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1/12 www.rohm.com 2010.01 - rev.b ? 2010 rohm co., ltd. all rights reserved. hall ic series bipolar latch hall ic BU52040HFV description bu52040 hall effect ic for wheel keys / trackballs is designed to detect a switch in magnetic field from n to s (or vice versa) and maintain its detection result on the ou tput until the next switch. output is pulled low for s-pole fields and high for n-po le fields. this ic is ideal for detecting the number of shaft rotations inside of a wheel key, trackball, or other similar applica tions. using two ics can also enable detection of rotation direction. features 1) ideally suited for wheel keys or trackballs 2) micropower operation (small current cons umption via intermittent operation method) 3) ultra-small outline package 4) supports 1.8 v supply voltage 5) high esd resistance: 8kv (hbm) applications wheel keys (zero-contact selection dials), tr ackballs, and other interface applications. product lineup product name supply voltage (v) operation point (mt) hysteresis (mt) period (s) supply current (avg) (a) output type package BU52040HFV 1.65 3.30 +/-3.0 6.0 500 200 cmos hvsof5 plus is expressed on the s-pole; minus on the n-pole absolute maximum ratings BU52040HFV (ta = 25c) parameters symbol limit unit power supply voltage v dd -0.1 4.5 1 v output current i out 0.5 ma power dissipation pd 536 2 mw operating temperature range t opr -40 +85 c storage temperature range t stg -40 +125 c 1. not to exceed pd 2. reduced by 5.36mw for each increase in ta of 1 over 25 (mounted on 70mm70 mm1.6mm glass-epoxy pcb) no.10045ebt05 downloaded from: http:///
BU52040HFV technical note 2/12 www.rohm.com 2010.01 - rev.b ? 2010 rohm co., ltd. all rights reserved. magnetic, electrical characteristics BU52040HFV (unless otherwise specified, v dd =1.80v, ta=25c) parameters symbol limit unit conditions min typ max power supply voltage v dd 1.65 1.80 3.30 v operation point b op 1.0 3.0 5.0 mt release point b rp -5.0 -3.0 -1.0 mt hysteresis b hys - 6.0 - mt period t p - 500 1200 s output high vol age v oh v dd - 0.2 - - v b < b rp 3 i out =-0.5ma output low voltage v ol - - 0.2 v b op < b 3 i out =+0.5ma supply current 1 i dd1(avg) - 200 300 a v dd =1.8v, average supply current during startup time 1 i dd1(en) - 3.0 - ma v dd =1.8v, during startup time value supply current during standby time 1 i dd1(dis) - 2.0 - a v dd =1.8v, during standby time value supply current 2 i dd2(avg) - 300 450 a v dd =2.7v, average supply current during startup time 2 i dd2(en) - 4.5 - ma v dd =2.7v, during startup time value supply current during standby time 2 i dd2(dis) - 3.5 - a v dd =2.7v, during standby time value 3. b = magnetic flux density 1mt=10gauss positive (+) polarity flux is defined as t he magnetic flux from south pole which is direct toward to the branded face of the sensor. after applying power supply, it takes one cycle of period (tp) to become definite output. radiation hardiness is not designed. downloaded from: http:///
BU52040HFV technical note 3/12 www.rohm.com 2010.01 - rev.b ? 2010 rohm co., ltd. all rights reserved. figure of measurement circuit b op /b rp vdd vdd gnd out 100 f v t p 200 ? vdd vdd gnd out i dd vdd vdd gnd out 2200 f a oscilloscope the period is monitored by oscilloscope. bop and brp are measured with applying the magnetic field from the outside. fig.1 b op ,b rp measurement circuit fig.2 t p measurement circuit v ol vdd vdd gnd out 100 f v i out 0.5ma fig.4 v ol measurement circuit fig.5 i dd measurement circuit v oh vdd gnd out 100 f v i out 0.5ma fig.3 v oh measurement circuit vdd downloaded from: http:///
