page 1 formosa ms lbs05-qh thru lbs10-qh document id issued date revised date revision page. ds-141146 2014/06/30 - a 7 http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 1 2 2 2 2 3 4 4 4 5 6 6 7 list list................................................................................................. package outline............................................................................... features.......................................................................................... maximum ratings ............................................................................. rating and characteristic curves........................................................ pinning information........................................................................... marking........................................................................................... suggested solder pad layout............................................................. packing information.......................................................................... reel packing .................................................................................... suggested thermal profiles for soldering processes............................. high reliability test capabilities........................................................... mechanical data............................................................................... chip mini bridge rectifier general purpose
1.0a miniature glass passivated single-phase surface mount bridge rectifiers-50v-1000v features suffix "-h" indicates halogen-free part, ex.lbs05-qh-h. ? ? ? ? ? ? low profile package : 1.00 mm (typ.) glass passivated chip junction. flat lead plastic package. ideally suited for automatic assembly. ultra thin profile package for space constrained utilization. low forward voltage drop. lead-free parts meet rohs requirments. ? ? mechanical data epoxy:ul94-v0 rated flame retardant case : molded plastic, qfnb terminals : solder plated, solderable per mil-std-202, method 208 polarity : marked on body mounting position : any ? ? ? ? ? ? weight : approximated 0.098 gram package outline page 2 dimensions in inches and (millimeters) qfnb formosa ms http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. maximum ratings (at t =25 a o c unless otherwise noted) maximum repetitive peak reverse voltage maximum rms voltage peak forward surge current 8.3ms single half sine-wave(jedec method) maximum dc blocking voltage maximum average forward rectified current maximum rating for fusing t 8 3 ms (< . ) operating junction temperature range storage temperature range parameter symbols v dc v rrm i fsm v rms it 2 t stg i o t j lbs05-qh 50 35 50 100 70 100 lbs1-qh lbs2-qh 200 140 200 -55 to +150 -65 to +175 400 280 400 1.0 lbs4-qh 30 3.7 LBS6-QH 600 420 600 800 560 800 lbs8-qh 1000 700 1000 lbs10-qh unit as 2 c c v v v a a .044(1.10) .1595(4.05) .221(5.6) .0256(0.65) .036(0.90) .1556(3.95) .213(5.4) .0217(0.55) .249(6.3) .241(6.1) .0335(0.85) .0296(0.75) .006(0.15) .002(0.05) .256(6.5) .249(6.3) .010(0.25) .006(0.15) lbs05-qh thru lbs10-qh ds-141146 2014/06/30 - a 7 maximum forward voltage at i =1.0a f maximum dc reverse current at t =25 c at rated dc blocking voltage at t =125 c j j parameter symbols v f i r lbs05-qh lbs1-qh lbs2-qh 5.0 500 1.10 lbs4-qh LBS6-QH lbs8-qh lbs10-qh unit ua ua v electrical characteristics (at t =25 a o c unless otherwise noted) note 1: mounted on aluminum substrate 15 x 15 x 1.7mm. typical thermal resistance j unction to ambient (1) typical thermal resistance j unction to case (1) per leg parameter symbols r ja lbs05-qh lbs1-qh lbs2-qh 55 35 lbs4-qh LBS6-QH lbs8-qh lbs10-qh unit c/w thermal characteristics r jc c/w chip mini bridge rectifier general purpose
page 3 rating and characteristic curves (lbs05-qh thru lbs10-qh) http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. mounted on aluminum substrate 15 x 15 x 1.7mm. case temperature, 001 . 01 . 1 04 05 06 07 08 09 10 11 12 ......... 2 tj=25 c ds-141146 2014/06/30 - a 7
