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datashee t product structure silicon monolithic integrated circuit this product has no designed protection against radioactive rays . 1/ 24 tsz02201-0a1a0a900060-1-2 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 www.rohm.com 27.nov.2014 rev.001 4.5v to 28v, 3a 1ch synchronous buck converter integrated fet BD95513MUV general description BD95513MUV is a switching regulator with current capability of 3a and the ability to achieve low output voltages of 0.7v to 5.0v from a wide input voltage range of 4.5v to 28v. it has built- in n-mos power transistors and implementation of simple light load mode (sllm tm ) technology make this device highly-efficien t. sllm tm improves efficiency when the device is used with light load, providing high efficiency over a wider range of loads. the device also uses a new technology called h 3 r eg tm proprietary control method, to achieve ultra-fast transient response against load changes. bd955 13 muv is especially designed for various applications and is integrated with protection features such as soft-start, variable frequency, short circuit protection with timer latch, over voltage protection, and power good function. features ? integratedl 5v linear voltage regulator ? h 3 reg tm dc/dc converter controller ? adjustable simple light load mode (sllm tm ), qu iet light load mode (qllm) and forced continuous mode ? built-in thermal shutdown (tsd), low input, over curr ent protection (ocp), over voltage protection (ovp) and under voltage lockout (uvlo) protection ? soft start function that minimizes rush current during startup ? adjustable switching frequency (f = 200 khz to 6 00 khz) ? built-in output discharge function ? tracking function ? integrated bootstrap d iode application mobile pc, desktop pc, lcd-tv, digital household electronics key specification ? input voltage range: 4. 5v to 28 v ? output voltage range: 0.7v to 5.0v ? output current: 3.0a(max) ? high side on -resistance: 120m (typ) ? low side on -resistance: 120m (typ) ? standby current: 0a (typ) ? operating temperature range: - 10 c to +100 c package w (typ) x d (typ) x h (max) typical application circuit figure 1. typical application circuit vqfn032v5050 5.00mm x 5.00mm x 1.00mm c 11 c 10 r 6 r 4 v reg (5v) ref c6 c 4 c 1 c 7 c 5 en v reg v in v reg c 12 pgnd pgnd c 14 pgnd pgnd r 7 l1 avin bd95513mvu u1 gnd v out en vreg ref(0.7v) fs ss/ track vcc gnd vdd boot v in sw pgnd fb 7 10 15 11 16 17 12 21 5 1 to 4 26 to 31 22 to 25,32 12v 1.8v/3a 18 pgood 6 n.c. . 20 r 1 r 8 extv cc mode 9 mode c 13 13 14 vout 19 v dd ctl ctl 8 5v r 9 c 3 downloaded from: http:///
BD95513MUV 2/ 24 tsz02201-0a1a0a900060-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 27.nov.2014 rev.001 pin configuration pin description (function table) pin no. pin name pin description 1 to 4 v in battery voltage input (4.5v to 28 v) 5 boot hg driver power supply 6 pgood power good output (high when output 10% of regulation) 7 avin battery voltage sense 8 ctl linear regulator on/off (h igh = 5.0v, l ow = off) 9 mode control mode selection gnd : continuous mode 3.0v : qllm v cc : sllm tm 10 en enable output (h igh when vout on) 11 fs switching frequency adjustment (r fs = 30k to 100 k ) 12 gnd sense ground 13 vcc power supply input 14 extvcc external power supply input 15 vreg ic reference voltage (5.0v / 200ma) 16 ss soft start condenser input 17 ref output reference voltage (0.7v) 18 fb feedback input (0.7 v) 19 vout voltage discharge output 20 n.c. no connect pin 21 vdd power supply input (5v) 22 to 25 pgnd power ground 26 to 31 sw output to inductor 32 pgnd power ground underside fin substrate connection 31 30 29 26 25 22 21 20 19 18 17 9 10 11 12 13 14 1 2 3 4 5 6 v in v in v in v in boot pgood pgnd v dd n.c. vout fb ref mode en fs gnd v cc extv cc sw sw sw sw sw pgnd 7 av in 8 ctl 15 vreg 16 ss 23 pgnd 24 pgnd 27 sw 28 32 note: connect the underside (fin) to the ground terminal top view figure. 2 pin configuration pgnd downloaded from: http:///
