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datashee t product structure silicon monolithic integrated circuit this product has not designed prot ection against radioactive rays . 1/27 tsz02201-0f1f0c100330-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.sep.2015 rev.006 tsz22111 ? 14? 001 www.rohm.com led drivers for lcd backlights white led driver for large lcd panel bd9397efv general description bd93 97efv is a high efficiency driver for white leds and designed for large lcd panel. this ic is built-in high current drive and high responsibility type 6ch led drivers and 1ch boost dcdc converter. bd9397efv has some protect function against fault conditions, such as the over-voltage protection (ovp), led open and short protection, the over current limit protection of dcdc (ocp). therefore bd9397efv is available for the fail-safe design over a wide range output voltage. key specification ? operating power supply voltage range: 9.0v to 35.0v ? oscillator frequency: 500khz (rt=30k ? ) ? operating current: 9ma (typ.) ? operating temperature range: -40c to +85c applications tv, computer display, notebook, lcd backlighting features 6ch constant led drivers, available 400ma dr ive per 1 ch. const ant current accuracy 1.8% (ic only) each 6ch external pwm inputs can control independent dimming . current analog (linear) dimming by vref 1ch boost controller with current mode (external fet) several protection functions d cdc part : ocp/ovp/uvlo/tsd led driver part :open,short detection short detection voltage is set by lsp terminal. error detection output fail terminal inside (normal=open, error=drain) package w(typ.) d(typ.) h(max.) htssop-b40 13.60mm x 7.80mm x 1.00mm pin pitch: 0.65mm typical application circuit figure 1. typical application circuit figure 2. htssop-b40 + - - - - - + - + - open/short detect err amp control logic driver current sense ss osc + + pwm comp - - vreg protection logic + pwm vref lsp fb agnd ss rt stb vcc reg9v uvlo fail ovp cp n pgnd led1 s1 cs vin cin vcc cvcc rfb cfb cout reg9v + - led6 s6 led_lv reg9v uvlo (vcc) uvlo tsd ovp scp filter fail_mode pwm6 agnd n.c. reg9v m_det fail_rst 1/5
datasheet d a t a s h e e t 2/27 tsz02201-0f1f0c100330-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.sep.2015 rev.006 www.rohm.com tsz22111 n 15 n 001 bd9397efv ? bd9397efv datasheet d a t a s h e e t 3/27 tsz02201-0f1f0c100330-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.sep.2015 rev.006 www.rohm.com tsz22111 n 15 n 001 bd9397efv ? ? ? ? ? datasheet d a t a s h e e t 4/27 tsz02201-0f1f0c100330-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.sep.2015 rev.006 www.rohm.com tsz22111 n 15 n 001 bd9397efv ? ? ? ? ? ? datasheet d a t a s h e e t 5/27 tsz02201-0f1f0c100330-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.sep.2015 rev.006 www.rohm.com tsz22111 n 15 n 001 bd9397efv datasheet d a t a s h e e t 6/27 tsz02201-0f1f0c100330-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.sep.2015 rev.006 www.rohm.com tsz22111 n 15 n 001 bd9397efv ? 1.4.1 i/o equivalence circuit reg9v / n / pgnd / cs ss fb :?:? led1 to led6, s1 to s6 cp uvlo ::?:?:?:?:? :a:?:?:? :?: pwm1 to pwm6 vref lsp,led_lv ::?::?:?:? :?:?:?:a :-:?:?:? ::a: ovp fail rt :?:?:?: 500 :?:? stb fail_mode / fail_rst m_det :a:?:? :?: figure 5. i/o equivalence circuit datasheet d a t a s h e e t 7/27 tsz02201-0f1f0c100330-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.sep.2015 rev.006 www.rohm.com tsz22111 n 15 n 001 bd9397efv ? ? datasheet d a t a s h e e t 8/27 tsz02201-0f1f0c100330-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.sep.2015 rev.006 www.rohm.com tsz22111 n 15 n 001 bd9397efv ? 2 block diagram :? :? :? :? :? :? :? :? :? :? :|::?::?:a:?:|:?:? :?:?:?:?:o:? :?:?:?:w :?:: :?:?:?:?::?:? ::?:?::o :?:?:?:-:?:? :?::::?:?:? :a:?:?::? :a:a :|:a:? :? :? ::?::w :?:|:: :? :? :-:?:?:? ::?:|:?:?:?:?:?:|::w ::?:?::o :? ::?:b? :-:?:?:? ::a: :?:? :?:?::? :a:a :?:? :a:?:? :-:?:? :?:?:?:?:- :?:-::| :?:?:?: :|:-: :?: : ::?::? ::?:?:? :a:? :?:a :-::? :?::? :-:?:? :?:-:?:? :?:?:? :?:?:? :?:?::? :?:?:?:?:- :? :? ::?:?:? :a:? ::?:?:?::- :?:?:?:?:- :?:-::| ::-:?:?:? :?:-::| :?:a:? :|:-: :a:?: :?::?:?:?: :?:?:?::?::|:?:? ::?::? :?:?::? ::?:?:? :?:?:?:?:- ::?:?:?:? :?:?:?::?:?:a:? :?:?:? figure 11. block diagram datasheet d a t a s h e e t 9/27 tsz02201-0f1f0c100330-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.sep.2015 rev.006 www.rohm.com tsz22111 n 15 n 001 bd9397efv ? 