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august 2008 rev 4 1/18 18 PD84001 rf power transistor the ldmost plastic family features excellent thermal stability common source configuration broadband performances p out = 1 w with 15 db gain @ 870 mhz plastic package esd protection supplied in tape and reel in compliance with the 2002/95/ec european directive description the PD84001 is a common source n-channel, enhancement-mode lateral field-effect rf power transistor. it is designed for high gain, broad band commercial and industrial applications. it operates at 7 v in common source mode at frequencies of up to 1 ghz. PD84001?s superior gain and efficiency makes it an ideal solution for portable radio and uhf rfid reader. figure 1. pin connection sot-89 source gate source drain www.st.com table 1. device summary order code marking package packaging PD84001 8401 sot-89 tape and reel
contents PD84001 2/18 contents 1 electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 static . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 dynamic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.3 esd protection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.4 moisture sensitivity level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 impedance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5 test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 6 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 6.1 thermal pad and via design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6.2 soldering profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 7 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
PD84001 electrical data 3/18 1 electrical data 1.1 maximum ratings 1.2 thermal data table 2. absolute maximum ratings (t case = +25 c) symbol parameter value unit v (br)dss drain-source voltage 18 v v gs gate-source voltage -0.5 to +15 v i d drain current 1.5 a p diss power dissipation 6 w t j max. operating junction temperature 150 c t stg storage temperature -65 to +150 c table 3. thermal data symbol parameter value unit r thjc junction - case thermal resistance 21 c/w
electrical characteristics PD84001 4/18 2 electrical characteristics 2.1 static 2.2 dynamic 2.3 esd protection characteristics 2.4 moisture sensitivity level table 4. static (t case = +25 o c) symbol test conditions min. typ. max. unit i dss v gs = 0 v v ds = 28 v 1 a i gss v gs = 5 v v ds = 0 v 1 a v gs(q) v ds = 10 v i d = 250 a2.03.05.0v v ds(on) v gs = 10 v i d = 0.4 a 0.6 v c iss v gs = 0 v v ds = 7 v f = 1 mhz 14.7 pf c oss v gs = 0 v v ds = 7 v f = 1 mhz 13.3 pf c rss v gs = 0 v v ds = 7 v f = 1 mhz 1.3 pf table 5. dynamic symbol test conditions min. typ. max. unit p out v dd = 7.5 v, i dq = 50 ma, p in = 17 dbm, f = 870 mhz 30 31 dbm g ps v dd = 7.5 v, i dq = 50 ma, p out = 30 dbm, f = 870 mhz 13 15 db h d v dd = 7.5 v, i dq = 50 ma p in = 17 dbm, f = 870 mhz 55 60 % load mismatch v dd = 7.5 v, i dq = 50 ma, p out = 1 w, f = 870 mhz all phase angles 20:1 vswr table 6. esd protection characteristics test conditions class human body model 2 machine model m3 table 7. moisture sensitivity level test methodology rating j-std-020b msl 3
PD84001 impedance 5/18 3 impedance figure 2. current conventions table 8. impedance data freq. (mhz) z gs ( )z dl ( ) 920 4.0 + j4.3 3.7 + j6.2 900 3.6 + j4.3 3.9 + j5.5 880 3.3 + j4.1 4.1 + j4.7 860 3.1 + j3.7 4.3 + j4.0 840 2.9 + j3.4 4.5 + j3.2 820 2.8 + j3.0 4.8 + j2.4 800 2.7 + j2.5 5.0 + j1.6
typical performance PD84001 6/18 4 typical performance figure 3. v gs vs i d figure 4. dc output characteristics
PD84001 typical performance 7/18 figure 5. c rss vs v ds figure 6. c iss vs v ds figure 7. c oss vs v ds 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 0 1 2 3 4 5 6 7 8 9 101112131415 vds (v) crss (pf) crss 0 2 4 6 8 10 12 14 16 18 20 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 vds (v) ciss (pf) ciss coss vs vds 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 0123456789101112131415 vds (v) coss (pf) coss
