size reduc tion of the application because it has small esr. please confirm frequency characteristic of esr from the datasheet of the manufacturer, and consider esr value is low in the switching frequency being used. it is necessary to consider the ceramic capacito r because the dc biasing characteristic is remarkable. for the voltage rating of the ceramic capacitor, twice or more than the maximum output volt age is usually required. by selecting these high voltages rating, it is possible to reduce the influence of dc bi as characteristics. moreover, in order to maintain good temperature characteristics, the one with t he characteristic of x7r or more is recommended. because the voltage rating of a mass ceramic capacitor is low, the se lection becomes difficult in the application with high output voltage. in that case, please select electr olytic capacitor. please consider having a voltage rating of 1.2 times or more of the output voltage when using electrolytic capacitor. electrolytic capacitors have a high voltage rating, large capacity, small amount of dc biasing characteristic, and are generally cheap. because main failure mode is open, it is effective to use electrolytic capacitor for applicat ions when reliability is required such as in-vehicle. but there are disadvantages such as, esr is relatively high, and decreases capacitance va lue at low temperatures. in this case, please take note that ? v pp may increase at low temperature conditions. moreover, c onsider the lifetime characte ristic of this capacitor because there is a possibility for it to dry up. a tantalum capacitor and a conductive polymer hybrid capa citor have excellent temperature characteristic unlike an electrolytic capacitor. moreover, as these esr is smaller th an an electrolytic capacitor, a ripple voltage is relatively-small over wide temperature range. the design is facilitated because there is little dc bias characteristic like an electrolytic capacitor. normally, for voltage rating, a tantalum capacito r is selected twice the output voltage, and for conductive polymer hybrid capacitor is se lected 1.2 times more than the out put voltage. the disadvantage of a tantalum capacitor is that the failure mode is short, and the br eakdown voltage is low. it is not gener ally selected in the application that reliability such as in automotive is demanded. the failure m ode of an electro conductive polymer hybrid capacitor is open. though it is effective for reliability, the disadvantage is generally expensive. in case of pch step-down switching regulator, when the input voltage decreases and the voltage between input and output becomes small, switching pulse b egin to skip before the pch mosfet comple tely turns on. because of this the output ripple voltage may increase. to improve performa nce in this condition, following is recommended: ? to use low esr capacitor like ceramic or conductive polymer hybrid capacitor. ? higher value of capacitance. these capacitors are rated in ripple current. the rms values of the ripple current that c an be obtained in the following equation must not exceed the ratings ripple current. ? [a] where: i co rms is the value of the ripple electric current in addition, with respect to c o , choose capacitance value less than the val ue obtained by the following equation. [f] where: i swlimit min is the ocp operation switch current (min) t ss min is the soft start time (min) i swstart max is the maximum output current during startup the startup failure may happen when the limits from the above-mentioned are exceeded. especially if the capacitance value is extremely large, over-current protection may be activated by the inrush current at startup, and the output does not start. please confirm this on the ac tual application. for stable transient response, the loop is dependent on the c o . please select after confirming the setti ng of the phase compensation circuit. also, in case of large changing input voltage and load curren t, select the capacitance in accordance with verifying that the actual application meets with the required specification. (3) setting constant of capacitor c in / cbulk input the input capacitor is usually required fo r two types of decoupling: capacitors c in and bulk capacitors cbulk. ceramic capacitors with values more than 2.4 f are necessary for the decoupling capacitor. ceramic capacitors are effective by being placed as close as possible to the vin