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1 caution: these devices are sensitive to electrosta tic discharge; follow proper ic handling procedures. 1-888-intersil or 1-888-468-3774 | copyright intersil americas inc. 2006-2009, 2011, 2012. all rights reserved intersil (and design) is a trademark owned by intersil corporation or one of its subsidiaries. all other trademarks mentioned are the property of their respective owners. isl2110, isl2111 100v, 3a/4a peak, high frequency half-bridge drivers the isl2110, isl2111 are 100v, high frequency, half-bridge n-channel power mosfet driver ics. they are based on the popular hip2100, hip2101 hal f-bridge drivers, but offer several performance improvements. peak output pull-up/ pull-down current has been increased to 3a/4a, which significantly reduces switching power losses and eliminates the need for external totem-pole buffers in many applications. also, the low end of the v dd operational supply range has been extended to 8vdc. the isl2110 has additional input hysteresis for superior operation in noisy environments and the inputs of the isl2111, like those of the isl2110, can now safely swing to the v dd supply rail. features ? drives n-channel mosfet half-bridge ? soic, dfn and tdfn package options ? soic, dfn and tdfn packages compliant with 100v conductor spacing guidelines per ipc-2221 ? pb-free (rohs compliant) ? bootstrap supply max voltage to 114vdc ? on-chip 1w bootstrap diode ? fast propagation times for multi-mhz circuits ? drives 1nf load with typical rise/fall times of 9ns/7.5ns ? cmos compatible input thresholds (isl2110) ? 3.3v/ttl compatible input thresholds (isl2111) ? independent inputs provide flexibility ? no start-up problems ? outputs unaffected by supply glitches, hs ringing below ground or hs slewing at high dv/dt ? low power consumption ? wide supply voltage range (8v to 14v) ? supply undervoltage protection ? 1.6w/1w typical output pull-up/pull-down resistance applications ? telecom half-bridge dc/dc converters ? telecom full-bridge dc/dc converters ? two-switch forward converters ? active-clamp forward converters ? class-d audio amplifiers ordering information part number (notes 1, 2) part marking temp range (c) package (pb-free) pkg. dwg. # isl2110abz 2110 abz -40 to +125 8 ld soic m8.15 isl2110ar4z 211 0ar4z -40 to +125 12 ld 4x4 dfn l12.4x4a isl2111abz 2111 abz -40 to +125 8 ld soic m8.15 isl2111ar4z 211 1ar4z -40 to +125 12 ld 4x4 dfn l12.4x4a isl2111artz 211 1artz -40 to +125 10 ld 4x4 tdfn l10.4x4 ISL2111BR4Z 211 1br4a -40 to +125 8 ld 4x4 dfn l8.4x4 notes: 1. add ?-t*? suffix for tape and reel. please refer to tb347 for details on reel specifications. 2. these intersil pb-free plastic packaged products employ special pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is rohs compliant and compatible with both snpb and pb-free soldering operations). intersil pb-free products are msl classified at pb-free peak reflow temperatures that meet or exceed the pb-free requirements of ipc/jedec j std-020. 3. for moisture sensitivity level (m sl), please see device information page for isl2110, isl2111 . for more information on msl please see techbrief tb363 . data sheet march 8, 2012 fn6295.6
2 fn6295.6 march 8, 2012 application block diagram pinouts isl2111artz (10 ld 4x4 tdfn) top view isl2110ar4z, isl2111ar4z (12 ld 4x4 dfn) top view isl2110abz, isl2111abz (8 ld soic) top view ISL2111BR4Z (8 ld 4x4 dfn) top view 2 3 4 1 5 9 8 7 10 6 vdd hb ho hs nc lo vss li hi nc vdd nc nc hb ho lo v ss nc nc li hs hi 2 3 4 1 5 11 10 9 12 8 6 7 epad* *epad = exposed pad 5 6 8 7 4 3 2 1 vdd hb ho hs lo li hi vss 2 3 4 1 7 6 5 8 v dd hb ho hs lo v ss li hi epad* *epad = exposed pad secondary circuit +100v control controller pwm li hi ho lo v dd hs hb +12v v ss reference and isolation drive lo drive hi isl2110 isl2111 isl2110, isl2111
