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features advanced process technology key parameters optimized for class-d audio amplifier applications low r dson for improved efficiency low q g and q sw for better thd and improved efficiency low q rr for better thd and lower emi 175c operating junction temperature for ruggedness repetitive avalanche capability for robustness and reliability multiple package options s d g v ds -55 v r ds(on) typ. @ v gs = -10v 93 m r ds(on) typ. @ v gs = -4.5v 150 m q g typ. 31 nc t j max 175 c key parameters irlr9343 IRLU9343 IRLU9343-701 d-pak irlr9343 i-pak IRLU9343 absolute maximum ratings parameter units v ds drain-to-source voltage v v gs gate-to-source voltage i d @ t c = 25c continuous drain current, v gs @ -10v a i d @ t c = 100c continuous drain current, v gs @ 10v i dm pulsed drain current p d @t c = 25c power dissipation w p d @t c = 100c power dissipation linear derating factor w/c t j operating junction and c t stg storage temperature range clamping pressure n thermal resistance parameter typ. max. units r jc junction-to-case ??? 1.9 r ja junction-to-ambient (pcb mounted) ??? 50 c/w r ja junction-to-ambient (free air) ??? 110 max. -14 -60 20 -55 -20 -40 to + 175 ??? 79 39 0.53 2014-8-16 1 www.kersemi.com

s d g electrical characteristics @ t j = 25c (unless otherwise specified) parameter min. typ. max. units bv dss drain-to-source breakdown voltage -55 ??? ??? v ? v dss / ? t j breakdown voltage temp. coefficient ??? -52 ??? mv/c r ds(on) static drain-to-source on-resistance ??? 93 105 m ? ??? 150 170 v gs(th) gate threshold voltage -1.0 ??? ??? v ? v gs(th) / ? t j gate threshold voltage coefficient ??? -3.7 ??? mv/c i dss drain-to-source leakage current ??? ??? -2.0 a ??? ??? -25 i gss gate-to-source forward leakage ??? ??? -100 na gate-to-source reverse leakage ??? ??? 100 g fs forward transconductance 5.3 ??? ??? s q g total gate charge ??? 31 47 q gs gate-to-source charge ??? 7.1 ??? v gs = -10v q gd gate-to-drain charge ??? 8.5 ??? i d = -14a q godr gate charge overdrive ??? 15 ??? see fig. 6 and 19 t d(on) turn-on delay time ??? 9.5 ??? t r rise time ??? 24 ??? t d(off) turn-off delay time ??? 21 ??? ns t f fall time ??? 9.5 ??? c iss input capacitance ??? 660 ??? c oss output capacitance ??? 160 ??? pf c rss reverse transfer capacitance ??? 72 ??? c oss effective output capacitance ??? 280 ??? l d internal drain inductance ??? 4.5 ??? between lead, nh 6mm (0.25in.) l s internal source inductance ??? 7.5 ??? from package avalanche characteristics parameter units e as single pulse avalanche energy mj i ar avalanche current a e ar repetitive avalanche energy mj diode characteristics parameter min. typ. max. units i s @ t c = 25c continuous source current ??? ??? -20 (body diode) a i sm pulsed source current ??? ??? -60 (body diode) v sd diode forward voltage ??? ??? -1.2 v t rr reverse recovery time ??? 57 86 ns q rr reverse recovery charge ??? 120 180 nc v gs = -4.5v, i d = -2.7a ??? 120 see fig. 14, 15, 17a, 17b v ds = v gs , i d = -250a v ds = -55v, v gs = 0v v ds = -55v, v gs = 0v, t j = 125c v gs = -20v v gs = 20v i d = -14a typ. max. ? = 1.0mhz, see fig.5 v gs = 0v, v ds = 0v to -44v v gs = 0v t j = 25c, i f = -14a di/dt = 100a/s t j = 25c, i s = -14a, v gs = 0v showing the integral reverse p-n junction diode. conditions v gs = 0v, i d = -250a reference to 25c, i d = -1ma v gs = -10v, i d = -3.4a mosfet symbol r g = 2.5 ? v ds = -25v, i d = -14a v ds = -44v conditions and center of die contact v dd = -28v, v gs = -10v v ds = -50v 2014-8-16 2 www.kersemi.com
fig 2. typical output characteristics fig 1. typical output characteristics fig 3. typical transfer characteristics fig 4. normalized on-resistance vs. temperature fig 6. typical gate charge vs.gate-to-source voltage fig 5. typical capacitance vs.drain-to-source voltage 0.1 1 10 100 -v ds , drain-to-source voltage (v) 0.1 1 10 100 - i d , d r a i n - t o - s o u r c e c u r r e n t ( a ) 60s pulse width tj = 25c -2.5v vgs top -15v -12v -10v -8.0v -5.5v -4.5v -3.0v bottom -2.5v 0.1 1 10 100 -v ds , drain-to-source voltage (v) 0.1 1 10 100 - i d , d r a i n - t o - s o u r c e c u r r e n t ( a ) 60s pulse width tj = 175c -2.5v vgs top -15v -12v -10v -8.0v -5.5v -4.5v -3.0v bottom -2.5v 0.0 5.0 10.0 15.0 -v gs , gate-to-source voltage (v) 0.1 1.0 10.0 100.0 - i d , d r a i n - t o - s o u r c e c u r r e n t ( ) v ds = -25v 60s pulse width t j = 25c t j = 175c -60 -40 -20 0 20 40 60 80 100 120 140 160 180 t j , junction temperature (c) 0.5 1.0 1.5 2.0 r d s ( o n ) , d r a i n - t o - s o u r c e o n r e s i s t a n c e ( n o r m a l i z e d ) i d = -14a v gs = -10v 1 10 100 -v ds , drain-to-source voltage (v) 10 100 1000 10000 c , c a p a c i t a n c e ( p f ) coss crss ciss v gs = 0v, f = 1 mhz c iss = c gs + c gd , c ds shorted c rss = c gd c oss = c ds + c gd 0 1020304050 q g total gate charge (nc) 0 4 8 12 16 20 - v g s , g a t e - t o - s o u r c e v o l t a g e ( v ) v ds = -44v vds= -28v vds= -11v i d = -14a for test circuit see figure 19
2014-8-16 3 www.kersemi.com
fig 11. maximum effective transient thermal impedance, junction-to-case fig 10. threshold voltage vs. temperature fig 9. maximum drain current vs. case temperature fig 7. typical source-drain diode forward voltage fig 8. maximum safe operating area 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 -v sd , source-to-drain voltage (v) 0.1 1.0 10.0 100.0 - i s d , r e v e r s e d r a i n c u r r e n t ( a ) t j = 25c t j = 175c v gs = 0v 25 50 75 100 125 150 175 t j , junction temperature (c) 0 4 8 12 16 20 - i d , d r a i n c u r r e n t ( a ) -75 -50 -25 0 25 50 75 100 125 150 175 t j , temperature ( c ) 1.0 1.5 2.0 2.5 - v g s ( t h ) g a t e t h r e s h o l d v o l t a g e ( v ) i d = -250a 1e-006 1e-005 0.0001 0.001 0.01 0.1 t 1 , rectangular pulse duration (sec) 0.001 0.01 0.1 1 10 t h e r m a l r e s p o n s e ( z t h j c ) 0.20 0.10 d = 0.50 0.02 0.01 0.05 single pulse ( thermal response ) notes: 1. duty factor d = t1/t2 2. peak tj = p dm x zthjc + tc ri (c/w) i (sec) 1.162 0.000512 0.7370 0.002157 j j 1 1 2 2 r 1 r 1 r 2 r 2 c ci i / ri ci= i / ri 1 10 100 1000 -v ds , drain-tosource voltage (v) 1 10 100 1000 - i d , d r a i n - t o - s o u r c e c u r r e n t ( a ) tc = 25c tj = 175c single pulse 1msec 10msec operation in this area limited by r ds (on) 100sec 2014-8-16 4 www.kersemi.com

fig 13. maximum avalanche energy vs. drain current fig 12. on-resistance vs. gate voltage fig 14. typical avalanche current vs.pulsewidth fig 15. maximum avalanche energy vs. temperature notes on repetitive avalanche curves , figures 14, 15: (for further info, see an-1005 at www.irf.com) 1. avalanche failures assumption: purely a thermal phenomenon and failure occurs at a temperature far in excess of t jmax . this is validated for every part type. 2. safe operation in avalanche is allowed as long ast jmax is not exceeded. 3. equation below based on circuit and waveforms shown in figures 17a, 17b. 4. p d (ave) = average power dissipation per single avalanche pulse. 5. bv = rated breakdown voltage (1.3 factor accounts for voltage increase during avalanche). 6. i av = allowable avalanche current. 7. ? t = allowable rise in junction temperature, not to exceed t jmax (assumed as 25c in figure 14, 15). t av = average time in avalanche. d = duty cycle in avalanche = t av f z thjc (d, t av ) = transient thermal resistance, see figure 11) p d (ave) = 1/2 ( 1.3bvi av ) = t/ z thjc i av = 2 t/ [1.3bvz th ] e as (ar) = p d (ave) t av 4.0 6.0 8.0 10.0 -v gs , gate-to-source voltage (v) 0 100 200 300 400 500 600 r d s ( o n ) , d r a i n - t o - s o u r c e o n r e s i s t a n c e ( m ? ) t j = 25c t j = 125c i d = -14a 25 50 75 100 125 150 175 starting t j , junction temperature (c) 0 100 200 300 400 500 e a s , s i n g l e p u l s e a v a l a n c h e e n e r g y ( m j ) i d top -4.0a -5.5a bottom -14a 25 50 75 100 125 150 175 starting t j , junction temperature (c) 0 20 40 60 80 100 120 140 e a r , a v a l a n c h e e n e r g y ( m j ) top single pulse bottom 1% duty cycle i d = -14a 1.0e-06 1.0e-05 1.0e-04 1.0e-03 1.0e-02 tav (sec) 0.1 1 10 100 1000 - a v a l a n c h e c u r r e n t ( a ) 0.05 duty cycle = single pulse 0.10 allowed avalanche current vs avalanche pulsewidth, tav assuming ? tj = 25c due to avalanche losses. note: in no case should tj be allowed to exceed tjmax 0.01 2014-8-16 5 www.kersemi.com

fig 19a. gate charge test circuit fig 19b gate charge waveform vds vgs id vgs(th) qgs1 qgs2 qgd qgodr fig 16.