pin. voltag e rating is recommended to more than 1.2 times the maximum input voltage, or twice the normal input voltage. the capacitor value including temperature change, dc bias change, and aging change must be larger than minimum value. also, the ic might not function properly when the pcb layout or the position of the capacitor is not good. please check ?notes on the pcb layout? on page 24. the bulk capacitor is option. the bulk capacitor prevents the decrease in the line voltage and serves a backup power supply to keep the input potential constant. the low esr electr olytic capacitor with large capacity is suitable for the bulk capacitor. it is necessary to select the best capacitance value as per set of application. n that case, please consider not to
datasheet d a t a s h e e t 15/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 exceed the rated ripple current of the capacitor. the rms value of the input ripple electric cu rrent is obtained in the following equation. ? [a] where: i cin rms is the rms value of the input ripple electric current in addition, in automotive and other applic ations requiring high reliability, it is recommended that capacitors are connected in parallel to accommodate a multiple of electrolytic capacit ors to minimize the chances of drying up. it is recommended by making it into two series + two parallel structures to decreas e the risk of ceramic capacitor destruction due to short circuit conditions. the line has been improved to the summary re spectively by 1pack in each capacitor manufacturer and confirms two series and two parallel structures to each manufacturer. when impedance on the input side is high because of wiring fr om the power supply to vin is long, etc., and then high capacitance is needed. in actual conditions, it is necessary to verify that ther e is no problem when ic operation turns off or overshoot the output due to the change in v in at transient response. (4) setting output voltage output voltage is governed by the following equation. 0.8 [v] please set feedback resistor r2 below 30 k ? to reduce the error margin by the bias current. in addition, since power efficiency is reduced with a small r1 + r2, please set the current flowing through the feedback resistor to be small as possible than the output current i o . (5) selection of the schottky barrier diode the schottky barrier diode that has small forward voltage and short reverse recovery time is used for d1. the important parameters for the selection of the schottky barrier diod e are the average rectified current and direct current inverse-direction voltage. average rectified current i f (avg) is obtained in the following equation: [a] where: i f ave is the average rectified current the absolute maximum rating of the schottky barrier di ode rectified current average is more than 1.2 times i f(avg) and the absolute maximum rating of the dc reve rse voltage is greater than or equal to 1.2 times the maximum input voltage. the loss of d1 is obtained in the following equation: [w] where: vf is the forward voltage in i o max condition selecting a diode that has small forward vo ltage, and short reverse recovery time is highly effective. please select a diode with 0.65 v max of forward voltage. please note that there is possibility of inte rnal element destruction when a diode with a larger vf than this is used. because the reverse recovery time of the schottky barrier diode is so short, that it is possible t o disregard, the switching loss can be di sregarded. when it is necessary for t he diode to endure t he state of output short-circuit, power dissipation ratings and the heat radiation ability are needed to be considered. the rated current that is required is about 1.5 times the overcurrent detection value.
datasheet d a t a s h e e t 16/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 (6) setting the oscillation frequency the internal oscillation frequency can be set by connecting a resistor between rt and gnd. the range that can be set is 50 khz to 600 khz, and the relation between resistance and the oscillation frequency is decided as shown in the figure below. when setting beyond this range, ther e is a possibility that there is no oscillation and ic operation cannot be guaranteed. figure 13. r rt vs f sw (7) setting the phase compensation circuit a good high frequency response performance is achieved by setti ng the 0 db crossing frequency, fc, (frequency at 0 db gain) high. however, you need to be aware of the relationship trade-off between speed and stability. moreover, dc / dc converter application is sampled by switching frequency, so the gain of this switching frequency must be suppressed. it is necessary to set the 0 db crossing frequency to 1 / 10 or less of the switching frequency. in summary, target these characteristics as follows: ? when the gain is 1 (0 db), phase lag is less than or equal to 135 ? (more than 45 ? phase margin). ? 