3 fn6295.6 march 8, 2012 functional block diagram under voltage v dd hi li v ss driver driver hb ho hs lo level shift under voltage epad (dfn package only) isl2111 isl2111 *epad = exposed pad. the epad is electric ally isolated from all other pins. for best thermal performance connect the epad to the pcb power ground plane. secondary isolation pwm +48v +12v circuit figure 1. two-switch forward converter isl2110 isl2111 secondary circuit isolation pwm +48v +12v figure 2. forward converter with an active-clamp isl2110 isl2111 isl2110, isl2111
4 fn6295.6 march 8, 2012 absolute maximum rati ngs thermal information supply voltage, v dd, v hb - v hs (notes 4, 5) . . . . . . . . -0.3v to 18v li and hi voltages (note 5) . . . . . . . . . . . . . . . . -0.3v to v dd + 0.3v voltage on lo (note 5) . . . . . . . . . . . . . . . . . . . -0.3v to v dd + 0.3v voltage on ho (note 5) . . . . . . . . . . . . . . v hs - 0.3v to v hb + 0.3v voltage on hs (continuous) (note 5) . . . . . . . . . . . . . . -1v to 110v voltage on hb (note 5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118v average current in v dd to hb diode . . . . . . . . . . . . . . . . . . 100ma maximum recommended operating conditions supply voltage, v dd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8v to 14v voltage on hs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1v to 100v voltage on hs . . . . . . . . . . . . . . .(repetitive transient) -5v to 105v voltage on hb. . . . .v hs + 7v to v hs + 14v and v dd - 1v to v dd + 100v hs slew rate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <50v/ns thermal resistance (typical) ja (c/w) jc (c/w) 8 ld soic (notes 6, 10). . . . . . . . . . . . 95 46 10 ld tdfn (notes 7, 8) . . . . . . . . . . . 42 5.5 12 ld dfn (notes 7, 8) . . . . . . . . . . . . 40 5.5 8 ld dfn (notes 7, 8) . . . . . . . . . . . . . 40 4.0 max power dissipation at +25c in free air 8 ld soic (notes 6, 10) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3w 10 ld tdfn (notes 7, 8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.0w 12 ld dfn (notes 7, 8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1w 8 ld dfn (notes 7, 8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1w storage temperature range . . . . . . . . . . . . . . . . . . . -65c to +150c junction temperature range. . . . . . . . . . . . . . . . . .-55c to +150c pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/pb-freereflow.asp caution: do not operate at or near the maximum ratings listed fo r extended periods of time. exposure to such conditions may adv ersely impact product reliability and result in failures not covered by warranty. notes: 4. the isl2110 and isl2111 are capable of derated operation at s upply voltages exceeding 14v. figure 22 shows the high-side volt age derating curve for this mode of operation. 5. all voltages referenced to v ss unless otherwise specified. 6. ja is measured in free air with the component mounted on a high effective thermal conductivity test board. see tech brief tb379 for details. 7. ja is measured in free air with the component mounted on a high ef fective thermal conductivity te st board with ?direct attach? fe atures. see tech brief tb379. 8. for jc , the ?case temp? location is the center of the exposed metal pad on the package underside. 9. parameters with min and/or max limits are 100% tested at +25 c, unless otherwise specified. temperature limits established by characterization and are not production tested. 10. for jc , the ?case temp? location is taken at the package top center. electrical specifications v dd = v hb = 12v, v ss = v hs = 0v, no load on lo or ho, unless otherwise specified. parameters symbol test conditions t j = +25c t j = -40c to +125c units min typ max min (note 9) max (note 9) supply currents v dd quiescent current i dd isl2110; li = hi = 0v - 0.1 0.25 - 0.3 ma v dd quiescent current i dd isl2111; li = hi = 0v - 0.3 0.45 - 0.55 ma v dd operating current i ddo isl2110; f = 500khz - 3.4 5.0 - 5.5 ma v dd operating current i ddo isl2111; f = 500khz - 3.5 5.0 - 5.5 ma total hb quiescent current i hb li = hi = 0v - 0.1 0.15 - 0.2 ma total hb operating current i hbo f = 500khz - 3.4 5.0 - 5.5 ma hb to v ss current, quiescent i hbs li = hi = 0v; v hb = v hs = 114v - 0.05 1.5 - 10 a hb to v ss current, operating i hbso f = 500khz; v hb = v hs = 114v - 1.2 - - - ma input pins low level input voltage threshold v il isl2110 3.7 4.4 - 3.5 - v low level input voltage threshold v il isl2111 1.4 1.8 - 1.2 - v high level input voltage threshold v ih isl2110 - 6.6 7.4 - 7.6 v high level input voltage threshold v ih isl2111 - 1.8 2.2 - 2.4 v input voltage hysteresis v ihys isl2110 - 2.2 - - - v input pull-down resistance r i - 210 - 100 500 k isl2110, isl2111