BU52040HFV technical note 4/12 www.rohm.com 2010.01 - rev.b ? 2010 rohm co., ltd. all rights reserved. reference data block diagram BU52040HFV pin no. pin name function comment 1 n.c. open or short to gnd. 2 gnd ground 3 n.c. open or short to gnd. 4 vdd power supply 5 out output out gnd dd latch timing logic dynamic offset cancellation sample & hold hall element 2 5 4 fig.12 0.1 f reverse 1 2 5 3 3 surface 1 4 5 2 4 fig.7 bop,brpC supply voltage fig.8 t p C ambient temperature fig.9 t p C supply voltage fig.10 i dd C ambient temperature fig.11 i dd C supply voltage fig.6 bop,brpC ambient temperature -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0 -60 -40 - 20 0 20 40 60 80 100 ambient temperature [ ] magnetic flux density [mt] bop brp v dd =1.8v -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0 1.4 1.8 2.2 2.6 3.0 3.4 3.8 supply voltage v magnetic flux density [mt ] ta = 25c bop brp 100 150 200 250 300 350 400 1.4 1.8 2.2 2.6 3.0 3.4 3.8 supply voltage [v] average supply current [a ] ta = 2 5 c 200 300 400 500 600 700 800 - 60 - 40 - 20 0 20 40 60 80 100 ambient temperature [ ] period [ s] v dd =1.8v 200 300 400 500 600 700 800 1.4 1.8 2.2 2.6 3.0 3.4 3.8 supply voltage [v] period [ s] ta = 25c 100 150 200 250 300 350 400 - 60 - 40 -20 0 20 40 60 80 100 ambient temperature [ ] average supply current [a] v dd =1.8v adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc. the cmos output terminals enable direct connection to the pc, with no external pull-up resistor required. downloaded from: http:///
BU52040HFV technical note 5/12 www.rohm.com 2010.01 - rev.b ? 2010 rohm co., ltd. all rights reserved. description of operations (micro-power operation) the hall effect ic for wheel keys / trackballs adopts an intermi ttent operation method to save energy. at startup, the hall elements, amp, comparator and other detection circuits po wer on and magnetic detection begins. during standby, the detection circuits power off, thereby reducing current consum ption. the detection results are held while standby is active, and then output. reference period: 500 s (max. 1200 s) reference startup time: 24 s fig.13 (offset cancellation) the hall elements form an equivalent wheatstone (resistor) br idge circuit. offset voltage may be generated by a differential in this bridge resistance, or can arise from changes in resistance due to package or bonding stress. a dynamic offset cancellation circuit is employed to cancel this offset voltage. when hall elements are connected as shown in fig. 14 and a magnetic field is applied perpendicularly to the hall elements, voltage is generated at the mid-point terminal of the bridge. this is known as the hall voltage. dynamic cancellation switches the wiring (shown in the figure) to redirect the current flow to a 90 ? angle from its original path, and thereby cancels the hall voltage. the magnetic signal (only) is maintained in the sample/ hold circuit during the offset cancellation process and then released. i dd standby startup time period t gnd v dd i b hall voltage fig.14 downloaded from: http:///
BU52040HFV technical note 6/12 www.rohm.com 2010.01 - rev.b ? 2010 rohm co., ltd. all rights reserved. (magnetic field detection mechanism) fig.15 the ic detects magnetic fields that running horizontal to the top layer of the package. when the magnetic pole switches from n to s, the output changes from high to low; likewise, when the magnetic pole switc hes from s to n, the output changes from low to high. the output condition is held unit the next switch in magnetic polarity is detected. [operation in continuously changing magnetic fields] direction of magnet movement n hall ic fig.16 the ic can detect a continuous switch in magnetic field (from n to s and s to n) as depicted above. b brp bop 0 n-pole ma g netic flux densit y [ mt ] high out [v] low s-pole magnet s n s s n s n s n s n s n bop brp magnetic field hall ic output high low downloaded from: http:///
BU52040HFV technical note 7/12 www.rohm.com 2010.01 - rev.b ? 