pinning information simplified outline symbol marking type number marking code lbs05-qh lbs05 lbs1 lbs1 lbs2 lbs2 lbs4 lbs4 lbs6 lbs6 lbs8 lbs8 lbs10 lbs10 -qh -qh -qh -qh -qh -qh page 4 formosa ms http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. suggested solder pad layout dimensions in inches and (millimeters) b 0.044 (1.10)min a 0.032 (0.80)min c 0.158(4.00)ref package qfnb b d c a d 0.182 (4.60)ref lbs05-qh thru lbs10-qh ds-141146 2014/06/30 - a 7 chip mini bridge rectifier general purpose
page 5 formosa ms http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. packing information d d 1 d 2 w 1 item tolerance qfnb carrier width carrier length carrier depth sprocket hole 13" reel outside diameter 7" reel outside diameter 13" reel inner diameter 7" reel inner diameter feed hole diameter sprocket hole position punch hole position punch hole pitch sprocket hole pitch embossment center reel width overall tape thickness tape width p 0 p 1 e b c d f t w p a d d d 1 d 1 d 2 w 1 symbol 0.1 0.05 0.1 min min 0.5 0.1 0.3 1.0 0.1 0.1 0.1 0.1 0.1 0.05 2.0 2.0 unit:mm 1.50 330.00 - 50.00 - 13.00 1.75 5.50 8.00 4.00 2.00 0.30 12.00 12~14.4 note:devices are packed in accor dance with eia standar rs-481-a and specifications listed above. 5.75 6.65 1.25 c lbs05-qh thru lbs10-qh ds-141146 2014/06/30 - a 7 chip mini bridge rectifier general purpose
page 6 formosa ms http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. profile feature soldering condition average ramp-up rate(t to t ) <3 /sec preheat -temperature min(tsmin) 150 -temperature max(tsmax) 200 -time(min to max)(t ) 60~120sec tsmax to t -ramp-uprate <3 /sec time maintained above: -temperature(t ) 217 -time(t ) 60~260sec peak temperature(t ) 255 0/ 5 time within 5 of actual peak temperature(t ) ramp-down rate <6 /sec time 25 to peak temperature <6minutes lp s l l l p p o o o o o oo o o o c c c c c c- + c c c c 3.reflow soldering 10~30sec 1.storage environment: temperature=5 ~40 humidity=55% 25% 2.reflow soldering of surface-mount devices oo cc suggested thermal profiles for soldering processes critical zone tl to tp critical zone tl to tp tl tsmax tsmin ramp-up tp ts preheat t25 c to peak o time 25 tl tp ramp-down temperature reel packing qfnb 13" 5,000 8.0 10,000 360*340*45 330 380*365*400 80,000 14.0 package reel size reel component spacing box inner box reel dia, carton size carton approx. gross weight (kg) (pcs) (m/m) (m/m) (m/m) (pcs) (m/m) (pcs) lbs05-qh thru lbs10-qh ds-141146 2014/06/30 - a 7 chip mini bridge rectifier general purpose
page 7 formosa ms 1. solder resistance 2. solderability 3. high temperature reverse bias 4. forward operation life 5. intermittent operation life 6. pressure cooker 7. temperature cycling 8. forward surge 9. humidity 10. high temperature storage life at 260 5 for 10 2sec. immerse body into solder 1/16" 1/32" at 245 5 for 5 sec. v =80% rate at t =150 for 168 hrs. rated average rectifier current at t =25 for 500hrs. t = 25 c, i = i on state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. 15p at t =121 for 4 hrs. -55 to +125 dwelled for 30 min. and transferred for 5min. total 10 cycles. 8.3ms single half sine-wave , one surge. at t =85 , rh=85% for 1000hrs. at 175 for 1000 hrs. c c c c c cc c c o o o o o oo o o rj a afo sig a a o mil-std-750d method-2031 mil-std-202f method-208 mil-std-750d method-1038 mil-std-750d method-1027 mil-std-750d method-1036 jesd22-a102 mil-std-750d method-1051 mil-std-750d method-4066-2 mil-std-750d method-1021 mil-std-750d method-1031 item test conditions reference high reliability test capabilities http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. lbs05-qh thru lbs10-qh ds-141146 2014/06/30 - a 7 chip mini bridge rectifier general purpose
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