3.1 pin configuration 1 pin. vcc power supply terminal of ic. the input range is 9 to 35v. the operation starts over vcc 9 7.5v(typ.) and the system stops under vcc=7.2v(typ.). 2 pin. fail fail signal output terminal (nmos open-drain). nmos is o pen at the normal operation so fail pin is hi-z. nmos becomes on state (500 ohm typ.) at the abnormal detection. it is possible to select the fail type from latch type (fail_mode=l) or one shot pulse (fail_mode= h).please refer to the detail explanation 9 38pin. fail_mode terminal 9 3 pin. reg9v reg9v is a 9 v output pin used delivering 20ma at maximum for switching power supply of n terminal. use at a current higher than 20ma may affect the reference voltage within ic, which may result in malfunction. it will also cause heating of ic itself. therefore it is recommended to set the load as small as possible. the characteristic of vcc line regulation at reg9v is shown as figure. vcc must be used in more than 10.5v for stable 9v output. install an oscillation prevention ceramic capacitor (2.2 to 10 4 pin. n.c non connect pin. please set it the open state or deal with connecting the gnd. 5 pin. n gate driving output pin of external nmos of dc/dc converter with 0 to 9v (reg9v ) swing. output resistance of high side is 2.5 ohm(typ.), low side is 3.0 ohm(typ.) in on state. the o scillation frequency is set by a resistance connected to rt pin. for details, see the explanation of <34pin. rt terminal>. 6pin. pgnd power gnd terminal of output terminal, n driver: 7pin. cs inductor current detection resistor connecti ng terminal of dc/dc current mode: it transforms the cu rrent flowing through the inductor into voltage by sense resistor r cs connected to cs terminal, and this voltage is compared with that set in the error amplifier by current detection comparat or to control dc/dc output voltage. rcs al so performs over current protection (ocp) and stops switching action when the voltage of cs termi nal is 0.45 v (typ.) or higher (pulse by pulse). 8 pin. ovp ovp terminal is the detection terminal of overvoltage protec tion (ovp) and short circuit protection (scp) for dc/dc output voltage. depending on the setting of the fail_mode termi nal, fail and cp terminal behave differently when an abnormality is detected. for details , see the table for each protection operation is described in ? 3.2 and ? 3.3. during the soft start (ss), there is a function which returns the ovp voltage to error amplifier to boost dc/dc output voltage at all low pwm (ovpfb function). after comple tion of ss, this function is disabled. 9 pin. m_det the di or output terminal of led 1 to 6. the output is the vo ltage which is added a diode forward voltage(two diode stack) to the lowest voltage among 6 led terminals. 10pin. agnd analog gnd for ic 11 to 16pin. led1 to led6 led constant current driver output terminal. setting of led current value is adjustable by setting the vref voltage and connecting a resistor to s terminal. for details, see the explanation of <25 to 30pin. s1 to s6, 35pin. vref >. the pwm dimming frequency of led current driver and upper/lower limit of t he duty need to be set in a manner that necessary linearity of pwm dimming characteristics c an be secured referring to the following figures: start/stop time of constant current driver (pwm pulse response) start-up time depends on the vref value; the resp onse becomes quick, so that voltage is high. in the way of reference, the cu rrent response upon application of current rise rate and pulse pwm1us (current pulse) to describe the dependence of vref. it needs to be adequately verified with an actual device because the response rate may vary with application conditions. figure 12. \ 1 ? 0 ? 1 ? 2 ? 3 ? 4 ? 5 ? 6 ? 7 ? 8 ? 9 ? 10 ? 0 5 10 15 20 25 30 35 reg9v ? [v] vcc ? [v] reg9v ?