p p js 68 0 9 june 8,2015 - rev.03 page 1 3 0 v p - c hannel enhancement mode mosfet voltage - 3 0 v current - 2.6 a sot - 23 6l unit : inch(mm) f eatures ? r ds(on) , v gs @ - 10 v , i d @ - 2.6 a< 115 m ? ? r ds(on) , v gs @ - 4 .5 v , i d @ - 1.7 a< 15 0m ? ? advan ced trench process technology ? specially designed for switch load, pwm application, etc. ? lead free in compliance with eu rohs 2011/65/eu directive. ? green molding compound as per iec61249 std. (halogen free) mechanical data ? case: sot - 23 6l package ? termi nals: solderable per mil - std - 750, method 2026 ? approx. weight: 0.0005 ounces, 0.014 grams ? marking: s t 9 parameter symbol limit units drain - source voltage v ds - 3 0 v gate - source voltage v gs + 20 v continuous drain current i d - 2. 6 a pulsed drain curre nt i dm - 1 0.4 a power dissipation t a =25 o c p d 1.25 w derate above 25 o c 10 m w/ o c operatin g junction an d storage temperature range t j ,t stg - 55~150 o c typical thermal resistance - j unction to ambient (note 3 ) r ja 10 0 o c /w maximum ratings and therma l characteristics (t a =25 o c unless otherwise noted)
p p js 68 0 9 june 8,2015 - rev.03 page 2 e lectrical c haracteristics (t a =25 o c unless otherwise noted) parameter symbol test condition min. typ. max. units static drain - source breakdown voltage bv dss v gs = 0 v, i d = - 25 0ua - 3 0 - - v gate t hreshold voltage v gs(th) v ds =v gs , i d = - 250 ua - 1 - 1. 31 - 2. 1 v drain - source on - state resistance r ds(on) v gs = - 10 v, i d = - 2.6 a - 9 3 11 5 m gs = - 4.5 v, i d = - 1.7 a - 1 16 15 0 zero gate voltage drain current i dss v ds = - 30 v, v gs =0v - - 0.01 - 1 u a gate - source leakage current i gss v gs = + 20 v, v ds =0v - + 10 + 10 0 n a dynamic total gate charge q g v ds = - 15 v, i d = - 2.6 a, v gs = - 10v (note 1 , 2 ) - 9.8 - nc gat e - source charge q gs - 1 .5 - gate - drain charge q gd - 2.2 - input capacitance ciss v ds = - 15 v, v gs = 0 v, f=1.0mhz - 3 96 - pf output capacitance coss - 47 - reverse transfer capacitance crss - 36 - switching turn - on delay time t d (on) v dd = - 15 v, i d = - 2 .6 a, v g s = - 10v, r g = 6 (note 1 , 2 ) - 5 - ns turn - on rise time tr - 30 - turn - o ff delay time t d (off) - 25 - turn - o ff fall time tf - 8 - drain - source diode maximum continuous drain - source diode forward current i s --- - - - 1. 5 a diode forward voltage v sd i s = - 1.0 a, v gs = 0 v - - 0. 77 - 1. 2 v notes : 1. pulse width < 300us, duty cycle < 2% 2. essentially independent of operating temperature typical characteristics . 3. r ? ja is the sum of the junction - to - case and case - to - ambient thermal resistance where the case thermal reference is defin ed as the solder mounting surface of the drain pins m ounted on a 1 inch fr - 4 with 2oz . square pad of copper 4. the maximum current rating is package limited
p p js 68 0 9 june 8,2015 - rev.03 page 3 t ypical characteristic curves fig.1 on - region characteristics fig. 2 transfer characte ristics fig. 3 on - resistance vs. drain current fig. 4 on - resistance vs. junction temperature fig. 5 on - resistance variation with vgs. fig. 6 body d i ode characteristics
p p js 68 0 9 june 8,2015 - rev.03 page 4 t ypical characteristic curves fig. 7 gate - charge characterist ics fig. 8 threshold voltage variation with temperature fig. 9 capacitance vs. drain - source voltage
p p js 68 0 9 june 8,2015 - rev.03 page 5 part no packing code version mounting pad layout part no packing code package type packing type marking ver sion PJS6809_ s 1_00001 sot - 23 6l 3k pcs / 7 0.024 (0.60) 0 . 0 2 6 ( 0 . 6 7 ) 0 . 0 9 6 ( 2 . 4 3 ) 0.037 (0.95) 0.037 (0.95)
p p js 68 0 9 june 8,2015 - rev.03 page 6 disclaimer
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