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lite - on technology corp. / optoelectronics no.90,chien 1 road, chung ho, new taipei city 23585, taiwan, r.o.c. tel: 886 - 2 - 2222 - 6181 fax: 886 - 2 - 2221 - 1948 / 886 - 2 - 2221 - 0660 http://www.liteon.com/opto smd led product data sheet ltsa - g6spvskt u spec no. : created date: 201 7 / 02 / 16 revision: 1 .0 bns - od - fc001/a 4 a 4
1 / 1 3 part no. : ltsa - g6spvskt u bns - od - fc002/a4 smd led ltsa - g6spvskt u smd led ltsa - g6spvskt u rev description by date 1 new datasheet ryan chen 02 / 16 /201 7 above data for pd and customer tracking only customer name: customer signat ure : print name : liteon sales signature: print name:
2 / 1 3 part no. : ltsa - g6spvskt u bns - od - fc002/a4 smd led ltsa - g6spvskt u 1. description smd leds from lite - on are available in miniature sizes and special configurations for automated pc board assembly and space - se nsitive applications. these smd leds are suitable for the accessary of engineering vehicles . 1 . 1 features ? meet rohs ? package in 12 mm tape on 7" diameter reels ? preconditioning: accelerate to jedec level 2 ? qualification is based on aec - q101 rev d ? eia std pac kage ? i.c. compatible ? compatible with automatic placement equipment ? compatible with infrared reflow solder process 1 . 2 applications ? automotive : access o ry applications 2 . package dimensions part no. lens color source color ltsa - g6spvskt u water clear alingap yellow notes : 1. all dimensions are in millimeters. 2. tolerance is 0.2 mm (.008") unless otherwise noted. 3. an ode lead frame is heat sink of led.
3 / 1 3 part no. : ltsa - g6spvskt u bns - od - fc002/a4 smd led ltsa - g6spvskt u note : dc forward minimum current is 5ma, maximum is 200ma (fig 3&5) 3.2 thermal characteristics parameter symbol typ. max. unit thermal resistance ( junction C amb ient ) note rth ja 5 0 - c /w thermal resistance ( junction C solder point) note rth j s 3 0 - c /w junction temperature t j - 1 2 5 c note : rth ja measurement condition substrate: fr4 (t=1.6mm) / pattern size: 16mm 2 3. rating and characteristics 3 . 1 absolute maximum ratings at ta=25 c parameter lt sa - g6sp v s k t u unit power dissipation 5 3 0 mw peak forward current (1/10 duty cycle, 0.1ms pulse width) 400 ma dc forward cu rrent 5 20 0 ma operating temperature range - 40 c to + 1 10 c storage temperature range - 40 c to + 1 1 0 c infrared soldering condition 260 c for 10 seconds
4 / 1 3 part no. : ltsa - g6spvskt u bns - od - fc002/a4 smd led ltsa - g6spvskt u 3.3 suggest ir reflow conditio n f or pb free process: ir - reflow soldering profile for lead free soldering (a cc. to j - std - 020 )
5 / 1 3 part no. : ltsa - g6spvskt u bns - od - fc002/a4 smd led ltsa - g6spvskt u n otes : 1. luminous intensity is measured with a light sensor and filter combination that approximates the cie eye - response curve 2. ? 1/2 is the off - axis angle at which the luminous intensity is half the axial luminous intensity. 3. the dominant wavelength, d is derived from the cie chromaticity diagram and represents the single wavelength which defines the colo r of the device . dominate wavelength tolerance is +/ - 1nm . 4. forward voltage tolerance is +/ - 0.1 volt. 5. reverse voltage (vr) condition is applied to ir test only. the device is not designed for reverse operation. 3 . 4 electrical / optical characteristics at ta=25 c parameter symbol part no. lt sa - min. typ. max. unit test condition luminous intensity iv g6s pvskt u 4.5 - 11.2 cd if = 1 4 0ma note 1 viewing angle 2 ? 1/2 g6spvskt u - 120 - deg note 2 (fig. 2 ) peak emission wavelength ? - 592 - nm measurement @peak (fig.1) dominant wavelength ? 58 3 - 59 5 nm if = 1 4 0ma note 3 spectral line hal f - width ? ? - 1 8 - nm forward voltage vf g6spvskt u 1. 90 - 2 . 6 5 v if = 1 4 0ma note 4 reverse current ir g6spvskt u - 10 a
6 / 1 3 part no. : ltsa - g6spvskt u bns - od - fc002/a4 smd led ltsa - g6spvskt u 4 . bin rank batch description on label: vf / iv /wd ( ex. d /da / 3 ) ? v f ran k forward voltage (vf ) unit : v @ 1 4 0ma bin code min. max. c 1.90 2.05 d 2.05 2.20 e 2.20 2.35 f 2.35 2.50 g 2.50 2.65 tolerance on each voltage bin is +/ - 0.1v ? iv rank luminous intensity (iv) unit : cd @ 14 0ma bin code min. max. da 4.5 5.6 db 5.6 7.1 ea 7.1 9.0 e b 9.0 11.2 tolerance on each intensity bin is +/ - 11% ? wd rank dominant wavelength (wd) unit : nm @ 1 4 0ma bin code min. max. 3 583 586 4 586 589 5 589 592 6 592 595 tolerance for each dominate wavelength bin is +/ - 1nm
