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this is information on a product in full production . july 2014 docid024119 rev 3 1/26 ts882 ts884 rail-to-rail 1.1 v dual and quad nanopower comparat ors datasheet - production data features ultra-low current consumption: 220 na typ./op. propagation delay: 2 s typ. rail-to-rail inputs push-pull outputs supply operation from 1.1 v to 5.5 v wide temperature range: -40 to +125 c esd tolerance: 8 kv hbm / 300 v mm dual version available in miniso8 and dfn8 (2 x 2 mm) package quad version available in so14, tssop14 and qfn16 3 x 3 mm package related product see the ts881 datasheet for single operator with smaller package. applications portable systems signal conditioning medical description the ts882 is a dual and the ts884 device a quad comparator featuring ultra-low supply current (220 na typical per operator with output high, v cc = 1.2 v, no load) with rail-to-rail input and output capability. the performance of these comparators allows them to be used in a wide range of portable applications. the ts882 and ts884 devices minimize battery supply leakage and therefore enhance battery lifetime. operating from 1.1 to 5.5 v supply voltage, these comparators can be used over a wide temperature range (-40 to +125 c) keeping the current consumption at an ultra-low level. qfn16 (3 x 3 mm) so14 tssop14 dfn8 (2 x 2 mm) miniso8 table 1. device summary order codes temperature range packages packaging marking ts882ist -40 to +125 c miniso8 tape and reel k514 TS882IQ2T dfn8 2 x 2 mm k56 ts884idt -40 to +125 c so14 tape and reel s884i ts884ipt tssop14 s884i ts884iq4t qfn16 3 x 3 mm k514 www.st.com
contents ts882, ts884 2/26 docid024119 rev 3 contents 1 pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 absolute maximum ratings and operating conditions . . . . . . . . . . . . . 4 3 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 6 4.1 dfn8 2 x 2 mm package mechanical data . . . . . . . . . . . . . . . . . . . . . . . 17 4.2 miniso8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4.3 so14 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 4.4 qfn16 3 x 3 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 4.5 tssop14 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 5 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
docid024119 rev 3 3/26 ts882, ts884 pin description 26 1 pin description figure 1. pin connections ts882 (top view) figure 2. pin connections ts884 (top view) ts882idt/ist/iq2t miniso8/dfn8 ,1 9&& 1& ,1 ,1 9&& 1& ,1 ,1 287 287 ,1 ,1 287 287 ,1 so14 / tssop14 qfn16
absolute maximum ratings and operating conditions ts 882, ts884 4/26 docid024119 rev 3 2 absolute maximum ratings and operating conditions table 2. absolute maximum ratings symbol parameter value unit v cc supply voltage (1) 1. all voltage values, except differential voltages, are referenced to v cc -. v cc is defined as the difference between v cc + and v cc -. 6 v v id differential input voltage (2) 2. the magnitude of input and output voltages must n ever exceed the supply rail 0.3 v. 6 v v in input voltage range (v cc -) - 0.3 to (v cc +) + 0.3 v r thja thermal resistance junction to ambient (ts882) (3) miniso8 dfn8 2 x 2 mm 3. short-circuits can cause excessive heating. these values are typical. 190 57 c/w thermal resistance junction to ambient (ts884) (3) so14 tssop14 qfn16 3 x 3 mm 105 100 45 t stg storage temperature -65 to +150 c t j junction temperature 150 c t lead lead temperature (soldering 10 seconds) 260 c esd human body model (hbm) (4) 4. according to jedec standard jesd22-a114f. 8 kv machine model (mm) (5) 5. according to jedec standard jesd22-a115a. 300 v charged device model (cdm) (6) 6. according to ansi/esd stm5.3.1. 1300 latch-up immunity 200 ma table 3. operating conditions symbol parameter value unit t oper operating temperature range -40 to +125 c v cc supply voltage -40 c < t amb < +125 c 1.1 to 5.5 v v icm common mode input voltage range -40 c < t amb < +85 c -40 c < t amb < +125 c (v cc- ) - 0.2 to (v cc+ ) + 0.2 (v cc- ) to (v cc+ ) + 0.2 v
