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product structure : silicon monolithic integrated circuit this product is not designed for protection against radioactive rays 1/ 18 tsz02201-0g1g0az00440-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 14 apr 2015 rev.002 www.rohm.com single-output ldo regulator 1a variable output ldo regulators bd00c0aw xx series general description the bd00c0aw series is a low -saturation regulator. the output voltage can be arbitrarily configured depending on the external resistor combination. this ic has a built- in over-current protection circuit that prevents the destruction of the ic due to output short circuit and a thermal shutdown circuit that protects the ic from thermal damage due to overloading. features ? output current capability : 1a ? high output voltage precision : 1% ? low saturation with pdmos output ? built-in over-current protection circuit that prevents the destruction of the ic due to output short circuit ? built-in thermal shutdown circuit for protecting the ic from thermal damage due to overloading ? low esr capacitor applications audiovisual equipment, fpd s, televisions, personal computers or any other consumer device key specifications ? supply voltage range: 4.0v to 26.5v ? output voltage range: 3.0v to 15.0v ? output current: 1a ? output voltage precision: 1% ? operating temperature range: - 40 ta + 10 5 packages w (typ.) x d (typ.) x h (max.) to252-5 6.50mm x 9.50mm x 2.50mm to220cp- v5 10.00mm x 20.12mm x 4.60mm typical application circuit ordering information b d 0 0 c 0 a w x x - e 2 part number output voltage 00:variable current capacity c0a 1a shutdown switch w : with switch package fp : to252-5 cp -v5:to220cp- v5 packaging specification e2: embossed tape and reel lineup maximum output current (max.) package orderable part number 1a to252-5 reel of 2000 bd00c0awfp- e2 to220cp- v5 reel of 500 BD00C0AWCP-V5E2 to252-5 to220cp- v5 figure 1 . typical application circuit vcc ctl gnd adj vo cout cin vcc r 1 r 2 datashee t downloaded from: http:///
2/ 18 tsz02201-0g1g0az00440-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 14 apr 2015 rev.002 bd00c0awxx series www.rohm.com pin configurations pin description pin no. symbol (bd00c0awfp / bd00c0awcp-v5) function 1 ctl output control pin 2 v cc power supply pin 3 n.c. / gnd n.c. pin / gnd 4 v o output pin 5 adj variable pin fin gnd / gnd / - n.c.pin can be open. because it isn't connect it inside of ic. block diagram to252-5 (top view) 1 2 3 4 5 to220cp- v5 (top view) 1 2 3 4 5 figure 3. bl ock diagram figure 2. pin configurations fin 1 2 ocp vref tsd driver 4 5 3 : ^o : ??o : ?? vref ocp tsd driver : ?R gnd ctl vcc n.c.(to252-5 gnd(hrp5) vo adj gnd / - n.c. / gnd vref: bandgap reference ocp: over current protection circuit tsd: thermal shut-down circuit driver: power transistor driver downloaded from: http:///
3/ 18 tsz02201-0g1g0az00440-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 14 apr 2015 rev.002 bd00c0awxx series www.rohm.com absolute maximum ratings (ta=25 ) parameter symbol ratings unit supply voltage *1 v cc -0.3 to +35.0 v output control voltage *2 v ctl -0.3 to +35.0 v power dissipation (to252- 5) *3 pd 1.3 w power dissipation (to220cp-v5) *4 pd 1.85 w operating temperature range topr - 40 to + 105 storage temperature range tstg - 55 to +150 maximum junction temperature tjmax +150 *1 not to exceed pd. *2 the order of starting up power supply (v cc ) and ctl pin doesn't have either in the problem within the range of the operation power-supply voltage ahead. *3 to252-5:reduced by 10.4mw / over ta = 25 , when mounted on glass epoxy board: 70mm70mm1.6mm. *4 to220cp-v5: reduced by 14.8mw / c over ta = 25 c without heatsink. recommended operating ratings (ta=25 ) parameter symbol min. max. unit supply voltage v cc 4.0 26.5 v output control voltage v ctl 0 26.5 v output current i o 0 1.0 a output voltage v o 3.0 15.0 v electrical characteristics unless otherwise specified, ta=25 , v cc =10v, v ctl =5v, i o =0ma, v o =5.0vsetting ( resistor valued used between adj and vo is 56.7k , while