7 / 1 3 part no. : ltsa - g6spvskt u bns - od - fc002/a4 smd led ltsa - g6spvskt u 5 . typical electrical / optical characteristics curves . 25 c ambient temperature unless special noted) fig. 2 s patial distributio n
8 / 1 3 part no. : ltsa - g6spvskt u bns - od - fc002/a4 smd led ltsa - g6spvskt u 6 . user guide 6 . 1 cleaning do not use unspecified chemical liquid to clean led they could harm the package. if cleaning is necessary, immerse the led in ethyl alcohol or isopropyl alcohol at normal temperature for less one minute. 6 . 2 recommend printed circuit bo ard attachment pad infrared reflow soldering 6 . 3 package dimensions o f tape and reel n ote : 1. all dimensions are in millimeters (inches).
9 / 1 3 part no. : ltsa - g6spvskt u bns - od - fc002/a4 smd led ltsa - g6spvskt u 6 . 4 package dimensions of reel notes: 1. empty co mponent pockets sealed with t o p cover tape. 2. 7 inch reel 1 000 pieces per reel and minimum 500 pieces per reel. 3. the maximum number of consecutive missing lamps is two. 4. in accordance with ansi/eia 481 specifications.
10 / 1 3 part no. : ltsa - g6spvskt u bns - od - fc002/a4 smd led ltsa - g6spvskt u 7 . c autions 7 . 1 application t he leds described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household applications).consult liteons sales in advance for information on applications in which exceptional reliabili ty is required, particularly when the failure or malfunction of the leds may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety devices). 7 . 2 storage this product is qualified as moisture sensitive level 2 per jedec j - std - 020 precaution when handing this moisture sensitive product is important to ensure the reliability of the product. the package is sealed: the leds should be stored at 30c or less and 70%rh or le ss. and the leds are limited to use within one year, while the leds is packed in moisture - proof package with the desiccants inside. the package is opened: the storage ambient for the leds should not exceed 30c temperature and 60% relative humidity. it is recommended that leds out of their original packaging are ir - reflowed within 365 days . for extended storage out of their original packaging, it is recommended that the leds be stored in a sealed container with appropriate desiccant, or in a desiccators wit h nitrogen ambient. leds stored out of their original packaging for more than 365 days should be baked at about 60 c for at least 48 hours before solder assembly. 7 . 3 cleaning use alcohol - based cleaning solvents such as isopropyl alcohol to clean the le d if necessary. 7 . 4 soldering recommended soldering conditions: reflow soldering soldering iron pre - heat pre - heat time peak temperature soldering time 150~200c 120 sec. max. 260c max. 10 sec. max.(max. two times) temperature soldering time 300c max. 3 sec. max. (one time only) notes: because different board designs use different number and types of devices, solder pastes, reflow ovens, and circuit boards, no single temperature profile works for all possible combinations. however, you can successfully mount your packages to the pcb by following the proper guidelines and pcb - specific characterization. lite - on runs both component - level verification using in - house kyramx98 reflow chambers and board - level assembly. the results of this testing are verified t hrough post - reflow reliability testing.profiles used at lite - on are based on jedec standards to ensure that all packages can be successfully and reliably surface mounted. figure on page3 shows a sample temperature profile compliant to jedec standards. you can use this example as a generic target to set up your reflow process. you should adhere to the jedec profile limits as well as specifications and recommendations from the solder paste manufacturer to avoid damaging the device and create a reliable solder joint.