docid024119 rev 3 5/26 ts882, ts884 electrical characteristics 26 3 electrical characteristics table 4. v cc = +1.2 v, t amb = +25 c, v icm = v cc /2 (unless otherwise specified) (1) symbol parameter test conditions min. typ. max. unit v io input offset voltage (2) t amb = +25 c -40 c < t amb < +125 c -6 1 6 mv d v io input offset voltage drift -40 c < t amb < +125 c 3 v/c v hyst input hysteresis voltage (3) t amb = +25 c -40 c < t amb < +125 c 1.5 2.4 4.2 mv i io input offset current (4) t amb = +25 c -40 c < t amb < +125 c 10 100 pa i ib input bias current (4) t amb = +25 c -40 c < t amb < +125 c 1 10 100 pa i cc supply current per operator no load, output low, v id = -0.1 v -40 c < t amb < +125 c no load, output high, v id = +0.1 v -40 c < t amb < +125 c 300 220 450 350 na i sc short-circuit current source sink 1.0 1.7 ma v oh output voltage high i source = 0.2 ma -40 c < t amb < +85 c -40 c < t amb < +125 c 1.13 1.10 1.00 1.15 v v ol output voltage low i sink = 0.2 ma -40 c < t amb < +85 c -40 c < t amb < +125 c 35 50 60 70 mv cmrr common mode rejection ratio 0 < v icm < v cc -40 c < t amb < +125 c 50 68 db t plh propagation delay (low to high) f = 1 khz, c l = 30 pf, r l = 1 m w overdrive = 10 mv -40 c < t amb < +125 c overdrive = 100 mv -40 c < t amb < +125 c 5.5 2.1 11 13 3.1 3.4 s t phl propagation delay (high to low) f = 1 khz, c l = 30 pf, r l = 1 m w overdrive = 10 mv -40 c < t amb < +125 c overdrive = 100 mv -40 c < t amb < +125 c 5.1 1.9 8 10 2.6 3.1 s t r rise time (10% to 90%) c l = 30 pf, r l = 1 m w 100 ns
electrical characteristics ts882, ts884 6/26 docid024119 rev 3 t f fall time (90% to 10%) c l = 30 pf, r l = 1 m w 110 ns t on power-up time 1.1 1.7 ms 1. all values over the temperature range are guarante ed through correlation and simulation. no productio n test is performed at the temperature range limits. 2. the offset is defined as the average value of pos itive and negative trip points (input voltage diffe rences requested to change the output state in each direction). 3. the hysteresis is a built-in feature of the ts882 device. it is defined as the voltage difference bet ween the trip points. 4. maximum values include unavoidable inaccuracies o f the industrial tests. table 4. v cc = +1.2 v, t amb = +25 c, v icm = v cc /2 (unless otherwise specified) (1) (continued) symbol parameter test conditions min. typ. max. unit
docid024119 rev 3 7/26 ts882, ts884 electrical characteristics 26 table 5. v cc = +2.7 v, t amb = +25 c, v icm = v cc /2 (unless otherwise specified) (1) symbol parameter test conditions min. typ. max. unit v io input offset voltage (2) t amb = +25 c -40 c < t amb < +125 c -6 1 6 mv d v io input offset voltage drift -40 c < t amb < +125 c 3 v/c v hyst input hysteresis voltage (3) t amb = +25 c -40 c < t amb < +125 c 1.6 2.7 4.2 mv i io input offset current (4) t amb = +25 c -40 c < t amb < +125 c 10 100 pa i ib input bias current (4) t amb = +25 c -40 c < t amb < +125 c 1 10 100 pa i cc supply current per operator no load, output low, v id = -0.1 v -40 c < t amb < +125 c no