0 db crossing frequency is 1 / 10 times or less of the swit ching frequency. to improve the responsiveness, higher the phase compensation is set by the capacitor and re sistor which are connected in series to the vc pin. achieving stability by using the phase co mpensation is done by cancelling the fp 1 and fp 2 (error amp pole and power stage pole) of the regulation loop by use of fz 1 . fp 1 , fp 2 and fz 1 are determined in the following equations. f [hz] f [hz] f [hz] also, by inserting a capacitor in c2, phase lead fz2 can be added. f [hz] where: g ea is the error amp trans conductance (270 a / v) a v is the error amp voltage gain (78 db) r rt [k ? ]f sw [khz] r rt [k ? ] f sw [khz] 22 599 100 151 24 555 110 139 27 500 120 128 30 455 130 119 33 418 150 104 36 386 160 98. 39 359 180 88 43 329 200 80 47 303 220 73 51 281 240 68 56 258 270 61 62 235 300 55 68 216 330 51 75 197 82 182 91 165 0 100 200 300 400 500 600 700 0 100 200 300 400 500 oscillating frequency: f sw [khz] oscillation frequency setting resistance : r rt [k ? ]
datasheet d a t a s h e e t 17/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 [s] setting phase compensation circuit actually, the changes in the frequency ch aracteristic are greatly affected by t he type and the condit ion (temperature, etc.) of parts that are used, the wi re routing and layout of the pcb. please confirm stability and responsiveness in actual equipment. to check the actual frequency characteristics, use a fra or a gain-phase analyzer. more over, the method of observing the degree of change by the loading response can be perform ed when these measuring instru ments are not available. the phase margin degree is said to be low when there are lots of variation quantities after the output is made to change under no load to maximum load. it can also be observed that the phase margin degree is low when there is a lot of ringing frequencies after the transition of no load to maximum l oad, usually two times or more ringing than the standard. however, a quantitative phase marg in degree cannot be confirmed. measurement of load responce (8) setting of soft start time (t ss ) the soft start function is necessary to prevent inrush of coil current and output volt age overshoot at startup. t ss will be changed by setting the oscillation frequency. the production tolerance of t ss is 18.1%.t ss can be calculated by using the equation. . inadequate phase margin adequate phase margin. load maximum load output voltage t
datasheet d a t a s h e e t 18/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 application examples1 parameter symbol specification case product name ic bd90640hfp/efj-c input voltage v in 6 v to 18 v output voltage v o 5 v output ripple voltage ? v pp 20 mvp-p output current i o min 1.0 a / typ 1.5 a / max 2.0 a switching frequency f sw 500 khz operating temperature topr -40 c to +105c specification example 1 reference circuit 1 parts list 1 no package parameters part name(series) type manufacturer r1 1608 43 k ? , 1 %, 1 / 10 w mcr03 series chip resistor rohm r2 1608 8.2 k ? , 1 %, 1 / 10 w mcr03 series chip resistor rohm r3 1608 20 k ? , 1 %, 1 / 10 w mcr03 series chip resistor rohm r100 - short - - - r rt 1608 27 k ? , 1 %, 1 / 10 w mcr03 series chip resistor rohm c1 1608 4700 pf, r, 50 v gcm series ceramic capacitor murata c2 - open - - - c rt 1608 100 pf, ch, 50 v gcm series ceramic capacitor murata c in 3225 4.7 f, x7r, 50 v gcm series ceramic capacitor murata c o 3225 22 f, x7r, 16 v 2 gcm series ceramic capacitor murata cbulk - 220 f, 50 v cd series electrolytic capacitor nichicon l1 w 9.7 x h 3.8 x l 10 mm 3 15 h clf10040t-150m-h coil tdk d1 cpd average i = 6 a max rb095bm-40fh schottky diode rohm tektronix dpo5054 fra5087 tektronix dpo5054 v in =13.2v io=1.5a 1 s/div v in =13.2v io=1.5a v in =13.2v io=1.5a 2.0a 200 s/div conversion efficiency output ripple voltage frequency characteristic load response vo 10mv/div ac io 200ma/div d c offset 1.5a vo 50mv/div a c vi n =13.2v
