24.04.2014 uvled375 - smd 1 of 6 uvled375 - smd technical data 375 nm smd uvled features ? zener diode is built in the protective circuit against static electricity ? low voltage dc operated ? high power intensity ? complies with rohs directive specifications (25c) type symbol v alue unit absolute maximum ratings dc forward current i f 25 ma peak pulse forward current * i fp 80 ma allowable reverse current i r 85 ma power dissipation p d 100 mw operating temperature t op - 30 ? +85 c storage temperature t stg - 40 ? +100 c so ldering temperature (reflow, 10 s) t sol 260 c soldering temperature (hand, 3 s) t sol 350 c * note: 1/10 duty cycle, <10 ms pulse width characteristics symbol min. typ. max. unit electrical specification forward current i f - 20 - ma forward volt age * 1 v f - 3.6 4.0 v optical specification output power p o 4.8 - 9.6 mw peak wavelength * 3 p 370 375 380 nm spectrum half width 15 nm viewing angel 100 deg. * note: 1. forward voltage measurement tolerance is 0.2 v 2. optical ouput measurement tolerance is 10% 3. peak wavelength measurement tolerance is 3 nm device materials ite m material package ceramics encapsulating resin silicone resin electrodes a u plating
24.04.2014 uvled375 - smd 2 of 6 typical performance curves forward voltage vs forward current: forward voltage vs relative radiant flux : duty ratio vs allowable forward current: ambient temperature vs. forward voltage: ambient temp. vs. relative output power: ambient temp. vs allowable forward current:
24.04.2014 uvled375 - smd 3 of 6 forward current vs. peak wavelenght. spectrum: ambient temperature vs. peak wavelenght: directivity :
24.04.2014 uvled375 - smd 4 of 6 reliability 1. test items and result no. test item standard test methode test conditions note sample s passed 1 steady state operating life i f =25ma, ta=25c 1000 hr 50 50/50 2 high temp. steady state operating life i f =7.5ma, ta=85c 1000 hr 50 50/ 50 3 high temp. high humidity steady state ta=60c, rh=90%, i f =20ma 500 hr 50 50/50 4 low temp. steady state operating life i f =20ma, ta= - 30c 1000 hr 50 50/50 5 reflow soldering jeita ed - 4701 330 301 tsol=260 5c, 10sec 2 times 50 50/50 6 reflow so lderability jeita ed - 4701 330 303 tsol=215 5c, 3sec 1 time >95% 50 50/50 7 themal shock jeita ed - 4701 330 307 0c ? +100c (15 s) 20 cycles 50 50/50 8 temperature cycle jeita ed - 4701 100 105 - 40c ~ 25c ~ 100c ~ 25c 30min. 5min. 30min. 5min. 100 cycles 50 50/50 9 moisture resistance cycle jeita ed - 4701 200 203 25c ~ 65c ~ - 10c 90%rh 24hrs./1 cycle 10 cycles 50 50/50 10 high temperature storage jeita ed - 4701 200 201 ta=100c 1000 hr 50 50/50 11 low temperature storage jeita ed - 4701 200 202 ta= - 40c 1000 hr 50 50/50 12 vibration jeita ed - 4701 400 403 100 ~ 2k ~ 100hz sweep 4min. 200m/s2, 3directions, 4 cycles 48min 50 50/50 2. criteria for judging the damage item symbol test conditions criteria for judgment min. max. forward vo ltage v f i f =20ma - u.s.l x 1.1 optical power ouput p o i f =20ma l.s.l x 0.7 - * note: 1. u.s.l: upper standard level 2. l.s.l: lower standard level
24.04.2014 uvled375 - smd 5 of 6 precaution for use 1. cautions ? this device is a uv led, which radiates intense uv light during operation. ? do not lo ok directly into the uv light or look through the optical system. to prevent inadequate exposure of uv radiation, wearing uv protective glasses is recommended 2. moisture proof package ? when moisture is absorbed into the smd package, it may vaporize and expan d during soldering. this can cause exfoliation of the contacts, alter the optical characteristics of the led, and may irreversible damage the led. 3. soldering ? the leds should be sodered using the reflow soldering method. function of the leds can not be guar anteed after assembling was done using dip soldering method ? recommended soldering conditions: reflow soldering dip soldering lead solder lead - free solder pre - heat 120 ?150c 180 ?200c - pre - heat time max 120 s max 120 s - peak temperature 240c 260c max 350c. soldering time max 10 s max 10 s max 3 s condition please see graph below please see graph below - lead solder: lead free solder: recommended solder pad design (unit mm): ? soldering at the lowest p ossible temperatures is desireable for the leds. ? occasionally there is a decrease in leds brightness due to the influence of heat or ambient atmoshere during soldering. nitrogen reflow soldering is recommended therefor. ? leds encapsulation material is silic one. therefor the leds surface is soft and must not be exposed to strong pressure during soldering.
24.04.2014 uvled375 - smd 6 of 6 4. static electricity ? the leds are very sensitive to static electricity and surge voltage. so it is recommended that a wrist band or an anti - electrostatic g love be used when handling the leds. ? all devices, equipment and machinery must be grounded properly. it is recommended that precautions should be taken against surge voltage to the equipment that mounts the leds. 5. heat generation ? the powered leds generate heat. heat dissipation should be considered in the application design to avoid the environmental conditions for operation in excess of the absolute maximum ratings. outline dimensons (mm)
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