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  november 2011 doc id 17655 rev 1 1/9 9 STTH5R06-Y automotive turbo 2 ultrafast high voltage rectifier features ultrafast switching low reverse recovery current reduces switching losses low thermal resistance aec-q101 qualified description the stth5r06, which uses st turbo 2 600 v technology, is specially suited as a boost diode in continuous mode power factor correction and hard switching conditions. this device is also intended for use as a free wheeling diode in power supplies and other power switching applications. table 1. device summary symbol value i f(av) 5 a v rrm 600 v t j 175 c v f (typ) 1.5 v t rr (max) 35 ns d 2 pak stth5r06g-y dpak stth5r06b-y k a nc k a nc www.st.com
characteristics STTH5R06-Y 2/9 doc id 17655 rev 1 1 characteristics to evaluate the maximum conduction losses use the following equation: p = 1.35 x i f(av) + 0.12 i f 2 (rms) table 2. absolute ratings (limiting values) symbol parameter value unit v rrm repetitive peak reverse voltage 600 v i f(rms) forward rms current d 2 pa k 2 5 a dpak 10 i f(av) average forward current = 0.5 d 2 pak / dpak t c = 145 c 5 a i fsm surge non repetitive forward current t p = 10 ms sinusoidal d 2 pa k 7 0 a dpak 50 a t stg storage temperature range -65 to + 175 c t j operating junction temperature range -40 to + 175 c table 3. thermal parameter symbol parameter maximum unit r th(j-c) junction to case 2.2 c/w table 4. static electrical characteristics symbol parameter test conditions min. typ. max. unit i r (1) 1. pulse test: t p = 5 ms, < 2 % reverse leakage current t j = 25 c v r = v rrm 30 a t j = 125 c 30 300 v f (2) 2. pulse test: t p = 380 s, < 2 % forward voltage drop t j = 25 c i f = 5 a 3.2 v t j = 125 c 1.5 1.95
STTH5R06-Y characteristics doc id 17655 rev 1 3/9 table 5. dynamic electrical characteristics symbol parameter test conditions min. typ. max. unit t rr reverse recovery time t j = 25 c i f = 0.5 a, i rr = 0.25 a, i r = 1 a 20 ns i f = 1 a, di f /dt = - 50 a/s, v r = 30 v 35 i rm reverse recovery current t j = 125 c i f = 5 a, di f /dt = - 200 a/s, v r = 400 v 4.5 6 a s factor softness factor 0.5 - q rr reverse recovery charges 110 nc t fr forward recovery time t j = 25 c i f = 5 a di f /dt = 40 a/s v fr = 2.5 v 220 ns v fp forward recovery voltage 4.5 v figure 1. average forward power dissipation versus average forward current figure 2. forward voltage drop versus forward current figure 3. relative variation of thermal impedance junction to case versus pulse duration figure 4. peak reverse recovery current versus di f /dt (typical values) p(w) 0 2 4 6 8 10 12 14 16 01234567 i (a) f(av) t =tp/t tp = 0.05 = 0.1 = 0.2 = 0.5 = 1 i (a) fm 0.0 2.5 5.0 7.5 10.0 12.5 15.0 17.5 20.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 t j =125 c (maximum values) t j =125 c (typical values) t j =25 c (maximum values) v (v) fm z/r th(j-c) th(j-c) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 single pulse t (s) p i (a) rm 0 1 2 3 4 5 6 7 8 9 0 50 100 150 200 250 300 350 400 450 500 i f =i f(av) v r =400 v t j =125 c di /dt(a/s) f