datasheet d a t a s h e e t 19/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 application examples 2 parameter symbol specification case product name ic bd90620hfp/efj-c input voltage v in 6 v to 18 v output voltage v o 5 v output ripple voltage ? v pp 20 mvp-p output current i o min 0.4 a / typ 0.8 a / max 1.5 a switching frequency f sw 500 khz operating temperature topr -40 c to +105c specification example 2 reference circuit 2 parts list 2 no package parameters part name(series) type manufacturer r1 1608 43 k ? , 1 %, 1 / 10 w mcr03 series chip resistor rohm r2 1608 8.2 k ? , 1 %, 1 / 10 w mcr03 series chip resistor rohm r3 1608 20 k ? , 1 %, 1 / 10 w mcr03 series chip resistor rohm r100 - short - - - r rt 1608 27 k ? , 1 %, 1 / 10 w mcr03 series chip resistor rohm c1 1608 4700 pf, r, 50 v gcm series ceramic capacitor murata c2 - open - - - c rt 1608 100 pf, ch, 50 v gcm series ceramic capacitor murata c in 3225 4.7 f, x7r, 50 v gcm series ceramic capacitor murata c o 3225 22 f, x7r, 16 v 2 gcm series ceramic capacitor murata cbulk - 220 f, 50 v cd series electrolytic capacitor nichicon l1 w 9.7 x h 3.8 x l 10 mm 3 22 h clf10040t-220m-h coil tdk d1 cpd average i = 6 a max rb095bm-40fh schottky diode rohm tektronix dpo5054 fra5087 tektronix dpo5054 v in =13.2v io=0.8a 1 s/div v in =13.2v io=0.8a v in =13.2v io=0.8a 1.5a 200 s/div conversion efficienc y output ripple voltage frequency characteristic load res p once vo 10mv/div ac io 200ma/div d c offset 0.8a vo 50mv/div a c vi n =13.2v
datasheet d a t a s h e e t 20/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 application examples 3 parameter symbol specification case product name ic bd90610efj-c input voltage v in 6 v to 18 v output voltage v o 5 v output ripple voltage ? v pp 20 mvp-p output current i o min 0.1 a / typ 0.4 a / max 0.8 a switching frequency f sw 500 khz operating temperature topr -40 c to +105c specification example 3 reference circuit 3 parts list 3 no package parameters part name(series) type manufacturer r1 1608 43 k ? , 1 %, 1 / 10 w mcr03 series chip resistor rohm r2 1608 8.2 k ? , 1 %, 1 / 10 w mcr03 series chip resistor rohm r3 1608 33 k ? , 1 %, 1 / 10 w mcr03 series chip resistor rohm r100 - short - - - r rt 1608 27 k ? , 1 %, 1 / 10 w mcr03 series chip resistor rohm c1 1608 10000 pf, r, 50 v gcm series ceramic capacitor murata c2 1608 180pf,ch,50v gcm series ceramic capacitor murata c rt 1608 100 pf, ch, 50 v gcm series ceramic capacitor murata c in 3225 4.7 f, x7r, 50 v gcm series ceramic capacitor murata c o 3225 22 f, x7r, 16 v 2 gcm series ceramic capacitor murata cbulk - 220 f, 50 v cd series electrolytic capacitor nichicon l1 w 9.7 x h 3.8 x l 10 mm 3 100 h clf10040t-101m-h coil tdk d1 pmds average i = 3 a max rb055l-40tf schottky diode rohm tektronix dpo5054 fra5087 tektronix dpo5054 v in =13.2v io=0.4a 1 s/div v in =13.2v io=0.4a v in =13.2v io=0.4a 0.8a 200 s/div conversion efficienc y output ripple voltage frequency characteristic load res p once vo 10mv/div ac vo 50mv/div a c io 200ma/div d c vi n =13.2v
datasheet d a t a s h e e t 21/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 application examples 4 parameter symbol specification case product name ic bd90640hfp/efj-c input voltage v in 3.5 v to 18 v output voltage v o 3.3 v output ripple voltage ? v pp 20 mvp-p output current i o min 1.0 a / typ 1.5 a / max 2.0a switching frequency f sw 500 khz operating temperature topr -40 c to +125 c specification example 4 reference circuit 4 parts list 4 no package parameters part name(series) type manufacturer r1 1608 47 k ? , 1 %, 1 / 10 w mcr03 series chip resistor rohm r2 1608 15 k ? , 1 %, 1 / 10 w mcr03 series chip resistor rohm r3 1608 10 k ? , 1 %, 1 / 10 w mcr03 series chip resistor rohm r100 - short - - - r rt 1608 27 k ? , 1 %, 1 / 10 w mcr03 series chip resistor rohm c1 1608 6800 pf, r, 50 v gcm series ceramic capacitor murata c2 - open - - - c rt 1608 100 pf, ch, 50 v gcm series ceramic capacitor murata c in 3225 4.7 f, x7r, 50 v gcm series ceramic capacitor murata c o 3225 22 f, x7r, 16 v 2 gcm series ceramic capacitor murata cbulk - 220 f,35 v 2 cz series electrolytic capacitor nichicon l1 w 9.7 x h 3.8 x l 10 mm 3 15 h clf10040t-150m-d coil tdk d1 cpd average i = 6 a max rb095bm-40fh schottky diode rohm tektronix dpo5054 fra5087 tektronix dpo5054 v in =13.2v io=1.5a 1 s/div v in =13.2v io=1.5a v in =13.2v io=1.5a 2.0a 200 s/div conversion efficienc y output ripple voltage frequency characteristic load res p once vo 50mv/div a c vo 10mv/div ac io 200ma/div d c offset 1.5a vi n =13.2v
