pk 469 (v1.0) july 29 , 201 1 www.xilinx.com 1 pk469 (v1.0) jul 29 , 2011 100% material declaration data sheet FGG900 spartan - 6 average weight: 3.949 g component substance description cas# or description % of component use in product component weight/ substance weight (in grams) component % of total silicon die 0.090946 2.303 silicon 7440 - 21 - 3 100 .00 main material 0.090946 die attach material 0.016016 0.406 silver 7440 - 22 - 4 77.50 main material 0.012412 bismaleimide monomer trade secret 15.00 main material 0.002402 acrylate monomer trade secret 7.50 main material 0.001201 mold compound 1.876994 47.531 solid epoxy resin trade secret 5.00 main material 0.093850 phenol resin trade secret 5.00 main material 0.093850 fused silica 60676 - 86 - 0 87.45 main material 1.641431 metal hydroxide trade secret 2.00 main material 0.037540 carbon black 1333 - 86 - 4 0.55 main material 0.010323 gold wire 0. 023056 0.584 gold 7440 - 57 - 5 99.05 main material 0.022837 palladium 7440 - 05 - 3 0.95 main material 0.000219 solder balls 0. 751829 19.038 tin 7440 - 31 - 5 96.50 main material 0.725515 silver 7440 - 22 - 4 3.00 main material 0.022555 copper 7440 - 50 - 8 0.50 main material 0.003759 substrate 1.190159 30.138 copper 7440 - 50 - 8 28.19 main material 0.335483 nickel 7440 - 02 - 0 4.13 main material 0.049192 gold 7440 - 57 - 5 0.30 main material 0.003529 bt (core) 21645 - 51 - 2 7440 - 50 - 8 epoxy resin 59.49 main material 0.708012 solder mask 14807 - 96 - 6 7727 - 43 - 7 7631 - 86 - 9 34590 - 94 - 8 85954 - 11 - 6 7.89 main material 0.093943 ? copyright 2011 xilinx, inc. xilinx, the xilinx logo, virtex, spartan, ise, and other designated brands included herein are trademarks of xil inx in the united states and other countries. all other trademarks are the property of their respective owners
100% material declaration data sheet FGG900 package for spartan - 6 fpgas pk 469 (v1.0) jul 29 201 1 www.xilinx.com 2 revision history the following table shows the revision history for this document. notice of disclaimer xilinx regards this materials data to be correct but makes no guarantee as to its accuracy or completeness, including, but not limited to, with respect to its compliance with applicable environmental laws and regulations. xilinx subcontracts the production, test and assembly of hardware devices to independent third - party vendors and ma terials suppliers (contractors). all data provided hereunder is based on information received from contractors. xilinx has not independently verified the accuracy or completeness of this information which is provided solely for your reference in connecti on with the use of xilinx products . date version description of revisions 0 7 / 29 /11 1.0 initial xilinx release.
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