BD95513MUV 3/ 24 tsz02201-0a1a0a900060-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 27.nov.2014 rev.001 block diagram description of blocks 1. v cc (pin 13) this is the power supply pin for the ics internal circuit s , except for the fet driver. use by connecting it to vreg output . using rc filter with 10 , 0.1 f( app.) for vcc pin is recommended. 2. en (pin 10) this pin enables or disables the switching regulator. when the voltage on en pin is at least 2.3v, the switching regulator is on. conversely, it is off when the voltage at en pin is lower than 0.8v. 3. v dd (pin 21) this is the power supply pin that drives the low side fet and the bootstrap diode. it is recommended that a 1 f to 10 f bypass capacitor be connected to compensate for rush current during the fet on/off transition. 4. vreg (pin 15) output pin o f the 5v linear regulator. this pin also supplies power to the internal driver and control circuitry . vreg standby function is controlled by the ctl pin. the output supplies 5v at 100 ma and should be bypass ed to ground using a 10 f capacitor with a rating of x5r or x7r. 5. extv cc (pin 14) external power supply input for the linear regulator. when the voltage on the extv cc pin exceeds 4.4v, the regulator uses it in conjunction with other power sources to supply vreg. leave the extv cc pin floating when not in use. 6. ref (pin 17 ) reference voltage output pin. the reference voltage is set internally by the ic to 0.7v, and the ic works to keep v ref approximately equal to v fb . variations in voltage levels on this pin affect the output voltage, so the pin should be bypassed with a 100pf to 0.1f ceramic capacitor. figure 3. block diagram extv cc reference block delay h 3 reg tm controller block r s q driver circuit power good 5v reg thermal protection boot v in sw v dd pgnd n.c. v ou t en/uvlo gnd mode mode tsd ilim fs vreg uvlo ilim scp tsd fb pgood ref(0.7v) ctl en av in ss v dd ss soft start ovp ref x 1.2 fb scp uvlo vreg av in v ref x 0.85 v ss x 0.85 vout mode en ss av in ocp v cc mode mode 13 7 16 5 10 8 17 6 18 14 15 11 9 12 19 20 21 1 2 3 4 26 27 28 30 31 22 23 24 25 32 29 hg lg downloaded from: http:///
BD95513MUV 4/ 24 tsz02201-0a1a0a900060-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 27.nov.2014 rev.001 description of blocks C continued 7. ss (pin 16 ) soft start/stop pin. when en is set to high, the capacitor between the internal current source and ss-gnd controls the startup time of the ic. when the voltage on the ss pin is lower than the ref output voltage (0.7v), the output volt age is held at the same voltage as the ss pin. 8. av in (pin 7) the BD95513MUV controls the duty cycle and output voltage based on the input voltage at this pin, so voltage variations or oscillations on this line can cause unstable operation. this pin also acts as the voltage input for the switching block, so insufficient coupling impedance can also cause unstable operation. therefore, this line should be bypassed with either a power capacitor or rc filter. 9. fs (pin 11) frequency-adjusting resistance input pin. attaching a resistance of 30 k? to 100 k? adjusts the switching frequency from 200 khz to 600khz. 10. boot (pin 5) this pin serves as the power source for the high side of the fet driver. a bootstrap diode is integrated with in the ic. the maximum voltage on this pin should not exceed +3 0v with reference to gnd or +7 v with reference to sw. when operating the switching regulator, the operation of the bootstrap circuitry causes the boot voltage to swi ng from (v in + v dd ) to v dd . 11. pgood (pin 6) power good indicator. this open-drain output should be connected to a power supply via a 100 k? pull -up resistor. 