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lite-on dcc release lite-on technology corp. / optoelectronics no.90,chien 1 road, chung ho, new taipei city 23585, taiwan, r.o.c. tel: 886-2-2222-6181 fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto through hole lamp product data sheetLTL1CHJSTNN-002A spec no.: ds20-2008-0252effective date: 03/09/2016revision: b bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4
1 / 10 part no. : ltl1chj s tnn - 0 02 a bns - od - fc002/a4 through hole lamp ltl1chjstnn - 0 0 2 a through hole lamp ltl1chjstnn - 0 02 a rev description by date above data for pd and customer tracking only - nppr ophas 09/04 /201 4 a update version lance 0 3 /0 3 /201 6
2 / 10 part no. : ltl1chj s tnn - 0 02 a bns - od - fc002/a4 through hole lamp ltl1chjstnn - 0 0 2 a 1. description through hol e leds are offered in a variety of packages such as 3mm, 4mm, 5mm, rectangular, and cylinder which are suitable for all applications requiring status indication. several intensity and viewing angle choices are available in each color for design flexibility . 1 . 1. features ? lead (pb) free product C rohs compliant. ? high luminous intensity output. ? low power consumption. ? high efficiency. ? versatile mounting on p.c. board or panel. ? i.c. compatible/low current requirement. ? 3.1 mm diameter package. ? yellow alingap 590 nm l amp & yellow transparent lens 1.2 . applications ? communication ? computer ? consumer ? home appliance ? industrial 2 . outline dimensions notes : 1. all dimensions are in millimeters (inches). 2. tolerance is 0.25mm (.010") unless otherwise noted. 3. protruded r esin under flange is 1.0mm (.04") max. 4. lead spacing is measured where the leads emerge from the package. 5. specifications are subject to change without notice.
3 / 10 part no. : ltl1chj s tnn - 0 02 a bns - od - fc002/a4 through hole lamp ltl1chjstnn - 0 0 2 a 3. absolute maximum ratings at ta = 25 c parameter maximum rating unit power dissipation 7 5 mw pe ak forward current (duty cycle Q 1/10, pulse width Q 10ms) 60 ma dc forward current 3 0 ma derating linear from 4 0 0. 4 5 ma/ c operating temperature range - 30c to + 85c storage temperature range - 40c to + 100c lead soldering temperature [2.0mm (.079") from body] 260c for 5 seconds max. 4. electrical / optical characteristics at ta=25 c parameter symbol min. typ. max. unit test condition luminous intensity iv 110 310 880 mcd if = 20ma note 1,5 viewing angle 21/2 45 deg note 2 (fig.6) peak emission wavelength p 5 91 n m measurement @peak (fig.1) dominant wavelength d 5 90 nm note 4 spectral line half - width ? 1 5 nm forward voltage vf 2. 05 2. 4 v if = 20ma reverse current ir 100 a vr = 5v note: 1. luminous intensity is measured with a light sensor and filter combination that approximates the cie eye - response curve. 2. 1/2 is the off - axis angle at which the luminous intensity is half the axial luminous intensity. 3. iv classification code is marked on each packing bag. 4. the dominant wavelength, d is derived from the cie chromaticity diagram and represents the single wavelength which defines the color of the device. 5. iv guarantee must be included with 15% testing tolerance. 6. reverse voltage (vr) condition is applied for ir test only. the dev ice is not designed for reverse operation.
