nichia sts-da1-3082c nichia corporation specifications for white led NFSW757DT-V1M2 pb -free reflow soldering application built -in esd protection device rohs compliant
nichia sts-da1-3082c 1 specifications (1) absolute maximum ratings item symbol absolute maximum rating unit forward current i f 180 ma pulse forward current i fp 240 ma allowable reverse current i r 85 ma power dissipation p d 594 mw operating temperature t opr -40~100 c storage temperature t stg -40~100 c junction temperature t j 120 c * absolute maximum ratings at t s =25c. * i fp conditions with pulse width 10ms and duty cycle 10%. (2) initial electrical/optical characteristics item symbol condition typ max unit forward voltage v f i f =65ma 2.88 - v luminous flux v i f =65ma 19.2 - lm luminous intensity i v i f =65ma 6.6 - cd chromaticity coordinate x - i f =65ma 0.336 - - y - i f =65ma 0.335 - - thermal resistance r js - 13 19 c/w * characteristics at t s =25c. * luminous flux value as per cie 127:2007 standard. * chromaticity coordinates as per cie 1931 chromaticity chart. * r js is thermal resistance from junction to t s measuring point. test board: fr4 board thickness=1.6mm, copper layer thickness=0.07mm
nichia sts-da1-3082c 2 ranks item rank min max unit forward voltage - 2.4 3.3 v luminous flux p9 21.4 25.5 lm p8 18.0 21.4 p7 15.1 18. 0 color rank rank c5 x 0.330 0.330 0.342 0.341 y 0.318 0.339 0.349 0.332 * ranking at t s =25c. * forward voltage tolerance: 0.05v * luminous flux tolerance: 5% * chromaticity coordinate tolerance: 0.003 * leds from the above ranks will be shipped. the rank combination ratio per shipment will be decided by nichia.
nichia sts-da1-3082c 3 chromaticity diagram c5 0.20 0.25 0.30 0.35 0.40 0.45 0.20 0.25 0.30 0.35 0.40 0.45 y x
nichia sts-da1-3082c 4 outline dimensions sts-da7-5251b nxsx757d-vx ? no. ( g unit: mm) this product complies with rohs directive. u? rohs ?m?? * ( g unit: mm, tolerance: 0.2) o protection device k a ? item `| package materials ??| encapsulating resin materials ?O| electrodes materials | weight description ?` heat-resistant polymer `? ? + w silicone resin (with diffuser and phosphor) ~? + y? ag-plated copper alloy 0.018g(typ) dimensions do not include mold flash. ?? * the dimension(s) in parentheses are for reference purposes. ? * cathode mark 3 3 2.6 2.6 0.52 1.42 2.27 cathode anode 0.48 2.6
nichia sts-da1-3082c 5 soldering ? recommended reflow soldering condition(lead -free solder) 120sec m ax pre-heat 180 to 200 c 260cm ax 10sec m ax 60sec m ax above 220c 1 to 5c per sec ? recommended hand sol dering condition temperature 350c max soldering time 3sec max recommended soldering pad pattern recommended metal solder stencil aperture ( g unit: mm) 0.6 1.45 0.95 0.6 0.85 2.3 0.85 0.4 2 2.3 3.15 0.6 1.53 0.69 0.6 0.58 2.3 3.15 * this led is designed to be reflow soldered on to a pcb. if dip soldered, nichia cannot guarantee its reliability. * reflow soldering must not be performed more than twice. hand soldering must not be performed more than once. * avoid rapid cooling. ramp down the temperature gradually from the peak temperature. * nitrogen reflow soldering is recommended. air flow soldering conditions can cause optical degradation, caused by heat and/or atmosphere. * since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin. pressure can cause nicks, chip -outs, encapsulant delamination and deformation, and wire breaks, decreasing reliability. * repairing should not be done after the leds have been soldered. when repairing is unavoidable, a double-head soldering iron should be used. it should be confirmed beforehand whether the characteristics of the leds will or will not be damaged by repairing. * when soldering, do not apply stress to the led while the led is hot. * when using a pick and place machine, choose an appropriate nozzle for this product. using a pick-and-place nozzle with a smaller diameter than the size of the led's emitting surface will cause damage to the emitting surface and may also cause the led not to illuminate. * the recommended soldering pad pattern is designed for attachment of the led without problems. when precise mounting accuracy is required, such as high-density mounting, ensure that the size and shape of the pad are suitable for the circuit design. * consider factors such as the reflow soldering temperature, hand soldering temperature, etc. when choosing the solder. * when flux is used, it should be a halogen free flux. ensure that the manufacturing process is not designed in a manner where the flux will come in contact with the leds. * make sure that there are no issues with the type and amount of solder that is being used. * all of the electrode pads are on the backside of this product; solder connections will not be able to be seen nor confirmed by a normal visual inspection. when using the product, ensure that there are no issues with the soldering conditi ons.
