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product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive rays . 1 / 30 ? 20 16 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 www.rohm.com tsz02201 - 0j3j0aj01200 - 1 - 2 22.apr.2016 rev.002 2.7v to 5.5v input, 4 .0a integrated mosfet single synchronous buck dc/dc converter b d 9b400 muv general description bd 9b400 muv is a synchronous buck switching regulator with built - in low on - resistance power mosfets. this ic, which is capabl e of providing current up to 4 a, features fast transient response by employing constant on - time control system. it offers high oscillating frequency at low inductance . with its original constant on - time control method which operates low consumption at ligh t load, this product is ideal for equipment and devices that demand minimal standby power consumption. features ? synchronous s ingle dc/dc c onverter ? constant on - time control suitable to deep - sllm ? over current p rotection ? short circuit protection ? t hermal shutdown p rotection ? under voltage l ockout p rotection ? adjustable s oft s tart ? power good o utput ? vqfn016v3030 p ackage (backside heat dissipation) applications ? step - down p ower s upply for dsps, fpgas, m icroprocessors , etc. ? laptop pcs/ t ablet pcs/ s ervers ? lcd tvs ? storage d evices (hdds/ssds) ? printers, oa e quipment ? entertainment d evices ? distributed p ower s upply , s econdary p ower s upply key specification s ? i nput voltage range: 2.7v to 5.5v ? o utput voltage range: 0.8 v to v pvin x 0.8 v ? maximum o perating current: 4 a ( max ) ? s witching frequency: 2 mhz /1mhz (typ) ? high - side mosfet on resistance: 3 0 m (typ) ? low - side mosfet on resistance: 3 0 m (typ) ? s tandby current: 0 a ( typ ) package(s) w (typ) x d (typ) x h (max) vqfn016v3030 3.00 mm x 3.00 mm x 1.00 mm typical application circuit figure 1. application circuit vqfn01 6v3030 en pvin boot freq bd 9 b 400 muv pgd sw fb vin v out avin ss pgd mode agnd pgnd enable 22f 0.1f css r2 r1 0.1 f 22 f 2 cfb 1.0 h datashee t
2 / 30 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 b d 9b400muv tsz02201 - 0j3j0aj01200 - 1 - 2 22.apr.2016 rev.002 pin config uration(s) pin description(s) pin no. pin n ame function 1, 2 pvin power supply terminals for the switching regulator. these terminals supply power to the output stage of the switching regulator. c onnect ing a 22 f ceramic capacito r is recommended. 3, 4 pgnd ground terminals for the output stage of the switching regulator. 5 agnd ground terminal for the control circuit. 6 fb an inverting input node for the error amplifier and main comparator . see page 22 for how to calculate t he resistance of the output voltage setting. 7 freq terminal for setting switching frequency. connecting this terminal to ground makes switching to operate constant on - time corresponding to 2.0mhz. connecting this terminal to avin make s switching to oper ate constant on - time corresponding to 1.0mhz. please fix this terminal to avin or ground in operation. 8 mode terminal for setting switching control mode. connecting this terminal to avin forces the device to operate in the fixed frequency pwm mode. conne cting this terminal to ground enables the deep - sllm control and the mode is automatically switched between the deep - sllm contro l and fixed frequency pwm mode. please fix this terminal to avin or ground in operation. 9 ss t erminal for setting th e soft start time. the rise time of the output voltage can be specified by connecting a capacitor to this terminal. see page 23 for how to calculate the capacitance . 10, 11, 12 sw switch nodes. these terminals are co nnected to the source of th e high - side mosfet and drain of the low - side mosfet. connect a bootstrap capacitor of 0.1 f between these terminals and boot terminal. in addition , connect an inductor of 0.47 h to 1 h (freq=l), h to 1.5 h (freq=h) considering the direct cur rent superimposition characteristic. 13 boot terminal for bootstrap. c onnect a bootstrap capacitor of 0.1 f between this terminal and sw terminals. the voltage of this terminal is t he gate drive voltage of the high - side mosfet. 14 pgd a 33 ower g ood t erminal , an open drain output. use of pull up resistor is needed . see page 17 for how to specify the resistance . when the fb terminal voltage reaches more than 80 % of 0.8 v, the internal nch mosfet turns off and the output turn s high. 15 en enable terminal. turning this terminal signal low (0. 