12. mode (pin 9) mode selection pin. when low, the ic functions in forced-continuous mode; at voltages from 0v to 3v, qllm mode; when high, sllm tm mode. 13. ctl (pin 8) linear regulator control pin. when voltage is 2.3v or higher, a logic high is recognized and the internal regulator (v reg = 5v) is switched on . at voltages of 0.8v or lower, a logic low is recognized and the regulator is switched off . however, even if en is logic high, the switching regulator will not operate if ctl is logic low. 14. fb (pin 18 ) output voltage feedback input. v fb is held at 0.7v by the ic. 15. sw (pin 26 to 31) output from the switching regulator to the inductor. this output swings from v in to gnd. the trace from the output to the inductor should be as short and wide as possible. 16. vout (pin 19) voltage output discharge pin. when en is off, this output is pulled to low. 17. v in (pin 1 to 4) power supply input. the ic can accept any input from 4.5v to 28v. this pin should be bypassed directly to ground by a power capacitor. 18. pgnd (pin 22 to 25, 32) power ground terminal. downloaded from: http:///
BD95513MUV 5/ 24 tsz02201-0a1a0a900060-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 27.nov.2014 rev.001 absolute maximum ratings (ta = 25 c ) parameter symbol rating unit input voltage 1 v cc 7 (note 1) v input voltage 2 v dd 7 (note 1) v input voltage 3 av in 30 (note 1) v input voltage 4 v in 30 (note 1) v external v cc voltage extv cc 7 (note 1) v boot voltage v boot 35 v boot- sw voltage v boot - sw 7 (note 1) v output feedback voltage v fb v cc v ss/fs/mode voltage v ss/ v fs/ v mode v cc v vreg voltage v reg v cc v en/ctl input voltage v en/ v ctl 7 (note 1) v p good voltage v pgood 7 (note 1) v output current (average) i sw 3 (note 1) a power dissipation 1 pd1 0.3 8 (note 2) w power dissipation 2 pd2 0.88 (note 3 and note 6) w power dissipation 3 pd3 2.06 (note 4 and note 6) w power dissipation 4 pd4 4.56 (note 5 and note 6) w operating temperature range topr - 10 to +100 c storage temperature range tstg - 55 to +1 50 c junction temperature tjmax +150 c (note 1 ) should not exceed pd. (note 2 ) ta 25 c ( ic only), power dissipated at 3.0 mw / c . (note 3 ) ta 25 c (single-layer board, 20.2 mm 2 copper heat dissipation pad), power dissipated at 7.0 mw / c . (note 4 ) ta 25 c (4 -layer board, 10.29 mm 2 copper heat dissipation pad on top layer, 5505 mm 2 pad on 2nd and 3rd layer), power dissipated at 16.5 mw/ c . (note 5 ) ta 25 c (4 -layer board, all layers with 5505 mm 2 copper heat dissipation pads), power dissipated at 36.5 mw/ c . (note 6 ) values observed with chip backside soldered. when unsoldered, power dissipation is lower. caution: operating the ic over the absolute maximum ratings may damage the ic. the damag e can either be a short circuit between pins or an open circuit between pins and internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (ta = 25 c ) parameter symbol rating unit min max input voltage 1 v cc 4.5 5.5 v input voltage 2 v dd 4.5 5.5 v input voltage 3 av in 4.5 28 v input voltage 4 v in 4.5 28 v external v cc voltage extv cc 4.5 5.5 v boot voltage v boot 4.5 33 v sw voltage v sw -0.7 + 28 v boot- sw voltage v boot - sw 4.5 5.5 v mode input voltage v mode 0 5.5 v en/ctl input voltage v en /v ctl 0 5.5 v pgood voltage v pgood 0 5.5 v minimum on time t on _min - 100 ns downloaded from: http:///
BD95513MUV 6/ 24 tsz02201-0a1a0a900060-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 27.nov.2014 rev.001 electrical characteristics (unless otherwise noted, ta=25 c , av in =12v, v cc =v dd =v reg , v en /v ctl =5v, v mode =0v, r fs =180k ) parameter symbol limit unit conditions min typ max [whole device] av in bias current 1 i in 1 - 1200 1800 a av in bias current 2 i in 2 - 150 250 a extv cc =5v av in standby current i instb - 0 10 a v ctl =v en =0v en low voltage v en low gnd - 0.8 v en hig h voltage v en high 2.3 - 5.5 v en bias voltage i en - 12 20 a ctl low voltage v ctllow gnd - 0.8 v ctl high voltage v ctlhigh 2.3 - 5.5 v ctl bias current i ctl - 1 6 a [5v regulator] vreg input voltage v reg 4.90 5.00 5.10 v av in =6.0v to 25v i r eg =0 to 100ma maximum current i reg 100 - - ma [5v switch] extv cc input threshold voltage ev cc _ uvlo 4.2 4.4 4.6 v extv cc : sweep up switch resistance r ev cc - 1.0 2.0 [ under -voltage lockout protection] av in threshold voltage av in _uvlo 4.1 4.3 4.5 v v cc : sweep up av in hysteresis voltage dav in _uvlo 100 160 220 mv v cc : sweep down vreg threshold voltage v reg_uvlo 4.1 4.3 4.5 v v reg : sweep up v re g hysteresis voltage dv reg_uvlo 100 160 220 mv v reg : sweep down [h 3 r eg tm control block] on time t on 400 500 600 nsec max on time t onmax 10.0 22.0 40.0 sec min off time t offmin - 450 550 nsec [fet block] high side on -resistance r on _ high - 120 200 m low side on -resistance r on _ low - 120 200 m [scp block] scp startup voltage v scp 0.420 0.490 0.560 v when v fb : 30% down delay t scp 0.5 1 2 ms downloaded from: http:///
BD95513MUV 7/ 24 tsz02201-0a1a0a900060-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 27.nov.2014 rev.001 electrical characteristics - continued (unless otherwise noted, ta=25 c , av in =12v, v cc =v dd =v reg , v en /v ctl =5v, v mode =0v , r fs =180k ) parameter symbol limit unit conditions min typ max [o ver-voltage protection block] ovp detect voltage v ovp 0.800 0.840 0.880 v when v fb : 20% up [soft start block] charge current i ss 1.4 2.2 3.0 a standby voltage v ss _ stb - - 100 mv [current regulation block] maximum output current i ocp 3 - - a [voltage detection block] feedback terminal voltage 1 v fb 1 0.693 0.700 0.707 v feedback terminal voltage 2 v fb 2 0.690 0.700 0.710 v ta =- 10 c to + 100 c i out = 0a to 3a feedback terminal bias current i fb - 100 0 + 100 na [mode block] sllm tm condition v th sllm v cc -0.5 - v cc v sllm tm longest low-gate off time: forced continuous mode v th cont gnd - 0.5 v continuous mode open voltage v mode 1.5 - 3.0 v [power good block] v fb power good low voltage v fb pl 0.605 0.63 0.655 v when v fb : 10% down v fb power good high voltage v fb ph 0.745 0.77 0.795 v when v fb : 10% up downloaded from: http:///
BD95513MUV 8/ 24 tsz02201-0a1a0a900060-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 27.nov.2014 rev.001 0 20 40 60 80 100 0.01 0.1 1 10 io [a] [%] sllm tm continuous mode qllm figure 6. efficiency vs output curr ent (v in =19v, v out =2.5v) figure 4. efficiency vs output current (v in =7v, v out =2.5v) sllm tm continuous mode qllm typical performance curves output current: i o [a] output current: i o [a] continuous mode efficiency: [%] efficiency: [%] 0 20 40 60 80 100 0.01 0.1 1 10 io [a] [%] sllm tm continuous mode qllm figure 5. efficiency vs output current (v in =12v, v out =2.5v) continuous mode efficiency: [%] output current: i o [a] downloaded from: http:///
BD95513MUV 9/ 24 tsz02201-0a1a0a900060-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 27.nov.2014 rev.001 figure 7. transient response (v in =7v, v out =2.5v) v out (50mv/div) sw (10v/div) i out (2a/div) 2sec/div figure 8. transient response (v in =12v, v out =2.5v) v out (50mv/div) sw (10v/div) i out (2a/div) 2sec/div figure 9. transient response (v in =19v, v out =2.5v) v out (50mv/div) sw (10v/div) i out (2a/div) 2sec/div figure 10 . transient response (v in =7v, v out =2.5v) v out (50mv/div) sw (10v/div) i out (2a/div) 2sec/div typical waveforms downloaded from: http:///
BD95513MUV 10 / 24 tsz02201-0a1a0a900060-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 27.nov.2014 rev.001 figure 11. transient response (v in =12v, v out =2.5v) v out (50mv/div) sw (10v/div) i out (2a/div) 2sec/div figure 12. transient response (v in =19v, v out =2.5v) v out (50mv/div) sw (10v/div) i out (2a/div) 2sec/div figure 13 . sllm tm mode (i out =0a) v out i l hg lg 2sec/div figure 14 . sllm tm mode (i out =0.4a) v out i l hg lg 2sec/div typical waveforms - continued downloaded from: http:///
BD95513MUV 11 / 24 tsz02201-0a1a0a900060-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 27.nov.2014 rev.001 figure 15 . 1 sllm tm mode (i out =1a) v out i l hg lg 2sec/div figure 16 . qllm mode (i out =0a) v out sw 10sec/div 10sec/div figure 17 . qllm mo de (i out =1a) figure 18 . pgood rising waveform v out 2[v/div] en pgood 200sec/div typical waveforms - continued downloaded from: http:///