load, output high, v id = +0.1 v -40 c < t amb < +125 c 310 220 450 350 na i sc short-circuit current source sink 10 13 ma v oh output voltage high i source = 2 ma -40 c < t amb < +85 c -40 c < t amb < +125 c 2.48 2.40 2.10 2.51 v v ol output voltage low i sink = 2 ma -40 c < t amb < +85 c -40 c < t amb < +125 c 130 210 230 310 mv cmrr common mode rejection ratio 0 < v icm < v cc -40 c < t amb < +125 c 55 74 db t plh propagation delay (low to high) f = 1 khz, c l = 30 pf, r l = 1 m w overdrive = 10 mv -40 c < t amb < +125 c overdrive = 100 mv -40 c < t amb < +125 c 6.4 2.3 12 14 3.0 3.7 s t phl propagation delay (high to low) f = 1 khz, c l = 30 pf, r l = 1 m w overdrive = 10 mv -40 c < t amb < +125 c overdrive = 100 mv -40 c < t amb < +125 c 6.4 2.2 12 14 3.0 3.7 s t r rise time (10% to 90%) c l = 30 pf, r l = 1 m w 120 ns t f fall time (90% to 10%) c l = 30 pf, r l = 1 m w 130 ns t on power-up time 1.1 1.7 ms 1. all values over the temperature range are guarante ed through correlation and simulation. no productio n test is performed at the temperature range limits. 2. the offset is defined as the average value of pos itive and negative trip points (input voltage diffe rences requested to change the output state in each direction). 3. the hysteresis is a built-in feature of the ts882. it is defined as the voltage difference between th e trip points. 4. maximum values include unavoidable inaccuracies o f the industrial tests.
electrical characteristics ts882, ts884 8/26 docid024119 rev 3 table 6. v cc = +5 v, t amb = +25 c, v icm = v cc /2 (unless otherwise specified) (1) symbol parameter test conditions min. typ. max. unit v io input offset voltage (2) t amb = +25 c -40 c < t amb < +125 c -6 1 6 mv d v io input offset voltage drift -40 c < t amb < +125 c 3 v/c v hyst input hysteresis voltage (3) t amb = +25 c -40 c < t amb < +125 c 1.6 3.1 4.2 mv i io input offset current (4) t amb = +25 c -40 c < t amb < +125 c 10 100 pa i ib input bias current (4) t amb = +25 c -40 c < t amb < +125 c 1 10 100 pa i cc supply current per operator no load, output low, v id = -0.1 v -40 c < t amb < +125 c no load, output high, v id = +0.1 v -40 c < t amb < +125 c 350 250 500 400 na i sc short-circuit current source sink 32 32 ma v oh output voltage high i source = 2 ma -40 c < t amb < +85 c -40 c < t amb < +125 c 4.86 4.75 4.60 4.88 v v ol output voltage low i sink = 2 ma -40 c < t amb < +85 c -40 c < t amb < +125 c 90 130 170 280 mv cmrr common mode rejection ratio 0 < v icm < v cc -40 c < t amb < +125 c 55 78 db svr supply voltage rejection d v cc = 1.2 v to 5 v -40 c < t amb < +125 c 65 80 db t plh propagation delay (low to high) f = 1 khz, c l = 30 pf, r l = 1 m w overdrive = 10 mv -40 c < t amb < +125 c overdrive = 100 mv -40 c < t amb < +125 c 8.3 2.5 13 22 3.4 4.1 s t phl propagation delay (high to low) f = 1 khz, c l = 30 pf, r l = 1 m w overdrive = 10 mv -40 c < t amb < +125 c overdrive = 100 mv -40 c < t amb < +125 c 9.0 2.6 16 19 3.5 4.2 s t r rise time (10% to 90%) c l = 30 pf, r l = 1 m w 160 ns
docid024119 rev 3 9/26 ts882, ts884 electrical characteristics 26 t f fall time (90% to 10%) c l = 30 pf, r l = 1 m w 150 ns t on power-up time 1.1 1.7 ms 1. all values over the temperature range are guarante ed through correlation and simulation. no productio n test is performed at the temperature range limits. 2. the offset is defined as the average value of pos itive and negative trip points (input voltage diffe rences requested to change the output state in each direction). 3. the hysteresis is a built-in feature of the ts882 device. it is defined as the voltage difference bet ween the trip points. 4. maximum values include unavoidable inaccuracies o f the industrial tests. table 6. v cc = +5 v, t amb = +25 c, v icm = v cc /2 (unless otherwise specified) (1) (continued) symbol parameter test conditions min. typ. max. unit