2010 rohm co., ltd. all rights reserved. intermittent operation at power on fig.17 the hall effect ic for wheel keys / trackballs adopts an interm ittent operation method in dete cting the magnetic field during startup, as shown in fig. 17. it outputs to the appropriate terminal based on the det ection result and maintains the output condition during the standby period. the time from power on until the end of the initial startup period is an indefinite interv al, but it cannot exceed the maximum period, 1200 s. to accommodate the system design, the hall ic output read should be programmed within 1200 s of power on, but after the time allowed for the period ambient temperature and supply voltage. additionally, if a magnetic flux density (b) of magnitude greater than b rp but less than b op is applied at power on, the output from the ic remains undefined and will be either high or low until a flux density exceeding the b op or b rp threshold is applied. application example wheel key two hall ics can enable detection of rotation direction of a magnetic zero-contact wheel key. c i r c u l a r m a g n e t BU52040HFV: 2pcs mounting position of hall ic inside wheel key the angular separation of the two hall ics within the footprint of the wheel key depends on n/s division angle of the internal magnet ( ), and can be set to either /4 or ? . mounting the two ics in this position causes the magnetic phase difference between the ics to equal 1/4, and the direction of rotation can be detected by measuring the change in this difference. an example of the magnetic field characteri stics for this application is shown in the figure below. s n s n s n s n n/s division angle of circular magnet = circular magnet s n n s clockwise rotation n s n s s s s s n n n n center of magnet 2) mounting angle of hall ic = ? mounting angle of hall ic hall ic a hall ic b 3/4 hall ic a hall ic b center of magnet /4 1) mounting angle of hall ic = /4 counterclockwise rotation v dd startup time standby time standby time startup time (intermittent operation) indefinite out ( n ma g netic field p resent ) indefinite interval out (s magnetic field present) low high supply current indefinite interval ( no ma g netic field p resent ) (b BU52040HFV technical note 8/12 www.rohm.com 2010.01 - rev.b ? 2010 rohm co., ltd. all rights reserved. detection of rotation direction 1) mounting angle = /4 2) mounting angle = ? because the ic measures changes in magnetic field every 1200 s, the ic cannot detect changes in rotation at speeds exceeding this period. clockwise rotation s n bop brp high low high low hall ic b output hall ic a output magnetic field applied to ic a magnetic field applied to ic b clockwise turn: output of ic b is low when out p ut of ic a becomes hi g h counterclockwise rotation s n bop brp high low high low magnetic field applied to ic a magnetic field applied to ic b rotation angle rotation angle hall ic a output hall ic b output counterclockwise rotation clockwise rotation s n bop brp high low high low hall ic b output hall ic a output magnetic field applied to ic a magnetic field applied to ic b rotation angle high s n bop brp high low low magnetic field applied to ic a magnetic field applied to ic b rotation angle hall ic a output hall ic b output counterclockwise turn: ou tput of ic b is high when output of ic a becomes high clockwise turn: output of ic b is high when output of ic a becomes high. counterclockwise turn: ou tput of ic b is a low when output of ic a becomes high. downloaded from: http:///
BU52040HFV technical note 9/12 www.rohm.com 2010.01 - rev.b ? 2010 rohm co., ltd. all rights reserved. magnet selection horizontally stacked magnet vertically stacked magnet because the field loop in horizontally stacked magnets extends fo r a shorter distance than that of vertically stacked magnets, the gap between the magnet and the hall ic must be decreased. therefore, if horizontally-stacked magnets are used in the application, the thickness of the magnet or the area of each section should be increased to allow for a larger gap between the magnet and ic. because the ic is unable to detect rotation direction if using magnets that are smaller than the ics package size, ensure that the physical size of each n/s division is larger than the ics package, and that the ic s are properly mounted with an angular distance of either /4 or ? from one another (where = n/s division angle of circular magnet). ic reference position s position of the hall effect ic(reference) ( unit mm ) s s n flux flux s s n n s n n s magnet n/s division angle = circular magnet s n n s n s n s s s s n n n n hall ic (x2) mounting angle of hall ic clockwise rotation counterclockwise rotation hvsof5 0.6 0.8 0.2 downloaded from: http:///