\ vcc ? (line ? regulation) ? datasheet d a t a s h e e t 10/27 tsz02201-0f1f0c100330-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.sep.2015 rev.006 www.rohm.com tsz22111 n 15 n 001 bd9397efv 17pin. stb on/off setting terminal for ic, which can be used perform a reset at shutdown. * the voltage of stb input in the sequence of vcc stb. * voltage input in stb terminal switches t he state of ic (ic on/off). using the termi nal between the 2 states (0.8 to 2.0 v) needs to be avoided. 18 to 23pin. pwm1 to pwm6 on/off terminal of led driver: it inputs pwm dimming signa l directly to pwm terminal and change of duty enables dimming. high/low level of pwm terminal is shown as follows: state pwm voltage led on pwm= 2.0 to 20v led off pwm= -0.3 to 0.8v 24pin.fail_rst reset terminal of the protection circuit and fail terminal: return the latch stopped protection block by setting the fail_r st to high. during high state, operation is masked by the latch system protection. 25 to 30pin. s1 to s6, 35pin. vref s terminal is a connecting terminal for led constant current se tting resistor, output current iled is in an inverse relationshi p to the resistance value. vref terminal is a terminal for analog dimming; output current iled is in a proportional relationship to the voltage value to be input. vref terminal is assumed that it is set by dividing the re sistance with a high degree of accuracy, vref terminal inside the ic is in open state (high impedance). it is necessary to input voltage to divide the resistance from the output of reg9v or use external power source. using the terminal in open state needs to be avoided. the relationship among output current iled, vref input voltage, and rs resistance has the following equation: the voltage of s terminal is following equation: *attention: rises led current accelerate heat generation of ic. adequate considerat ion needs to be taken to thermal design in use. ::?:? :? :? >#:?::?:? :?:a :a:w:?:?:?:?:- :-:?:?:?:?:?:?:?:-:?:w:?:a:?:?:w:2 datasheet d a t a s h e e t 12/27 tsz02201-0f1f0c100330-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.sep.2015 rev.006 www.rohm.com tsz22111 n 15 n 001 bd9397efv ::?:?:?::- ::?:?:? ::?:?:? :a:? :? :? :a:? :a:? :a:? :a:? :a:? :? :? :? :? :? :? :? :? :? :? ::?:?:? ::?:?:? ::?:?:? ::?:?:? :?:?:?:?:- :?:: :? :? :? :? :? :? :? 37pin. lsp terminal which sets led short detection voltage: the input impedance of lsp pin is high impedance, because it is assumed that the input of lsp terminal is set by dividing the resistance with a high degree of accuracy. the lsp terminal is assumed that it is set by dividing the resistance with a high degree of accuracy, lsp terminal inside the ic is in open state (high impedance). it is necessary to input voltage to divide the resistance fr om the output of reg9v or use external power source. using the terminal in open state needs to be avoided. set lsp voltage in the range of 0.8v to 3.0v. led short b lsp detection voltage, vlsp b lsp terminal voltage the conditions there are restrict ions on short led detection. for details, see the explanation of section 38pin. fail_mode output mode of fail can be change by fail_mode terminal. when fail_mode is in low state, the output of fail terminal is the latch mode. fail terminal is latched after the cp charge time from detection of abnormal stat e. when fail_mode is in high state, the output of fail terminal is one-sh ot-pulse mode. at detected abnormality, firs tly fail is in low state (drain state). fail returns to high state (open state) if abnormality is cleared after cp charge time, in this mode, there is no latch stop fo r protection operation in ic. monitoring the fail wi th the microcomputer, decide to stop working ic. for fail_mode = h when the detection seque nce, see the explanation of section 39pin. uvlo uvlo terminal of the power of step-up dc/dc converter: at 2.5 v (typ.) or higher , ic starts step-up operation and stops at 2.4v or lower (typ.). (it is not shutdown of ic.) uvlo can be used to perform a reset after latch stop of the protections. the power of step-up dc/dc converter needs to be set detection level by dividing the resistance. if any problem on the application causes noise on uvlo terminal which results in unstable operation of dc/dc c onverter, a capacitance of approximately 1000 pf needs to be conn ected between uvlo and agnd terminals. 