5 fn6295.6 march 8, 2012 undervoltage protection v dd rising threshold v ddr 6.1 6.6 7.1 5.8 7.4 v v dd threshold hysteresis v ddh -0.6- - - v hb rising threshold v hbr 5.5 6.1 6.8 5.0 7.1 v hb threshold hysteresis v hbh -0.6- - - v boot strap diode low current forward voltage v dl i vdd-hb = 100a - 0.5 0.6 - 0.7 v high current forward voltage v dh i vdd-hb = 100ma - 0.7 0.9 - 1 v dynamic resistance r d i vdd-hb = 100ma - 0.7 1 - 1.5 lo gate driver low level output voltage v oll i lo = 100ma - 0.1 0.18 - 0.25 v high level output voltage v ohl i lo = -100ma, v ohl = v dd - v lo - 0.16 0.23 - 0.3 v peak pull-up current i ohl v lo = 0v - 3 - - - a peak pull-down current i oll v lo = 12v - 4 - - - a ho gate driver low level output voltage v olh i ho = 100ma - 0.1 0.18 - 0.25 v high level output voltage v ohh i ho = -100ma, v ohh = v hb - v ho - 0.16 0.23 - 0.3 v peak pull-up current i ohh v ho = 0v - 3 - - - a peak pull-down current i olh v ho = 12v - 4 - - - a electrical specifications v dd = v hb = 12v, v ss = v hs = 0v, no load on lo or ho, unless otherwise specified. (continued) parameters symbol test conditions t j = +25c t j = -40c to +125c units min typ max min (note 9) max (note 9) switching specifications v dd = v hb = 12v, v ss = v hs = 0v, no load on lo or ho, unless otherwise specified. parameters symbol test conditions t j = +25c t j = -40c to +125c units min typ max min (note 9) max (note 9) lower turn-off propagation de lay (li falling to lo falling) t lphl - 32 50 - 60 ns upper turn-off propagation dela y (hi falling to ho falling) t hphl - 32 50 - 60 ns lower turn-on propagation delay (li rising to lo rising) t lplh - 39 50 - 60 ns upper turn-on propagation delay (hi rising to ho rising) t hplh - 38 50 - 60 ns delay matching: upper turn-off to lower turn-on t mon 1 8 - - 16 ns delay matching: lower turn-off to upper turn-on t moff 1 6 - - 16 ns either output rise time (10% to 90%) t rc c l = 1nf - 9 - - - ns either output fall time (90% to 10%) t fc c l = 1nf - 7.5 - - - ns either output rise time (3v to 9v) t r c l = 0.1f - 0.3 0.4 - 0.5 s either output fall time (9v to 3v) t f c l = 0.1f - 0.19 0.3 - 0.4 s minimum input pulse width that changes the output t pw - - - - 50 ns bootstrap diode turn-on or turn-off time t bs -10- - - ns isl2110, isl2111
6 fn6295.6 march 8, 2012 timing diagrams pin descriptions symbol description v dd positive supply to lower gate driver. bypass this pin to v ss . hb high-side bootstrap supply. external bootstrap capacitor is r equired. connect positive side of bootstrap capacitor to this pi n. bootstrap diode is on-chip. ho high-side output. connect to gate of high-side power mosfet. hs high-side source connection. connect to source of high-side pow er mosfet. connect negative side of bootstrap capacitor to thi s pin. hi high-side input. li low-side input. v ss chip negative supply, which will generally be ground. lo low-side output. connect to gate of low-side power mosfet. nc no connect. epad exposed pad. connect to ground or float. the epad is electrically isolated from all other pins. figure 3. propagation delays figure 4. delay matching t hplh , t lplh t hphl , t lphl hi , li ho , lo t mon t moff li hi lo ho typical performance curves figure 5. isl2110 i dd operating current vs frequency figure 6. isl2111 i dd operating current vs frequency 0.1 1.0 10.0 frequency (hz) i ddo (ma) t = +25c t = -40c t = +125c t = +150c 10k 100k 1 . 10 3 k 10k 100k 1 . 10 3 k 0.1 1.0 10.0 frequency (hz) i ddo (ma) t = +25c t = -40c t = +150c t = +125c isl2110, isl2111
