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product structure silicon monolithic integrated circuit this product is not designed to have protection against radioactive rays. 1/20 tsz02201-0r6r0a600180-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 14 ? 001 17.may.2013 rev.004 datashee t 300ma variable / fixed output ldo regulators bdxxga3wefj / bdxxga3wnux general description bdxxga3wefj / bdxxga3wnux series devices are ldo regu lators with an output cu rrent of 300ma. the output accuracy is 1% of the output voltage. both fixed and variabl e output voltage devices are avai lable. the output voltage of the variable output voltage device can be varied from 1.5v to 13v using external resistors. various fixed output voltage devices that do not use external resistors are also available. it can be used for a wide range of digital appliance application s. it has small package types : htsop-j8 (4.90mm x 6.00mm x 1.00mm) / vson008x2030 (2.00mm x 3.00mm x 0.60mm). these devices have built-in over cu rrent protection to protect the device when output is shorted, 0 a shutdown mode, and thermal shutdown circuit to protect the device during thermal over-load conditions. these ldo regulators are usable with ceramic capacitors that enable a sm aller layout and longer life. package (typ.) (typ.) (max.) features ? +/-1% output voltage accuracy ? built-in over current protection (ocp) ? built-in thermal shut down circuit (tsd) ? zero a shutdown mode key specifications ? input power supply voltage range: 4.5v to 14.0v ? output voltage range(variable type): 1.5v to 13.0v ? output voltage(fixed type): 1.5v/1.8v/2.5v/3.0v/3.3v 5.0v/6.0v/7.0v/8 .0v/9.0v/10v/12v ? output current: 0.3a (max.) ? shutdown current: 0 a(typ.) ? operating temperature range: -25 to +85 typical application circuit htsop-j8 (efj) 4.90mm x 6.00mm x 1.00mm vson008x2030 (nux) 2.00mm x 3.00mm x 0.60mm htsop-j8 ( efj ) v son008x2030 (nux) v cc en gnd fin v o v o v cc en gnd fin r 1 r 2 v o_s c out c in c in , c out : ceramic capacitor fb c out c in c in , c out : ceramic capacitor output voltage variable type output voltage fixed type downloaded from: http:///
bdxxga3wefj / bdxxga3wnux datasheet ordering information b d x x g a 3 w y y y - z z part number output voltage 00:variable 15:1.5v 18:1.8v 25:2.5v 30:3.0v 33:3.3v 50:5.0v 60:6.0v 70:7.0v 80:8.0v 90:9.0v j0:10.0v j2:12.0v input voltage range g:15v output current a3:0.3a shutdown mode w:included package efj :htsop-j8 nux:vson008x2030 packaging and forming specification e2:emboss tape reel (htsop-j8) tr:emboss tape reel (vson008x2030) line up xx output voltage(v) product name 00 variable bd00ga3wefj-e2 bd00ga3wnux-tr 15 1.5 BD15GA3WEFJ-e2 bd15ga3wnux-tr 18 1.8 bd18ga3wefj-e2 bd18ga3wnux-tr 25 2.5 bd25ga3wefj-e2 bd25ga3wnux-tr 30 3.0 bd30ga3wefj-e2 bd30ga3wnux-tr 33 3.3 bd33ga3wefj-e2 bd33ga3wnux-tr 50 5.0 bd50ga3wefj-e2 bd50ga3wnux-tr 60 6.0 bd60ga3wefj-e2 bd60ga3wnux-tr 70 7.0 bd70ga3wefj-e2 bd70ga3wnux-tr 80 8.0 bd80ga3wefj-e2 bd80ga3wnux-tr 90 9.0 bd90ga3wefj-e2 bd90ga3wnux-tr j0 10.0 bdj0ga3wefj-e2 bdj0ga3wnux-tr j2 12.0 bdj2ga3wefj-e2 bdj2ga3wnux-tr 2/20 tsz02201-0r6r0a600180-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 17.may.2013.rev.004 downloaded from: http:///
3/20 tsz02201-0r6r0a600180-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 17.may.2013.rev.004 bdxxga3wefj / bdxxga3wnux datasheet block diagram bd00ga3wefj / bd00ga3wnux (variable output voltage type) pin configuration (top view) pin description pin no. pin name pin function 1 v o output pin 2 fb feedback pin 3 gnd gnd pin 4 n.c. no connect (connect to gnd or leave open) 5 en enable pin 6 n.c. no connect (connect to gnd or leave open) 7 n.c. no connect (connect to gnd or leave open) 8 v cc input pin reverse fin substrate(connect to gnd) figure 1. block diagram v o v cc soft start 2 ( vson008x2030 ) fb n.c. 8 7 6 5 3 4 v o gnd en n.c. n.c. v cc 1 ( htsop-j8 ) 8 7 6 5 1 2 3 4 v o fb gnd n.c. en n.c. n.c. v cc downloaded from: http:///