40pin. agnd analog gnd for ic ] [ 5 v vlsp led short ? ? datasheet d a t a s h e e t 13/27 tsz02201-0f1f0c100330-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.sep.2015 rev.006 www.rohm.com tsz22111 n 15 n 001 bd9397efv D D D D datasheet d a t a s h e e t 14/27 tsz02201-0f1f0c100330-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.sep.2015 rev.006 www.rohm.com tsz22111 n 15 n 001 bd9397efv ? 3.3 protection operation when the fail one shot outputs(failmode=h) ? 3.3.1 list of the threshold function terminal b typ. condition b please decide the resistance divider of the various protection detection using the following table. protection name detection pin name detection condition release condition protection type pwm led open ledx ledx < 0.2v(4clk) ss>3v high ledx > 0.2v(3clk) fail drain state under the detection. led short ledx ledx > 5vlsp(4clk) ss>3v high ledx < 5vlsp(3clk) fail drain state under the detection. uvlo uvlo uvlo < 2.4v D D D D datasheet d a t a s h e e t 15/27 tsz02201-0f1f0c100330-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.sep.2015 rev.006 www.rohm.com tsz22111 n 15 n 001 bd9397efv 5 ] [ ] [ ] [ ? ? a i v v ohm r led vref s ] v [ 0 . 3 ] a [ 10 0 . 1 ] s [ t ] f [ c 6 ss ss ? ? ? ? ? ? ? ? ] [ 10 5 . 1 10 ? ? ? sw rt f r sw f 5 ] [ ] [ v vled v v short lsp ? ] [ 5 2 1 2 9 v r r r v reg vled short ? ? ? ? ? ? ? ? ? ? datasheet d a t a s h e e t 16/27 tsz02201-0f1f0c100330-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.sep.2015 rev.006 www.rohm.com tsz22111 n 15 n 001 bd9397efv ? 3.4.6 maximum dcdc output voltage(vout ,max) the dcdc output maximum voltage is rest ricted by max duty of n output. moreover, the voltage needed in order that vf may modulate by led current also with the same number of leds. vf becomes high, so that there is generally much current. when you have grasped the variation factor of everythings, such as variation in a dcdc input voltage range, the variation and temperature characteristics of led load, and exte rnal parts, please carry out a margin setup. ? 3.4.7 setting the ovp in bd9397efv, when over voltage in vout line is detected, the instant stop of the n pin output is carried out, and voltage rise operation is stopped. but the latch stop by cp charge is not performed. if vout drops by naturally discharge, it is less than th e hysteresis voltage of ovp detection and the oscillation condition is fulfilled, n output will be resumed again. | equation of setting ovp detect n pin output is suspended at the time of scp detection, it stops step-up operation, and t he latch protection by cp timer. | equation of setting scp detect moreover, there is an ovpfb function whic h returns ovp voltage and controls error amplifier so that output voltage may be raised, even when there is no pwm signal during a soft start. | the vout setting formula by ovpfb in soft start ? 3.4.8 fail logic fail signal output pin (open drain); when an abnormalit y is detected, nmos is brought into gnd level. the rating of this pin is 36v. state fail output in normal state, in stb open in completion of an abnormality, when the uvlo is detected(after cp latch) gnd level (500ohm typ.) ? 3.4.9 how to set the uvlo uvlo pin detect the power supply voltag e: vin for step-up dc/dc converters. operation starts operation on more than 2.5v (typ.) an d operation stops on less than 2.4v (typ.) . since internal impedance exists in uvlo pin, cautions are needed for selection of resistance for resistance division. a vin voltage level to make it detecting becomes settled like the following formula by resistance division of r1 and r2 (unit: k ? ] [ 1 480 530 1 125 1400 1 2 2 1 5 . 2 v r k k k k r r r vin det ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ] [ 1 40 480 530 1 125 1400 1 2 2 1 4 . 2 v r k k k k k r r r vin lock ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ] [ 2 2 1 43 . 2 v r r r vovp ? ? ? ] [ 2 2 1 2 . 0 v r r r vscp ? ? ? ] [ 400 1 2 2 1 2 3 _ v v r r r r vout lv led ? ? ? ? ? ? ? ? ? ? datasheet d a t a s h e e t 17/27 tsz02201-0f1f0c100330-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.sep.2015 rev.006 www.rohm.com tsz22111 n 15 n 001 bd9397efv ? 