4 / 10 part no. : ltl1chj s tnn - 0 02 a bns - od - fc002/a4 through hole lamp ltl1chjstnn - 0 0 2 a 5. typical electrical / optical characteristics curves (25 c ambient temperature unless otherwise noted)
5 / 10 part no. : ltl1chj s tnn - 0 02 a bns - od - fc002/a4 through hole lamp ltl1chjstnn - 0 0 2 a 6. taping features * compatible with radial lead automatic insertion equipment. * most radial lead pla stic lead lamps available packaged in tape and folding. * 2.54mm (0.1") straight lead spacing available. * folding packaging simplifies handling and testing. * reel packaging is available by removing suffix a on option. package dimensions specification item symbol minimum maximum mm inch mm inch tape feed hole diameter d 3.8 0.149 4.2 0.165 component lead pitch f 2.3 0.091 3.0 0.118 front to rear deflection h -- -- 2.0 0.078 height of seating plane h 17.5 0.688 18.5 0.728 feed hole to bottom of component h1 22.4 0.882 24.0 0.945 feed hole to overall component height h2 3.8 0.149 4.2 0.165 lead length after component height l w0 11.0 0.433 feed hole pit ch p 12.4 0.488 13.0 0.511 lead location p1 4.4 0.173 5.80 0.228 center of component location p2 5.05 0.198 7.65 0.301 total taped thickness t -- -- 0.90 0.035 feed hole location w0 8.5 0.334 9.75 0.384 adhesive tape position w2 0 0 3.0 0.118 tape wi dth w3 17.5 0.689 19.0 0.748
6 / 10 part no. : ltl1chj s tnn - 0 02 a bns - od - fc002/a4 through hole lamp ltl1chjstnn - 0 0 2 a 7. packing spec. total 3,0 00pcs per inner carton 10 inner cartons per outer carton t otal 30 ,000 pcs per outer carton in every shipping lot, only the last pack will be non - full packing
7 / 10 part no. : ltl1chj s tnn - 0 02 a bns - od - fc002/a4 through hole lamp ltl1chjstnn - 0 0 2 a 8. bin table specification lum inous intensity unit : mcd @20ma bin code min. max. fg 110 180 hj 180 310 kl 310 520 mn 52 0 88 0 note: tolerance of each bin limit is 15% dominant wavelength unit : nm @20ma bin code min max h14 582.0 584.0 h15 584.0 586.0 h16 586 .0 588.0 h17 588.0 590.0 h18 590.0 592.0 h19 592.0 594.0 h20 594.0 596.0 note: tolerance of each bin limit is 1nm
8 / 10 part no. : ltl1chj s tnn - 0 02 a bns - od - fc002/a4 through hole lamp ltl1chjstnn - 0 0 2 a 9. cautions 9. 1. application this led lamp is good for application of indoor and outdoor sign, also ordinary electro nic equipment. 9. 2. storage the storage ambient for the leds should not exceed 30c temperature or 70% relative humidity. it is recommended that leds out of their original packaging are used within three months. for extended storage out of their original packaging, it is recommended that the leds be stored in a sealed container with appropriate desiccant or in desiccators with nitrogen ambient. 9. 3. cleaning use alcohol - based cleaning solvents such as isopropyl alcohol to clean the leds if necessary. 9. 4 . lead forming & assembly during lead forming, the leads should be bent at a point at least 3mm from the base of led lens. do not use the base of the lead frame as a fulcrum during forming. lead forming must be done before soldering, at normal temperature . during assembly on pcb, use minimum clinch force possible to avoid excessive mechanical stress. 9. 5. soldering when soldering, leave a minimum of 2 mm clearance from the base of the lens to t he soldering point. dipping the lens into the solder must b e avoided. do not apply any external stress to the lead frame during sol dering while the led is at high temperature. r ecommended soldering conditions : soldering iron wave soldering temperature soldering time position 350c max. 3 sec onds max. (one time only) no closer than 2 mm from the base of the epoxy bulb pre - heat pre - heat time solder wave soldering time dipping position 100c max. 60 seconds max. 260c max. 5 seconds max. no lower than 2 mm from the base of the epoxy b ulb note: excessive soldering temperature and/or time might result in deformation of the led lens or catastrophic failure of the led. ir reflow is not suitable process for through hole type led lamp product. 9. 6. drive method an led is a current - opera ted device. in order to ensure intensity uniformity on multiple leds connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each led as shown in circuit a below. circ uit model ( a ) circuit model ( b ) (a) recommended circuit (b) the brightness of each led might appear different due to the differences in the i - v characteri stics of those leds. led led