8 v or lower) forces the device to enter the shutdown mode. turning this terminal signal high (2.0 v or higher) enables the device. this terminal must be terminated. 16 avin terminal for supplying power to the control circuit of the switching regulator. c onnect ing a 0.1 f ceramic capacitor is recommended . this terminal must be connected to pvin. - e - pad a backside heat dissipation exposed pad. connecting to the internal pcb ground plane by using multiple vias provides excellent heat dissipation characteristics. figure 2 . pin a ssignment (top view) p g n d 4 1 2 3 p v i n p g n d s s 9 1 2 1 1 1 0 s w 1 3 1 6 1 5 1 4 5 6 7 8 a g n d f r e q m o d e s w s w b o o t p g d e n a v i n p v i n f b e - p a d
3 / 30 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 b d 9b400muv tsz02201 - 0j3j0aj01200 - 1 - 2 22.apr.2016 rev.002 block diagram(s) figure 3 . block d iagram c o n t r o l l o g i c + d r v v r e f t s d u v l o o n t i m e o n t i m e m o d u l a t i o n f b m o d e p g d p g n d s w p v i n e n v o u t 3 8 1 5 1 6 1 1 1 4 4 2 1 6 1 0 1 2 a v i n 5 a g n d 9 1 3 b o o t s s 7 f r e q p g o o d s o f t s t a r t e r r o r a m p l i f i e r m a i n c o m p a r a t o r h o c p l o c p s c p
4 / 30 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 b d 9b400muv tsz02201 - 0j3j0aj01200 - 1 - 2 22.apr.2016 rev.002 description of block(s)
5 / 30 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 b d 9b400muv tsz02201 - 0j3j0aj01200 - 1 - 2 22.apr.2016 rev.002 absolute maxi mum ratings (ta = 25c) parameter symbol rating unit supply v oltage v pvin , v avin - 0.3 to + 7 v en t erminal v oltage v en - 0.3 to + 7 v mode t erminal v oltage v mode - 0.3 to + 7 v freq t erminal v oltage v freq - 0.3 to + 7 v pgd t erminal v oltage v pgd - 0.3 to + 7 v voltage from gnd to boot v boot - 0.3 to + 14 v voltage from sw to boot S ? ? (note 1) parameter symbol thermal resistance (typ) unit 1s (note 3) 2s2p ( note 4) vqfn016v3030 junction to ambient ja 189.0 57.5 c/w junction to top characterization parameter (note 2) jt 23 10 c/w (note 1) based on jesd 51 - 2a(still - air) (note 2) the thermal characterization parameter to report the difference between junction temperature and the temperature at the t op center of the outside surface of the component package. (note 3) using a pcb board based on jesd 51 - 3. layer number of measurement board material board size single fr - 4 114.3mm x 76.2mm x 1.57mmt top copper pattern thickness footprints and traces 70 m (note 4) using a pcb board based on jesd 51 - 5, 7. layer number of measurement board material board size thermal via (note 5) pitch diameter 4 layers fr - 4 114.3mm x 76.2mm x 1.6mmt 1.20mm -pp top 2 internal layers bottom copper pattern thicknes s copper pattern thickness copper pattern thickness footprints and traces 70 m 74.2mm x 74.2mm 35 m 74.2mm x 74.2mm 70 m (note 5) this thermal via connects with the copper pattern of all layers.. recommended operating conditions (ta= - 40 c to +85 c ) par ameter symbol min typ max unit supply voltage v pvin , v avin 2.7 - 5.5 v output c urrent (note 6 ) i out - - 4 a output v oltage r ange v range 0.8 - v pvin 0. 8 v ( note 6 ) pd, aso should not be exceeded
6 / 30 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 b d 9b400muv tsz02201 - 0j3j0aj01200 - 1 - 2 22.apr.2016 rev.002 electrical characteristics ( unless otherwise specified ta=25 c , v avin = v pvin = 5v, v en = 5 v, v mode = gnd ) parameter symbol min typ max unit conditions avin pin standby supply current i stb - 0 10 a en=gnd operating supply current i cc - 4 5 80 a freq= avin, i out =0ma no n switching uvlo d etection threshold v uvlo1 2.35 2.45 2.55 v v in falling uvlo r elease threshold v uvlo2 2.425 2.55 2.7 v v in rising uvlo hysteresis v uvlohys 50 100 200 mv enable en i nput h igh l evel v oltage v enh 2.0 - - v en i nput l ow level v oltage v enl - - 0. 8 v en input c urrent i en - 5 10 a en=5v reference voltage, error amplifier fb terminal voltage v fb 0.792 0.8 0.808 v fb input bias current i fb - - 1 a fb= 0. 8 v internal soft start time t ss 0.5 1.0 2.0 ms ss terminal is open soft start terminal current i ss 0.5 1.0 2.0 a co ntrol freq input high level voltage v frqh v avin - 0.3 - - v freq input low level voltage v frql - - 0.3 v mode input high level voltage v modeh v avin - 0.3 - - v mode input low level voltage v model - - 0.3 v on time1 ont1 96 120 144 ns v out =1.2v , freq=g nd on time2 ont2 192 240 288 ns v out =1.2v , freq=avin power good power good rising threshold v pgdh 75 80 85 % fb rising , v pgdh =fb/v fb x100 power good falling threshold v pgd l 65 70 75 % fb falling , v pgdl =fb/v fb x100 output l eakage c urrent i lkpgd - 0 5 a pgd=5v power g ood o n r esistance r pgd - 100 200 power g ood l ow l evel v oltage p gdv l - 0.1 0.2 v i pgd =1ma sw high s ide fet o n r esistance r onh - 30 6 0 p boot - sw = 5 v low s ide fet o n r esistance r onl - 30 6 0 p high s ide o utput l eakage c urrent r il h - 0 10 a no switching low s ide o utput l eakage c urrent r ill - 0 10 a no switching
