multilayer ceramic chip capacitors 1 of 3 creation date : february 27, 2017 (gmt) c2012x7t2e104k125aa tdk item description c2012x7t2e104kt**** applications commercial grade please refer to part no. cga4j3x7t2e104k125aa for automotive use. feature mid mid voltage (100 to 630v) series c2012 [eia 0805] status production size length(l) 2.00mm 0.20mm width(w) 1.25mm 0.20mm thickness(t) 1.25mm 0.20mm terminal width(b) 0.20mm min. terminal spacing(g) 0.50mm min. recommended land pattern (pa) 1.00mm to 1.30mm(flow soldering) 0.90mm to 1.20mm(re?ow soldering) recommended land pattern (pb) 1.00mm to 1.20mm(flow soldering) 0.70mm to 0.90mm(re?ow soldering) recommended land pattern (pc) 0.80mm to 1.10mm(flow soldering) 0.90mm to 1.20mm(re?ow soldering) electrical characteristics capacitance 100nf 10% rated voltage 250vdc temperature characteristic x7t(+22,-33%) dissipation factor (max.) 2.5% insulation resistance (min.) 5000m other soldering method wave (flow) re?ow aec-q200 no packing blister (plastic)taping [180mm reel] package quantity 2000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : february 27, 2017 (gmt) c2012x7t2e104k125aa characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance c2012x7t2e104k125aa esr c2012x7t2e104k125aa capacitance c2012x7t2e104k125aa dc bias characteristic c2012x7t2e104k125aa temperature characteristic c2012x7t2e104k125aa(no bias) c2012x7t2e104k125aa(dc bias = 125v ) ripple temperature rising c2012x7t2e104k125aa(100khz) c2012x7t2e104k125aa(500khz) c2012x7t2e104k125aa(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : february 27, 2017 (gmt) c2012x7t2e104k125aa associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
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