resistor value used between adj and gnd is 10k ) parameter symbol guaranteed limits unit conditions min. typ. m ax . shutdown current isd 0 10 a v ctl =0v circuit current ib 0.5 1.0 ma adj terminal voltage v adj 0.742 0.750 0.758 v i o =50ma dropout voltage vd 0.3 0.5 v v cc =v o 0.95, i o =500 ma ripple rejection r.r. 45 55 db f=120hz,ein *1 =1vrms, i o =100ma line regulation reg.i 20 60 mv v cc =6 25v load regulation reg.l v o 0.010 v o 0.015 v i o =5ma 1a temperature coefficient of output voltage tcvo .1 +0.04 %/ i o =5ma,tj=- 40 to - 20 tcvo .2 0.005 %/ i o =5ma,tj=- 20 to +105 ctl on mode voltage vthh 2.0 v active mode ctl off mode voltage vthl 0.8 v off mode ctl bias current i ctl 25 50 a *1 ein : input voltage ripple downloaded from: http:///
4/ 18 tsz02201-0g1g0az00440-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 14 apr 2015 rev.002 bd00c0awxx series www.rohm.com typical performance curves bd00c0aw series (v o =5.0v output setting) unless otherwise specified, ta=25 , v cc =10v, v ctl =5v, i o =0ma, v o =5.0v (resistor valued used between adj and vo is 56.7k , while resistor value used between adj and gnd is 10k ) figure 4. circuit current (i feedback_r P 75a) figure 5. shutdown current figure 6. line regulation (i o =0ma) figure 7. line regulation (i o =500ma) 0.0 0.2 0.4 0.6 0.8 1.0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 circuit current:ib + i feedback_r [ma] supply voltage:vcc [v] 0 3 6 9 12 15 18 0 2 4 6 8 10 12 14 16 18 20 22 24 26 shutdown current:isd [ a] supply voltage:vcc [v] 0 1 2 3 4 5 6 0 2 4 6 8 10 12 14 16 18 20 22 24 26 output voltage:vo [v] supply voltage:vcc [v] 0 1 2 3 4 5 6 0 2 4 6 8 10 12 14 16 18 20 22 24 26 output voltage:vo [v] supply voltage:vcc [v] downloaded from: http:///
5/ 18 tsz02201-0g1g0az00440-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 14 apr 2015 rev.002 bd00c0awxx series www.rohm.com figure 8. load regulation typical performance curves - continu ed figure 9. dropout voltage (v cc =4.75v) (l o =0ma 1000ma) figure 10. ripple rejection (l o =100ma) figure 11. output voltage temperature characteristic 0 1 2 3 4 5 6 0 400 800 1200 1600 2000 2400 output voltage:vo [v] output current:io [ma] 0 100 200 300 400 500 600 700 800 900 1,000 0 200 400 600 800 1000 dropout voltage : vd [mv] output current:io [ma] 0 10 20 30 40 50 60 70 80 10 100 1000 10000 100000 1000000 ripple rejection:r.r. [db] frequency: f [hz] 0 1 2 3 4 5 6 -40 -20 0 20 40 60 80 100 output voltage: vo [v] ambient temperature: [ ] downloaded from: http:///
6/ 18 tsz02201-0g1g0az00440-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 14 apr 2015 rev.002 bd00c0awxx series www.rohm.com typical performance curves - continu ed figure 15. thermal shutdown circuit characteristic figure 14. ctl voltage vs output voltage figure 12 . ci rcuit current (l o =0ma 1000 ma) (ifeedback_r P 75a) figure 13. ctl voltage vs ctl current 0.0 0.2 0.4 0.6 0.8 1.0 0 200 400 600 800 1000 circuit current:ib+i feedback_r [ma] output current:io [ma] 0 20 40 60 80 100 120 140 160 0 2 4 6 8 10 12 14 16 18 20 22 24 26 ctl bias current:i ctl [ a] control voltage: v ctl [v] 0 1 2 3 4 5 6 0 2 4 6 8 10 12 14 16 18 20 22 24 26 output voltage:vo [v] control voltage: v ctl [v] 0 1 2 3 4 5 6 130 140 150 160 170 180 190 output voltage:vo [v] ambient temperature:ta [ ] downloaded from: http:///
7/ 18 tsz02201-0g1g0az00440-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 14 apr 2015 rev.002 bd00c0awxx series www.rohm.com a vcc ctl gnd vo adj 1 f 5v 10 k 56 .7k 1 f measurement circuit of fig.1 a vcc ctl gnd vo adj 1 f 56 .7k vcc ctl gnd vo adj 1 f 5v 56 .7k vcc ctl gnd vo adj 1 f 5v 56 .7k vcc ctl gnd vo adj 1 f 5v 56 .7k vcc ctl gnd vo adj 1 f 5v 56 .7k vcc ctl gnd vo adj 1 f 5v 56 .7k vcc ctl gnd vo adj 1 f 5v 56 .7k vcc ctl gnd vo adj 1 f 5v 56 .7k vcc c tl gnd vo adj 1 f 10 v 56 .7k vcc ctl gnd vo adj 1 f 10 v 56 .7k vcc ctl gnd vo adj 1 f 5v 56 .7k v v 500 ma a a 4. 