7 fn6295.6 march 8, 2012 figure 7. i hb operating current vs frequency figure 8. i hbs operating current vs frequency figure 9. high level outp ut voltage vs temperature figure 10. low level output voltage vs temperature figure 11. undervoltage lockout threshold vs temperature figure 12. undervoltage lockout hysteresis vs temperature typical performance curves (continued) frequency (hz) i hbo (ma) 0.01 1.0 10.0 t = +25c t = -40c t = +125c t = +150c 10k 100k 1 . 10 3 k 0.1 frequency (hz) i hbso (ma) 0.01 1.0 10.0 t = -40c t = +125c t = +150c 10k 100k 1 . 10 3 k 0.1 t = +25c -50 0 50 100 150 50 100 150 200 250 300 temperature (c) v ohl , v ohh (mv) v dd = v hb = 12v v dd = v hb = 14v v dd = v hb = 8v -50 0 50 100 150 50 100 150 200 v oll , v olh (mv) temperature (c) v dd = v hb = 12v v dd = v hb = 14v v dd = v hb = 8v v ddr , v hbr (v) -50 0 50 100 150 6.7 temperature (c) v hbr v ddr 6.5 6.3 6.1 5.9 5.7 5.5 5.3 v ddh , v hbh (v) -50 0 50 100 150 0.70 temperature (c) v hbh v ddh 0.65 0.60 0.55 0.50 0.45 0.40 isl2110, isl2111
8 fn6295.6 march 8, 2012 figure 13. isl2110 propagation delays vs temperature figure 14. isl2111 propagation delays vs temperature figure 15. isl2110 delay matching vs temperature figure 16. isl2111 delay matching vs temperature figure 17. peak pull-up current vs output voltage figure 18. peak pull-down current vs output voltage typical performance curves (continued) 25 30 35 40 45 50 55 t lplh , t lphl , t hplh , t hphl (ns) -50 0 50 100 150 temperature (c) t lphl t hphl t lplh t hplh 25 30 35 40 45 50 55 t lplh , t lphl , t hplh , t hphl (ns) -50 0 50 100 150 temperature (c) t lphl t hphl t lplh t hplh 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 t mon , t moff (ns) -50 0 50 100 150 temperature (c) t moff t mon 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 t mon , t moff (ns) -50 0 50 100 150 temperature (c) t moff t mon 0481012 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 v lo , v ho (v) i ohl , i ohh (a) 26 0481012 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 v lo , v ho (v) i ohl , i ohh (a) 26 1.0 0.5 isl2110, isl2111
9 all intersil u.s. products are manufactured, asse mbled and tested utilizing iso9000 quality systems. intersil corporation?s quality certifications ca n be viewed at www.intersil.com/design/quality intersil products are sold by description only. intersil corpor ation reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. accordingly, the reader is cautioned to verify that data sheets are current before placing orders. information furnishe d by intersil is believed to be accurate and reliable. however, no responsibility is assumed by intersil or its subsidiaries for its use; nor for any infringements of paten ts or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of intersil or its subsidiari es. for information regarding intersil corporation and its products, see www.intersil.com fn6295.6 march 8, 2012 figure 19. isl2110 quiescent current vs voltage figure 20. isl2111 quiescent current vs voltage figure 21. bootstrap diode i-v characteristics figure 22. v hs voltage vs v dd voltage typical performance curves (continued) 0 5 10 15 20 0 10 20 30 40 50 60 70 80 90 100 110 120 v dd , v hb (v) i dd , i hb (a) i hb i dd 0 5 10 15 20 v dd , v hb (v) i dd , i hb (a) 0 20 40 60 80 100 120 140 160 180 200 220 240 260 280 300 320 i hb i dd 0.3 0.4 0.5 0.6 0.7 0.8 1 . 10 -3 0.01 0.10 1.00 forward voltage (v) forward current (a) 1 . 10 -4 1 . 10 -5 1 . 10 -6 12 13 14 15 16 0 20 40 60 80 100 120 v h s to v s s v o lta g e ( v ) v d d to v s s v o lta g e ( v ) isl2110, isl2111