4/20 tsz02201-0r6r0a600180-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 17.may.2013.rev.004 bdxxga3wefj / bdxxga3wnux datasheet block diagram bdxxga3wefj / bdxxga3wnux (fixed output voltage type) pin configuration (top view) pin description pin no. pin name pin function 1 v o output pin 2 v o_s output voltage monitor pin 3 gnd gnd pin 4 n.c. no connect (connect to gnd or leave open) 5 en enable pin 6 n.c. no connect (connect to gnd or leave open) 7 n.c. no connect (connect to gnd or leave open) 8 v cc input pin reverse fin substrate(connect to gnd) gnd en tsd ocp soft start v o v cc v o_s figure 2. block diagram 8 7 6 5 1 2 3 4 ( vson008x2030 ) v o_s n.c. v o gnd en n.c. n.c. v cc ( htsop-j8 ) 8 7 6 5 1 2 3 4 v o v o_s gnd n.c. en n.c. n.c. v cc downloaded from: http:///
bdxxga3wefj / bdxxga3wnux datasheet absolute maximum ratings (ta=25 ) parameter symbol ratings unit power supply voltage v cc 15.0 * 1 v en voltage v en 15.0 v htsop-j8 pd *2 2110 *2 power dissipation vson008x2030 pd *3 1700 *3 mw operating temperature ra nge topr -25 to +85 storage temperature range tstg -55 to +150 junction temperature tjmax +150 *1 not to exceed pd *2 reduced by 16.9mw/ for temperature above 25 . (when mounted on a two-layer glass epoxy board with 70mm 70mm 1.6mm dimension) *3 reduced by 13.6mw/ for temperature above 25 . (when mounted on a four-layer glass epoxy board with 114.3mm 76.2mm 1.6mm dimension) recommended operating range (ta=25 ) ratings parameter symbol min. max. unit input power supply voltage v cc 4.5 14.0 v en voltage v en 0.0 14.0 v output voltage setting range v o 1.5 13.0 v output current i o 0.0 0.3 a electrical characteristics (unl ess otherwise specified, ta=25 , en=3v, v cc =6v, r 1 =43k , r 2 =8.2k ) limits parameter symbol min. typ. max. unit conditions circuit current at shutdown mode i sd - 0 5 a v en =0v, off mode bias current i cc - 600 900 a line regulation reg.i -1 - 1 % v cc =( v o +0.9v ) 14.0v load regulation reg i o -1.5 - 1.5 % i o =0 0.3a minimum dropout voltage1 v co1 - 0.15 0.30 v v cc =5v, i o =100ma minimum dropout voltage2 v co2 - 0.30 0.60 v v cc =5v, i o =200ma minimum dropout voltage3 v co3 - 0.45 0.90 v v cc =5v, i o =300ma output reference voltage(variable type) v fb 0.792 0.800 0.808 v i o =0a output voltage(fixed type) v o v o 0.99 v o v o 1.01 v i o =0a en low voltage v en (low) 0 - 0.8 v en high voltage v en (high) 2.4 - 14.0 v en bias current i en 1 3 9 a 5/20 tsz02201-0r6r0a600180-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 17.may.2013.rev.004 downloaded from: http:///
bdxxga3wefj / bdxxga3wnux datasheet typical performance curves (unless otherwise specified, ta=25 , en=3v, v cc =6v, r 1 =43k , r 2 =8.2k ) i o v o v o i o figure 4. transient response (0.3 0a) co=1f figure 3. transient response (0 0.3a) co=1f v en v cc v o v en v cc v o figure 5. input sequence 1 co=1f figure 6. off sequence 1 co=1f 6/20 tsz02201-0r6r0a600180-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 17.may.2013.rev.004 downloaded from: http:///
7/20 bdxxga3wefj / bdxxga3wnux datasheet tsz02201-0r6r0a600180-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 17.may.2013.rev.004 figure 10. ta - i cc figure 7. input sequence 2 co=1f figure 8. off sequence 2 co=1f figure 9. ta - v o (i o =0ma) v o [v] i cc [a] v en v en v cc v cc v o v o ta [ ] ta [ ] downloaded from: http:///