9 / 10 part no. : ltl1chj s tnn - 0 02 a bns - od - fc002/a4 through hole lamp ltl1chjstnn - 0 0 2 a 9.7. esd (electrostatic discharge) static electricity or power surge will damage the led. suggestions to prevent esd damage: ? use a conductive wrist band or anti - electrostatic glove when handling these leds ? all devices, equipment, an d machinery must be properly grounded ? work tables, storage racks, etc. should be properly grounded ? use ion blower to neutralize the static charge which might have built up on surface of the leds plastic lens as a result of friction between leds during stor age and handing suggested checking list : training and certification 9.7. 1 .1 . everyone working in a static - safe area is esd - certified? 9.7.1. 2. training records kept and re - certification dates monitored? static - safe workstation & work areas 9.7. 2.1 . static - safe workstation or work - areas have esd signs? 9.7. 2. 2. all surfaces and objects at all static - safe workstation and within 1 ft measure less than 100v? 9.7.2. 3. all ionizer activated, positioned towards the units? 9.7.2. 4. each wor k surface mats grounding is good? personnel grounding 9.7.3.1 . every person (including visitors) handling esd sensitive (esds) items wear wrist strap, heel strap or conductive shoes with conductive flooring? 9.7.3.1 . if conductive footwear used, con ductive flooring also present where operator stand or walk? 9.7.3.2 . garments, hairs or anything closer than 1 ft to esd items measure less than 100v*? 9.7.3.3 . every wrist strap or heel strap/conductive shoes checked daily and result recorded fo r all dls? 9.7.3.4 . all wrist strap or heel strap checkers calibration up to date? note: *50v for blue led. device handling 9.7.4. 1. every esds items identified by eia - 471 labels on item or packaging? 9.7.4. 2. all esds items comp letely inside properly closed static - shielding containers when not at static - safe workstation? 9.7.4. 3. no static charge generators (e.g. plastics) inside shielding containers with esds items? 9.7.4. 4. all flexible conductive and dissipative pack age materials inspected before reuse or recycle? others 9.7.5. 1. audit result reported to entity esd control coordinator? 9.7.5. 2. corrective action from previous audits completed? 9.7.5. 3. are audit records complete and on file?
10 / 10 part no. : ltl1chj s tnn - 0 02 a bns - od - fc002/a4 through hole lamp ltl1chjstnn - 0 0 2 a 10. relia bility test classification test item test condition sample size reference standard endurance test operation life ta = u nder room t emperature if = per datasheet maximum drive current test time= 1000hrs 22 pcs (cl=90%; ltpd= 10 %) mil - std - 750d:1026 (1995) mil - std - 883g:1005 (2006) high temperature high humidity storage ta = 60 c rh = 90 % test time= 24 0hrs 22 pcs (cl=90%; ltpd= 10 %) mil - std - 202g:103b (2002) jeita ed - 4701:100 103 (2001) high temperature storage ta= 105 5 c test time= 1000hrs 22 pcs (cl=90%; ltpd= 10 %) mil - std - 750d:1031 (1995) mil - std - 883g:1008 (2006) jeita ed - 4701:200 201 (2001) low temperature storage ta= - 55 5 c test time= 1000hrs 22 pcs (cl=90%; ltpd= 10 %) jeita ed - 4701:200 202 (2001) environmental test temperature cycling 100 c 25 c - 40 c 25 c 30mins 5mins 30mins 5mins 3 0 cycles 22 pcs (cl=90%; ltpd= 10 %) mil - std - 750d:1051 (1995) mil - std - 883g:1010 (2006) jeita ed - 4701:100 105 (2001) jesd22 - a104c (2005) thermal shock 100 5 c - 30 c 5 c 15mins 1 5mins 3 0 cycles (<20 secs transfer ) 22 pcs (cl=90%; ltpd=10 %) mil - std - 750d:1056 (1995) mil - std - 883g:1011 (2006) mil - std - 202g:107g (2002) jesd22 - a106b (2004) solder resistance t.sol = 260 5 c dwell time= 101 seconds 3mm from the base of the epoxy bulb 11 pcs (cl=90%; ltpd=18.9%) mil - std - 750d:2031(1995) jeita ed - 4701: 300 302 (2001) solderability t. sol = 245 5 c dwell time= 5 0.5 seconds (lead free solder, coverage R 95% of the dipped surface) 11 pcs (cl=90%; ltpd=18.9%) mil - std - 750d:2026 (1995) mil - std - 883g:2003 (2006) mil - std - 202g:208h (2002) ipc/eia j - std - 002 (2004) soldering iron t. sol = 350 5 c dwell time= 3.5 0.5 seconds 11 pcs (cl=90%; ltpd=18.9%) mil - std - 202g:208h (2002) jeita ed - 4701:300 302 (2001) 11. others the appearanc e and specifications of the product may be modified for improvement, without prior notice.

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