BD95513MUV 12 / 24 tsz02201-0a1a0a900060-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 27.nov.2014 rev.001 figure 19 . pgood falling waveform pgood en v out 2[v/div] 2msec/div figure 20 . scp timer latch waveform sw v out 2[v/div] i l 5[a/div] 200sec/div figure 21. v in change (5 v 19v) v out hg/lg v in figure 22 . v in change (19 v 5v) typical waveforms - continued hg/lg v out v in downloaded from: http:///
BD95513MUV 13 / 24 tsz02201-0a1a0a900060-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 27.nov.2014 rev.001 figure 23 . en wake up sw en v reg 2[v/div] v out 2[v/div] 400sec/div typical waveforms - continued downloaded from: http:///
BD95513MUV 14 / 24 tsz02201-0a1a0a900060-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 27.nov.2014 rev.001 application information 1. explanation of operation the bd9?13muv is a switching regulator incorporating rohms proprietary h 3 reg tm controlla control system. when v out drops suddenly due to changes in load, the system quickly restores the output voltage by extending the t on time interval. this improves the regulators transient response. when light -load mode is activated, the ic employs the simple light load mode (sllm tm ) controller, further improving system efficiency. h 3 reg tm control (normal operation) ? ? sec 1 f v v t in ref on ? ? (1) (rapid changes in load) light load control (sllm tm mode) (qllm mode) high gate output is determined by the above formula. when v fb falls below the reference voltage (0.7v), the h 3 reg tm controlla is activated; v fb v ref hg io lg t on + when v out drops due to a sudden change in load and the voltage remains below v ref after the preprogrammed t on time interval has elapsed, the system quickly restores v out by extending the t on time, thereby improving transient response. sllm tm mode is enabled by setting the mode pin to logic high. when the low gate is off and the current through the inductor is 0 (current flowing from vout to sw), the sllm tm function is activated, disabling high gate output. if v fb falls below v ref again, the high gate is switched back on, lowering the switching frequency of the regulator and yielding higher efficiency when powering light loads. qllm mode is enabled by setting the mode pin to hi-z or middle voltage. when the lower gate is off and the current through the inductor is 0 (current flowing from vout to sw), qllm mode is activated, disabling high gate output. if v fb falls below v ref within a programmed time interval (typ 40 s ec ), the high gate is switched on, but if v fb does not fall below v ref , the lower gate is forced on, dropping v fb and switching the high gate back on. the minimum switching frequency is set to 25 khz ( t= 40sec ), which keeps the regulators frequency from entering the audible spectrum but yields less efficient results than sllm tm mode. v fb v ref hg lg 0a v fb v ref hg lg v fb v ref hg lg 0a i l downloaded from: http:///
BD95513MUV 15 / 24 tsz02201-0a1a0a900060-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 27.nov.2014 rev.001 2. timing chart (1) soft start function ? ? sec ) ( 2.2 ) (7.0 typ a c v t ss ss ? ? ? (2) ? ? a t v c on i ss out o in ? ? ) ( (3) (2) timer latch-type short circuit protection (3) output over-voltage protection the soft start function is enabled when the en pin is set to high. current control circuitry takes effect at startup, yielding a moderate ramping start in output voltage. soft start timing and incoming current are given by equation (2) and (3) below: when output voltage falls t o v ref x 0.70 (v fb 0.49v) or less, the output short circuit protection is triggered, turning the ic off after a set period of time to prevent internal damage. when en is switched back on or when uvlo is cleared, output continues. the time period before shutting off is set internally at 1ms. soft start period: rush current: where: c ss is the soft start capacitor c o is the output capacitor. when output reaches or exceeds v ref x 1.2 (v fb 0.84v) , th e output over-voltage protection is triggered, turning the low-side fet completely on to reduce the output (low gate on, high gate off). when the output falls, it returns to standard mode. en ss v out i in t ss v out hg lg v ref x 1.2 switching v out scp en/uvlo 1ms 0.49v downloaded from: http:///