7 / 30 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 b d 9b400muv tsz02201 - 0j3j0aj01200 - 1 - 2 22.apr.2016 rev.002 t ypical performance curves mode=l mode=h mode=l mode=h figure 4. operating supply current vs temperature figure 5. stand - by supply current vs temperature figure 6. efficiency vs load current ( v in =5v, v out = 1.2v, l=1.0h, freq=l) figure 7. efficiency vs load current ( v in =5v, v out = 1.2v, l=1.0h, freq=h) v out =1.2v, freq =l v out =1.2v, freq= h v in =5v v in =3.3v v in =5v v in =3.3v 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 80 temperature [c] i stby >$@ 0 10 20 30 40 50 60 -40 -20 0 20 40 60 80 temperature [c] i cc >$@ 0 10 20 30 40 50 60 70 80 90 100 1 10 100 1000 10000 load current [ma] efficiency [%] 0 10 20 30 40 50 60 70 80 90 100 1 10 100 1000 10000 load current [ma] efficiency[%]
8 / 30 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 b d 9b400muv tsz02201 - 0j3j0aj01200 - 1 - 2 22.apr.2016 rev.002 t ypical performance curves - continued figure 8. efficiency vs load current ( v in =5v, v out =3.3 v, l=1.0h, freq=l) figure 9. efficiency vs load current ( v in =5v, v out =3.3 v, l=1.0h, freq=h) figure 10. fb voltage vs temperature figure 11. uvlo threshold vs temperature mode=l mode=h mode=l mode=h v out = 3.3 v, freq=l v out = 3 .3 v freq= h v in =5v v in =3.3v release detect 0.792 0.794 0.796 0.798 0.800 0.802 0.804 0.806 0.808 -40 -20 0 20 40 60 80 temperature [c] v fb [v] 2.36 2.40 2.44 2.48 2.52 2.56 2.60 -40 -20 0 20 40 60 80 temperature [c] v uvlo [v] 0 10 20 30 40 50 60 70 80 90 100 1 10 100 1000 10000 load current [ma] efficiency [%] 0 10 20 30 40 50 60 70 80 90 100 1 10 100 1000 10000 load current [ma] efficiency [%]
9 / 30 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 b d 9b400muv tsz02201 - 0j3j0aj01200 - 1 - 2 22.apr.2016 rev.002 t ypical performance curves - continued figure 14 . freq threshold vs temperature figure 15. freq input current vs temperature figure 12. e n threshold vs temperature figure 13. en input current vs temperature v in =5v v in =3.3v v in =5v up down v in =3.3v v in =5 v v in =3.3v v in =5.0 v v in =5.0 v 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 -40 -20 0 20 40 60 80 temperature [c] v en [v] 0.0 2.0 4.0 6.0 8.0 10.0 -40 -20 0 20 40 60 80 temperature [c] i en >$@ 0.0 0.5 1.0 1.5 2.0 2.5 -40 -20 0 20 40 60 80 temperature [c] i freq >$@ 0.5 1.0 1.5 2.0 2.5 3.0 3.5 -40 -20 0 20 40 60 80 temperature [c] v freq [v]
10 / 30 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 b d 9b400muv tsz02201 - 0j3j0aj01200 - 1 - 2 22.apr.2016 rev.002 t ypical performance curves - continued figure 18. high side on - resistance vs temperature figure 19. low side on - resistan ce vs temperature figure 16. mode t hreshold v oltage vs t emperature figure 17. mode input current vs t emperature v in =5v v in =3.3v v in =5v v in =5v v in =3.3v v in =5v v in =3.3v 20.0 22.5 25.0 27.5 30.0 32.5 35.0 37.5 40.0 -40 -20 0 20 40 60 80 temperature [c] r onl [m b? ] 0.5 1.0 1.5 2.0 2.5 3.0 3.5 -40 -20 0 20 40 60 80 temperature [c] v mode [v] 20.0 22.5 25.0 27.5 30.0 32.5 35.0 37.5 40.0 -40 -20 0 20 40 60 80 temperature [c] r onh [m b? ] 3.0 3.5 4.0 4.5 5.0 5.5 6.0 -40 -20 0 20 40 60 80 temperature [c] i mode >$@
11 / 30 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 b d 9b400muv tsz02201 - 0j3j0aj01200 - 1 - 2 22.apr.2016 rev.002 t ypical performance curves - continued figure 22 . soft start time vs temperature figure 23. ss t erminal c urrent vs temperature figure 20. pgd threshol d vs temperature figure 21. pgd on - resistance vs temperature rising falling v in =5v v in =3.3v v in =5v v in =3.3v v in =5v v in =3.3v 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 80 temperature [c] i ss >$@ 0.0 0.5 1.0 1.5 2.0 -40 -20 0 20 40 60 80 temperature [c] t ss [msec] 60 65 70 75 80 85 -40 -20 0 20 40 60 80 temperature [c] v pgd [%] 60 70 80 90 100 110 120 -40 -20 0 20 40 60 80 temperature [c] p gd on > @