typical performance PD84001 8/18 figure 8. gain vs output power and frequency figure 9. output power vs input power and frequency figure 10. efficiency vs output power and frequency figure 11. gain and efficiency vs frequency 6 8 10 12 14 16 18 20 18 20 22 24 26 28 30 32 34 pout (dbm) gain (db) 840 mhz 870 mhz 900 mhz 18 20 22 24 26 28 30 32 34 0 2 4 6 8 10 12 14 16 18 20 pin (dbm) pout (dbm) 840 mhz 870 mhz 900 mhz vdd = 7.5v idq = 50ma 10 20 30 40 50 60 70 18 20 22 24 26 28 30 32 34 pout (dbm) nd (%) 840 mhz 870 mhz 900 mhz vdd = 7.5v idq = 50ma 6 8 10 12 14 16 18 810 820 830 840 850 860 870 880 890 900 910 920 freq (mhz) gain (db) 20 30 40 50 60 70 80 gain nd pin = 17dbm vdd = 7.5v idq = 50ma
PD84001 typical performance 9/18 figure 12. input return loss vs frequency figure 13. output power vs input power and v dd figure 14. efficiency vs output power and v dd figure 15. output power and drain current vs drain supply voltage -10 -8 -6 -4 -2 0 810 820 830 840 850 860 870 880 890 900 910 920 freq (mhz) input return loss (db) pin = 17dbm vdd = 7.5v idq = 50ma 18 20 22 24 26 28 30 32 34 0 2 4 6 8 101214161820 pin (dbm) pout (dbm) 9v 7.5v 6v freq = 870 mhz idq = 50ma 10 20 30 40 50 60 70 18 20 22 24 26 28 30 32 34 pout (dbm) nd (%) 9v 7.5v 6v 22 24 26 28 30 32 34 2345678910 vdd (v) pout (dbm) 0 0.1 0.2 0.3 0.4 0.5 0.6 po u t id freq = 870 mhz pin = 17dbm idq = 50ma
typical performance PD84001 10/18 figure 16. gain and efficiency vs pin y 8 10 12 14 16 18 20 22 24 26 -5 0 5 10 15 20 25 30 pin (dbm) gain (db) 0 10 20 30 40 50 60 70 80 90 efficiency (%) gain-70ma gain-200ma gain-50ma gain-100ma eff-70ma eff-200ma eff-50ma eff-100ma freq = 520 mhz vdd = 7.5v
PD84001 test circuit 11/18 5 test circuit figure 17. test circuit schematic / 840-900 mhz
package mechanical data PD84001 12/18 6 package mechanical data in order to meet environmental requirements, st offers these devices in ecopack? packages. these packages have a lead-free second level interconnect . the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com
PD84001 package mechanical data 13/18 figure 18. package dimensions table 9. sot-89 mechanical data dim. mm. inch min typ max min typ max a 1.4 1.6 55.1 63.0 b 0.44 0.56 17.3 22.0 b1 0.36 0.48 14.2 18.9 c 0.35 0.44 13.8 17.3 c1 0.35 0.44 13.8 17.3 d 4.4 4.6 173.2 181.1 d1 1.62 1.83 63.8 72.0 e 2.29 2.6 90.2 102.4 e 1.42 1.57 55.9 61.8 e1 2.92 3.07 115.0 120.9 h 3.94 4.25 155.1 167.3 l 0.89 1.2 35.0 47.2
package mechanical data PD84001 14/18 6.1 thermal pad and via design thernal vias are required in the pcb layout to effectively conduct heat away from the package. the via pattern has been designed to address thermal, power dissipation and electrical requirements of the device. the via pattern is based on thru-hole vias with 0.203 mm to 0.330 mm finished hole size on a 0.5 mm to 1.2 mm grid pattern with 0.025 plating on via walls. if micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results. figure 19. pad layout details sot-89
PD84001 package mechanical data 15/18 6.2 soldering profile figure 20 shows the recommeded solder for devices that have pb-free terminal plating and where a pb-free solder is used. figure 20. recommended solder profile figure 21 shows the recommeded solder for devices with pb-free terminal plating used with leaded solder, or for devices with leaded terminal plating used with a leaded solder. figure 21. recommended solder profile for leaded devices
package mechanical data PD84001 16/18 figure 22. reel information
PD84001 revision history 17/18 7 revision history table 10. document revision history date revision changes 06-dec-2006 1 initial release 16-may-2007 2 marking updated 05-jun-2007 3 part number update 25-aug-2008 4 updated table 4 on page 4
PD84001 18/18 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2008 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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