electrical characteristics ts882, ts884 10/26 docid024119 rev 3 figure 3. current consumption per operator vs. supply voltage - output low figure 4. current consumption per operator vs. supply voltage - output high figure 5. current consumption per operator vs. input common mode voltage at v cc = 1.2 v figure 6. current consumption per operator vs. input common mode voltage at v cc = 5 v figure 7. current consumption per operator vs. temperature figure 8. current consumption per operator vs. toggle frequency
docid024119 rev 3 11/26 ts882, ts884 electrical characteristics 26 figure 9. input offset voltage vs. input common mode voltage at v cc = 1.2 v figure 10. input hysteresis voltage vs. input common mode voltage at v cc = 1.2 v figure 11. input offset voltage vs. input common mode voltage at v cc = 5 v figure 12. input hysteresis voltage vs. input common mode voltage at v cc = 5 v figure 13. input offset voltage vs. temperature figur e 14. input hysteresis voltage vs. temperature
electrical characteristics ts882, ts884 12/26 docid024119 rev 3 figure 15. output voltage drop vs. sink current at v cc = 1.2 v figure 16. output voltage drop vs. source current at v cc = 1.2 v figure 17. output voltage drop vs. sink current at v cc = 2.7 v figure 18. output voltage drop vs. source current at v cc = 2.7 v figure 19. output voltage drop vs. sink current at v cc = 5 v figure 20. output voltage drop vs. source current at v cc = 5 v
docid024119 rev 3 13/26 ts882, ts884 electrical characteristics 26 figure 21. propagation delay t plh vs. input common mode voltage at v cc = 1.2 v figure 22. propagation delay t phl vs. input common mode voltage at v cc = 1.2 v figure 23. propagation delay t plh vs. input common mode voltage at v cc = 5 v figure 24. propagation delay t phl vs. input common mode voltage at v cc = 5 v figure 25. propagation delay t plh vs. input signal overdrive at v cc = 1.2 v figure 26. propagation delay t phl vs. input signal overdrive at v cc = 1.2 v
electrical characteristics ts882, ts884 14/26 docid024119 rev 3 figure 27. propagation delay t plh vs. input signal overdrive at v cc = 5 v figure 28. propagation delay t phl vs. input signal overdrive at v cc = 5 v figure 29. propagation delay t plh vs. supply voltage for signal overdrive 10 mv figure 30. propagation delay t phl vs. supply voltage for signal overdrive 10 mv figure 31. propagation delay t plh vs. supply voltage for signal overdrive 100 mv figure 32. propagation delay t phl vs. supply voltage for signal overdrive 100 mv
docid024119 rev 3 15/26 ts882, ts884 electrical characteristics 26 figure 33. propagation delay vs. temperature for signal overdrive 10 mv figure 34. propagation delay vs. temperature for signal overdrive 100 mv $0 9 29 p9 9 ,&0 9 && 7 3 7 3/+ 9 && 9 7 3+/ 9 && 9 7 3+/ 9 && 9 7 3/+ 9 && 9 $0 9 29 p9 9 ,&0 9 && 7 3 7 3/+ 9 && 9 7 3+/ 9 && 9 7 3+/ 9 && 9 7 3/+ 9 && 9
package information ts882, ts884 16/26 docid024119 rev 3 4 package information in order to meet environmental requirements, st off ers these devices in different grades of ecopack ? packages, depending on their level of environmenta l compliance. ecopack specifications, grade definitions and product statu s are available at: www.st.com . ecopack is an st trademark.