75 v v 100 ma 10 v v 10 v a a 10 v v v 10 v 10 v 1vrms 10 k 1 f 10 k 1 f 10 k 1 f 10 k 1 f 10 k 1 f 10 k 1 f 10 k 1 f 10 k 1 f 10 k 1 f 10 k 1 f 10 k 1 f i feedback _r i feedback _r measurement circuit of fig.2 measurement circuit of fig.3 measurement circuit of fig.4 measurement circuit of fig.5 measurement circuit of fig.6 measurement circuit of fig.7 measurement circuit of fig.8 measurement circuit of fig.9 measurement circuit of fig. 10 measurement circuit of fig. 11 measurement circuit of fig. 12 measurement circuit for re ference data measurement circuit of figure 4 measurement circuit of figure 5 measurement circuit of figure 6 measurement circuit of figure 7 measurement circuit of figure 8 measurement circuit of figure 9 measurement circuit of figure 10 measurement circuit of figure 11 measurement circuit of figure 12 measurement circuit of figure 13 measurement circuit of figure 14 measurement circuit of figure 15 downloaded from: http:///
8/ 18 tsz02201-0g1g0az00440-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 14 apr 2015 rev.002 bd00c0awxx series www.rohm.com v cc gnd v cc gnd application examples ? positive voltage surges on v cc pin a power zener diode should be inserted between v cc and gnd for protection against voltage surges of more than 35 v on the v cc pin. ? negative voltage surges on v cc pin a schottky barrier diode should be inserted between v cc and gnd for protection against voltages lower than gnd on th e v cc pin. ? output protection diode loads with large inductance components may cause rever se current flow during startup or shutdown. in such cases, a protection diode should be inserted on the output to protect the ic. vo figure 16. figure 17. figure 18. downloaded from: http:///
9/ 18 tsz02201-0g1g0az00440-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 14 apr 2015 rev.002 bd00c0awxx series www.rohm.com power dissipation mounted on a rohm standard board board size : 70mm70mm1.6mm copper foil area :7mm7mm to252-5 ja= 96.2( /w) ic mounted on a rohm standard board board size 70mm70mm1.6mm copper area 7mm7mm :2-layer pcb (copper foil area on the reverse side of pcb:15mm15mm) :2-layer pcb (copper foil area on the reverse side of pcb:70mm70mm) :4-layer pcb (copper foil on the reverse side of pcb:70mm70mm) :ja=67.6 /w :ja=35.7 /w :ja=26.0 /w :ic only ja=67.6( /w ) : al uminum heat dissipation board ja=6.3( /w ) (reference data) figure 21. to220cp- v5 0 5 10 15 20 25 0 25 50 75 100 125 150 ambient temperature ta( ) power dissipation pd (w) 1.85 20.0 (reference data)) figure 19. to252-5 0 1 2 3 4 5 0 25 50 75 100 125 150 ambient temperature ta( ) power dissipation pd(w) 1.30 figure 20. to252-5 0 1 2 3 4 5 0 25 50 75 100 125 150 ambient temperature ta( ) power dissipation pd(w) 1.85 3.50 4.80 downloaded from: http:///
10 / 18 tsz02201-0g1g0az00440-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 14 apr 2015 rev.002 bd00c0awxx series www.rohm.com when operating at temperature more than ta=25 , please refer to the power dissipation characteristic curve shown in figure 19 to figure 21. the ic characteristics are closely related to the temperature at which the ic is used, so it is necessary to operate th e ic a t temperatures less than the maximum junction temperature tjma x. figure 19 to figure 21 show the acceptable power dissipatio n characteristic curves of to252-5 package and to220cp-v5 package. even when the ambient temperature ( ta ) is at normal temperature (25 ), the chip junction temperature ( tj ) may be quite high so please operate the ic at temperatures less tha n the acceptable power dissipation . the calculation method for power consumption pc(w) is as follow s :(figure 20 and figure 21) pc=(v cc -v o )i o +v cc ib acceptable loss pd pc solving this for load current i o in order to operate within the acceptable loss, it is then possible to find the maximum load current io max with respect to the applied voltage v cc at the time of thermal design. calculation example) when to252- 5, ta=85 , v cc =10v, v o =5v calculation example) when to220cp- v5 , ta=85 , v cc =25v , v o = 5v please refer to the above information and keep thermal desi gns within the scope of acceptable loss for all operati ng temperature ranges. the power consumption pc of the ic when there is a short circuit (short between v o and gnd) is: pc=v cc (ib+ishort) v cc : v o : i o : ib: ishort: input voltage output voltage load current circuit current short current (please refer to figure 12 for ib.) (please refer t o figure 8 for ishort.) figure 20 : ja =26.0 /w -38.4mw/ 25 =4.80w 85 =2.496w i o i o 498.2ma (ib: 0.5ma) 2.496 10 ib 5 i o 10.4 25 ib 20 figure 21 (aluminium heat dissipation board) ja=6.3 /w -160mw/ 25 =20w 85 =10.4w i o 519.4ma (ib:0.5ma) i o pd v cc ib v cc v o downloaded from: http:///