nichia sts-da1-3082c 6 tape and reel dimensions sts-da7-4266 nxxx757x ` / ` trailer and leader top cover tape led ?? ` 400mm ` 160mm ? trailer 160mm min(empty pockets) loaded pockets ??` embossed carrier tape ??`` feed direction leader without top cover tape 400mm min 100mm ? leader with top cover tape 100mm min(empty pocket) ? no. ( g unit: mm) cathode mark 60 +1 -0 ` reel f 13 0 . 2 f 21 0 . 8 label 21 0 . 8 13 0 . 2 11.4 1 9 0.3 180 +0 -3 -0 1.5 +0.1 `? tape 4 0.1 1.75 0.1 4 0.1 2 0.05 3.5 0.05 8 +0.3 -0.1 0.2 0.05 0.7 0.1 3.18 0.1 3.18 0.1 -0 1 +0.2 reel size: 5000pcs 1 ` 5000 ? * the tape packing method complies with jis c 0806 (packaging of electronic components on continuous tapes). * jis c 0806 ??`??? when the tape is rewound due to work interruptions, no more than 10n should be applied to the embossed carrier tape. the leds may stick to the top cover tape. * g?I???`?`? ??`? (10n ) led ``N??
nichia sts-da1-3082c 7 packaging - tape & reel nichia led sts-da7-4989 nxxxxxxx label label ? no. reel ` ?` seal moisture-proof bag ? rohs nxxxxxxx xxxx led ******* nichia corporation 491 oka, kaminaka, anan, tokushima, japan type lot qty. ymxxxx-rrr pcs rohs nxxxxxxx xxxx led ******* rrr pcs type rank qty. nichia corporation 491 oka, kaminaka, anan, tokushima, japan reels are shipped with desiccants in heat-sealed moisture-proof bags. `??`?? desiccants moisture-proof bags are packed in cardboard boxes with corrugated partitions. ?K`?? `???y??? * ?\Hy?B?y * ?QH?n??u?p???? * using the original package material or equivalent in transit is re commended. do not expose to water. the box is not water-resistant. do not drop or expose the box to external forces as it may damage the pr oducts. products shipped on tape and reel are packed in a moisture-proof bag. they are shipped in cardboard boxes to protect them from external for ces during transportation. * u?`??n?o`y? if not provided, it will not be indicated on the label. ******* is the customer part number. O??? * ******* ?? ? for details, see "lot numbering code" in this document. * ?? the label does not have the rank field for un-ranked products. * ?????
nichia sts-da1-3082c 8 lot numbering code lot number is presented by using the following alphanumeric code. ymxxxx - rrr y - year year y 2015 f 2016 g 2017 h 2018 i 2019 j 2020 k m - month month m month m 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 a 5 5 11 b 6 6 12 c xxxx -nichia's product number rrr-ranking by color coordinates, ranking by luminous flux
nichia sts-da1-3082c 9 derating characteristics nfsx757d-vx ? no. sts-da7-5224b 0 50 100 150 200 250 300 0 20 40 60 80 100 120 derating1 (70, 180) (100, 70.0) 0 50 100 150 200 250 300 0 20 40 60 80 100 120 derating2 (100, 180) 10 100 1000 1 10 100 duty 180 240 S allowable forward current(ma) ( ` ) - S solder temperature(cathode side) vs allowable forward current - S ambient temperature vs allowable forward current S allowable forward current(ma) S allowable forward current(ma) ??? ( ` ) solder temperature(cathode side)( c) ?? ambient temperature( c) `` duty ratio(%) ` ` - S duty ratio vs allowable forward current 76 c/w ja r = t a =25 c
nichia sts-da1-3082c 10 optical characteristics nfsw757d-v1m2 ? no. sts-da7-5945 0.0 0.2 0.4 0.6 0.8 1.0 400 450 500 550 600 650 700 750 800 spectrum ? relative illuminance(a.u.) 90 80 70 60 50 40 30 20 10 0 - 10 - 20 - 30 - 40 - 50 - 60 - 70 - 80 - 90 directivity1 k spectrum k relative emission intensity(a.u.) L wavelength(nm) ? directivity ? radiation angle 1 0.5 0 0.5 1 a 65ma i f = t =25 c 65ma i fp = t a =25 c * ? all characteristics shown are for reference only and are not guaranteed.
