part number: XZMYLA109FS 3.5x2.8 mm smd chip led lamp feb 19, 2016 xdsb8557 v1-z layout: maggie l. p. 1/6 features 3.5mm x 2.8mm x 0.8mm smd led ideal for indication fo r hand held products ir-reflow compatible ideal 0.5-watt power for back lighting and accent lighting special colors available standard package: 2000pcs / reel msl (moisture sensitivity level): 2a rohs compliant attention observe precautions for handling electrostatic discharge sensitive devices notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.25(0.01") unless otherwise noted. 3. specifications are subjec t to change without notice. package schematics
part number: XZMYLA109FS 3.5x2.8 mm smd chip led lamp feb 19, 2016 xdsb8557 v1-z layout: maggie l. p. 2/6 handling precautions compare to epoxy encapsulant that is hard and brittle, si licone is softer and flexible. although its characteristic significantly reduces thermal stress, it is more susc eptible to damage by external mechanical force. as a result, special handling precautions need to be ob served during assembly using silicone encapsulated led products. failure to comply might lead to damage and premature failure of the led. 1. handle the component along the side surfaces by using forceps or appropriate tools. 2. do not directly touch or handle the silicone lens surface. it may damage the internal circuitry. 3. do not stack together assembled pcbs containing exposed leds. impact may scratch the silicone lens or damage the internal circuitry. 4.1. the inner diameter of the smd pickup nozzle should not exceed the size of the led to prevent air leaks. 4.2. a pliable material is suggested for the nozzle tip to av oid scratching or damaging the led surface during pickup. 4.3. the dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. as silicone encapsulation is permeable to gases, some corrosive substances such as h 2 s might corrode silver plating of leadframe. special care should be taken if an led with si licone encapsulation is to be used near such substances.
part number: XZMYLA109FS 3.5x2.8 mm smd chip led lamp feb 19, 2016 xdsb8557 v1-z layout: maggie l. p. 3/6 absolute maximum ratings at ta=25c notes: 1.results from mounting on pc board fr4(pad size 70mm 2 ), mounted on pc board-me tal core pcb is recommend for lowest thermal resistance. 2. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 3.1/10 duty cycle, 0.1ms pulse width. 4.a relative humidity between 40% and 60% is recommended in esd-pr otected work areas to reduce static build up during assembly process (reference jedec/jesd 625-a and jedec/j-std-033) electrical / optical characteristics at ta=25c part number emitting color emitting material lens-color luminous intensity cie127-2007* (i f =150ma) mcd wavelength cie127-2007* nm p viewing angle 2 1/2 min. typ. min. typ. XZMYLA109FS yellow algainp water clear 3600* 4490* 12000* 13700* 590* 120 luminous flux cie127-2007* (i f =150ma)* mlm notes: leds are binned according to their luminous flux. *luminous intensity/luminous flux value and waveleng th are in accordance with cie127-2007 standards. *wavelength value is in accordan ce with cie127-2007 standards. parameter symbol value unit power dissipation p d 495 mw junction temperature [1] t j 110 c operating temperature top -40 ~ +85 c storage temperature tstg -40 ~ +85 c dc forward current [1] i f 150 ma peak forward current [2] i fm 200 ma thermal resistance [1] (junction/ambient) r th j-a 135 c/w thermal resistance [1] (junction/solder point) r th j-s 55 c/w 8000 v electrostatic discharge threshold (hbm) reverse voltage v r 5 v parameter symbol value unit wavelength at peak emission cie127-2007* i f =150ma [typ.] peak 590* nm dominant wavelength cie127-2007* i f =150ma [typ.] dom [1] 590* nm spectral line half-width i f =150ma [typ.] 20 nm v f [2] v forward voltage i f =150ma [typ.] 2.7 forward voltage i f =150ma [max.] 3.3 allowable reverse current [max.] i r 85 ma capacitance c 45 pf
part number: XZMYLA109FS 3.5x2.8 mm smd chip led lamp feb 19, 2016 xdsb8557 v1-z layout: maggie l. p. 4/6 yellow
part number: XZMYLA109FS 3.5x2.8 mm smd chip led lamp feb 19, 2016 xdsb8557 v1-z layout: maggie l. p. 5/6 ? the device has a single mounting surface. the device must be mounted according to the specifications. ? reel dimension ? recommended soldering pattern (units : mm; tolerance: 0.1) led is recommended for reflow soldering and soldering profile is shown below. remarks: if special sorting is required (e.g. binn ing based on forward voltage, luminous intensity / luminous flux, or wavelength), the typical accuracy of the so rting process is as follows: 1. wavelength: +/-1nm 2. luminous intensity / luminous flux: +/-15% 3. forward voltage: +/-0.1v note: accuracy may depend on the sorting parameters. ? tape specification (units : mm)
part number: XZMYLA109FS 3.5x2.8 mm smd chip led lamp feb 19, 2016 xdsb8557 v1-z layout: maggie l. p. 6/6 packing & label specifications terms of use 1. data presented in this document reflect statistical figures and should be treated as technical reference only. 2. contents within this document are subject to improvement and enhancement changes without notice. 3. the product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet. user accepts full risk and responsibility when operating the product(s) beyond their intended specifications. 4. the product(s) described in this document are intended for electronic applications in which a person?s life is not reliant u pon the led. please consult with a sunled representative for special applications where the led may have a direct impact on a person?s life. 5. the contents within this document may not be altered without prior consent by sunled. 6. additional technical notes are available at http://www.sunledusa.co m/technicalnotes.asp ?
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