10 fn6295.6 march 8, 2012 isl2110, isl2111 package outline drawing l10.4x4 10 lead thin dual flat no-lead plastic package rev 1, 1/08 typical recommended land pattern detail "x" side view top view bottom view located within the zone indicated. the pin #1 identifier may be unless otherwise specified, tolerance : decimal 0.05 tiebar shown (if present) is a non-functional feature. the configuration of the pin #1 identifier is optional, but must be between 0.15mm and 0.30mm from the terminal tip. dimension b applies to the metallized terminal and is measured dimensions in ( ) for reference only. dimensioning and tolerancing conform to amse y14.5m-1994. 6. either a mold or mark feature. 3. 5. 4. 2. dimensions are in millimeters. 1. notes: 4.00 2.60 0.15 ( 3.80) (4x) ( 10x 0 . 30 ) ( 8x 0 . 8 ) 0 .75 base plane c seating plane 0.08 c 0.10 c 10 x 0.30 see detail "x" 0.10 4 ca mb index area 6 pin 1 4.00 a b pin #1 index area bsc 3.2 ref 8x 0.80 6 ( 10 x 0.60 ) 0 . 00 min. 0 . 05 max. c 0 . 2 ref 10x 0 . 40 3.00 ( 2.60) ( 3.00 ) 0.05 m c 6 5 10 1
11 fn6295.6 march 8, 2012 isl2110, isl2111 package outline drawing l12.4x4a 12 lead dual flat no-lead plastic package rev 1, 3/11 typical recommended land pattern detail "x" side view top view bottom view located within the zone indicated. the pin #1 identifier may be unless otherwise specified, tolerance : decimal 0.05 tiebar shown (if present) is a non-functional feature. the configuration of the pin #1 identifier is optional, but must be between 0.15mm and 0.30mm from the terminal tip. lead width applies to the metallized terminal and is measured dimensions in ( ) for reference only. dimensioning and tolerancing conform to amse y14.5m-1994. 6. either a mold or mark feature. 3. 5. 4. 2. dimensions are in millimeters. 1. notes: 4.00 1.58 0.15 ( 3.80) (4x) ( 12x 0 . 25) ( 10x 0 . 5 ) 1.00 max base plane c seating plane 0.08 c 0.10 c 12 x 0.25 see detail "x" 0.10 4 ca mb index area 6 pin 1 4.00 a b pin #1 index area 3.2 ref 10x 0.50 bsc 6 ( 12 x 0.65 ) 0 . 00 min. 0 . 05 max. c 0 . 2 ref 12x 0 . 45 2.80 ( 1.58) ( 2.80 ) 0.05 m c 7 6 12 1
12 fn6295.6 march 8, 2012 isl2110, isl2111 package outline drawing m8.15 8 lead narrow body small outline plastic package rev 3, 3/11 detail "a" top view index area 123 -c- seating plane x 45 notes: 1. dimensioning and tolerancing per ansi y14.5m-1982. 2. package length does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 3. package width does not include interlead flash or protrusions. interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 4. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 5. terminal numbers are shown for reference only. 6. the lead width as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 7. controlling dimension: millimeter. co nverted inch dimensions are not necessarily exact. 8. this outline conforms to jedec publication ms-012-aa issue c. side view ?a side view ?b? 1.27 (0.050) 6.20 (0.244) 5.80 (0.228) 4.00 (0.157) 3.80 (0.150) 0.50 (0.20) 0.25 (0.01) 5.00 (0.197) 4.80 (0.189) 1.75 (0.069) 1.35 (0.053) 0.25(0.010) 0.10(0.004) 0.51(0.020) 0.33(0.013) 8 0 0.25 (0.010) 0.19 (0.008) 1.27 (0.050) 0.40 (0.016) 1.27 (0.050) 5.20(0.205) 1 2 3 4 5 6 7 8 typical recommended land pattern 2.20 (0.087) 0.60 (0.023)
13 fn6295.6 march 8, 2012 package outline drawing l8.4x4 8 lead dual flat no-lead plastic package rev 0, 11/09 typical recommended land pattern detail "x" side view top view bottom view located within the zone indicated. the pin #1 identifier may be unless otherwise specified, tolerance : decimal 0.05 tiebar shown (if present) is a non-functional feature. the configuration of the pin #1 identifier is optional, but must be between 0.15mm and 0.30mm from the terminal tip. dimension applies to the metallized terminal and is measured dimensions in ( ) for reference only. dimensioning and tolerancing conform to asme y14.5m-1994. 6. either a mold or mark feature. 3. 5. 4. 2. dimensions are in millimeters. 1. notes: 4.00 2.50 0.10 0.15 ( 3.80) (4x) ( 8x 0 . 30 ) ( 6x 0 . 8 ) 0 .9 0.10 base plane c seating plane 0.08 c 0.10 c 8 x 0.30 see detail "x" 0.10 4 ca mb index area 6 pin 1 4.00 a b pin #1 index area bsc 2.4 ref 6x 0.80 6 ( 8 x 0.60 ) 8x 0 . 40 0.10 3.45 0.10 ( 2.50) ( 3.45 ) 0.05 m c 5 4 8 1 0 . 00 min. 0 . 05 max. c 0 . 2 ref isl2110, isl2111

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