nichia sts-da1-3082c 11 forward current characteristics / temperature characteristics nfsw757d-v1m2 ? no. sts-da7-5946a 2.0 2.5 3.0 3.5 4.0 -60 -40 -20 0 20 40 60 80 100 120 tavf 0.6 0.8 1.0 1.2 1.4 -60 -40 -20 0 20 40 60 80 100 120 taiv 10 100 1000 2.0 2.5 3.0 3.5 4.0 vfif 65 240 relative luminous flux(a.u.) - ambient temperature vs relative luminous flux forward current(ma) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 50 100 150 200 250 300 ifiv relative luminous flux(a.u.) - forward current vs relative luminous flux forward current(ma) R - forward voltage vs forward current - R ambient temperature vs forward voltage ?R forward voltage(v) ?R forward voltage(v) ?? ambient temperature( c) ?? ambient temperature( c) t a =25 c * ? all characteristics shown are for reference only and are not guaranteed. t a =25 c i fp = 65ma i fp = 65ma
nichia sts-da1-3082c 12 forward current characteristics / temperature characteristics nfsw757d-v1m2 ? no. sts-da7-5947 0.31 0.32 0.33 0.34 0.35 0.32 0.33 0.34 0.35 0.36 taxy - 40 c 0 c 25 c 100 c x 0.31 0.32 0.33 0.34 0.35 0.32 0.33 0.34 0.35 0.36 ifxy 10ma 65ma 240ma x y y 65ma i fp = - ? ambient temperature vs chromaticity coordinate - ? forward current vs chromaticity coordinate t a =25 c * ? all characteristics shown are for reference only and are not guaranteed.
nichia sts-da1-3082c 13 reliability (1) tests and results test reference standard test conditions test duration failure criteria # units failed/tested resistance to soldering heat (reflow soldering) jeita ed- 4701 300 301 t sld =260c, 10sec, 2reflows, precondition: 30c, 70%rh, 168hr #1 0/22 solderability (reflow soldering) jeita ed- 4701 303 303a t sld =2455c, 5sec, lead-free solder(sn-3.0ag-0.5cu) #2 0/22 temperature cycle jeita ed- 4701 100 105 -40c(30min)~25c(5min)~ 100c(30min)~25c(5min) 100cycles #1 0/50 moisture resistance (cyclic) jeita ed- 4701 200 203 25c~65c~-10c, 90%rh, 24hr per cycle 10cycles #1 0/22 high temperature storage jeita ed- 4701 200 201 t a =100c 1000hours #1 0/22 temperature humidity storage jeita ed- 4701 100 103 t a =60c, rh=90% 1000hours #1 0/22 low temperature storage jeita ed- 4701 200 202 t a =-40c 1000hours #1 0/22 room temperature operating life condition 1 t a =25c, i f =65ma test board: see notes below 1000hours #1 0/22 room temperature operating life condition 2 t a =25c, i f =180ma test board: see notes below 500hours #1 0/22 high temperature operating life t a =100c, i f =70ma test board: see notes below 1000hours #1 0/22 temperature humidity operating life 60c, rh=90%, i f =65ma test board: see notes below 500hours #1 0/22 low temperature operating life t a =-40c, i f =65ma test board: see notes below 1000hours #1 0/22 vibration jeita ed- 4701 400 403 200m/s 2 , 100~2000~100hz, 4cycles, 4min, each x, y, z 48minutes #1 0/22 electrostatic discharges jeita ed- 4701 300 304 hbm, 2kv, 1.5k, 100pf, 3pulses, alternately positive or negative #1 0/22 soldering joint shear strength jeita ed- 4702b 002 3 5n, 101sec #1 0/22 notes: 1) test board: fr4 board thickness=1.6mm, copper layer thickness=0.07mm, r ja 76c/w 2) measurements are performed after allowing the leds to return to room temperature. (2) failure criteria criteria # items conditions failure criteria #1 forward voltage(v f ) i f =65ma >u.s.l.1.1 luminous flux( v ) i f =65ma nichia sts-da1-3082c 14 cautions (1) storage conditions temperature humidity time storage before opening aluminum bag 30c 90%rh within 1 year from delivery date after opening aluminum bag 30c 70%rh 168hours baking 655c - 24hours product complies with jedec msl 3 or equivalent. see ipc/jedec std-020 for moisture-sensitivity details. absorbed moisture in led packages can vaporize and expand during soldering, which can cause interf ace delamination and result in optical performance degradation. products are packed in moisture-proof aluminum bags to minimize moisture absorption during transportation and storage. included silica gel desiccants change from blue to red if moisture had penetrated bags. after opening the moisture - proof aluminum bag, the prod ucts should go through the soldering process within the range of the conditions stated above. unused remaining leds should be stored with silica gel desiccants in a hermetically sealed container, preferably the original moisture-proof bags for storag e. after the period after opening storage time has been exceeded or silica gel desiccants are no lo nger blue, the products should be baked. baking should only be done once. customer is advised to keep the leds in an airtight container when not in use. exposure to a corrosive environment may cause the plated metal parts of the product to tarnish, which could adversely affect soldering and optical char acteristics. it is also recommended to return the leds to the original moisture proof bags