this is information on a product in full production. december 2013 docid025264 rev 1 1/9 USBULC6-2F7 2-line transil? ultralow capacitance protection for high speed usb datasheet ? production data features ? ultralow capacitance (1pf) ? two data lines (d+ and d-) protected against esd ? breakdown voltage v br = 5.5 v min. ? flip chip 350 m pitch, lead-free ? very low leakage current ? very small pcb area ? rohs compliant benefits ? minimized impact on rise and fall times for maximum data integrity ? low pcb space occupation ? higher reliability offered by monolithic integration complies with the following standards ? iec 61000-4-2 level 4: ? 8 kv (contact discharge) ? mil std 883g - method 3015.7 ? 25 kv (human body model) application this device is designed to protect a high speed usb port in wireless handsets (up to 480 mb/s according to usb 2.0 high speed specification). description the USBULC6-2F7 is a monolithic, application specific discrete device dedicated to esd protection of high speed interfaces. its ultra low line capacitance secures a high level of signal integrity without compromising the protection of downstream sensitive chips against the most stringently characterized esd strikes. figure 1. pin layout (bump side) figure 2. device configuration tm: transil is a trademar k of stmicroelectronics flip chip (4 bumps) b 1 2 a a2 a1 b2 b1 note: b1 and b2 bumps must be grounded on the pcb together www.st.com
characteristics USBULC6-2F7 2/9 docid025264 rev 1 1 characteristics figure 3. electrical char acteristics - definitions table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp esd discharge iec 61000-4-2: contact discharge air discharge 10 30 kv p pp peak pulse power dissipation (8/20 s) 50 w t j operation junction temperature range -40 to +150 c t stg storage temperature range -55 to +150 c t l (1) 1. for a surge greater than the maximum val ues, the diode will fail in short-circuit. maximum lead temperature for soldering during 10 s 260 c table 2. electrical char acteristics - values (t amb = 25 c) symbol test conditions min. typ. max. unit v br i r = 1 ma 5.5 - 9 v i rm v rm = 3 v - - 70 na c line f = [200 mhz - 3000mhz], v r = 0 v - 1.0 1.35 pf r d dynamic resistance, pulse width 100 ns i/o to gnd 0.67 ? gnd to i/o 0.56 i v i f i rm i pp v rm v f v br v cl symbol parameter v breakdown voltage i leakage current @ v v stand-off voltage v clamping voltage i peak pulse current c line capacitance v forward voltage drop br rm rm rm cl pp line f
docid025264 rev 1 3/9 USBULC6-2F7 characteristics 9 figure 4. eye diagram, board only (according to usb high speed specification) figure 5. eye diagram, board with USBULC6-2F7 (according to usb 2.0 high speed specification) 347.2 mv/div 200 ps/div 347.2 mv/div 200 ps/div figure 6. esd response to iec 61000-4-2 (+8 kv contact discharge) (1) figure 7. esd response to iec 61000-4-2 (-8 kv contact discharge) (1) 1. test board connected to oscilloscope through 50 ? cable and 20 db + 6 db attenuator. esd generator return path connected to pcb ground plane. 20 v/div 105 v 23 v 17 v 9 v v : esd peak voltage pp v :clamping voltage @ 30 ns cl v :clamping voltage @ 60 ns cl v :clamping voltage @ 100 ns cl 1 1 2 2 3 3 4 4 20 ns/div 20 v/div -84 v -8 v -5 v -1 v v : esd peak voltage pp v :clamping voltage @ 30 ns cl v :clamping voltage @ 60 ns cl v :clamping voltage @ 100 ns cl 20 ns/div 1 2 3 4 1 2 3 4 figure 8. junction capacitance versus frequency (typical values) figure 9. analog crosstalk measurement c (pf) 0.0 0.5 1.0 1.5 1 10 100 1000 t j = 25 c v osc = 30 mv io / gnd io / io f( hz) m db 100k 1m 10m 100m 1g 10g - 120 - 110 - 100 - 90 - 80 - 70 - 60 - 50 - 40 - 30 - 20 - 10 0 xtalk f (hz)
characteristics USBULC6-2F7 4/9 docid025264 rev 1 figure 10. peak pulse power versus initial junction temperature (maximum values) figure 11. peak pulse power versus exponential pulse duration (maximum values) 0 10 20 30 40 50 60 70 80 90 100 0 25 50 75 100 125 150 175 p (w) pp tj (c) 8/20 s 1 10 100 1000 10 100 1000 tp(s) t j initial = 25 c p pp (w) figure 12. clamping voltage versus peak pulse current (typical values) figure 13. leakage current versus junction temperature (typical values) 0.1 1 10 6789101112131415 tj initial = 25 c 8/20 s vcl(v) i pp (a) 0.1 1 10 100 1000 25 50 75 100 125 150 v r = v rm = 3 v io / gnd i (na) r tj (c) figure 14. s21 (db) attenuation measurement figure 15. tlp measurement 100 k 1 m 10 m 100 m 1 g 10 g -10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 a1 b1 f (hz) db i pp (a) 0 5 10 15 20 25 0 5 10 15 20 25 v cl (v) gnd to i/o i/o to gnd
docid025264 rev 1 5/9 USBULC6-2F7 application information 9 2 application information figure 16. application diagram usb connector vbus d- d + gnd b2 a2 b1 a1 b2 a2 b1 a1 to usb transceiver vbus d- d + gnd
package information USBULC6-2F7 6/9 docid025264 rev 1 3 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack ? is an st trademark. figure 17. package dimensions figure 18. footprint recommendations figure 19. marking 170 m 20 0.73 mm 30 m 0.73 mm 30 m 350 m 10 230 m 25 350 m 10 375 m 40 190 m 190 m circle 250 m 200 m solder stencil opening : copper pad diameter: solder mask opening: 300 m dot xx = marking yww = datecode (y = year ww = week) z = additional information x y x w z w
docid025264 rev 1 7/9 USBULC6-2F7 package information 9 figure 20. flip-chip tape and reel specifications note: more information is available in the stmicroelectronics application notes: an4137: ?350 m flip chip: package de scription and recomme ndations for use? an1826: ?transient protection solution s: transil? diode versus varistor? dot identifying pin a1 location user direction of unreeling all dimensions in mm 4.0 0.1 2.0 0.05 2.0 0.05 8.0 0.3 1.75 0.1 3.5 - 0.05 ? 1.55 0.1 0.46 0.03 0.82 0.05 0.20 0.02 0.82 0.05 xxz yww xxz yww xxz yww xxz yww xxz yww xxz yww xxz yww
ordering information USBULC6-2F7 8/9 docid025264 rev 1 4 ordering information figure 21. ordering information scheme 5 revision history table 3. ordering information order code marking package weight base qty delivery mode USBULC6-2F7 fa flip chip 0.417 mg 14000 tape and reel (7?) usb ulc 6 - 2 f7 usb protection ultra low capacitance breakdown voltage number of lines package 6 = 5.5 v min 2 = 2 lines f = flip chip = l 7 ead-free, pitch = 350 m, bump = 230 m table 4. document revision history date revision changes 20-dec-2013 1 initial release.
docid025264 rev 1 9/9 USBULC6-2F7 9 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems wi th product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
|