8/20 bdxxga3wefj / bdxxga3wnux datasheet tsz02201-0r6r0a600180-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 17.may.2013.rev.004 figure 14. v cc -i sd (v en =0v) figure 11. ta - i sd (v en =0v) figure 12. ta - i en figure 13. i o -v o i en [a] i sd [a] i sd [a] v o [v] i o [a] v cc [v] ta [ ] ta [ ] downloaded from: http:///
9/20 bdxxga3wefj / bdxxga3wnux datasheet tsz02201-0r6r0a600180-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 17.may.2013.rev.004 figure 18. minimum dropout voltage1 v cc =5v i o =0.3a figure 15. v cc -v o (i o =0ma) figure 16. tsd (i o =0ma) figure 17. ocp vo[v] i o [a] v o [v] v o [v] v cc [v] v o [v] ta [ ] ta [ ] downloaded from: http:///
10/20 bdxxga3wefj / bdxxga3wnux datasheet tsz02201-0r6r0a600180-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 17.may.2013.rev.004 figure 19. esr-io characteristics figure 20. i o -i cc figure 21. psrr (i o =0ma) i o [a] i cc [a] i o [a] p s rr [d b ] vdrop[v] figure 22. minimum dropout voltage 2 v cc =4.5v ta = 2 5 i o [a] downloaded from: http:///
11/20 bdxxga3wefj / bdxxga3wnux datasheet tsz02201-0r6r0a600180-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 17.may.2013.rev.004 figure 25. minimum dropout voltage 5 v cc =10v ta = 2 5 figure 26. minimum dropout voltage 6 v cc =12v ta = 2 5 figure 23. minimum dropout voltage 3 v cc =6v ta = 2 5 figure 24. minimum dropout voltage 4 v cc =8v ta = 2 5 vdrop[v] vdrop[v] vdrop[v] vdrop[v] i o [a] i o [a] i o [a] i o [a] downloaded from: http:///
12/20 tsz02201-0r6r0a600180-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 17.may.2013.rev.004 bdxxga3wefj / bdxxga3wnux datasheet power dissipation htsop-j8 vson008x2030 ?? :ta [ ] measurement condition: mounted on a rohm board, substrate size: 70mm 70mm 1.6mm (substrate with thermal via) ? solder the thermal pad to ground ic only j-a=249.5 /w 1-layer copper foil are : 0mm 0mm j-a=153.2 /w 2-layer copper foil are : 15mm 15mm j-a=113.6 /w 2-layer copper foil are : 70mm 70mm j-a=59.2 /w 4-layer copper foil are : 70mm 70mm j-a=33.3 /w power dissipation :pd [w] 0 25 50 75 100 125 150 0 2.0 3.0 4.0 1.0 0.50w 0.82w 1.10w 2.11w 3.76w ambient temperature : ta [ ] power dissipation :pd [w] 0 25 50 75 100 125 150 0 2.0 3.0 4.0 ?? :ta [ ] 1.0 0.26w 0.56w 1.70w 1.80w ambient temperature : ta [ ] measurement condition: mo unted on a rohm board, substrate size: 114.3mm 76.2mm 1.6 mm ? solder the thermal pad to ground ic only j-a=480.8 /w 1-layer copper foil are : 0mm 2 j-a=223.2 /w 4-layer 2 nd , 3 rd layer copper foil are : 5655mm 2 , 4 th layer copper foil are : thermal land j-a=73.5 /w 4-layer 2 nd , 3 rd , 4 th layer copper foil are : 5655mm 2 j-a=69.4 /w downloaded from: http:///
bdxxga3wefj / bdxxga3wnux datasheet thermal design should ensure operation within the following co nditions. note that the temper atures listed are the allowed temperature limits and thermal design should a llow sufficient margin beyond these limits. 1. ambient temperature ta can be not higher than 85 . 2. chip junction temperature (tj) can be not higher than 150 . chip junction temperature can be determined as follows: calculation based on ambient temperature (ta) tj=ta+ j-a w reference values j-a: htsop-j8 153.2 /w 1-layer substrate (copper foil density 0mm 0mm) 113.6 /w 2-layer substrate (copper foil density 15mm 15mm) 59.2 /w 2-layer substrate (copper foil density 70mm 70mm) 33.3 /w 4-layer substrate (copper foil density 70mm 70mm) substrate size: 70mm 70mm 1.6mm (substrate with thermal via) j-a: vson008x2030 223.2 /w 1-layer substrate (copper foil density 0mm 2 ) 73.5 /w 4-layer substrate (2 nd , 3 rd layer copper foil density 5655mm 2 , 4 th