? semiconductor components industries, llc, 2016 june, 2016 ? rev. 6 1 publication order number: nl17sg04/d nl17sg04 single inverter the nl17sg04 minigate is an advanced high?speed cmos inverter in ultra?small footprint. the nl17sg04 input structures provides protection when voltages up to 4.6 v are applied. features ? wide operating v cc range: 0.9 v to 3.6 v ? high speed: t pd = 2.3 ns (typ) at v cc = 3.0 v, c l = 15 pf ? low power dissipation: i cc = 0.5 a (max) at t a = 25 c ? 4.6 v overvoltage tolerant (ovt) input pins ? ultra?small packages ? these are pb?free and halide?free devices v cc nc in a out y gnd 1 2 34 5 figure 1. sot?953 (top thru view) v cc nc in a gnd figure 2. sc?88a (top view) 1 2 3 5 4 figure 3. udfn (top view) 1 2 3 6 5 4 nc in a gnd nc v cc out y out y figure 4. logic symbol 1 in a out y www. onsemi.com ordering information see detailed ordering and shipping information on page 5 o f this data sheet. pin assignment 1 2 3nc in a gnd 4 5v cc out y marking diagrams sot?953 case 527ae v m 1 l h a input y output h l function table udfn6 1.0 x 1.0 case 517bx m udfn6 1.45 x 1.0 case 517aq m sc?88a df suffix case 419a ap m m 5 4 m = date code* = pb?free package (note: microdot may be in either location) *date code orientation and/or position may vary depending upon manufacturing location. 6 sot?953 sc?88a udfn6 nc in a gnd v cc out y gnd nc in a v cc out y gnd nc in a nc out y v cc
nl17sg04 www. onsemi.com 2 maximum ratings symbol parameter value unit v cc dc supply voltage ?0.5 to +5.5 v v in dc input voltage ?0.5 to +4.6 v v out dc output voltage output at high or low state power?down mode (v cc = 0 v) ?0.5 to v cc +0.5 ?0.5 to +4.6 v i ik dc input diode current v in < gnd ?20 ma i ok dc output diode current v out < gnd ?20 ma i out dc output source/sink current 20 ma i cc dc supply current per supply pin 20 ma i gnd dc ground current per ground pin 20 ma t stg storage temperature range ?65 to +150 c t l lead temperature, 1 mm from case for 10 seconds 260 c t j junction temperature under bias +150 c msl moisture sensitivity level 1 f r flammability rating oxygen index: 28 to 34 ul 94 v?0 @ 0.125 in v esd esd withstand voltage human body model (note 2) machine model (note 3) >2000 >100 v i latchup latchup performance above v cc and below gnd at 125 c (note 4) 100 ma stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. 1. measured with minimum pad spacing on an fr4 board, using 10 mm?by?1 inch, 2?ounce copper trace with no air flow. 2. tested to eia/jesd22?a114?a. 3. tested to eia/jesd22?a115?a. 4. tested to eia/jesd78. recommended operating conditions symbol characteristics min max unit v cc positive dc supply voltage 0.9 3.6 v v in digital input voltage 0.0 3.6 v v out output voltage output at high or low state power?down mode (v cc = 0 v) 0.0 0.0 v cc 3.6 v t a operating temperature range ?55 +125 c t / v input transition rise or fail rate v cc = 3.3 v 0.3 v 0 10 ns/v functional operation above the stresses listed in the recommended operating ranges is not implied. extended exposure to stresse s beyond the recommended operating ranges limits may affect device reliability.