3.4.10 setting of the led_lv voltage (led_lv pin) led_lv pin is in the open (high impedance) state. please be sure to use an external seal of approval, carrying out by inputting reg9v output by resistance division. it cannot use in the state of open. | equation of setting led_lv voltage when led_lv voltage is set up by resistance division of r1 and r2 using reg9v, it becomes like the following formula. *also including the variation in ic, please also take the part va riation in a set into consideration for an actual constant set up, and inquire enough to it. ? 3.5 selecting of dcdc part selecting inductor l the value of inductor has a great influence on input ripple current. as shown in equation (1), as the in ductor becomes large and switching frequency becomes high, the ri pple current of an inductor ?: il becomes low. (1) ] [ ) ( ? ????nnnnn? ? a f v l v v v il sw out in in out ? ? ? ? ? (2) ?? ?????nnnnn in in out out i v i v ? ? ? ? (3) 2 2 ?nnnnn?? ?? ?? il v i v il i il in out out in max ? ? ? ? ? ? ? (4) ] [ 1 1 ?nnnnn?? ? v f i c r ilmax v sw out out esr out ? ? ? ? ? ? ] [ 2 1 2 9 _ v r r r v reg v lv led ? ? ? datasheet d a t a s h e e t 18/27 tsz02201-0f1f0c100330-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.sep.2015 rev.006 www.rohm.com tsz22111 n 15 n 001 bd9397efv selecting switching mosfet though there is no problem if the absolute maximum rating is the rated current of l or (withstand voltage of c out + rectifying diode) vf or higher, one with small gate capacitance (inj ected charge) needs to be selected to achieve high-speed switching. * one with over current protection setting or higher is recommended. * selection of one with small on resistance results in high efficiency. selecting rectifying diode a schottky barrier diode which has current ability higher than t he rated current of l, reverse voltage larger than withstand voltage of c out , and low forward voltage vf especially needs to be selected. selecting mosfet for load switch and its soft-start as a normal step-up dc/dc converter does not have a switch on the path from v in to v out , output voltage is generated even though ic is off. to keep output voltage at 0 v until ic works, pmosfet for load switch needs to be inserted between v in and the inductor. fail terminal needs to be used to dr ive the load switch. pmosfet for the load switch of which gate-source withstand voltage and drain-s ource withstand voltage are both higher than v in needs to be selected. to provide soft-start for the load switch, a ca pacitor must be inserted among gates and sources. ? 3.6 how to set phase compensation dc/dc converter application controlling current mode has each one pole (phase lag) f p due to cr filter composed of output capacitor and output resistance (= led current) and zero (phase lead) f z by output capacitor and esr of the capacitor. moreover, step-up dc/dc converter has rhp zero f zrhp as another zero. since rhp zero has a characteristic of phase lag (-90) as pole does, cross-over frequency f c needs to be set at rhp zero or lower. i. determine pole f p and rhpzero f zrhp of dc/dc converter: here, ? 9 =sum of led current, ii. determine phase compen sation to be inserted into error amplifier (with f c set at 1/5 of f zrhp ) here, iii. determine zero to compensate esr (r esr ) of c out (electrolytic capacitor) * when a ceramic capacitor (with r esr of the order of millimeters) is used to c out , too, operation is stabilized by insertion of r esr and c fb2 . though increase in r fb1 and decrease in c fb1 are necessary to improve transient response, it needs to be adequately verified with an actual device in consideration of variat ion between external parts since phase margin is decreased. v out vin c out r cs l r esr figure 25. output part figure 26. error amplifier ?? ? ] [ 2 ) 1 ( 2 hz i l d v f led out zrhp ? ? ? ? ? ? ] [ ) 1 ( 5 1 ? ? ? ? ? ? ? ? ? d v gm f i r f r out p led cs rhzp fb ?? ? ] [ 2 1 1 1 f f r c p fb fb ? ? ? ? ] [ 1 2 f r c r c fb out esr fb ? ? ] [ 2 hz c v i f out out led p ? ? ? ? out in out v v v d ? ? led i ? ] [ 10 036 . 