creat by art - high efficiency, low vf - high current capability - high reliability - high surge current capability - low power loss - halogen-free according to iec 61249-2-21 definition molding compound, ul flammability classification rating 94v-0 base p/n with suffix "g" on packing code - halogen-free terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test v rrm 50 100 150 200 300 400 500 600 v v rms 35 70 105 140 210 280 350 420 v v dc 50 100 150 200 300 400 500 600 v i f(av) a trr ns cj pf r ja o c/w t j o c t stg o c document number: ds_d1312029 version: h13 sft11g thru sft18g taiwan semiconductor glass passivated su p er fast rectifiers features - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec mechanical data case: ts-1 ts-1 weight: 0.2g (approximately) maximum ratings and electrical characteristics (t a =25 unless otherwise noted) parameter symbol sft 11g sft 12g sft 13g sft 14g sft 15g sft 16g sft 17g sft 18g unit maximum repetitive peak reverse voltage maximum rms voltage maximum dc blocking voltage maximum average forward rectified current 1 v maximum reverse current @ rated vr t j =25 t j =125 i r peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm 30 a maximum instantaneous forward voltage (note 1) @ 1 a v f a 20 typical thermal resistance 100 operating junction temperature range storage temperature range - 55 to +150 - 55 to +150 typical junction capacitance (note 3) 10 note 3: measured at 1 mhz and applied reverse voltage of 4.0v d.c. note 1: pulse test with pw=300 s, 1% duty cycle note 2: reverse recovery test conditions: i f =0.5a, i r =1.0a, i rr =0.25a 0.95 1.3 1.7 5 100 maximum reverse recovery time (note 2) 35
creat by art part no. part no. sft16g sft16g (ta=25 unless otherwise noted) document number: ds_d1312029 version: h13 packing ts-1 r0 3,000 / ammo box (52mm taping) sft11g thru sft18g taiwan semiconductor ordering information packing code green compound code package 3,000 / ammo box (26mm taping) ts-1 b0 ts-1 note 1: "x" defines voltage from 50v (sft11g) to 600v (sft18g) sft1xg (note 1) a0 suffix "g" ts-1 a1 a0 g example preferred p/n packing code green compound code ratings and characteristics curves green compound description 1,000 / bulk packing 5,000 / 13" paper reel sft16g a0 a0 sft16g a0g 0.0 0.5 1.0 1.5 0 255075100125150175 average forward current (a) ambient temperature ( o c) fig.1- maximum average forward current derating resistive or inductive load 0 5 10 15 20 25 30 35 110100 peak forward surge current (a) number of cycles at 60 hz fig. 3- maximum non-repetitive forward surge current 8.3ms single half sine wave jedec method 0.1 1 10 100 1000 0 20 40 60 80 100 120 140 instantaneous reverse current ( a) percent of rated peak reverse voltage (%) fig.2- typical reverse characteristics tj=25 tj=75 0.1 1 10 100 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 instantaneous forward current (a) forward voltage (v) fig. 4- typical forward characteristics sft17g-sft18g pulse width=300 s 1% duty cycle sft15g-sft16g sft11g - sft14g
creat by art min max min max a 2.00 2.70 0.079 0.106 b 0.53 0.64 0.021 0.025 c 25.40 - 1.000 - d 3.00 3.30 0.118 0.130 e 25.40 - 1.000 - p/n = specific device code g = green compound yw = date code f = factory code document number: ds_d1312029 version: h13 marking diagram sft11g thru sft18g taiwan semiconductor package outline dimensions dim. unit (mm) unit (inch) 0 10 20 30 40 50 60 70 0.1 1 10 100 junction capacitance (pf) reverse voltage (v) fig. 5- typical junction capacitance sft15g-sft18g sft11g-sft14g f=1.0mhz vslg=50mvp-p
creat by art assumes no responsibility or liability for any errors inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d1312029 version: h13 sft11g thru sft18g taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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