gaas sp4t switch dc - 4.0 ghz rev. v4 masw4060g 1 1 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 1 features ? low insertion loss, 1.2 db typical ? fast switching speed, 4 ns typical ? ultra low dc power consumption ? terminated option ? rohs* compliant description m/a - coms masw4060g is an spdt absorptive or reflective gaas mesfet mmic. this part combines small size, low insertion loss and power consumption with high isolation. ideal for many applications and module use. it will function well for designs below 4.0 ghz. the masw4060g is fabricated using a mature 1 - micron gate length gaas mesfet process. the process features full chip passivation for increased performance and reliability. bond pad dimensions pad layout parameter absolute maximum control value (a or b) - 8.5 vdc max input rf power +34 dbm storage temperature - 65c to +175c max operating temperature +175c 2. exceeding any one or combination of these limits may cause permanent damage to this device. 3. m/a - com does not recommend sustained operation near these survivability limits. bond pad dimensions - inches (mm) rf 0.005 x 0.005 (0.125 x 0.125) rf1, rf2, rf3, rf4 0.004 x 0.004 (0.100 x 0.100) a1, a2, a3, a4 0.004 x 0.004 (0.100 x 0.100) b1, b2, b3, b4 0.004 x 0.004 (0.100 x 0.100) g1, g2, g3, g4 4 0.008 x 0.004 (0.200 x 0.100) t1, t2, t3, t4 5 0.006 x 0.005 (0.150 x 0.125) die size - inches (mm) 0.076 x 0.058 x 0.010 (1.920 x 1.470 x 0.25) 4. Dg pads designate internal grounds necessary to maintain data sheet isolation. these are not dc blocked and would need to be blocked if positive control voltage is required. 5. Dt pads denote a 50 termination path connected to each rfx port. if bonded to ground, it will cause the related port to be absorptive, or matched, in the isolated condition. as de- scribed in note 4, these pads are also not dc blocked. ordering information part number package masw4060g die 1 1. die quantity varies. schematic * restrictions on hazardous substances, european union directive 2002/95/ec. absolute maximum rating 2,3 a 4 b 2 b 3 b 4 a 3 a 2 a 1 b 1 r f t 2 r f 2 g 2 g 1 r f 1 t 1 t 4 t 3 r f 3 g 3 g 4 r f 4 r f r f 2 r f 1 r f 4 r f 3
gaas sp4t switch dc - 4.0 ghz rev. v4 masw4060g 2 2 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 2 electrical specifications: 0/ - 5 vdc, 50 ? 55c to +85c 6 parameter test conditions units min. typ. max. insertion loss dc - 0.5 ghz dc - 1.0 ghz dc - 2.0 ghz dc - 4.0 ghz db db db db 1.3 1.3 1.3 1.7 isolation dc - 0.5 ghz dc - 1.0 ghz dc - 2.0 ghz dc - 4.0 ghz db db db db 50 45 40 30 vswr dc - 0.5 ghz dc - 1.0 ghz dc - 2.0 ghz dc - 4.0 ghz ratio ratio ratio ratio 1.4:1 1.4:1 1.5:1 2.0:1 input p - 1db 0.5 ghz 0.5 - 4.0 ghz dbm dbm +17 +27 ip2 two tone input power up to +5 dbm 0.5 ghz 0.5 - 4.0 ghz dbm dbm +45 +60 ip3 two tone input power up to +5 dbm 0.5 ghz 0.5 - 4.0 ghz dbm dbm +35 +46 control current v in low (0 to C 0.2 v) v out high ( - 5 v) a a 50 25 200 t - rise, t - fall 10% to 90% rf and 90% to 10% rf ns 2 t on , t off 50% control to 90% rf, and 50% control to 10% rf ns 4 transients in band mv 20 truth table 7 a1 b1 a2 b2 a3 b3 a4 b4 ant - rf1 ant - rf2 ant - rf3 ant - rf4 1 0 0 1 0 1 0 1 on off off off 0 1 1 0 0 1 0 1 off on off off 0 1 0 1 1 0 0 1 off off on off 0 1 0 1 0 1 1 0 off off off on 7. 0 = 0 v to C 0.2 v, 1 = - 5 v. handling procedures please observe the following precautions to avoid damage: static sensitivity gallium arsenide integrated circuits are sensitive to electrostatic discharge (esd) and can be damaged by static electricity. proper esd control techniques should be used when handling these devices. 6. loss changes 0.0025 db/c. (from - 55c to +85c) wire bonding a. ball or wedge with 1.0 mil diameter pure gold wire. thermosonic wirebonding with a nominal stage temperature of 150c and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. ultrasonic energy and time should be adjusted to the minimum levels achieve reliable wirebonds. b. wirebonds should be started on the chip and terminated on the package. gnd bonds should be as short as possible; at least three and no more than four bond wires from ground pads to package are recommended.