12 / 30 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 b d 9b400muv tsz02201 - 0j3j0aj01200 - 1 - 2 22.apr.2016 rev.002 t ypical performance curves - continued figure 26 . swi t chi n g frequency vs input voltage figure 27. swi t chi n g frequency vs i nput voltage figure 24. swi t chi n g frequency vs load current figure 25. swi t chi n g frequency vs load current mode=l mode=h freq=h v in =5v mode=l mode=h freq=l v in =5v v out = 1.2v mode=h freq=l i out = 4 a v out = 1.2v mode=h freq= h i out =4 a 0 200 400 600 800 1000 1200 0 1000 2000 3000 4000 load current [ma] f sw [khz] 800 850 900 950 1000 1050 1100 1150 1200 3.0 3.5 4.0 4.5 5.0 5.5 vin input voltage [v] f sw [khz] 1600 1700 1800 1900 2000 2100 2200 2300 2400 3.0 3.5 4.0 4.5 5.0 5.5 vin input voltage [v] f sw [khz] 0 400 800 1200 1600 2000 2400 0 1000 2000 3000 4000 load current [ma] f sw [khz]
13 / 30 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 b d 9b400muv tsz02201 - 0j3j0aj01200 - 1 - 2 22.apr.2016 rev.002 t ypical performance curves - continued figure 30 . power up waveform with vin (freq =h , r load =0. 3 figure 31 . power down waveform with vin (freq =h , r load fi gure 28. power up waveform with en (freq =h , r load =0.3 figure 29. power down waveform with en (freq =h , r load time=1ms/div v in =5v/div en=5v/div v out =1v/div sw=5v/div v in =5v/div en=5v/div v out =1v/div sw=5v/div time=1ms/div v in =5v/div en=5v/div v out =1v/div sw=5v/div v in =5v/div en=5v/div v out =1v/div sw=5v/div time=1ms/div time=1ms/div
14 / 30 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 b d 9b400muv tsz02201 - 0j3j0aj01200 - 1 - 2 22.apr.2016 rev.002 t ypical performance curves - continued figure 35 . switching waveform ( v in =5v, v out = 1.2v, freq=h, i out =4a) figure 32 . switching waveform ( v in =5v, v out = 1.2v, f req=l, i out =0.1a) figure 33 . switching waveform ( v in =5v, v out = 1.2v, freq=l, i out =4a) figure 34 . switching waveform ( v in =5v, v out = 1.2v, freq=h, i out =0.2a) time=1s/div v out =20mv/div sw=2v/div v out =20mv/div sw=2v/div time=1s/div time=1s/div v out =20mv/div sw=2v/div v out =20mv/div sw=2v/div time=1s/div
15 / 30 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 b d 9b400muv tsz02201 - 0j3j0aj01200 - 1 - 2 22.apr.2016 rev.002 t ypical performance curves - continued figure 36. line regulation (v out =1.2v, l=1.0 h, freq=h , i out =4a ) figure 37. load regulation (v in =5v, v out =1.2v, l=1. 0 h , freq=h) figure 38. load transient response i out =0.1a to 3a (v in =5v, v out =1.2v, freq=l , mode=l , c out =ceramic 44f) figure 39. load transient response i out = 0 .1a to 4 a (v in =5v, v out =1.2v, freq=l , mode= h, c out =ceramic 44f) mode=h mode= l mode= l mode=h v out = 50m v/div v out = 50m v/div i out = 2a /div i out = 2a /div time = 0.4ms /div time = 0.4ms /div -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 0.0 1.0 2.0 3.0 4.0 load current [a] output voltage deviation[%] -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 vin input voltage[v] output voltage deviation[%]
16 / 30 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 b d 9b400muv tsz02201 - 0j3j0aj01200 - 1 - 2 22.apr.2016 rev.002 function explanation ( s ) 1 . basic operation (1) dc/dc converter operation bd 9b400 muv is a synchronous rectifying step - down switching regulator that achieves faster transient response by employing constant on - time control system. it utilizes switching operation in pwm (pulse width modulation) mode for heav ier load, while it utilizes deep - sllm ( deep_ simple light load mode) control for lighter load to improve efficiency. figure 40 . efficiency (deep - sllm control and pwm control)
17 / 30 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 b d 9b400muv tsz02201 - 0j3j0aj01200 - 1 - 2 22.apr.2016 rev.002 (2) enable control the ic shutdown can be controlled by the voltage applied to the en terminal. when v en reaches 2.0 v(typ), the internal circuit i s activated and the ic starts up. to enable shutdown control with the en terminal, the shutdown interval (low level interval of en) must be set to 100 s or longer. startup by en must be at the same time or after the input of power supply voltage. figure 43 . start up and down with enable (3) power good when the out put voltage reaches more than 8 0% of the voltage setting, the open drain nmosfet , internally connected to the pgd terminal , turns off and the pgd terminal turns to hi - z condi tion. also when the output voltage falls below 70% of voltage setting, the open drain nmos fet turns on and pgd terminal pulls down with &rqqhfwlqjdsxooxsuhvlvwru. wr. lvuhfrpphqghg f igure 4 4. power good t iming c hart (4) soft start when en terminal is turned high, soft start operates and output voltage gradually rises . with the soft start function , over sh oot of output voltage and rush current can be prevented. rising time of output voltage when ss terminal is open is 1msec (typ ). capacitor connected to ss terminal makes rising time more than 1msec. pleas e refer to page 23 for the method of setting rising t ime. figure 4 5. soft start timing chart e n v o u t p g d ? ? ? ? ? ? ? > >? ? ? ? ? ? ? ?b 8 0 % ? ? ? ? ? ? ? > >? ? ? ? ? ? ? ?b 7 0 % e n v o u t f b 0 . 8 ? ?b 9 0 % 1 m s e c ( t y p . ) b w h e n s s t e r m i n a l i s o p e n 0 . 8 v v e n 0 v o u t 0 s o f t s t a r t 1 m s e c ( t y p . ) v e n h v e n l e n t e r m i n a l o u t p u t s e t t i n g v o l t a g e t t
18 / 30 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 b d 9b400muv tsz02201 - 0j3j0aj01200 - 1 - 2 22.apr.2016 rev.002 2 . protection the protective circuits are intended for prevention of damage caused by unexpected accidents. do not use them for continuous protective operation (1) over current protection (ocp) / sho rt c ircuit p rotection (scp) setting (typ) of o ver current protection are 7 a ( lower mosfet ) and 9.5 a (upper mosfet) . when ocp is triggered, o ver current protection is realized by restricting on / off duty of current flowing in upper and lower mosfet by each switching cycle. also , if over c urrent protection operates 512 cycle s in a condition where fb te rminal voltage reaches below 70 % of internal standard voltage, sh ort circuit protection (scp) operates and stops switching for 1msec (typ ) before it initiates re start . however, during startup, short circuit protection will not operate even if the ic is still in the scp condition . table 1. over current protection / short c ircuit p rotection f unction en terminal pgd startup over current protection short circuit protection m ore than 2.0v l while start up valid invalid startup completed valid valid h v o u t f b h i g h s i d e o c p t h r e s h o l d i n s i d e i c o c p s i g n a l ( l o w s i d e ) i n s i d e i c o c p s i g n a l ( h i g h s i d e ) p g d 5 1 2 c y c l e l o w s i d e o c p t h r e s h o l d c o i l c u r r e n t l o w s i d e m o s f e t g a t e h i g h s i d e m o s f e t g a t e 1 m s ( t y p )
19 / 30 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 b d 9b400muv tsz02201 - 0j3j0aj01200 - 1 - 2 22.apr.2016 rev.002 (2) under v oltage l ockout p rotection (uvlo) the under voltage lockout protection circuit monitors the avin ter minal voltage. the operation enters standby when th e avin terminal voltage i s 2.45 v (typ) or lower. the operation starts when the avin terminal voltage is 2.55v (typ) or higher. figure 4 7. uvlo t iming c hart (3) thermal s hutdown when the chip temperature exceeds tj =175 ? ? ? v i n 0 v v o u t h i g h s i d e m o s f e t g a t e f b t e r m i n a l s o f t s t a r t h y s u v l o o f f u v l o o n n o r m a l o p e r a t i o n n o r m a l o p e r a t i o n u v l o l o w s i d e m o s f e t g a t e
20 / 30 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 b d 9b400muv tsz02201 - 0j3j0aj01200 - 1 - 2 22.apr.2016 rev.002 application example(s) figure 48. application circuit table 2 . recommend ed component values ( v in =5v, freq= h ) reference designator v out description 1. 0 v 1.2v 1.5v 1.8v 3.3v r5 100 n 100 n 100 n 100 n 100 n - r7 51 n 75 n 16 0 n 150 n 75 n - r8 2 00 n 150 n 18 0 n 120 n 24 n - c2 ( note 7 ) 22 f 22 f 22 f 22 f 22 f 10v, x5r, 3216 c4 0.1 f 0.1 f 0.1 f 0.1 f 0.1 f 25v, x5r, 1608 c8 ( note 8 ) 0.1 f 0.1 f 0.1 f 0.1 f 0.1 f - c9 22 f 22 f 22 f 22 f 22 f 6.3v, x5r, 3225 c10 22 f 22 f 22 f 22 f 22 f 6.3v, x5r, 3225 c14 120 p f 120 pf 150 pf 150 pf 1 80 pf - l1 1.0 h 1.0 h 1.0 h 1.0 h 1.0 h toko, fdsd0630 table 3 . recommend ed component values ( v in =5v, freq= l ) reference designator v out descripti on 1. 0 v 1.2v 1.5v 1.8v 3.3v r5 n 100 n 100 n 100 n 100 n - r7 51 n 75 n 16 0 n 150 n 75 n - r8 2 00 n 150 n 18 0 n 120 n 24 n - c2 ( note 7 ) 22 f 22 f 22 f 22 f 22 f 10v, x5r, 3216 c4 0.1 f 0.1 f 0.1 f 0.1 f 0.1 f 25v, x5r, 1608 c8 ( note 8 ) 0.1 f 0. 