MCM1216 p-channel power mosfet features ? epoxy meets ul 94 v-0 flammability rating maximum r atings @ 25 o c unle ss otherwi se specified symbol parameter rating unit v ds drain-source voltage -12 v i d drain curren t-con tinu ous -16 a i d m pulsed drain current (note1) -65 a v gs gate-source voltage 8 v r j a thermal resistance junction to ambient(note4) 50 /w t j operating junction temperature -55 to +150 t stg storage temperature -55 to +150 revision: a 2016/02/03 moisture sensitivity level 1 inches mm dim mi nmax mi nmax note dfn2020-6j ? advanced trench mosfet process technology ? ultra low on-resistance with low gate charge ? h alogen free available upon request by adding suffix "-hf" a 0.700 0.800 0.028 .032 b 0.203ref. 0.008ref. c 0.000 0.050 0000 0.002 d 1.924 2.076 0.076 0.082 e 1.924 2.076 0.076 0.082 f 0.800 1.000 0.031 0.039 g 0.850 1.050 0.033 0.041 h 0.200 0.400 0.008 0.016 j 0.200 --- 0.008 --- k 0.460 0.660 0.018 0.026 l 0.650typ. 0.026typ. m 0.250 0.350 0.010 0.014 n 0.174 0326 0.007 0.013 dimensions micro commercial components m c c r omponents 20736 marilla street chatsworth
www. mccsemi .com 1 of 4 equivalent circuit b d e f g h j c a k l m n p d power dissipation(note2,ta=25 o c) 2.5 w maximum power dissipation(note3,tc=25 o c) 18 r jc thermal resistance junction to case(note4) 6.9 /w notes: 1.. repetit e rating: pulse width lim ited by maximum junction temperature. 2. this test is performed with no heat sink at t a =25 . 3. this test is performed with infinite heat sink at t c =25 . 4.. surface m nted on fr4 board, t 10s. m arking:1216 1. drain 2.drain 3.gate 4.source 5.drain 6.drain
revision: a 2016/02/03 electrical characteristics(t a =25 unless otherwise specified) micro commercial components m c c r www. mccsemi .com 2 of 4 parameter symbol test condition min typ max unit off characteristics drain-source breakdown voltage v (br)dss v gs = 0v, i d =-250a -12 v gate-body leakage current i gss ds v =0v, v gs =8v 100 na zero gate voltage drain current i dss ds v =-12v, v gs =0v -1 a on characteristics (note 5) gate-threshold voltage v gs(th) v ds =v gs , i d =-250a -0.4 -0.7 -1 v v gs =-4.5v, i d =-6.7a 21 drain-source on-state resistance r ds(on) v gs =-2.5v, i d =-6.2a 27 m? forward transconductance g fs v ds =-10v, i d =-6.7a 40 s dynamic characteristics (note 6) input capacitance c iss 2700 output capacitance c oss 680 reverse transfer capacitance c rss v ds =-10v,v gs =0v,f =1mhz 590 pf v ds =-6v,v gs =-8v,i d =-10a 60 100 total gate charge q g 35 48 gate-source charge q gs 5 gate-drain charge q gd v ds =-6v,v gs =-4.5v,i d =-10a 10 nc drain-source diode characteristics diode forward current (note 5) i s -16 a diode forward voltage(note 4) v sd gs v =0v, i sd =-8a -1.2 v notes: 5. pulse test: pulse with 300 s,duty cycle 2%. 6. guaranteed by design, not s ubject to production testing.
m c c r revision: a 2016/02/03 www. mccsemi .com 3 of 4 micro commercial components 7 \ s l f d o & |