BD95513MUV 16 / 24 tsz02201-0a1a0a900060-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 27.nov.2014 rev.001 3. external component selection (1) inductor (l) selection ? ? ? ? a f v l v v v i in out out in l ? ? ? ? ? ? (4) ? ? a i i out l max 3.0 ? ? ? (5) ? ? [h] f v i v v v l in l out out in ? ? ? ? ? ? (6) where: ? i l is the output ripple current and f is the switching frequency (a) passing a current larger than the inductors rated current will cause magnetic saturation in the ind uctor and decrease s system efficiency. in selecting the inductor, be sure to allow enough margin to assure that peak current do es not exceed the inductors rated current value. (b) to minimize possible inductor damage and maximize efficiency, choose an inductor with a low dcr and acr resistance. (2) output capacitor selection (c o ) on l l out t i esl esr i v / ?? ? ? ?? ? (7) give special consideration to the conditions of eq uation (8 ) for output capacitance. also, keep in mind that the output rise time must be established within the soft start timeframe. ? ? out out it ss o v i i t c ? ? ? lim (8) choosing a capacitance that is too large can cause startup malfunctions, or in some cases, may trigger the short circuit protection. (3) input capacitor selection (c in ) ? ? a v v v v i i in out in in out rms ) ( ? ? ? (9) 2 out rms i i ? a low-esr capacitor is recommended to reduce esr loss and maximize efficiency. the inductors value directly influences the output ripple current. as indicated by equation (4) below, the greater the inductance or switching frequency, the lower the ripple current: the proper output ripple current setting is about 30% of maximum output current. when determining the proper output capacitor, be sure to consider the equivalent series resistance (esr) and equivalent series inductance (esl) required to set the output ripple voltage to 20 mv or more. when selecting the limit of the inductor, be sure to allow enough margin for the output voltage. output ripple voltage is determined by equation (7) below: where: ? i l is the output ripple current esr is the equivalent series resistance esl is the equivalent series inductance where: t ss is the soft start timeframe (see p. 15, equation (2) i limit is the maximum output current.) i out is the load current in order to prevent extreme over-current conditions, the input capacitor must have a low enough esr to fully support a large ripple in the output. the formula for rms ripple current (i rms ) is given by equation (9) below: when out in v v ? ? 2 , i l v in i l l co vout output ripple current hg lg v in l co vout esr output capacitor esl hg lg input capacitor v in l co vout c in hg lg downloaded from: http:///
BD95513MUV 17 / 24 tsz02201-0a1a0a900060-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 27.nov.2014 rev.001 external component selection C continued (4) frequency adjustment the BD95513MUV operates by feeding the output voltage back through a resistive voltage divider. the ou tput voltage is set by the following equation (see schematic below): output voltage = ? ? esr i v v r r r l ref ? ? ? ? ? 2 1 7.0 2 2 1 (11) the switching frequency is also amplified by the same resistive voltage divider network: ? ? ? 