docid024119 rev 3 17/26 ts882, ts884 package information 26 4.1 dfn8 2 x 2 mm package mechanical data figure 35. dfn8 2 x 2 mm package outline table 7. dfn8 2 x 2 mm package mechanical data (pit ch 0.5 mm) symbol dimensions millimeters inches min. typ. max. min. typ. max. a 0.51 0.55 0.60 0.020 0.022 0.024 a1 0.05 0.002 a3 0.15 0.006 b 0.18 0.25 0.30 0.007 0.010 0.012 d 1.85 2.00 2.15 0.073 0.079 0.085 d2 1.45 1.60 1.70 0.057 0.063 0.067 e 1.85 2.00 2.15 0.073 0.079 0.085 e2 0.75 0.90 1.00 0.030 0.035 0.039 e 0.50 0.020 l 0.50 0.020 ddd 0.08 0.003 4&"5*/( 1-"/& $ " " " $ eee 1*/*% % f & - & c %
package information ts882, ts884 18/26 docid024119 rev 3 figure 36. dfn8 2 x 2 mm footprint recommendation pp pp pp pp pp pp
docid024119 rev 3 19/26 ts882, ts884 package information 26 4.2 miniso8 package information figure 37. miniso8 package outline table 8. miniso8 package mechanical data symbol dimensions millimeters inches min. typ. max. min. typ. max. a 1.10 0.043 a1 0 0.15 0 0.006 a2 0.75 0.85 0.95 0.030 0.033 0.037 b 0.22 0.40 0.009 0.016 c 0.08 0.23 0.003 0.009 d 2.80 3.00 3.20 0.11 0.118 0.126 e 4.65 4.90 5.15 0.183 0.193 0.203 e1 2.80 3.00 3.10 0.11 0.118 0.122 e 0.65 0.026 l 0.40 0.60 0.80 0.016 0.024 0.031 l1 0.95 0.037 l2 0.25 0.010 k 0 8 0 8 ccc 0.10 0.004
package information ts882, ts884 20/26 docid024119 rev 3 4.3 so14 package information figure 38. so14 package outline table 9. so14 package mechanical data dimensions (1) 1. drawing dimensions include single and matrix versions. symbol millimeters inches note min. typ. max. min. typ. max. a 1.35 1.75 0.05 0.068 a1 0.10 0.25 0.004 0.009 a2 1.10 1.65 0.04 0.06 b 0.33 0.51 0.01 0.02 c 0.19 0.25 0.007 0.009 d 8.55 8.75 0.33 0.34 (2) 2. dimension d does not include mold flash, protru sions or gate burrs. mold flash, protrusions or gat e burrs shall not exceed 0.15 mm per side. e 3.80 4.0 0.15 0.15 e 1.27 0.05 h 5.80 6.20 0.22 0.24 l 0.40 1.27 0.015 0.05 k 0 8 0 8 ddd 0.10 0.004
docid024119 rev 3 21/26 ts882, ts884 package information 26 4.4 qfn16 3 x 3 package information figure 39. qfn16 3 x 3 mm (pitch 0.5 mm) package ou tline 6($7,1* 3/$1( & $ ' $ $ ggg& 3,1,' & ' h ( ( h / / e ' %277209,(: ( e
package information ts882, ts884 22/26 docid024119 rev 3 table 10. qfn16 3 x 3 mm (pitch 0.5 mm) package mec hanical data symbol dimensions millimeters inches min. typ. max. min. typ. max. a 0.80 0.90 1.00 0.031 0.035 0.039 a1 0.02 0.05 0.001 0.002 a3 0.20 0.008 b 0.18 0.25 0.30 0.007 0.010 0.012 d 2.85 3.00 3.15 0.112 0.118 0.124 d1 1.50 0.059 d2 see exposed pad variation see exposed pad variation e 2.85 3.00 3.15 0.112 0.118 0.124 e1 1.50 0.059 e2 see exposed pad variation see exposed pad variation e 0.45 0.50 0.55 0.018 0.020 0.022 l 0.30 0.40 0.50 0.012 0.016 0.020 ddd 0.08 0.003
docid024119 rev 3 23/26 ts882, ts884 package information 26 figure 40. qfn16 3 x 3 mm (pitch 0.5 mm) footprint recommendation % $
package information ts882, ts884 24/26 docid024119 rev 3 4.5 tssop14 package information figure 41. tssop14 package outline table 11. tssop14 package mechanical data symbol dimensions millimeters inches min. typ. max. min. typ. max. a 1.20 0.047 a1 0.05 0.15 0.002 0.004 0.006 a2 0.80 1.00 1.05 0.031 0.039 0.041 b 0.19 0.30 0.007 0.012 c 0.09 0.20 0.004 0.0089 d 4.90 5.00 5.10 0.193 0.197 0.201 e 6.20 6.40 6.60 0.244 0.252 0.260 e1 4.30 4.40 4.50 0.169 0.173 0.176 e 0.65 0.0256 l 0.45 0.60 0.75 0.018 0.024 0.030 l1 1.00 0.039 k 0 8 0 8 aaa 0.10 0.004 76623 ' e $ $ $ ddd& ( f h 3,1,'(17,),&$7,21 ( n / / pp *$*(3/$1( 6($7,1* 3/$1( &