BU52040HFV technical note 10/12 www.rohm.com 2010.01 - rev.b ? 2010 rohm co., ltd. all rights reserved. footprint dimensions (optimize footprint dimensions to the board design and soldering condition) terminal equivalent circuit diagram because they are configured for cmos (inverter) output, the out put pins require no external resistance and allow direct connection to the pc. this, in turn, enables reduction of the current that would otherwise flow to the external resistor durin g magnetic field detection, and supports ov erall low current (micropower) operation. fig.18 gnd vdd out (unit mm) hvsof5 downloaded from: http:///
BU52040HFV technical note 11/12 www.rohm.com 2010.01 - rev.b ? 2010 rohm co., ltd. all rights reserved. notes for use 1) absolute ma ximum ratings exceeding the absolute maximum ratings for supply voltage, operating conditions, etc. may result in damage to or destruction of the ic. because the source (short mode or open mode) cannot be identified if the device is damaged in this way, it is important to take physical safety measures such as fusing when implementing any special mode that operates in excess of absolute rating limits. 2) gnd voltage make sure that the gnd terminal potential is maintained at the minimum in any operating state, and is always kept lower than the potential of all other pins. 3) thermal design use a thermal design that allows for sufficient margin in light of the power dissipation (pd) in actual operating conditions. 4) pin shorts and mounting errors use caution when positioning the ic for mounting on printed ci rcuit boards. mounting errors, such as improper positioning or orientation, may damage or destroy the device. the ic may also be damaged or destroyed if output pins are shorted together, or if shorts occur between t he output pin and supply pin or gnd. 5) positioning components in proximity to the hall ic and magnet positioning magnetic components in close proximity to the hall ic or magnet may alter the ma gnetic field, and therefore the magnetic detection operation. thus, placing magnetic components near the hall ic and magnet should be avoided in the design if possible. however, where t here is no alternative to employing such a design, be sure to thoroughly test and evaluate performance with the magnetic co mponent(s) in place to verify normal operation before implem enting the design. 6) operation in strong electromagnetic fields exercise extreme caution about using the device in the presence of a strong electr omagnetic field, as such use may cause the ic to malfunction. 7) common impedance make sure that the power supply and gnd wiring limits co mmon impedance to the extent possible by, for example, employing short, thick supply and ground lines. also, take measures to minimize ripple such as using an inductor or capacitor. 8) gnd wiring pattern when both a small-signal gnd and high-current gnd are provided, single-point grounding at t he reference point of the set pcb is recommended, in order to separate the small-signal and high-current patterns, and to ensure that voltage changes due to the wiring resistance and high current do not cause any vo ltage fluctuation in the sma ll-signal gnd. in the same way, care must also be taken to avoid wiring pattern fluct uations in the gnd wiring pattern of external components. 9) power source design since the ic performs intermittent operati on, it has peak current when its on. please taking that into account and under examine adequate evaluations when designing the power source. downloaded from: http:///
BU52040HFV technical note 12/12 www.rohm.com 2010.01 - rev.b ? 2010 rohm co., ltd. all rights reserved. ordering part number b u 5 2 0 4 0 h f v - t r part no part no 52040 package hfv : hvsof5 packaging and forming specification tr: embossed tape and reel (hvsof5) (unit : mm) hvsof5 s 0.08 m 0.1 s 4 321 5 (0.05) 1.6 0.05 1.0 0.05 1.6 0.05 1.2 0.05 (max 1.28 include burr) 45 32 1 (0.8) (0.91) (0.3) (0.41) 0.2max 0.13 0.05 0.22 0.05 0.6max 0.5 0.02 +0.03C0.02 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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