11 / 18 tsz02201-0g1g0az00440-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 14 apr 2015 rev.002 bd00c0awxx series www.rohm.com input / output equivalent circuit diagrams output voltage configuration method please connect resistors r1 and r2 (which determines the output vol tage) as shown in figure 23 . please be aware that the offset due to the current that flows from th e adj terminal becomes large when resistor values are large. du e to this, resistance ranging from 5k to 10k is highly recommended for r1. v o P v adj (r 1 +r 2 ) / r1 figure 23 . vcc ic ctl 200k 200k 1k v cc terminal ctl terminal vcc vo 15k vo adj 1k 35k v o terminal adj terminal ic adj pin vo r 2 r 1 adj P 0.75v (typ.) v adj P 0.75v figure 22. downloaded from: http:///
12 / 18 tsz02201-0g1g0az00440-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 14 apr 2015 rev.002 bd00c0awxx series www.rohm.com operational notes 1. absolute maximum ratings exceeding the absolute maximum rating for supply voltag e, operating temperature or other parameters can result in damages to or destruction of the chip. in this event it also b ecomes impossible to determine the cause of the damag e (e.g. short circuit, open circuit, etc). therefore, if any spec ial mode is being considered with values expected to ex ceed the absolute maximum ratings, implementing physical safety me asures, such as adding fuses, should be considered. 2. the electrical characteristics given in this specific ation may be influenced by conditions such as temperatur e, supply voltage and external components. transient characteristics should be sufficiently verified.. 3. gnd electric potential keep the gnd pin potential at the lowest (minimum) level und er any operating condition. furthermore, ensure that, including the transient, none of the pins voltage s are less than the gnd pin voltage. 4. ground wiring pattern when both a small-signal gnd and a high current gnd are pre sent, single-point grounding (at the set standard point) i s recommended. this in order to separate the small-signal a nd high current patterns and to ensure that voltage chang es stemming from the wiring resistance and high current do not cause any voltage change in the small-signal gnd. simil arly, care must be taken to avoid wiring pattern fluctuations in any connected external component gnd. 5. inter-pin shorting and mounting errors ensure that when mounting the ic on the pcb the direction and p osition are correct. incorrect mounting may result in damaging the ic. also, shorts caused by dust entering betwee n the output, input and gnd pin may result in damaging the ic. 6. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 7. inspection using the set board the ic needs to be discharged after each inspection proce ss as, while using the set board for inspection, connectin g a capacitor to a low-impedance pin may cause stress to the ic. as a protection from static electricity, ensure that the assembly setup is grounded and take sufficient caution wi th transportation and storage. also, make sure to turn off the power supply when connecting and disconnecting the inspection equipment. 8. power dissipation (pd) should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maxim um rating of the pd stated in this specification is when th e ic is mounted on a 70mm70mm1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the p d rating. 