and reseal. after assembly and during use, silver plating can be affected by the corrosive gases emitted by co mponents and materials in close proximity of the leds within an end product, and the gases entering into the product from the external atmo sphere. the above should be taken into consideration when designing. resin materials, in particular, may contain substances which can affect silver plating, such as halo gen. do not use sulfur -containing materials in commercial products. some materials, such as seals and adhesives, may contain sulfur. the extremely corroded or contaminated plating of leds might cause an open circuit. silicone rubber is recommended as a material for seals. bear in mind, the use of silicones may lead to silicone contamination of electrical contact s inside the products, caused by low molecular weight volatile siloxane. to prevent water condensation, please avoid large temperature and humidity fluctuations for the st orage conditions. do not store the leds in a dusty environment. do not expose the leds to direct sunlight and/or an environment where the temperature is higher th an normal room temperature. (2) directions for use when designing a circuit, the current through each led must not exceed the absolute maximum rating. operating at a constant current per led is recommended. in case of operating at a constant vo ltage, circuit b is recommended. if the leds are operated with constant voltage using circuit a, the current through the leds may vary due to the v ariation in forward voltage characteristics of the leds. (a) ... (b) ... this product should be operated using forward current. ensure that the product is not subjected to either forward or reverse voltage while it is not in use. in particular, subjecting it to continuous reverse voltage may cause migration, which may cause damage to the led die. when used in displays that are not used for a lon g time, the main power supply should be switched off for safety. it is recommended to operate the leds at a current greater than 10% of the sorting current to stabilize the led char acteristics. ensure that excessive voltages such as lightning surges are not applied to the leds. for outdoor use, necessary measures should be taken to pr event water, moisture and salt air damage.
nichia sts-da1-3082c 15 (3) handling precautions do not handle the leds with bare hands as it will contaminate the led surface and may affect the o ptical characteristics: it might cause the led to be deformed and/or the wire to break, which will cause the led not to illuminate . when handling the product with tweezers, be careful not to apply excessive force to the resin. otherwise, the resin can be cut, chipped, delaminate or deformed, causing wire-bond breaks and catastrophic failures. dropping the product may cause damage. do not stack assembled pcbs together. failure to comply can cause the resin portion of the product to be cut, chipped, delaminated and/or deformed. it may cause wire to break, leading to catastrophic failures. (4) design consideration pcb warpage after mounting the products onto a pcb can cause the package to break. the led should be placed in a way to minimize the stress on the leds due to pcb bow and twist. the position and orientation of the leds affect how much mechanical stress is exerted on the leds placed near the score lin es. the led should be placed in a way to minimize the stress on the leds due to board flexing. board separation must be perf ormed using special jigs, not using hands. volatile organic compounds that have been released from materials present around the leds (e.g. ho using, packing, adhesive, secondary lens, lens cover, etc.) may penetrate the led lens and/or encapsulating resin . if the leds are being used in a hermetically sealed environment, these volatile compounds can discolor after be ing exposed to heat and/or photon energy and it may greatly reduce the led light output and/or cause a color shift. in this case, ventilating the environment may improve the reduction in light output and/or color shi ft. perform a light-up test of the chosen application for optical evaluation to ensure that there are no issues, especially if the leds are planned to be used in a hermetically sealed environment. (5) electrostatic discharge (esd) the products are sensitive to static electricity or surge voltage. esd can damage a die and its re liability. when handling the products, the following measures against electrostatic discharge are strongly recommended: eliminating the charge grounded wrist strap, esd footwear, clothes, and floors grounded workstation equipment and tools esd table/shelf mat made of conductive materials ensure that tools (e.g. soldering irons), jigs and machines that are being used are properly grounded and that proper grounding techniques