lite-on dcc release lite-on technology corp. / optoelectronics no.90,chien 1 road, chung ho, new taipei city 23585, taiwan, r.o.c. tel: 886-2-2222-6181 fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto ir emitter and detectorproduct data sheetLTE-C216-P spec no.: ds50-2012-0016effective date: 08/17/2012revision: - bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4
lite - on technology co rporation. p r o p e r t y o f l i t e - o n o n l y features * package in 8mm tape on 7" diameter reels. * compatible with automatic placement equipment. * compatible with infrared reflow solder process * eia std package. * meet rohs, green product . * p ackage type 1206 pac kage dimensions notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.10 mm (.004") unless otherwise noted. 3. specifications are subject to change without notice. part no. : lte - c216 - p ( only for logitech ) page : 1 of 8 bns - od - c131/a4 C rev.a C april 13, 2012
lite - on technology co rporation. p r o p e r t y o f l i t e - o n o n l y absolute maximum ratings at t a =25 parameter maximum rating unit power dissipation 100 mw peak forward current (300pps, 10 s pulse) 8 00 m a continuous forward current 60 ma revers e voltage 5 v operating temperature range - 40 to + 85 storage temperature range - 55 to + 100 infrared soldering condition 260 c for 10 seconds suggest ion profile: suggest ion ir reflow profile for pb free process part no. : lte - c216 - p ( only for logitech ) page : 2 of 8 bns - od - c131/a4 C rev.a C april 13, 2012
lite - on technology co rporation. p r o p e r t y o f l i t e - o n o n l y electrical optical characteristics at t a =25 parameter symbol min. typ. max. unit test condition radiant intensity i e 4 5.5 13 mw/sr i f = 20 ma pea k emission wavelength peak - 850 - nm i f = 50ma spectral line half - width ? - 50 - nm i f = 50ma forward voltage v f - 1. 6 2.0 v i f = 5 0ma reverse current i r - - 10 a v r = 5v rise/fall time tr/tf - 2 0 - ns 10%~90% viewing angle (see fig.6) 2 1/2 - 75 - deg. part no. : lte - c216 - p ( only for logitech ) page : 3 of 8 bns - od - c131/a4 C rev.a C april 13, 2012
lite - on technology co rporation. p r o p e r t y o f l i t e - o n o n l y typical electrical / optical characteristics curves (25 ambient temperature unless otherwise noted) part no. : lte - c216 - p ( only for logitech ) page : 4 of 8 bns - od - c131/a4 C rev.a C april 13, 2012
lite - on technology co rporation. p r o p e r t y o f l i t e - o n o n l y cleaning do not use unspecified chemical liquid to clean led they could harm the package. if clean is necessary, immerse the led in ethyl alcohol or in isopropyl alcohol at normal temperature for less one minute. suggest soldering pad dimensions package dimensions of tape and reel notes: 1. all dimensions are in millimeters (inches). part no. : lte - c216 - p ( only for logitech ) page : 5 of 8 bns - od - c131/a4 C rev.a C april 13, 2012
lite - on technology co rporation. p r o p e r t y o f l i t e - o n o n l y notes: 1. all dimensions are in millimeters (inches). 2. empty component pockets sealed with top c over tape. 3. 7 inch reel - 3000 pieces per reel. 4. the maximum number of consecutive missing lamps is two. 5. in accordance with ansi/eia 481 - 1 - a - 1994 specifications. part no. : lte - c216 - p ( only for logitech ) page : 6 of 8 bn s - od - c131/a4 C rev.a C april 13, 2012
lite - on technology co rporation. p r o p e r t y o f l i t e - o n o n l y cautions 1. application the leds described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household applications).consult liteons sales in advanc e for information on applications in which exceptional reliability is required, particularly when the failure or malfunction of the leds may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment, medical and lif e support systems and safety devices). 2. storage the package is sealed: the leds should be stored at 30c or less and 90%rh or less. and the leds are limited to use within one year, while the leds is packed in moisture - proof package with the desiccant s inside. the package is opened: the storage ambient for the leds should not exceed 30c temperature or 6 0% relative humidity. it is recommended that leds out of their original packaging are ir - reflowed within one week hrs . for extended storage out of thei r original packaging, it is recommended that the leds be stored in a sealed container with appropriate desiccant, or in a desiccators with nitrogen ambient. leds stored out of their original packaging for more than one week hrs should be baked at about 60 deg c for at least 2 0 hours before solder assembly. 3. cleaning use alcohol - based cleaning solvents such as isopropyl alcohol to clean the led if necessary. 4. soldering recommended soldering conditions: reflow soldering soldering iron pre - heat pre - he at time peak temperature soldering time 1 50 ~ 200 c 120 sec. max. 2 6 0c max. 10 sec. max. (max. two times) temperature soldering time 300c max. 3 sec. max. (one time only) because different board designs use different number and types of devices, solder pa stes, reflow ovens, and circuit boards, no single temperature profile works for all possible combinations. however, you can successfully mount your packages to the pcb by following the proper guidelines and pcb - specific characterization . lite - on runs both component - level verification using in - house kyramx98 reflow chambers and board - level assembly. the results of this testing are verified through post - reflow reliability testing. profiles used at lite - on are based on jedec standards to ensure that all packa ges can be successfully and reliably surface mounted. figure on page3 shows a sample temperature profile compliant to jedec standards. you can use this example as a generic target to set up your reflow process. you should adhere to the jedec profile limits as well as specifications and recommendations from the solder paste manufacturer to avoid damaging the device and create a reliable solder joint. part no. : lte - c216 - p ( only for logitech ) page : 7 of 8 bns - od - c131/a4 C rev.a C april 13, 2012
lite - on technology co rporation. p r o p e r t y o f l i t e - o n o n l y 5. drive method an led is a current - operated device. in order to ensure intensity uniformity on multiple leds connected in parallel in an application, it is recommended that a current limiting resistor be in corporated in the drive circuit, in series with each led as shown in circuit a below. circuit model a circuit model b (a) recommended circuit. (b) the br ightness of each led might appear different due to the differences in the i - v characteristics of those leds. part no. : lte - c216 - p ( only for logitech ) page : 8 of 8 bns - od - c131/a C rev.a C april 13, 2012 led led
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