11 / 1 3 part no. : ltsa - g6spvskt u bns - od - fc002/a4 smd led ltsa - g6spvskt u 7 . 5 drive method a led is a current - operated device. in order to ensure intensity uniformity on multiple leds connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in serie s with each led as shown in circuit a below. circuit model a circuit model b (a) recommended circuit. (b) the brightness of each led might appear different due to the differences in the i - v characteristics of those leds. 7 . 6 esd (electrostatic discharge) static electricity or power surge will damage the led. suggestions to prevent esd damage: ? use of a conductive wrist band or anti - electrostatic glove when handling these leds. ? all devices, equipment, and machinery must be properly grounded. ? work tables, storage racks, etc. should be properly grounded. ? use ion blower to neutralize the static charge which might have built up on surface of the leds plastic lens as a result of friction between leds during storage and handling . esd - damaged leds will exhibit abnormal characteristics such as high reverse leakage current, low forward voltage, or no lightup at low currents. to verify for esd damage, check for lightup and vf of the suspect leds at low currents. the vf of good leds should be >2.0v@0.1ma for ingan product and >1.4v@0.1ma for alingap product. led led
12 / 1 3 part no. : ltsa - g6spvskt u bns - od - fc002/a4 smd led ltsa - g6spvskt u 8 . reliability test 8.1 test item/condition: (based on aecq - 101 ver.d) no. test item test condition sample size per lot reference standard 2 pre - conditioning m sl 2 1 25 , 24 hrs baking moisture soak 60 /60% 168 hrs interval: 15mins ~ 4 hours to do ir - reflow 462 jesd22 a - 11 3 5b+ high temperature forward bias ( htfb) ta= 70 2c if: 200 ma 1000 hrs 77 jesd22 a - 108 5b high temperature forward bias ( htfb) ta= 110 2c if: 50ma 1000 hrs 77 jesd22 a - 108 7 temperature cycle (tc) - 40 c(+0, - 10) to 1 1 0c(+15, - 0) 10 min 10 min 10 min 1000 cycles 77 jesd22 a - 104 appendix 6 9a high temperature high humidity bias (hthhb) ta= 8 5 2c , 85 5% rh if: 145ma 1000 hrs 77 j esd22 a - 101 10alt power and temperature cycle (ptc) - 40c (+0, - 10) to 85 c (+1 0 , - 0) 10 min 1 0 min 10 min if: 145ma 1 cycle: 2 min. on / 2 min. off 15000 cycles (1000 hrs) 77 jesd22 a - 105 11 esd characterization hbm 2000v 30 jesd22 - a114 - f 20 resis tance to solder heat tsld=260 c , 10sec. 3times 30 jesd22a - 111 2 1 solderability tsld = 2 3 5 5 c , 5 sec , leas - free solder 10 j - std - 002 jesd22b102
13 / 1 3 part no. : ltsa - g6spvskt u bns - od - fc002/a4 smd led ltsa - g6spvskt u 9. others the appearance and specifications of the product may be modified for improvement without pri or notice. 10 . suggested checking list training and certification 1. everyone working in a static - safe area is esd - certified? 2. training records kept and re - certification dates monitored? static - safe workstation & work areas 1. static - safe workstation or work - areas have esd signs? 2. all surfaces and objects at all static - safe workstation and within 1 ft measure less than 100v? 3. all ionizer activated, positioned towards the units? 4. each work surface mats grounding is good? personnel grounding 1. every person (includi ng visitors) handling esd sensitive (esds) items wears wrist strap, heel strap or conductive shoes with conductive flooring? 2. if conductive footwear used, conductive flooring also present where operator stand or walk? 3. garments, hairs or anything closer than 1 ft to esd items measure less than 100v*? 4. every wrist strap or heel strap/conductive shoes checked daily and result recorded for all dls? 5. all wrist strap or heel strap checkers calibration up to date? note: *50v for ingan led. device handling 1. every esd s items identified by eia - 471 labels on item or packaging? 2. all esds items completely inside properly closed static - shielding containers when not at static - safe workstation? 3. no static charge generators (e.g. plastics) inside shielding containers with esds i tems? 4. all flexible conductive and dissipative package materials inspected before reuse or recycles? others 1. audit result reported to entity esd control coordinator? 2. corrective action from previous audits completed? 3. are audit records complete and on file?

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