1 f 0.1 f 0.1 f 0.1 f - c9 22 f 22 f 22 f 22 f 22 f 6.3v, x5r, 3225 c10 22 f 22 f 22 f 22 f 22 f 6.3v, x5r, 3225 c14 100 p f 100 pf 120 pf 120 pf 120 pf - l1 1.0 h 1.0 h 1.0 h 1.0 h 1.0 h toko, fdsd0630 ( note 7 ) for capacitance of input capacitor take temp erature characteristics, dc bias characteristics, etc. into consideration to set minimum value to no less than 10 f. ( note 8 ) for capacitance of bootstrap capacitor take temperature characteristics, dc bias characteristics, etc. into c onsideration to set minimum value to no less than 0.047 f. e n p v i n b o o t f r e q b d 9 b 4 0 0 m u v p g d s w f b v o u t a v i n s s p g d p g n d m o d e c 2 c 8 l 1 c 1 0 a g n d r 7 r 8 c 1 4 v i n c 9 c 4 r 5
21 / 30 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 b d 9b400muv tsz02201 - 0j3j0aj01200 - 1 - 2 22.apr.2016 rev.002 selection of components externally connected 1 . output lc f ilte r c onstant in order to supply a continuous current to the load, t he dc/dc converter requires an lc filter for smoothing the output voltage. it is recommended to use inductors of values 0.47 h to 1. 0 h when freq=l or 1.0 h to 1.5 h at freq=h . figure 4 9 . waveform of current through inductor figure 50 . output lc filter circuit inductor ulssohfxuuhqw?,/ where : v in = 5v v out = 1. 2 v l=1.0 h f sw =1mhz ( switching frequency ) the saturation current of the inductor must be larger than the sum of the maximum output current and 1/2 of the inductor ulssohfxuuhqw,/ the output capacit or c out affects the output ripple voltage characteristics. the output capacitor c out must satisfy the required ripple voltage characteristics. the output ripple voltage can be represented by the following equation. where r esr is the equivalent serie s resistance (esr) of the output capacitor. * the capacitor rating must allow a sufficient margin with respect to the output voltage. the output ripple voltage can be decreased with a smaller esr. a ceramic capacitor of about 22 f to 4 7 f is recommen ded. *be careful of total capacitance value, when additional capacitor c load is connected in addi tion to output capacitor c out . use maximum additional capacitor c load ( m ax) condition which satisfies the following condition . maximum starting inducto r ripple bottom current i lstart can be expressed using the following equation . v o u t l c o u t p v i n d r i v e r ? ? ) f c 8 1 + (r i = v sw out esr l rpl ? ? 912 = l f v 1 ) v (v v = sw in out in out - l i 2 i ) i capacitor( output to current charge + current(i output starting maximum = il l cap ) omax start i l a v e r a g e i n d u c t o r c u r r e n t t i o u t m a x i n d u c t o r s a t u r a t i o n c u r r e n t a(min) limit current over fet side low < il current ripple inductor starting maximum start 5 . 4 bottom
22 / 30 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 b d 9b400muv tsz02201 - 0j3j0aj01200 - 1 - 2 22.apr.2016 rev.002 charge current to output capacitor i cap can be expressed using the following equation . for example, given v in = 5v, v out = 3.3v, l = 1.5h, s witching frequency f sw = 1. 2m hz ( m ax ), output capacitor c out = 44f, soft start time t ss = 0.5ms ( m in), and l oad c urrent during s oft s tart i oss = 4 a , maximum c load can be computed using the following equation. if the value of c load is large, and can not meet the above equation, a dju st the value of the capacitor c ss to meet the condition below . ( r efer to the following items (3) soft start setting equation of time t ss and soft - start value of the capacitor to be connected to the c ss .) for example, g iven v in = 5 v, v out = 3.3v , l = 1.5 h, load current during soft start i o ss = 4 a, switching frequency f sw = 1.2m hz ( m ax ), output capacitor c out = 44 f, v fb = 0.792 v( max ) , i ss = 3.6 a ( max ) , with c load = 22 0uf , capacitor c ss is computed as follows . ? ? out r1 0.8 - v 0.8 = r2 v o u t r 1 r 2 f b e r r o r a m p l i f i e r 0 . 8 v ? ? f 78.9 c - v t /2) i i - (4.5 < (max) c out out ss l oss load ? ? ? ? 2710 = ) c + (c v /2) i i - (4.5 i v > c out load fb l oss ss out ss ? [ ] a ss out load out cap t v ) c + (c = i out ss ss out fb l oss load c - c i v v /2) i i - (4.5 < (max) c ? ? ? 0.8 r2 r2 + r1 = v out