nl17sg04 www. onsemi.com 3 dc electrical characteristics symbol parameter conditions v cc (v) t a = 25 c t a = -55 c to +125 c min max min max unit v ih high-level input voltage 0.9 v cc v cc v 1.1 to 1.3 0.7xv cc 0.7xv cc 1.4 to 1.6 0.65xv cc 0.65xv cc 1.65 to 1.95 0.65xv cc 0.65xv cc 2.3 to 2.7 1.7 1.7 3.0 to 3.6 2.0 2.0 v il low?level input voltage 0.9 gnd gnd v 1.1 to 1.3 0.3xv cc 0.3xv cc 1.4 to 1.6 0.35xv cc 0.35xv cc 1.65 to 1.95 0.35xv cc 0.35xv cc 2.3 to 2.7 0.7 0.7 3.0 to 3.6 0.8 0.8 v oh high-level output voltage v in = v ih or v il i oh = ?20 a 0.9 0.75 0.75 v i oh = -0.3 ma 1.1 to 1.3 0.75xv cc 0.75xv cc i oh = -1.7 ma 1.4 to 1.6 0.75xv cc 0.75xv cc i oh = -3.0 ma 1.65 to 1.95 vcc-0.45 v cc ?0.4 5 i oh = -4.0 ma 2.3 to 2.7 2.0 2.0 i oh = -8.0 ma 3.0 to 3.6 2.48 2.48 v ol low-level output voltage v in = v ih or v il i ol = 20 a 0.9 0.1 0.1 v i ol = 0.3 ma 1.1 to 1.3 0.25xv cc 0.25xv cc i ol = 1.7 ma 1.4 to 1.6 0.25xv cc 0.25xv cc i ol = 3.0 ma 1.65 to 1.95 0.45 0.45 i ol = 4.0 ma 2.3 to 2.7 0.4 0.4 i ol = 8.0 ma 3.0 to 3.6 0.4 0.4 i in input leakage current 0 v in 3.6 v 0 to 3.6 0.1 1.0 a i cc quiescent supply current v in = v cc or gnd 3.6 0.5 10.0 a product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions.
nl17sg04 www. onsemi.com 4 ????????????????????????????????? ????????????????????????????????? input t r = t f = 3.0 ns symbol parameter test condition v cc (v) t a = 25 c t a = -55 c to +125 c min typ max min max unit t plh , t phl propagation delay, a to y c l = 10 pf, r l = 1 m 0.9 - 10.0 13.3 - 17.0 ns 1.1 to 1.3 - 8.7 11.2 - 14.0 1.4 to 1.6 - 4.9 8.5 - 10.0 1.65 to 1.95 - 3.8 6.2 - 6.7 2.3 to 2.7 - 2.6 3.9 - 4.4 3.0 to 3.6 - 2.1 3.1 - 3.7 c l = 15 pf, r l = 1 m 0.9 - 11.55 13.7 - 19.7 ns 1.1 to 1.3 - 7.2 10.8 - 15.6 1.4 to 1.6 - 5.4 9.3 - 11.2 1.65 to 1.95 - 4.2 6.9 - 7.1 2.3 to 2.7 - 2.8 4.4 - 5.0 3.0 to 3.6 - 2.3 3.4 - 3.9 c l = 30 pf, r l = 1 m 0.9 - 16.85 18.9 - 22.3 ns 1.1 to 1.3 - 10.2 13.4 - 17.5 1.4 to 1.6 - 7.4 13.1 - 15.9 1.65 to 1.95 - 5.6 9.2 - 9.6 2.3 to 2.7 - 3.7 5.7 - 6.1 3.0 to 3.6 - 2.9 4.4 - 4.8 c in input capacitance 0 to 3.6 3 - - - pf c pd power dissipation capacitance (note 5) f = 10 mhz 0.9 to 3.6 - 4 - - - pf product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 5. c pd is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption with out load. average operating current can be obtained by the equation: i cc(opr ) = c pd v cc f in + i cc . c pd is used to determine the no?load dynamic power consumption; p d = c pd v cc 2 f in + i cc v cc .