characteristics STTH5R06-Y 4/9 doc id 17655 rev 1 figure 5. reverse recovery time versus di f /dt (typical values) figure 6. reverse recovery charges versus di f /dt (typical values) figure 7. softness factor versus di f /dt (typical values) figure 8. relative variations of dynamic parameters versus junction temperature t (ns) rr 0 10 20 30 40 50 60 70 80 0 50 100 150 200 250 300 350 400 450 500 i f =i f(av) v r =400 v t j =125 c di /dt(a/s) f q (nc) rr 0 20 40 60 80 100 120 140 160 0 50 100 150 200 250 300 350 400 450 500 i f =i f(av) v r =400 v t j =125 c di /dt(a/s) f s factor 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0 50 100 150 200 250 300 350 400 450 500 i f =i f(av) v r =400 v t j =125 c di /dt(a/s) f 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 25 50 75 100 125 i f =i f(av) v r =400 v reference: t j =125 c i rm s factor q rr t (c) j figure 9. transient peak forward voltage versus di f /dt (typical values) figure 10. forward recovery time versus di f /dt (typical values) v (v) fp 0 2 4 6 8 10 12 14 050 1 00 1 50 2 00 2 50 300 350 4 00 4 50 500 i f =i f(av) t j =125 c di /dt(a/s) f t (ns) fr 0 20 40 60 80 100 120 140 160 0 50 100 150 200 250 300 350 400 450 500 i f =i f(av) v fr =2.5v t j =125 c di /dt(a/s) f
STTH5R06-Y characteristics doc id 17655 rev 1 5/9 figure 13. thermal resistance junction to ambient versus copper surface under tab (dpak) figure 11. junction capacitance versus reverse voltage applied (typical values) figure 12. thermal resistance junction to ambient versus copper surface under tab (d 2 pa k ) c(pf) 10 100 1 10 100 1000 f=1 mhz v osc =30 mv rms t j =25 c v (v) r r (c/w) th(j-a) 0 10 20 30 40 50 60 70 80 0 5 10 15 20 25 30 35 40 d2pak s(cu)(cm2) epoxy printed circuit board fr4 copper thickness = 35 m r (c/w) th(j-a) 0 10 20 30 40 50 60 70 80 90 100 0 5 10 15 20 25 30 35 40 dpak s(cu)(cm2) epoxy printed circuit board fr4 copper thickness = 35 m
package information STTH5R06-Y 6/9 doc id 17655 rev 1 2 package information epoxy meets ul94, v0 lead-free packages in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 14. footprint (dimensions in mm) table 6. d 2 pak dimensions ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.017 0.024 c2 1.23 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.40 0.393 0.409 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.40 1.75 0.055 0.069 m 2.40 3.20 0.094 0.126 r 0.40 typ. 0.016 typ. v2 0 8 0 8 g l l3 l2 b b2 e * flat zone no less than 2m m a c2 d r a2 m v2 c a1 * 16.90 10.30 8.90 3.70 5.08 1.30
STTH5R06-Y package information doc id 17655 rev 1 7/9 figure 15. footprint (dimensions in mm) table 7. dpak dimensions ref. dimensions millimeters inches min. max. min. max. a 2.20 2.40 0.086 0.094 a1 0.90 1.10 0.035 0.043 a2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b2 5.20 5.40 0.204 0.212 c 0.45 0.60 0.017 0.023 c2 0.48 0.60 0.018 0.023 d 6.00 6.20 0.236 0.244 e 6.40 6.60 0.251 0.259 g 4.40 4.60 0.173 0.181 h 9.35 10.10 0.368 0.397 l2 0.80 typ. 0.031 typ. l4 0.60 1.00 0.023 0.039 v2 0 8 0 8 h l4 g b l2 e b2 d a1 r r c a c2 0.60 min. v2 a2 6.7 6.7 3 3 1.6 1.6 2.3 2.3
ordering information STTH5R06-Y 8/9 doc id 17655 rev 1 3 ordering information 4 revision history table 8. ordering information order code marking package weight base qty delivery mode stth5r06gy-tr stth5r06gy d 2 pak 1.48 g 1000 tape and reel stth5r06by-tr stth5r06by dpak 0.3 g 2500 tape and reel table 9. document revision history date revision changes 03-nov-2011 1 initial release.
STTH5R06-Y doc id 17655 rev 1 9/9 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2011 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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