1. 2. 3. material content data sheet sales product name tle5206-2gp issued 28. august 2013 ma# MA000543916 package pg-dso-20-37 weight* 1.15 g construction element material group substances cas# if applicable weight [g] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 0.000 0.00 0 3600 leadframe inorganic material phosphorus 7723-14-0 0.000 0.00 0 non noble metal zinc 7440-66-6 0.000 0.00 0 non noble metal iron 7439-89-6 0.000 0.00 0 non noble metal copper 7440-50-8 0.000 0.00 0 3600 wire noble metal gold 7440-57-5 0.000 0.00 0 3600 encapsulation organic material carbon black 1333-86-4 0.000 0.00 0 plastics epoxy resin - 0.000 0.00 0 inorganic material silicondioxide 60676-86-0 0.000 0.00 0 3600 leadfinish non noble metal tin 7440-31-5 0.000 0.00 0 3600 solder noble metal silver 7440-22-4 0.000 0.00 0 non noble metal tin 7440-31-5 0.000 0.00 0 non noble metal lead 7439-92-1 0.000 0.00 0 3600 *deviation < 10% sum in total: 0,00 21601 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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