layer copper foil : thermal land) 69.4 /w 4-layer substrate (2 nd , 3 rd , 4 th layer copper foil density 5655mm 2 ) substrate size: 114.3mm 76.2mm 1.6mm most of the heat loss that occurs in the bdxxga3wefj / bd xxga3wnux series is generated from the output pch fet. power loss is determined by the voltage drop across v cc -v o and the output current. be sure to confirm the systems input and output voltages, as well as the output cu rrent conditions in relation to the powe r dissipation characteristics of the v cc and v o in the design. bearing in mind that the power dissipati on may vary substantially depending on the pcb employed, it is important to consider pcb size based on thermal design and po wer dissipation characteristics of the chip with the pcb. power consumption [w] = input voltage (v cc ) - output voltage (v o ) i o (ave) example: where v cc =5.0v, v o =3.3v, i o (ave) = 0.1a, power consumption [w] = 5.0v - 3.3v 0.1a =0.17w 13/20 tsz02201-0r6r0a600180-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 17.may.2013.rev.004 downloaded from: http:///
bdxxga3wefj / bdxxga3wnux datasheet input and output capacitor it is recommended that a capacitor (over 1uf) is placed near pins between the input pin and gnd as well as the output pin and gnd. a capacitor, between input pin and gnd, is valid wh en the power supply impedance is high or trace is long. also, as for the capacitor between the output pi n and gnd, the greater the capacitance, the more sustainable the line regulation will be and the capacitor will make improvements of characteristics depending on the load. however, please check the actual functionality of this part by mounting it on a board for the actual application. ceramic capacitors usually have differe nt, thermal and equivalent series resistance characteristics, and moreover capacitance decreases gradually in use. for additional details, please check with the manufacturer, and select the best ceramic capacitor for your application. dc bias voltage [v] ceramic capacitor capacity C dc bias characteristics (characteristics example) -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 0 1 2 3 4 rated voltage 10v b1 caacec rated voltage 4v x6s caacec capacitance change [%] rated voltage:10v f characteristics rated voltage 6.3v b caacec b caacec rated voltage 10v equivalent series resistance esr (output capacitor) to prevent oscillations, please attach a capacitor between v o and gnd. capacitors usually have esr (equivalent series resistance). operation will be stable in the esr-i o range shown to the right. ceramic, tantalum and electrolytic capacitors have different esr values, so please ensure that you are using a capacitor that operates in the stable operating region shown on the right. finally, please evaluate in the actual application. c o =1 f esr C i o characteristics 14/20 tsz02201-0r6r0a600180-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 17.may.2013.rev.004 downloaded from: http:///
15/20 tsz02201-0r6r0a600180-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 17.may.2013.rev.004 bdxxga3wefj / bdxxga3wnux datasheet evaluation board circuit evaluation board parts list board layout pcb layout considerations: ? input capacitor c in connected to v cc (v in ) should be placed as close to v cc (v in ) pin as possible. output capacitor c out also should be placed as close to ic pin as possi ble. in case the part is connected to inner layer gnd plane, please use several through holes. ? fb pin has comparatively high impedance and can be affect ed by noise, so stray capacitance should be as small as possible. please take care of this during layout. ? please make gnd pattern wide