? semiconductor components industries, llc, 2015 september, 2015 ? rev. 1 publication order number: bas21tmr6/d 1 bas21tmr6 high voltage switching diode the bas21tmr6t1g device houses three high?voltage switching diodes in a sc?74 surface mount package. this device is ideal for low?power surface mount applications where board space is at a premium. features ? reduces board space ? nsv prefix for automotive and other applications requiring unique site and control change requirements; aec?q101 qualified and ppap capable ? these devices are pb?free, halogen free/bfr free and are rohs compliant maximum ratings (each diode) rating symbol value unit reverse voltage v r 250 vdc forward current i f 200 madc peak forward surge current i fm(surge) 625 madc thermal characteristics characteristic symbol max unit total device dissipation fr? 5 board (note 1) t a = 25 c derate above 25 c p d 311 2.5 mw mw/ c thermal resistance, junction?to?ambient r ja 402 c/w total device dissipation alumina substrate, (note 2) t a = 25 c derate above 25 c p d 347 2.8 mw mw/ c thermal resistance, junction?to?ambient r ja 360 c/w junction and storage temperature t j , t stg ?55 to +150 c stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. fr?4 @ 10 mm 2 , 2 oz copper traces 2. fr?4 @ 25 mm 2 , 2 oz copper traces 250 v high voltage switching diode www. onsemi.com device package shipping ? ordering information sc?74 case 318f 1 2 4 3 5 6 marking diagram bas21tmr6t1g sc?74 (pb?free) 3000 / tape & reel raa m raa = device code m = date code* = pb?free package (note: microdot may be in either location) *date code orientation may vary depending upon manufacturing location. 1 23 654 NSVBAS21TMR6T1G sc?74 (pb?free) 3000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. nsvbas21tmr6t2g sc?74 (pb?free) 3000 / tape & reel
bas21tmr6 www. onsemi.com 2 electrical characteristics (t a = 25 c unless otherwise noted) characteristic symbol min max unit reverse voltage leakage current (v r = 200 vdc) (v r = 200 vdc, t j = 150 c) i r ? ? 0.1 100 adc reverse breakdown voltage (i br = 100 adc) v (br) 250 ? vdc forward voltage (i f = 100 madc) (i f = 200 madc) v f ? ? 1.0 1.25 vdc diode capacitance (v r = 0, f = 1.0 mhz) c d ? 5.0 pf reverse recovery time (i f = i r = 30 madc, i r(rec) = 3.0 madc, r l = 100) t rr ? 50 ns product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. notes: 1. a 2.0 k variable resistor adjusted for a forward current (i f ) of 30 ma. notes: 2. input pulse is adjusted so i r(peak) is equal to 30 ma. notes: 3. t p ? t rr +10 v 2.0 k 820 0.1 f d.u.t. v r 100 h 0.1 f 50 output pulse generator 50 input sampling oscilloscope t r t p t 10% 90% i f i r t rr t i r(rec) = 3.0 ma output pulse (i f = i r = 30 ma; measured at i r(rec) = 3.0 ma) i f input signal figure 1. recovery time equivalent test circuit
bas21tmr6 www. onsemi.com 3 typical characteristics v f , forward voltage (v) 0.1 10 20 v r , reverse voltage (v) 1.0 0.1 0.01 0.001 50 80 110 140 170 1.6 0 v r , reverse voltage (v) 1.4 1.0 0.6 0.4 c d , diode capacitance (pf) 246 8 i f , forward current (ma) figure 2. v f vs. i f figure 3. i r vs. v r figure 4. capacitance i r , reverse current ( a) 1.0 10 100 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 85 c 55 c 150 c 125 c 25 c -55 c 200 230 0.8 1.2 1357 cap -40 c 260 150 c 125 c 85 c 55 c 25 c
bas21tmr6 www. onsemi.com 4 package dimensions sc?74 case 318f?05 issue n 23 4 5 6 d 1 e b e a1 a 0.05 (0.002) notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. 4. 318f?01, ?02, ?03 obsolete. new standard 318f?04. c l h e dim a min nom max min millimeters 0.90 1.00 1.10 0.035 inches a1 0.01 0.06 0.10 0.001 b 0.25 0.37 0.50 0.010 c 0.10 0.18 0.26 0.004 d 2.90 3.00 3.10 0.114 e 1.30 1.50 1.70 0.051 e 0.85 0.95 1.05 0.034 0.20 0.40 0.60 0.008 0.039 0.043 0.002 0.004 0.015 0.020 0.007 0.010 0.118 0.122 0.059 0.067 0.037 0.041 0.016 0.024 nom max 2.50 2.75 3.00 0.099 0.108 0.118 h e ? ? l 0 10 0 10 0.7 0.028 1.9 0.074 0.95 0.037 2.4 0.094 1.0 0.039 0.95 0.037 mm inches scale 10:1 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* on semiconductor and the are registered trademarks of semiconductor components industries, llc (scillc) or its subsidia ries in the united states and/or other countries. scillc owns the rights to a number of pa tents, trademarks, copyrights, trade secret s, and other intellectual property. a listin g of scillc?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf. scillc reserves the right to make changes without further notice to any product s herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any part icular purpose, nor does sci llc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typi cal? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating param eters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgic al implant into the body, or other applications intended to s upport or sustain life, or for any other application in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer s hall indemnify and hold scillc and its officers , employees, subsidiaries, affiliates, and dist ributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufac ture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 bas21tmr6/d literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative
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