molded choke coil ? pia0502sp series note: specifications subject to change without notice. please check our website for latest information. proprietary and confidential document of superworld 17/11/2017 p1 1. part no. expression: p i a 0 5 0 2 s p 1 r 0 m n a) series code d) inductance code (a) (b) (c) (d) (e)(f) c b) dimension code e) tolerance code c) type code f) internal controlled code 2. configuration & dimensions: a b c e d marking d/c 3. schematic: 4. material list: a) core b) wire c) terminal d) ink a b c d e l g h 5.70.3 5.20.2 1.8 0.2 1.00.3 2.50.3 6.0 ref. 2.8 ref. 2.5 ref. l g h recommended pc board pattern note: 1. the above pcb layout is for reference only. 2. solder paste thickness of 0.12mm and above is recommended. 3. marking: top row ? inductance code, bottom row ? yyww unit: mm
molded choke coil ? pia0502sp series note: specifications subject to change without notice. please check our website for latest information. proprietary and confidential document of superworld 17/11/2017 p2 5. general specification: (a) operating temp. : -40c to +125c (inclusive of coil temp rise). (b) storage temp. : -40c to +125c (on board).. (c) humidity range. : 85 2% rh. (d) heat rated current (irms) will cause the coil temperature rise approximately ? t of 40c. (e) saturation current (isat) will cause l0 to drop approximately 30%. (f) part temp. (ambient + temp. rise) should not exceed 125c under worst case operating conditions. (g) storage condition (component in its packaging) i) temperature: less than 40c ii) humidity : 60% rh 6. electrical characteristics: part number inductance l (uh) @ 0a test frequency (hz) irms (a) typ. irms (a) max. isat (a) typ. isat (a) max. dcr (m ? ) typ. dcr (m ? ) max. pia0502spr15yn 0.15 1.0v/100k 22 19 27 24 2.8 3.2 pia0502spr22mn 0.22 1.0v/100k 16 14 20 17 3.8 4.4 pia0502spr33mn 0.33 1.0v/100k 14 13 11 9.0 5.2 6 pia0502spr47mn 0.47 1.0v/100k 13 11 9.0 8.0 6.1 7.2 PIA0502SPR68MN 0.68 1.0v/100k 12 10 8.0 7.0 8 9.2 pia0502sp1r0mn 1.00 1.0v/100k 8.6 7.5 7.5 6.5 14 16.2 pia0502sp1r5mn 1.50 1.0v/100k 7.5 6.5 7.0 6.0 22 26.4 pia0502sp2r2mn 2.20 1.0v/100k 6.5 6.0 5.8 5.0 29 34 pia0502sp3r3mn 3.30 1.0v/100k 6.0 5.0 5.0 4.7 50 60 *tolerance code: m = 20%, y= 30%
molded choke coil ? pia0502sp series note: specifications subject to change without notice. please check our website for latest information. proprietary and confidential document of superworld 17/11/2017 p3 7. characteristics curves: 0 6.4 12.8 19.2 25.6 32 dc current ( a ) 0 0.05 0.1 0.15 0.2 0.25 induct a nce (uh) 0 14 28 42 56 70 temp. rise ( o c ) 0 5 10 15 20 25 dc current ( a ) 0 0.076 0.152 0.228 0.304 0.38 induct a nce (uh) 0 10 20 30 40 50 temp. rise ( o c ) 0 3.6 7.2 10.8 14.4 18 dc current ( a ) 0 0.11 0.22 0.33 0.44 0.5 5 inductance (uh) 0 12 24 36 48 60 temp. rise ( o c ) 0 3.2 6.4 9.6 12.8 16 dc current ( a ) 0 0.16 0.32 0.48 0.64 0.8 induct a nce (uh) 0 10 20 30 40 50 temp. rise ( o c ) 0 2.8 5.6 8.4 11.2 14 dc current ( a ) 0 0.24 0.48 0.72 0.96 1.2 induct a nce (uh) 0 10 20 30 40 50 temp. rise ( o c ) 02.44.87.29.612 dc current ( a ) 0 0.32 0.64 0.96 1.28 1.6 induct a nce (uh) 0 12 24 36 48 60 temp. rise ( o c ) 01.63.24.86.48 dc current ( a ) 0 0.5 1 1.5 2 2.5 induct a nce (uh) 0 10 20 30 40 50 temp. rise ( o c ) 0 1.6 3.2 4.8 6.4 8 dc current ( a ) 0 0.72 1.44 2.16 2.88 3. 6 inductance (uh) 0 12 24 36 48 6 0 temp. rise ( o c ) 0 1.4 2.8 4.2 5.6 7 dc current ( a ) 0 1.1 2.2 3.3 4.4 5. 5 inductance (uh) 0 12 24 36 48 6 0 temp. rise ( o c ) pia0502spr15yn pia0502spr22mn pia0502spr33mn pia0502spr47mn PIA0502SPR68MN pia0502sp1r0mn pia0502sp1r5mn pia0502sp2r2mn pia0502sp3r3mn
molded choke coil ? pia0502sp series note: specifications subject to change without notice. please check our website for latest information. proprietary and confidential document of superworld 17/11/2017 p4 8. soldering: mildly activated rosin fluxes are preferred. the minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. our terminations are suitable for all re-flow solderin g systems. if hand soldering canno t be avoided, the preferred technique is the utilization of hot air. 8-1 solder re-flow recommended temperature profiles for re-flow soldering in figure 1. 8-2 soldering iron (figure 2) products attachment with soldering iron is discouraged due to the inherent process control limitations. in the event that a soldering iron must be employed the following precautions are recommended. note: a) preheat circuit and products to 150c. b) 355c tip temperature (max.) c) never contact the ceramic with the iron tip d) 1.0mm tip diameter (max.) e) use a 20 watt soldering iron with tip diameter of 1.0mm f) limit soldering time to 4~5 secs.
molded choke coil ? pia0502sp series note: specifications subject to change without notice. please check our website for latest information. proprietary and confidential document of superworld 17/11/2017 p5 9. packaging information: 9-1 reel dimension 9-2 tape dimension d p w f b0 k0 t a0 200mm or more direction of tape 400mm or more blank portions 4.0 chip cavity blank portions 9-3 packaging quantity type a(mm) b(mm) c(mm) d(mm) 13?x12mm 12.4+2/-0 1002 13+0.5/-0.2 330 pia 0502 chip / reel 3000 inner box 6000 carton 24000 series size bo(mm) ao(mm) ko(mm) p(mm) w(mm) f(mm) t(mm) d(mm) pia 0502 6.20.1 5.6.1 2. 30.1 8.00.1 12.00.3 5.5 0.1 0.350.05 1.50.1
molded choke coil ? pia0502sp series note: specifications subject to change without notice. please check our website for latest information. proprietary and confidential document of superworld 17/11/2017 p6 9-4 tearing off force application notice: 1. storage conditions: to maintain the solderabililty of terminal electrodes: a) recommended products should be used within 12 months from the time of delivery. b) the packaging material should be kept where no chlorine or sulfur exists in the air. 2. transportation: a) products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) vacuum pick up is strongly recommended for individual components. c) bulk handling should ensure that abrasion and mechanical shock are minimized. the force for tearing off cover tape is 10 to 130 grams in the arrow direction under the following conditions. room temp. ( ) room humidity (%) room atm (hpa) tearing speed mm/min 5~35 45~85 860~1060 300
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