2 2 1 r r r f sw (frequency set by r fs ) [hz] (12) f v h 3 reg tm controlla s r q driver circuit sllm v in output voltage v in fb r 1 r 2 sllm tm esr ref(0.7v) the resistance connected to the fs terminal adjusts the on-time (t on ) during normal operation as illustrated on the left. when t on , input voltage and v ref voltage are known, the switching frequency can be determined by the following equation: on in ref t v v f ? ? (10) however, real-life considerations (such as external mosfet gate capacitance and switching time) must be factored in as they affect the overall switching rise and fall time. this leads to an increase in t on , lowering the total frequency slightly. additionally, when output current is around 0a in continuous mode, this dead time also has an effect upon on t on , further lowering the switching frequency. confirm the switching frequency by measuring the current through the coil (at the point where current does not flow backwards) during normal operation. 0 50 100 150 200 250 300 350 400 450 500 50 100 150 200 250 300 rfs[k] frequency [khz] 5v7v 12v19v 25v from top: v in = r fs [k] frequency [khz] frequency: [khz] downloaded from: http:///
BD95513MUV 18 / 24 tsz02201-0a1a0a900060-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 27.nov.2014 rev.001 4. evaluation board circuit (frequency=300khz continuous mode/qllm/sllm tm sample circuit) 5. evaluation board parts list part no. value company part name part no. value company part name u1 rohm BD95513MUV r 1 10 rohm mcr03 d 1 rohm rb051l- 40 r 4 10 rohm mcr03 c 1 1f kyocera cm105b105k06a r 6 180k rohm mcr03 c 3 1f kyocera cm105b105k16a r 7 31k rohm mcr03 c 4 10f kyocera cm316b106k06a r 8 20k rohm mcr03 c 5 1000pf murata grm39x7r102k50 r 9 100k rohm mcr03 c 6 0.1f kyocera cm105b104k06a l 1 1.8h sumida cdep104-1r8ml c 7 1f kyocera cm105b105k16a c 14 470f sanyo 2r5tpe470ml c 11 10f kyocera cm316b106m16a c 12 0.1f kyocera cm05b104k25a c 13 220pf murata grm39c0g221j50 c 11 r 6 r 4 v reg (5v) ref c 6 c 4 c 1 c 7 c 5 en v reg v in v reg c 12 pgnd pgnd c 14 pgnd r 7 l 1 av in BD95513MUV u1 gnd v o ut en vreg ref(0.7v) fs ss/ track v cc gnd v dd boot v in sw pgnd fb 7 10 15 11 16 17 12 21 5 1 to 4 26 to 31 22 to 25 32 12v 1.8v/3a 18 pgood 6 n.c. 20 r 1 r 8 extv cc mode 9 mode c 13 13 14 vout 19 v dd ctl ctl 8 5v r 9 c 3 downloaded from: http:///
BD95513MUV 19 / 24 tsz02201-0a1a0a900060-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 27.nov.2014 rev.001 power dissipation vqfn032v5050 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0 25 50 75 100 125 150 ambient temperature: ta ( ) power dissipation : pd (w) 0.38w 0.88w 2.06w 4.56w ic only j-a = 328.9 c /w ic mounted on 1-layer board (with 20.2 mm 2 copper thermal pad) j-a = 142.0 c /w ic mounted on 4-layer board (with 20.2 mm 2 pad on top layer, 550 5 mm 2 pad on layers 2,3) j-a = 60.7 c /w ic mounted on 4-layer board (with 5505mm 2 pad on all layers) j-a = 27.4 c /w ambient temperature: ta(c) power dissipation: pd(w) downloaded from: http:///
BD95513MUV 20 / 24 tsz02201-0a1a0a900060-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 27.nov.2014 rev.001 operational notes 1. reverse connection of power s upply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity whe n connecting the power supply, such as mounting an external diode between the power supply and th e ic s power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signa l ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush curre nt may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation u nd er strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and outp ut pin . inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environme nt) and unintentional solder bridge deposited in between pins during assembly to name a few. downloaded from: http:///