1 3 s gm ? ? ? datasheet d a t a s h e e t 19/27 tsz02201-0f1f0c100330-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.sep.2015 rev.006 www.rohm.com tsz22111 n 15 n 001 bd9397efv ? 3.7 timing chart ? 3.7.1 normal operation sequence :?:::?:1:?:? :?:?:?:1:?:? :?:::?:1:?:? :-:?:? :? :? ::?:?:w:?:?:?:?:w:?:?:?:?:o:?::?:? ::?:?:w::?:?::?:w:?:?:?:?:o:?::?:? :?:?:?:- :a:?:? :?:?:?:- :?:?:?:?:- :?:?:?:- :?:?:?: :?:-::| :a:a :-:|:?:? ::?::? :?::?:?:? :?:?:?:- :?:?:?:- b?:?::?:?:?:w:o::::?:?:?:w:::w::?:?:?:?:?:?:?:?:?:?:w:o:?:?:?::?:?:?:?:?:w:1:e:w:?:?:o:?:w::?::?:w:?::?:? b?:?:?:?::w:?::?:w:::w:?::?:?:?:?:w::?:? :?:?:?:- :?:?:?:- figure 27. datasheet d a t a s h e e t 20/27 tsz02201-0f1f0c100330-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.sep.2015 rev.006 www.rohm.com tsz22111 n 15 n 001 bd9397efv ? 3.8.2 protective operation state tr ansition table at fail_mode=l (open detection) pwm :?:::?::w::?:?:?:? pwm :?:::?::w::?:?:?:? pwm :?:::?::w::?:?:?:? l(no pulse) or pulse less than 4cnt. :?:?:?:~:?:w:o:?::? :?:::o:?:?::?:? -- - - :?:?::?:?:?:w::?:?:?:? ::?:?:w:?:?:?:?:o:? :?:::o:?:?::?:? -- - - :?:?::?:?:?:w::?:?:?:? ::?:?:w:?:?:?:?:o:? :?:::o:?:?::?:? - - :?:?::?:?:?:w::?:?:?:? ::?:?:w:?:?:?:?:o:? :?:?::?:?:?:w::?:?:?:? :?:?:?:?:o:? ch latch fail latch ::?:?:w:?:?:?:?:o:? :?:?::?:?:?:w::?:?:?:? :?:?:?:?:o:? ch latch fail latch ::?:?:w:?:?:?:?:o:? :?:::o:?:?::?:? - - :?:?::?:?:?:w::?:?:?:? ::?:?:w:?:?:?:?:o:? :?:?::?:?:?:w::?:?:?:? :?:?:?:?:o:? ch latch fail latch ::?:?:w:?:?:?:?:o:? :?:?::?:?:?:w::?:?:?:? :?:?:?:?:o:? ch latch fail latch l(no pulse) h(input pulse) :?:?:?:?:o:? :o:?:?::?:? l(no pulse) h(input pulse) :?:?:?:?:o:? :o:?:?::?:? l(no pulse) h(input pulse) before cp charge >" cp charge >" cp=2v arrival :?:?:?:w:?:?:w::?:?:?:? pulse over 4cnt. :?:?:?:?:o:? ::?:?::? :o:?:?::?:? (short detection) pwm :?:::?::w::?:?:?:? pwm :?:::?::w::?:?:?:? pwm :?:::?::w::?:?:?:? l(no pulse) or puse less than 4cnt. :?:?:?:~:?:w:o:?::? :?:::o:?:?::?:? -- - - :?:?::?:?:?:w::?:?:?:? ::?:?:w:?:?:?:?:o:? :?:::o:?:?::?:? -- - - :?:?::?:?:?:w::?:?:?:? l(no pulse) :?:?:?:~:?:w:o:?::? ch latch fail latch ::?:?:w:?:?:?:?:?:o:? :?:?::?:?:?:w::?:?:?:? :?:?:?:?:o:? ch latch :?:?:?::w:?:?:?:o:? ::?:?:w:?:?:?:?:o:? :?:::o:?:?::?:? -- :?:?::?:?:?:w::?:?:?:? l(no pulse) :?:?:?:~:?:w:o:?::? ch latch :?:?:?::w:?:?:?:o:? ::?:?:w:?:?:?:?:?:o:? :?:?::?:?:?:w::?:?:?:? :?:?:?:?:o:? ch latch :?:?:?::w:?:?:?:o:? :?:?:?:w:?:?:w::?:?:?:? before cp charge cp charge cp=2v arrival >">" h(input pulse) :o:?:?::?:? h(input pulse) :o:?:?::?:? :?:?:?:?:o:? :?:?:?:~:?:w:o:?::? h(input pulse) pulse over 4cnt. :?:?:?:?:o:? ::?:?::? :o:?:?::?:? l(no pulse) with "the pulse of less than 4 cnt", it is defined as the pulse width from (100n)sec to (hi time of less than 4 cnt of dcdc fre quency). in the pulse below (100n)sec, since delay from a pwm pin input to internal logic exists, it becomes unfixed. datasheet d a t a s h e e t 21/27 tsz02201-0f1f0c100330-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.sep.2015 rev.006 www.rohm.com tsz22111 n 15 n 001 bd9397efv ? 3.7.3 protective operation sequence at fail_mode=h n basic sequence n actual sequence ::?:::? ::?:?:?:? :?:?:?: :?: datasheet d a t a s h e e t 22/27 tsz02201-0f1f0c100330-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.sep.2015 rev.006 www.rohm.com tsz22111 n 15 n 001 bd9397efv ? 3.7.4 about led short detection led short detection don?t work by individual ch. the followings are needed for detection. n detection channel is pwm=h and led terminal voltage is over led short detection threshold voltage. n except for detection ch, any 1ch is pwm=h and led terminal voltage is under 3v. n the above-mentioned 2 states continue over 4clk of dcdc oscillation frequency. detection sequence is the followings.(omit 4clk mask) figure 30. datasheet d a t a s h e e t 23/27 tsz02201-0f1f0c100330-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.sep.2015 rev.006 www.rohm.com tsz22111 n 15 n 001 bd9397efv operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply terminals. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and s upply lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all po wer supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the refe rence point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy b oard. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guarantee d under the conditions of each parameter. 7. rush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give s pecial consideration to power coupling capacitance, power wiring, width of ground wiri ng, and routing of connections. 8. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always dischar ge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assemb ly and use similar precautions during transport and storage. 9. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. datasheet d a t a s h e e t 24/27 tsz02201-0f1f0c100330-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.sep.2015 rev.006 www.rohm.com tsz22111 n 15 n 001 bd9397efv operational notes ? continued 10. unused input terminals input terminals of an ic are often con nected to the gate of a mo s transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric fi eld from the outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input terminals should be connected to the power supply or ground line. 11. regarding the input pin of the ic this monolithic ic contains p+ isolat ion and p substrate layers between adjac ent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (a nd thus to the p substrate) should be avoided. figure 31. example of monolithic ic structure 12. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 13. area of safe operation (aso) operate the ic such that th e output voltage, output current, and power dissipation are all within the area of safe operation (aso). 14. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that pr events heat damage to the ic. normal operation should always be within the ic?s power dissipation rating. if however th e rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circui t that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are autom atically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute ma ximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other t han protecting the ic from heat damage. 15. over current protection circuit (ocp) this ic incorporates an integrated over current protection circuit that is acti vated when the load is shorted. this protection circuit is effective in pr eventing damage due to sudden and unexpecte d incidents. however, the ic should not be used in applications characterized by continuous operation or transitioning of the protection circuit. datasheet d a t a s h e e t 25/27 tsz02201-0f1f0c100330-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.sep.2015 rev.006 www.rohm.com tsz22111 n 15 n 001 bd9397efv ? ordering information b d 9 3 9 7 e f v - e2 part number package efv:htssop-b packaging and forming specification e2: embossed tape and reel ? marking diagram htssop-b40 (top view) bd9397efv part number marking lot number 1pin mark datasheet d a t a s h e e t 26/27 tsz02201-0f1f0c100330-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.sep.2015 rev.006 www.rohm.com tsz22111 n 15 n 001 bd9397efv physical dimension, tape and reel information package name htssop-b40 ? order quantity needs to be multiple of the minimum quantity. datasheet d a t a s h e e t 27/27 tsz02201-0f1f0c100330-1-2 ? 2013 rohm co., ltd. all rights reserved. 1.sep.2015 rev.006 www.rohm.com tsz22111 n 15 n 001 bd9397efv revision history date revision changes 9.jan.2014 001 draft version 10.mar.2014 002 p.5 1.3 pin descriptions no.11-16 led1-led6 rating -0.3 to 60 [v] datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be us ed on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification datasheet datasheet notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the pro ducts are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in p art, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. datasheet part number bd9397efv package htssop-b40 unit quantity 2000 minimum package quantity 2000 packing type taping constitution materials list inquiry rohs yes bd9397efv - web page distribution inventory |
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