gaas sp4t switch dc - 4.0 ghz rev. v4 masw4060g 3 3 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 3 typical performance @ 25c handling precautions permanent damage to the masw4060 may occur if the following precautions are not adhered to: a. cleanliness - the masw4060 should be handled in a clean environment. do not attempt to clean unit after masw4060 is installed. b. static sensitivity - all chip handling equipment and personnel should be dc grounded. c. transient - avoid instrument and power supply transients while bias is applied to the masw4060. use shielded signal and bias cables to minimize inductive pick - up. d. bias - apply voltage to either control port v1 or v2 only when the other is grounded. no port should be allowed to Dfloat. e. general handling - it is recommended that the masw4060 chip be handled along the long side of the die with a sharp pair of bent tweezers. do not touch the surface of the chip with fingers or tweezers. mounting the masw4060 is back - metallized with pd/ni/au (100/1,000/10,000?) metallization. it can be die - mounted with ausn eutectic performs or with ther- mally conductive epoxy. the package surface should be clean and flat before attachment. eutectic die attach: a. a 80/20 gold/tin perform is recommended with a work surface temperature or approximately 225c and a tool temperature of 265c. when hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be approximately 290c. b. do not expose the masw4060 to a tempera- ture greater than 320c for more than 20 sec- onds. no more than 3 seconds of scrubbing should be required for attachment. epoxy die attach : a. apply a minimum amount of epoxy and place the masw4060 into position. a thin epoxy fillet should be visible around the perimeter of the chip. b. cure epoxy per manufacturers recommended schedule. c. electrically conductive epoxy may be used but is not required. insertion loss isolation vswr 0 1 2 3 4 0.0 0.5 1.0 1.5 2.0 frequency (ghz) 35 40 45 50 55 60 65 0 1 2 3 4 frequency (ghz) 1.0 1.1 1.2 1.3 1.4 0 1 2 3 4 frequency (ghz)
gaas sp4t switch dc - 4.0 ghz rev. v4 masw4060g 4 4 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 4 m/a - com technology solutions inc. all rights reserved. information in this document is provided in connection with m/a - com technology solutions inc ("macom") products. these materials are provided by macom as a service to its customers and may be used for informational purposes only. except as provided in macom's terms and conditions of sale for such products or in any separate agreement related to this document, macom assumes no liability whatsoever. macom assumes no responsibility for errors or omissions in these materials. macom may make changes to specifications and product descriptions at any time, without notice. macom makes no commitment to update the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to its specifications and product descriptions. no license, express or implied, by estoppels or otherwise, to any intellectual property rights is granted by this document. these materials are provided "as is" without warranty of any kind, either express or implied, relating to sale and/or use of macom products including liability or warranties relating to fitness for a particular purpose, consequential or incidental damages, merchantability, or infringement of any patent, copyright or other intellectual property right. macom further does not warrant the accuracy or completeness of the information, text, graphics or other items contained within these materials. macom shall not be liable for any special, indirect, incidental, or consequential damages, including without limitation, lost revenues or lost profits, which may result from the use of these materials. macom products are not intended for use in medical, lifesaving or life sustaining applications. macom customers using or selling macom products for use in such applications do so at their own risk and agree to fully indemnify macom for any damages resulting from such improper use or sale.
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