BD95513MUV 21 / 24 tsz02201-0a1a0a900060-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 27.nov.2014 rev.001 operational notes C continued 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and ex tremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diode s to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p s ubstrate) should be avoided. figure 24. example of monolithic ic structure 13. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 14. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevents heat damage to the ic. normal operation should alwa ys be within the ics power dissipation rating. if however the rating is exceeded for a continued perio d, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. tsd on temp. [ c ] (typ) hysteresis temp. [ c ] (typ) BD95513MUV 175 15 15. ground wiring traces when using both small-signal and large-current gnd traces, the two ground traces should be routed separately but connected to a single ground potential within the application in order to avoid variations in the small-signal ground caused by large currents. also ensure that the gnd traces of external components do not cause variations on gn d voltage. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
BD95513MUV 22 / 24 tsz02201-0a1a0a900060-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 27.nov.2014 rev.001 ordering information b d 9 5 5 1 3 m u v - e 2 part number package muv: vqfn032v5050 packaging and forming specification e2: embossed tape and reel marking diagram vqfn032v5050 (top view) d 9 5 5 1 3 part number marking lot number 1pin mark downloaded from: http:///
BD95513MUV 23 / 24 tsz02201-0a1a0a900060-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 27.nov.2014 rev.001 physical dimension, tape and reel information package name vqfn032v5050 downloaded from: http:///
BD95513MUV 24 / 24 tsz02201-0a1a0a900060-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 27.nov.2014 rev.001 revision history date revision changes 27.nov.2014 001 new release downloaded from: http:///
notice- ge rev.003 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear powe r controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in adv ance. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific app lications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to s trict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adeq uate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arisi ng from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6. in particular, if a transient load (a large amount of load a pplied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7. de -rate power dissipation (pd) depending on ambient temperature (ta). wh en used in sealed area, confirm the actual ambient temperature. 8. confirm that operation temperature is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, e tc.) flux is used, the residue of flux may negatively affect p roduct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mu st be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice- ge rev.003 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in this docu ment are presented only as guidance for products use. therefore, i n case you use such information, you are solel y responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderab ility of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is in dicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label qr code printed on rohm products label is for rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under controlled goods prescr ibed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to ap plication example contained in this document is for referen ce only. rohm does not warrant that foregoing information or da ta will not infringe any intellectual property rights or any other rights of a ny third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or other d amages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any i ntellectual property rights or other rights of rohm or any third parties with respect to the information contained in this d ocument. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the products and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described i n this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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