enough to handle thermal dissipation. ? for output voltage setting (bd00ga3wefj / bd00ga3wnux) output voltage can be set by fb pin voltage 0.800v typ. and external resistance r1, r2. the use of resistors with r1+r2=1k to 90k is recommended designation value part no. company designation value part no. company r1 43k mcr01pzpzf4302 rohm c4 \ \ \ r2 8.2k mcr01pzpzf8201 rohm c5 1f cm105b105k16a kyocera r3 \ \ \ c6 \ \ \ r4 \ \ \ c7 \ \ \ r5 \ \ \ c8 \ \ \ r6 \ \ \ c9 \ \ \ c1 1f cm105b105k16a kyocera c10 \ \ \ c2 \ \ \ u1 \ bdxxga3wefj / bdxxga3wnux rohm c3 \ \ \ u2 \ \ \ v o = v fb r1+r2 r2 n.c. gnd fb n.c. n.c. v o 2 v o c7 3 4 7 5 u1 8 c1 c2 c3 r1 r2 c6 c5 1 v cc 6 en gnd sw1 en fin v cc v o en gnd ( v cc v in ) c in r 1 r2 c out downloaded from: http:///
16/20 tsz02201-0r6r0a600180-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 17.may.2013.rev.004 bdxxga3wefj / bdxxga3wnux datasheet i/o equivalent circuits (variable type : bd00ga3wefj / bd00ga3wnux) i/o equivalent circuits (fixed type : bdxxga3wefj /bdxxga3wnux) 8pin (v cc ) / 1pin (v o ) 2pin (fb) 5pin (en) 2pin (fb) 8pin (v cc ) 1pin (v o ) 5pin (en) 1m 2m 8pin (v cc ) / 1pin (v o ) 2pin (v o_s ) 5pin (en) 2pin (v o_s ) 8pin (v cc ) 1pin (v o ) 5pin (en) 1m 2m downloaded from: http:///
bdxxga3wefj / bdxxga3wnux datasheet operational notes (1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply vo ltage, temperature range of operating conditions, etc., can break down the device, thus making it im possible to identify the damage mode, such as a short circuit or an open circuit. if there is any possibility of exposure over the rated values, please consider addi ng circuit protection devices such as fuses. (2) connecting the power supply connector backward connecting of the power supply in reverse polarity c an damage the ic. take precautio ns when connecting the power supply lines. an external direction diode can be added. (3) power supply lines design the pcb layout pattern to provide low impedance gnd and supply lines. to obtain a low noise ground and supply line, separate the grou nd section and supply lines of t he digital and analog blocks. furt hermore, for all power supply terminals to ics, connect a capacitor between the power suppl y and gnd terminal. when using electrolytic capacitors in a circuit, note that capacitance values are re duced at low temperatures and over time. (4) gnd voltage the potential of the gnd pin must be minimu m potential under all operating conditions. (5) thermal design use a thermal design that allows for a sufficient margin in light of the power dissipation (pd) in actual operating conditions. (6) inter-pin shorts and mounting errors use caution when positioning the ic fo r mounting on printed circuit boards. t he ic may be damaged if there is any connection error or if pi ns are shorted together. (7) actions in strong electromagnetic field use caution when using the ic in the presence of a strong electr omagnetic field as doing so may cause the ic to malfunction. (8) aso when using the ic, set the output transistor so that it does not exceed absolute maximum ratings or aso. (9) thermal shutdown circuit the ic incorporates a built-in thermal shutdown circuit (tsd circuit). the thermal shutdown circuit (tsd circuit) is designed only to shut the ic off to prevent thermal runaway. it is not designed to protect the ic or guarantee its operation. do not continue to use the ic after operatin g this circuit or use the ic in an environ ment where the operation of this circuit is assumed. tsd on temperature[ ] (typ.) hysteresis temperature [ ] (typ.) bdxxga3wefj / bdxxga3wnux 175 15 (10) testing on application boards when