23 / 30 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 b d 9b400muv tsz02201 - 0j3j0aj01200 - 1 - 2 22.apr.2016 rev.002 3 . s oft s tart s etting turning the en terminal signal high activates the soft start function. this causes the output voltage to rise gradually while the current at startup is placed under control. this allows the prevention of output voltage overshoot and inrush current. the rise time depends on the value of the capacitor connected to the ss terminal. turning the en terminal signal high with the ss terminal open or with the terminal signal high (no capacitor connected) causes the output voltage to rise in 1msec (typ). 4 . fb capacitor generally , in fixed on time control ( hysteresis control) , sufficient ripple voltage in fb voltage is needed to operate comparator stably. regarding th is ic, by injecting ripple voltage to fb voltage inside ic it is designed to correspond to low esr output capacitor. please set the fb capacitor within the range of the following expression to inject an appropriate ripple. frequency switching voltage output voltage input : : : sw out in sw in out out fb sw in out out f v v 10 3.3 f ) v v - (1 v < c < 10 7.65 f ) v v - (1 v 3 3 [msec] ] f f f 8.0 = /1.0 0.8 (0.01 = t 0.01 = c i v c t )/v t (i = c )/i v (c = t ss ss ss fb ss ss fb ss ss ss ss fb ss ss ) , : : : : )) $7\s
24 / 30 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 b d 9b400muv tsz02201 - 0j3j0aj01200 - 1 - 2 22.apr.2016 rev.002 pcb layout design in the step - down dc/dc converter, a large pulse current flows into two loops. the first loop is the one into which the current flows when the high - side fet is turned on. the flow starts from the input capacitor c in , runs through the fet, inductor l and ou tput capacitor c out and back to gnd of c in via gnd of c out . the second loop is the one into which the current flows when the low - side fet is turned on. the flow starts from the low - side fet, runs through the inductor l and output capacitor c out and back to gnd of the low - side fet via gnd of c out . route these two loops as thick and as short as possible to allow noise to be reduced for improved efficiency. it is recommended to connect the input and output capacitors directly to the gnd plane. the pcb layout h as a great influence on the dc/dc converter in terms of all of the heat generation, noise and efficiency characteristics . accordingly, design the pcb layout considering the following points. ? ? ? ? ? c i n m o s f e t c o u t v o u t l v i n
25 / 30 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 b d 9b400muv tsz02201 - 0j3j0aj01200 - 1 - 2 22.apr.2016 rev.002 i/o equivalence circuit (s) 6. fb 7. freq 8. mode 9. ss 10.11.12. sw 13. boot 14. pgd 15. en s w p v i n b o o t b o o t p v i n s w s s a v i n 1 0 k @ 1 0 k @ 1 0 k @ f r e q a v i n a v i n 1 0 0 k @ f b a v i n 1 0 k @ m o d e a v i n a v i n 1 0 0 k @ 1 0 0 0 k @ e n 3 9 0 k @ 4 7 0 k @ 1 4 0 k @ p g d a v i n
26 / 30 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 b d 9b400muv tsz02201 - 0j3j0aj01200 - 1 - 2 22.apr.2016 rev.002 operational notes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polari ty can damage the ic. take pr ecautions against reverse polarity when connecting the power supply , such as mounting an external diode between the power supply and the ic ? s power supply pin s . 2. power s upply l ines design the pcb layout pattern to provi de low impedance supply lines. s eparate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block . furthermore, connect a capacitor to ground at all pow er supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. howeve r, pins that drive inductive loads (e.g. motor driver outputs, dc - dc converter outputs) may inevitably go below ground due to back emf or electromotive force. in such cases, the user should make sure that such voltages going below ground will not cause the ic and the system to malfunction by examining carefully all relevant factors and conditions such as motor characteristics, supply voltage, operating frequency and pcb wiring to name a few. 4. g round w iring p attern when using both small - signal and large - curr ent ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small - signal ground caused by large currents. also ensure that the ground tra ces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal c onsideration should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction temperature rating. 6. recommended o perating c onditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained . the e lectrical characteristics are guaranteed under the conditions of each parameter . 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special cons ideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation u nder s trong e lectromagnetic f ield operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction . 9. te sting on a pplication b oards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may vxemhfwwkh,&wrvwuhvv$ozd\vglvfkdujhfdsdflwruvfrpsohwho\diwhuhdfksurfhvvruvwhs7kh,&?vsrzhuvxsso\ sh ould always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter - pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground , power supply and output pin . inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