docid024119 rev 3 25/26 ts882, ts884 revision history 26 5 revision history table 12. document revision history date revision changes 18-jan-2013 1 initial release. 02-may-2013 2 added ts884 device to header, description , and table 1: device summary . updated title (added quad comparator). updated features and table 2 (esd tolerance: 6 kv hbm replaced by 8 kv hbm). updated description in accordance with added ts884 device. added so14, tssop14 and qfn16 3 x 3 mm package to features , figure on page 1, section 4: package information . and table 1: device summary . moved figure 1: pin connections ts882 (top view) to page 3. added figure 2: pin connections ts884 (top view) . updated table 2: absolute maximum ratings (added ts884 device r thja values). minor corrections throughout document. 14-jul-2014 3 updated table 1: device summary on page 1
ts882, ts884 26/26 docid024119 rev 3 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (st) reserve the right to make changes, corrections, modifications o r improvements, to this document, and the products and services described herein at any time, without notice. all st products are sold pursuant to sts terms and conditions of sale. purchasers are solely responsible for the choice, s election and use of the st products and services de scribed herein, and st assumes no liability whatsoever relating to the choice, select ion or use of the st products and services describe d herein. no license, express or implied, by estoppel or othe rwise, to any intellectual property rights is grant ed under this document. if any part of this document refers to any third party products or serv ices it shall not be deemed a license grant by st f or the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the u se in any manner whatsoever of such third party products or services or any intellectua l property contained therein. unless otherwise set forth in sts terms and condit ions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a partic ular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent , copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems wit h product functional safety requirements; (b) aeronautic applications; (c) automotive application s or environments, and/or (d) aerospace application s or environments. where st products are not designed for such use, the purchaser shall use products at purchasers sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for a utomotive, automotive safety or medical industry domains according to st product design specificatio ns. products formally escc, qml or jan qualified ar e deemed suitable for use in aerospace by the corresp onding governmental agency. resale of st products with provisions different fro m the statements and/or technical features set fort h in this document shall immediately void any warranty granted by st for the st product or se rvice described herein and shall not create or exte nd in any manner whatsoever, any liability of st. st and the st logo are trademarks or registered tra demarks of st in various countries. information in this document supersedes and replace s all information previously supplied. the st logo is a registered trademark of stmicroele ctronics. all other names are the property of their respective owners. ? 2014 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - cze ch republic - finland - france - germany - hong kon g - india - israel - italy - japan - malaysia - malta - morocco - philippines - singapor e - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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