9. thermal design the power dissipation under actual operating conditions should be taken into consideration and a sufficient marg in should be allowed for in the thermal design. on the reverse side of the package this product has an exposed heat pad for improving the heat dissipation. use both the front and reverse side of the pcb to increase the heat dissipation pattern as far as possible. the amount of heat generated depends on the voltage difference across the input and output, load current, and bias current. therefore, when actually using the chip, ensure that the generated heat does not exceed the pd rating. tjmax: maximum junction temperature=150[ ], ta: peripheral temperature [ ], ja : thermal resistance of package-ambience[ /w], pd : package power dissipation [w], pc: power dissipation [w], v cc : input voltage, v o : output voltage, i o : load, ib : circuit current package power dissipation : pd (w) = (tjmax-ta) / ja power dissipation : pc (w) = (v cc -v o ) i o +v cc ib 10. v cc pin insert a capacitor(v o 5.0v:capacitor 1f, 3.0 v o 5.0v:capacitor 2.2f) between the v cc and gnd pins. choose the capacitance according to the line between the power smoo thing circuit and the v cc pin. selection of the capacitance also depends on the application. verify the application and al low for sufficient margins in the design. we recommend us ing a capacitor with excellent voltage and temperature characteristic s. electric capacitance ceramic capacitors, low esr capacitor ic downloaded from: http:///
13 / 18 tsz02201-0g1g0az00440-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 14 apr 2015 rev.002 bd00c0awxx series www.rohm.com 11. output pin in order to prevent oscillation, a capacitor needs to be placed between the output pin and gnd pin. we recommend a capacitor with a capacitance of more than 1 f . electrolytic, tantalum and ceramic capacitors can be used. when selecting the capacitor ensure that the capacitance of more th an 1 f is maintained at the intended applied voltage and temperature range. due to changes in temperature, the capacita nce can fluctuate possibly resulting in oscillation. for selection of the capacitor refer to the cout esr vs. i o . the stable operation range given in the reference data is based on the standalone ic and resistive load. for actual applicati ons the stable operating range is influenced by the pcb impedance, input supply impedance and load impedance . therefore verification of the final operating environment i s needed. when selecting a ceramic type capacitor, we recommend usin g x5r, x7r or better with excellent temperature and dc -biasing characteristics and high voltage tolerance. also, in case of rapidly changing input voltage and load current, select the capacitance in accordance with verifying that the actual application meets with the required specification. 12. ctl pin do not set the voltage level on the ic's enable pin in be tween vthh and vthl. do not leave it floating or unconnected, otherwise, the output voltage would be unstable. 13. rapid variation in v cc voltage and load current in case of a rapidly changing input voltage, transients in the output voltage might occur due to the use of a mo sfet as output transistor. although the actual application might b e the cause of the transients, the ic input voltage, output current and temperature are also possible causes. in case problem s arise within the actual operating range, use countermeasures such as adjusting the output capacitance. 14. minute variation in output voltage in case of using an application susceptible to minute ch anges to the output voltage due to noise, changes in in put and load current, etc., use countermeasures such as implementing f ilters. 15. over current protection circuit (ocp) this ic incorporates an integrated overcurrent protection circu it that is activated when the load is shorted. this protection circuit is effective in preventing damage due to sudden a nd unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or transi tioning of the protection circuit. 