nl17sg04 www. onsemi.com 5 figure 5. switching waveforms figure 6. test circuit gnd 50% 50% v cc input a output y t phl t plh 50% v ol v oh v cc input c l * *includes all probe and jig capacitance. a 1?mhz square input wave is recommended for propagation delay tests. output ordering information device package shipping ? nl17sg04p5t5g sot?953 (pb?free) 8000 / tape & reel nl17sg04dft2g sc?88a (pb?free) 3000 / tape & reel NL17SG04AMUTCG udfn6 1.45x1 mm (pb?free) 3000 / tape & reel nl17sg04cmutcg udfn6 1x1 mm (pb?free) 3000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
nl17sg04 www. onsemi.com 6 package dimensions sot?953 case 527ae issue e *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* e d c a h e 123 4 5 notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters 3. maximum lead thickness includes lead finish. minimum lead thickness is the minimum thickness of the base material. 4. dimensions d and e do not include mold flash, protrusions, or gate burrs. dim min nom max millimeters a 0.34 0.37 0.40 b 0.10 0.15 0.20 c 0.07 0.12 0.17 d 0.95 1.00 1.05 e 0.75 0.80 0.85 e 0.35 bsc l 0.95 1.00 1.05 h e x y pin one indicator b 5x x 0.08 y l 5x l3 l2 e 5x 5x l2 0.05 0.10 0.15 l3 ??? ??? 0.15 0.175 ref top view side view bottom view 1.20 dimensions: millimeters 0.20 5x 1 package outline 0.35 pitch 0.35 5x
nl17sg04 www. onsemi.com 7 package dimensions udfn6 1.0x1.0, 0.35p case 517bx issue o soldering footprint* recommended dim min max millimeters a 0.45 0.55 a1 0.00 0.05 a3 0.13 ref b 0.12 0.22 d 1.00 bsc e 1.00 bsc e 0.35 bsc l 0.25 0.35 l1 0.30 0.40 a b e d 0.10 c pin one reference top view 0.10 c a a1 0.05 c 0.05 c c seating plane side view 2x 2x a3 bottom view b e 6x 0.10 b 0.05 a c c l 5x note 3 l1 1 3 4 6 m m dimensions: millimeters 0.22 5x 0.48 6x 1.18 0.53 pitch 0.35 1 pkg outline
nl17sg04 www. onsemi.com 8 package dimensions udfn6 1.45x1.0, 0.5p case 517aq issue o notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip. a b e d bottom view b e 6x 0.10 b 0.05 a c c l 6x note 3 0.10 c pin one reference top view 0.10 c 6x a a1 0.05 c 0.05 c c seating plane side view 1 3 4 6 dim min max millimeters a 0.45 0.55 a1 0.00 0.05 b 0.20 0.30 d 1.45 bsc e 1.00 bsc e 0.50 bsc l 0.30 0.40 l1 ??? 0.15 dimensions: millimeters 0.30 6x 1.24 0.53 pitch *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 0.50 1 mounting footprint package outline l1 detail a l optional constructions l 0.07 ref 6x a2 detail b detail a
nl17sg04 www. onsemi.com 9 package dimensions notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. 419a?01 obsolete. new standard 419a?02. 4. dimensions a and b do not include mold flash, protrusions, or gate burrs. dim a min max min max millimeters 1.80 2.20 0.071 0.087 inches b 1.15 1.35 0.045 0.053 c 0.80 1.10 0.031 0.043 d 0.10 0.30 0.004 0.012 g 0.65 bsc 0.026 bsc h --- 0.10 --- 0.004 j 0.10 0.25 0.004 0.010 k 0.10 0.30 0.004 0.012 n 0.20 ref 0.008 ref s 2.00 2.20 0.079 0.087 b 0.2 (0.008) mm 12 3 4 5 a g s d 5 pl h c n j k ?b? sc?88a (sc?70?5/sot?353) case 419a?02 issue l mm inches scale 20:1 0.65 0.025 0.65 0.025 0.50 0.0197 0.40 0.0157 1.9 0.0748 solder footprint* *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. on semiconductor and are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries i n the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . a listing of on semiconductor?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does o n semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. ?typical? parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including ?typic als? must be validated for each customer application by customer?s technical experts. on semiconductor does not convey any license under its patent rights nor the right s of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semicondu ctor products for any such unintended or unauthorized application, buyer shall indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distrib utors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 nl17sg04/d minigate is a trademark of semiconductor components industries, llc (scillc). literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative
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