are used in work areas. for devices/equipment that mount the leds, protection against surge voltages should also be used. i f tools or equipment contain insulating materials such as glass or plastic, the following measures against electrostatic discharge are strongly recommended: dissipating static charge with conductive materials preventing charge generation with moisture neutralizing the charge with ionizers the customer is advised to check if the leds are damaged by esd when performing the characteristics inspection of the leds in the application. damage can be detected with a forward voltage measurement or a light- up test at low current (1ma). esd damaged leds may have current flow at a low voltage or no longer illuminate at a low current. failure criteria: v f <2.0v at i f =0.5ma
nichia sts-da1-3082c 16 (6) thermal management proper thermal management is a n important when designing products with leds. led die temperature is affected by pcb thermal resistance and led spacing on the board. please design products in a way that the led die temperature does not exceed the maximum junction temperature (t j ). drive current should be determined for the surrounding ambient temperature (t a ) to dissipate the heat from the product. the following equations can be used to calculate the junction temperature of the products. 1) t j =t a +r ja ? w 2) t j =t s +r js ? w *t j =led junction temperature: c t a =ambient temperature: c t s =soldering temperature (cathode side): c r ja =thermal resistance from junction to ambient: c/w r js =thermal resistance from junction to t s measuring point: c/w w=input power(i f v f ): w ts point (7) cleaning the leds should not be cleaned with water, benzine, and/or thinner. if required, isopropyl alcohol (ipa) should be used. other solvents may cause premature failure to the leds due to the damage to the resin portion. the effects of such solvents should be verified prior to use. in addition, the use of cfcs such as freon is heavily regulated. when dust and/or dirt adheres to the leds, soak a cloth with isopropyl alcohol (ipa), then squeeze it before wiping the leds. ultrasonic cleaning is not recommended since it may have adverse effects on the leds depending on the ultrasonic power and how led is assembled. if ultrasonic cleaning must be used, the customer is advised to make sure the leds will not be damaged prior to cleaning. (8) eye safety in 2006, the international electrical commission (iec) published iec 62471:2006 photobiological sa fety of lamps and lamp systems, which added leds in its scope. on the other hand, the iec 60825-1:2007 laser safety standard removed leds from its scope. however, please be advised that some countries and regions have adopted standards based on the iec laser safety standard iec 60825-1:20112001, which still includes leds in its scope. most of nichia's leds can be classified as belonging into either the exempt group or risk group 1. high-power leds, that emit light containing blue wavelengths, may be classified as risk group 2. please proceed with caution when viewing directly any leds driven at high current, or viewing leds with optical instruments which may greatly increase the damages to your eyes. viewing a flashing light may cause eye discomfort. when incorporating the led into your product, please be careful to avoid adverse effects on the human body caused by light stimulation.
nichia sts-da1-3082c 17 (9) others this product is intended to be used for general lighting, household appliances, electronic devices (e.g. mobile communicati on devices); it is not designed or manufactured for use in applications that require safety critical functions (e. g. aircraft, automobiles, combustion equipment, life support systems, nuclear reactor control system, safety devices, spacecraft, submarine repeaters, traffic control equipment, trains, vessels, etc.). if the leds are planned to be used for these applications, unless otherwise detailed in the specification, nichia will neither guarantee that the product is fit for that purpose nor be responsible for any resulting property damage, injuries and/or loss of life/health. this product does not comply with iso/ts 16949 and is not intended for automotive applications. the customer shall not reverse engineer by disassembling or analysis of the leds without having pr ior written consent from nichia. when defective leds are found, the customer shall inform nichia directly before disassembling or ana lysis. the specifications and appearance of this product may change without notice; nichia does not guarantee the contents of this specification. both the customer and nichia will agree on the official specifications of supplied products before the volume production of a program begins.
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