16. thermal shutdown circuit (tsd) this ic incorporates and integrated thermal shutdown circui t to prevent heat damage to the ic. normal operation should be within the power dissipation rating, if however the rati ng is exceeded for a continued period, the junction tempe rature (tj) will rise and the tsd circuit will be activated and turn a ll output pins off. after the tj falls below the tsd threshold the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set des ign or for any purpose other than protecting the ic from heat damage. cout_es r vs. i o (reference data) cin vs. cout(reference data) operation note 11 measurement circuit 4.0v v cc 26.5v 3.0v v o 15 .0 v - 40 ta +1 05 5k r 1 10k 2.2f cin 100f 1 f cout 100 f 4.0v v cc 26.5v 3.0v v o 15 .0 v - 40 ta +1 05 0a i o 1a 5k r 1 10k 1 10 100 1 10 100 cout f cin f stable operating region 2.2 unstable operating region 1 10 100 1 10 100 cout( f) cin f stable operating region 6.0v v cc 26.5v 5.0v v o 15 .0 v - 40 ta +1 05 0a i o 1a 5k r 1 10k vcc ctl vo adj gnd v ctl (5.0v) cin (1f or higher) vcc (4.0v to 26.5v) r 1 (5k to 10k ) r 2 io (rout) cout (1f or higher) esr (0.001 or higher) 0.001 0.01 0.1 1 10 100 0 200 400 600 800 1000 io(ma) cout_esr( unstable operating region stable operating region downloaded from: http:///
14 / 18 tsz02201-0g1g0az00440-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 14 apr 2015 rev.002 bd00c0awxx series www.rohm.com 17. in some applications, the v cc and pin potential might be reversed, possibly resulting in circuit internal damage or damage to the elements. for example, while the external capacito r is charged, the v cc shorts to the gnd. use a capacitor with a capacitance with less than 1000f. we also recommend u s ing reverse polarity diodes in series or a bypass betwee n all pins and the v cc pin. 18. this monolithic ic contains p+ isolation and p substrate lay ers between adjacent elements in order to keep them isolate d. p/n junctions are formed at the intersection of these p layers with the n layers of other elements to create a variety of parasitic elements. for example, in case a resistor and a transistor are connected to the pins as shown in the figure below then: the p/n junction functions as a parasitic diod e when gnd > pin a for the resistor, or gnd > pin b for the transistor. also, when gnd > pin b for the transistor (npn), the parasitic diode described above combines with the n layer of the other adjacent elements to operate as a parasitic npn transistor. parasitic diodes inevitably occur in the structure of the ic. t heir operation can result in mutual interference between circuits and can cause malfunctions and, in turn, physica l damage to or destruction of the chip. therefore do not empl oy any method in which parasitic diodes can operate su ch as applying a voltage to an input pin that is lo wer than th e (p substrate) gnd. n n p + p n n p + p substrate parasitic element gnd n p + n n p + n p p substrate gnd gnd parasitic element pin a pin a pin b pin b b c e parasitic element gnd parasitic element or transistor parasitic element c be transistor (npn) resistor downloaded from: http:///
15 / 18 tsz02201-0g1g0az00440-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 14 apr 2015 rev.002 bd00c0awxx series www.rohm.com marking diagrams to252-5 (top view) part number marking lot number 00c 0 a w to220cp- v5 (top view) d00c 0w cp 5 part number marking lot number downloaded from: http:///
16 / 18 tsz02201-0g1g0az00440-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 14 apr 2015 rev.002 bd00c0awxx series www.rohm.com physical dimension, tape and reel information package name to252-5 downloaded from: http:///
17 / 18 tsz02201-0g1g0az00440-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 14 apr 2015 rev.002 bd00c0awxx series www.rohm.com physical dimension, tape and reel information package name to220cp- v5 downloaded from: http:///
18 / 18 tsz02201-0g1g0az00440-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 14 apr 2015 rev.002 bd00c0awxx series www.rohm.com revision history date revision changes 08.feb.2013 001 new release 14 .apr.2015 002 p.1 figure of package image (to220cp- v5 ) was corrected. downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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