datasheet d a t a s h e e t 22/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 application examples 5 parameter symbol specification case product name ic bd90640hfp/efj-c input voltage v in 9 v to 18 v output voltage v o 8.8 v output ripple voltage ? v pp 100 mvp-p output current i o min 1.0 a / typ 1.5 a / max 2.0 a switching frequency f sw 500 khz operating temperature topr -40 c to +125c specification example 5 reference circuit 5 parts list 5 no package parameters part name(series) type manufacturer r1 1608 51 k ? , 1 %, 1 / 10 w mcr03 series chip resistor rohm r2 1608 5.1 k ? , 1 %, 1 / 10 w mcr03 series chip resistor rohm r3 1608 91 k ? , 1 %, 1 / 10 w mcr03 series chip resistor rohm r100 - short - - - r rt 1608 27 k ? , 1 %, 1 / 10 w mcr03 series chip resistor rohm c1 1608 10000 pf, r, 50 v gcm series ceramic capacitor murata c2 - open - - - c rt 1608 100 pf, ch, 50 v gcm series ceramic capacitor murata c in 3225 4.7 f, x7r, 50 v gcm series ceramic capacitor murata c o - 270 f, 25 v hvp series hybrid capacitor suncon cbulk - 220 f, 3 5 v 2 cz series electrolytic capacitor nichicon l1 w 9.7 x h 3.8 x l 10 mm 3 22 h clf10040t-220d coil tdk d1 cpd average i = 6 a max rb095bm-40fh schottky diode rohm tektronix dpo5054 fra5087 tektronix dpo5054 v in =13.2v io=1.5a 1 s/div v in =13.2v io=1.5a v in =13.2v io=1.5a 2.0a 200 s/div conversion efficienc y output ripple voltage frequency characteristic load res p once vo 10mv/div ac vo 50mv/div a c io 200ma/div d c offset 1.5a vi n =13.2v
datasheet d a t a s h e e t 23/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 input filter figure 14. filter circuit the input filter circuit for emc measures is depicted in the above figure 14. the type filters are the third order lc filters. when the decoupling capacitor fo r high frequency is insufficient, it uses type filters. an excellent characteristic can be performed as emi filter by a large attenuation characte ristic. tvs (transient voltage suppressors) are used for the first protecti on of the in automotive powe r supply line. because it is necessary to endure high energy when the load is connected, a general zener diode is in sufficient. the following are recommended. to protect it when the power supply such as battery is accidentally connect ed in reverse, reverse polarity protection diode is needed. parts of filter circuit recommended parts manufacturer list shown below is the list of the recommended parts manufacturers for reference. device part name(series) manufacturer l clf series tdk l xal series coilcraft c cj series nichicon c cz series nichicon tvs sm8 series vishay d s3a thru s3m series vishay type manufacturer url electrolytic capacitor nichicon www.nichicon.com ceramic capacitor murata www.murata.com coil tdk www.global.tdk.com coil coilcraft www.coilcraft.com coil sumida www.sumida.com diode vishay www.vishay.com diode/resistor rohm www.rohm.com
datasheet d a t a s h e e t 24/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 directions for pattern layout of pcb exposed die pad is needed to be connected to gnd. application circuit (hrp7) exposed die pad is needed to be connected to gnd. application circuit (htsop-j8) arrange the wirings of the wide lines, shown above, as short as possible in a broad pattern. locate the input ceramic capacitor c in as close to the vin - gnd pin as possible. locate r rt as close to the rt pin as possible. locate r1 and r2 as close to the fb pin as possible, and prov ide the shortest wiring from t he r1 and r2 to the fb pin. locate r1 and r2 as far away from the l1 as possible. separate power gnd (schottky diode, i/o capacitor`s gnd) and signal gnd (r t , vc), so that sw noise does not have an effect on signal gnd at all. the feedback frequency characteristics (phase margin) can be measured using fra by inserting a resistor at the location of r100. however, this should be shorted during no rmal operation. r100 is option pattern for measuring the feedback frequency characteristics. 1.vc 2.vin 3.fb 4.gnd 5.rt 6.sw 7.en/sync gnd d1 l1 v o c o 1 c o 2 r1 r100 c2 r3 c1 c rt r2 r rt c in 1 c in 2 c bulk