27 / 30 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 b d 9b400muv tsz02201 - 0j3j0aj01200 - 1 - 2 22.apr.2016 rev.002 operational notes C n n p + p n n p + p s u b s t r a t e g n d n p + n n p + n p p s u b s t r a t e g n d g n d p a r a s i t i c e l e m e n t s p i n a p i n a p i n b p i n b b c e p a r a s i t i c e l e m e n t s g n d p a r a s i t i c e l e m e n t s c b e t r a n s i s t o r ( n p n ) r e s i s t o r n r e g i o n c l o s e - b y p a r a s i t i c e l e m e n t s
28 / 30 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 b d 9b400muv tsz02201 - 0j3j0aj01200 - 1 - 2 22.apr.2016 rev.002 ordering informatio n b d 9 b 4 0 0 m u v - e 2 part number package vqfn016v 3030 packaging and forming specification e2: embossed tape and reel marking diagram s vqfn016v3030 (top view) d 9 b 4 0 0 part number marking lot number 1pin mark
29 / 30 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 b d 9b400muv tsz02201 - 0j3j0aj01200 - 1 - 2 22.apr.2016 rev.002 physical dimension , tape and reel information package name vqfn016v3030
30 / 30 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 b d 9b400muv tsz02201 - 0j3j0aj01200 - 1 - 2 22.apr.2016 rev.002 revision history date revision changes 1 . mar . 20 16 001 new release 22.apr.2016 002 p age. 5 thermal resistance - footprints and traces 74.2mm 2 (square) ?
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our p roducts are designed and manufactured for application in ordinary electronic equipment s ( such as av equipment, oa equipment, telecommunication equipment, home elec tronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, f uel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales represe ntative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific appl ications. ( n ote1) m edical e quipment c lassification of the s pecific applications japan usa eu china class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsi bilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our p roducts are designed and manufactured for use under standard conditions a nd not under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any special or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, pri or to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our prod ucts in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in p roximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cleanin g residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proo f design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of pe rformance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation d epending on a mbient temperature . when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under devian t condition from what is defined in this document . precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products , please consult with the roh m representative in advance. for details , please refer to rohm mounting specification
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin considerin g variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in t his document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in t his document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive product, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condition (e .g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excess ive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaution for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information an d data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party reg arding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatso ever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number bd9b400muv package vqfn016v3030 unit quantity 3000 minimum package quantity 3000 packing type taping constitution materials list inquiry rohs yes bd9b400muv - web page distribution inventory

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