testing the ic on an application board, connecting a capacitor to a pin with low impedance subjects the ic to stress. always discharge capacitors after each process or step. always turn the ics power supply off before connecting it to or removing it from a jig or fixture during the inspection pr ocess. ground the ic during assembly steps as an antistatic measure. use similar precaution wh en transporting or storing the ic. 17/20 tsz02201-0r6r0a600180-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 17.may.2013.rev.004 downloaded from: http:///
bdxxga3wefj / bdxxga3wnux datasheet (11) regarding input pin of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersecti on of these p layers with the n layers of other elements, creating a parasitic diode or transistor. for example, the relation between each potential is as follows: when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes can occur inevitable in the structure of the ic. the operation of parasitic diodes can result in mutual interf erence among circuits, operational faults, or physical damage. accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the gnd(p substrate) voltage to an input pin, should not be used. resistor transistor (npn) n n n p + p + p p substrate gnd parasitic element pin a n n p + p + p p substrate gnd parasitic element pin b c b e n gnd pin a pin b other adjacent elements e b c gnd parasitic element parasitic element (12) ground wiring pattern. when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluc tuations in the small-signal ground caused by large currents. also ens ure that the ground traces of external components do not cause variations on the ground voltage. the power supply and ground lines must be as short and thick as possible to reduce line impedance. 18/20 tsz02201-0r6r0a600180-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 17.may.2013.rev.004 downloaded from: http:///
19/20 tsz02201-0r6r0a600180-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 17.may.2013.rev.004 bdxxga3wefj / bdxxga3wnux datasheet physical dimension tape and reel information marking diagram xx product name 00 bd00ga3wefj bd00ga3wnux 15 BD15GA3WEFJ bd15ga3wnux 18 bd18ga3wefj bd18ga3wnux 25 bd25ga3wefj bd25ga3wnux 30 bd30ga3wefj bd30ga3wnux 33 bd33ga3wefj bd33ga3wnux 50 bd50ga3wefj bd50ga3wnux 60 bd60ga3wefj bd60ga3wnux 70 bd70ga3wefj bd70ga3wnux 80 bd80ga3wefj bd80ga3wnux 90 bd90ga3wefj bd90ga3wnux j0 bdj0ga3wefj bdj0ga3wnux j2 bdj2ga3wefj bdj2ga3wnux (unit : mm) htsop-j8 0.08 s 0.08 m s 1.0max 0.85 0.05 1.27 0.08 0.08 0.42 +0.05 - 0.04 1.05 0.2 0.65 0.15 4 + 6 4 0.17 +0.05 - 0.03 234 568 (max 5.25 include burr) 7 1 0.545 (3.2) 4.9 0.1 6.0 0.2 (2.4) 3.9 0.1 1pin mark ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 ( direction of feed reel ) 1pin htsop-j8 (top view) xxga3w part number marking lot number 1pin mark vson008x2030 (top view) ga3 x x part number marking lot numbe r 1pin mark ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 4000pcs tr ( direction of feed reel ) 1pin (unit : mm) vson008x2030 5 1 8 4 1.4 0.1 0.25 1.5 0.1 0.5 0.3 0.1 0.25 +0.05 0.04 c0.25 0.6max (0.12) 0.02 +0.03 0.02 3.0 0.1 2.0 0.1 1pin mark 0.08 s s downloaded from: http:///
bdxxga3wefj / bdxxga3wnux datasheet revision history date revision changes 20.july.2012 001 new release 03.dec.2012 002 improvement english translation and added package lineup 17.jan.2013 003 the description was modified. 17.may.2013 004 added bdxxga3wnux series 20/20 tsz02201-0r6r0a600180-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 17.may.2013.rev.004 downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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