datasheet d a t a s h e e t 25/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 reference layout pattern hrp7 htsop-j8 top layer bottom layer top layer bottom layer r3 c1 gnd en sw rt vc vin pvin fb gnd vin1 vo pgnd pgnd r2 c2 r1 r100 en/ sync vin1 pgnd pgnd en/ sync c bulk c in 2 c in 1 l1 c o 1c o 2 c rt r rt vo gnd d1 d1 c1 c rt gnd en sw rt vc vin fb r100 r rt
datasheet d a t a s h e e t 26/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 power dissipation for thermal design, be sure to operate the ic within the following conditions. (since the temperatures described hereunder are all guaranteed temperatures, take margin into account.) 1. the ambient temperature ta is to be 125 c or less. 2. the chip junction temperature tj is to be 150 c or less. the chip junction temperature tj can be considered in the following two patterns: to obtain tj from the package surface center temperature tt in actual use to obtain tj from the ambient temperature ta reference value hrp7 reference value htsop-j8 jc jc top : 22 c /w top : 44 c /w bottom : 2 c /w bottom : 14 c /w ja ja 95.3 c / w 1-layer pcb 189.4 c / w 1-layer pcb 17.9 c / w 4-layer pcb 40.3 c / w 4-layer pcb jt jt 5 c /w 1-layer pcb 21 /w 1-layer pcb 1 c /w 4-layer pcb 5 /w 4-layer pcb pcb size 114.3 mm x 76.2 mm x 1.6 mm pcb size 114.3 mmx76.2 mm x 1.6 mm the heat loss w of the ic can be obtained by the formula shown below: w where: r on is the on resistance of ic (refer to page 7) [ ? ] i o is the load current [a] v o is the output voltage [v] v in is the input voltage [v] i cc is the circuit current (refer to page 7) [a] tr is the switching rise time [s] (typ:17ns) tf is the switching fall time [s] (typ:17ns) fsw is the oscillating frequency [hz] 2 1 2 1 sw wave form
datasheet d a t a s h e e t 27/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 thermal reduction characteristics hrp7 ic mounted on rohm standard board based on jedec board material : fr4 board size : 114.3m 76.2 mm 1.6 mm (with thermal via on the board) mount condition : pcb and exposed pad are soldered. top copper foil : the footprint rohm recommend. + wiring for measure. ? 1-layer pcb copper foil area on the reverse side of pcb : 0 mm 0 mm ? 4-layer pcb 2,3 inner layers and copper foil area on the reverse side of pcb 74.2 mm 74.2 mm condition : ja = 95.3 c / w condition : ja = 17.9 c / w figure 15. thermal reduction characteristics (hrp7) htsop-j8 ic mounted on rohm standard board based on jedec board material : fr4 board size : 114.3m 76.2 mm 1.6 mm (with thermal via on the board) mount condition : pcb and exposed pad are soldered. top copper foil : the footprint rohm recommend. + wiring for measure. ? 1-layer pcb copper foil area on the reverse side of pcb : 0 mm 0 mm ? 4-layer pcb 2,3 inner layers and copper foil area on the reverse side of pcb 74.2 mm 74.2 mm condition : ja = 189.4 c / w condition : ja = 40.3 c / w figure 16. thermal reduction characteristics (htsop-j8) 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 0 255075100125150 power dissipation : pd[w] ambient temperature : [ ? c] 6.98 w 1.31w 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 0 25 50 75 100 125 150 power dissipation : pd[w] ambient tem p erature : [ ? c ] 3.10 w 0.66 w
datasheet d a t a s h e e t 28/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 i/o equivalent circuit vc rt sw fb en / sync
datasheet d a t a s h e e t 29/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance s upply lines. separate the gro und and supply lines of the digital and analog blocks to prev ent noise in the ground and supp ly lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. cons ider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the refer ence point of the application board to av oid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external component s do not cause variations on the ground voltage. the ground lines must be as s hort and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guarante ed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possi ble that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiri ng, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comp letely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage fr om static discharge, ground the ic during as sembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input pins input pins of an ic are often connec ted to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnec ted, the electric field from the out side can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conducti on through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line.
datasheet d a t a s h e e t 30/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 operational notes ? continued 12. regarding the input pin of the ic this monolithic ic contains p+ isolat ion and p substrate layers between adj acent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction o perates as a parasitic transistor. parasitic diodes inevitably occur in t he structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure xx. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevents heat damage to t he ic. normal operation should always be within the ic?s power dissipation rating. if however th e rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circui t that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are autom atically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolut e maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other t han protecting the ic from heat damage. 16. over current protection circuit (ocp) this ic incorporates an integrated over current protection circuit that is acti vated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characteriz ed by continuous operation or transit ioning of the protection circuit. 17. disturbance light in a device where a portion of silicon is exposed to light su ch as in a wl-csp, ic characteristics may be affected due to photoelectric effect. for this reason, it is recommended to come up with countermeasures that will prevent the chip from being exposed to light.
datasheet d a t a s h e e t 31/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 ordering information b d 9 0 6 4 0 h f p - c t r product name output switch current 90640: 4 a 90620: 2.5 a 90610: 1.25 a package hfp hrp7 efj htsop-j8 product rank c: for automotive tape and reel information tr: reel type embossed taping e2: reel type embossed taping marking diagram output switch current part number marking 4 a bd90640hfp 2.5 a bd90620 hfp 1.25 a bd90610 hfp output switch current part number marking 4 a d90640 2.5 a d90620 1.25 a d90610 htsop-j8 (top view) part number marking lot numbe r 1pin mark hrp7 (top view) part number marking lot number 1pin mark
datasheet d a t a s h e e t 32/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 physical dimension, tape and reel information package name hrp7
datasheet d a t a s h e e t 33/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 physical dimension, tape and reel information package name htsop-j8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin
datasheet d a t a s h e e t 34/34 BD906XX series tsz02201-0t1t0al00130-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 21.nov.2014 rev.004 revision history date revision changes 06.jan.2014 001 new release 07.apr.2014 002 p.4 description of ocp remove sentence ?furthermore ~? p.6 operating output switch current of overcurrent protection symbol change i swlimit . p.18 parts list d1 package change ?pmds? p.19 parts list c2 change ?open? p.21 about directions for pattern layout of pcb change ? and signal gnd (r t , vc,), ? 17.oct.2014 003 hrp package version addition p. 5 recommended operating conditions capacitance of input capacitor addition 21.nov.2014 004 p.17 setting phase compensation circuit change sbd symbol p.28 i/o equivalent circuit change mos symbol
notice C ss rev.00 3 ? 20 13 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may caus e loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or li able for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. ( n ote1) m edical equipment classification of the specific applications japan usa eu china class 2 . rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequa te safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection ci rcuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3 . our p roducts are not designed under any special or extraordinary environments or conditions, a s exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any special or extraordinary environments or conditions . if you intend to use our pr oducts under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, prior to use, must be necessary : [a] use of our products in any types of l iquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our products in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat - producing components, plastic cords, or other flammabl e items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cleaning residue of flux is recommended); or washing our products by using wat er or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proof design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse . is applied, confirmation of performance characteristics after on - board mounting is strongly recommend ed. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation (pd) depending on ambient temperature (ta). whe n used in sealed area, confirm the actual ambient temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under d eviant condition from what is defined in this document . precaution for mounting / circuit board design 1 . when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability . 2 . in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products, please consult with t he rohm representative in advance. for details , please refer to rohm mounting specification
notice C ss rev.00 3 ? 20 13 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1 . if change is made to the constant of an external circuit, please allow a sufficient margin co nsidering variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2 . you agree that application notes, reference designs, and associated data and information contai ned in this document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contai ned in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive p roduct, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry cond ition (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1 . product performance and soldered connect ions may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2 . even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3 . store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due t o excessive stress applied when dropping of a carton. 4 . use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precau tion for p roduct l abel qr code printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since our products might fall under controlled goods prescribed by the applicable f oreign exchange and f oreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1 . al l i nformation and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of a ny third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data. : 2 . no license, expressly or implied, i s granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1 . this document may not be reprinted or reproduced, in whole or in part, wit hout prior written consent of rohm. 2 . the products may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3 . i n no event shall you use in any way whatsoever the products and the related tech nical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4 . the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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