for p-channel hexfet power mosfets
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6.73 (.265) 6.35 (.250) - a - 4 1 2 3 6.22 (.245) 5.97 (.235) - b - 3x 0.89 (.035) 0.64 (.025) 0.25 (.010) m a m b 4.57 (.180) 2.28 (.090) 2x 1.14 (.045) 0.76 (.030) 1.52 (.060) 1.15 (.045) 1.02 (.040) 1.64 (.025) 5.46 (.215) 5.21 (.205) 1.27 (.050) 0.88 (.035) 2.38 (.094) 2.19 (.086) 1.14 (.045) 0.89 (.035) 0.58 (.023) 0.46 (.018) 6.45 (.245) 5.68 (.224) 0.51 (.020) min. 0.58 (.023) 0.46 (.018) lead assignments 1 - gate 2 - drain 3 - source 4 - drain 10.42 (.410) 9.40 (.370) notes: 1 dimensioning & tolerancing per ansi y14.5m, 1982. 2 controlling dimension : inch. 3 conforms to jedec outline to-252aa. 4 dimensions shown are before solder dip, solder dip max. +0.16 (.006). example: lot code 9u1p this is an irfr120 wi t h as s e mb l y we e k = 16 dat e code ye ar = 0 logo rectifier international as s e mb l y lot code 016 irf u120 9u 1p notes: this part marking information applies to devices produced before 02/26/2001 international logo rectifier 34 12 irf u120 916a lot code as s e mb l y example: wi t h as s e mb l y this is an irfr120 year 9 = 1999 dat e code line a we e k 16 in the assembly line "a" as s embled on ww 16, 1999 lot code 1234 part number notes: t his part marking information applies to devices produced after 02/26/2001 2014-8-16 7 www.kersemi.com

6.73 (.265) 6.35 (.250) - a - 6.22 (.245) 5.97 (.235) - b - 3x 0.89 (.035) 0.64 (.025) 0.25 (.010) m a m b 2.28 (.090) 1.14 (.045) 0.76 (.030) 5.46 (.215) 5.21 (.205) 1.27 (.050) 0.88 (.035) 2.38 (.094) 2.19 (.086) 1.14 (.045) 0.89 (.035) 0.58 (.023) 0.46 (.018) lead assignments 1 - gate 2 - drain 3 - source 4 - drain notes: 1 dimensioning & tolerancing per ansi y14.5m, 1982. 2 controlling dimension : inch. 3 conforms to jedec outline to-252aa. 4 dimensions shown are before solder dip, solder dip max. +0.16 (.006). 9.65 (.380) 8.89 (.350) 2x 3x 2.28 (.090) 1.91 (.075) 1.52 (.060) 1.15 (.045) 4 1 2 3 6.45 (.245) 5.68 (.224) 0.58 (.023) 0.46 (.018) week = 16 dat e code ye ar = 0 notes : t his part marking information applies to devices produced before 02/26/2001 example: lot code 9u1p this is an irfr120 with assembly assembly international rectifier logo lot code irfu120 9u 1p 016 international logo rectifier lot code assembly example: with assembly this is an irfr120 year 9 = 1999 dat e code line a we e k 19 in the assembly line "a" as s embled on ww 19, 1999 lot code 5678 part number notes : t his part marking information applies to devices produced after 02/26/2001 56 irfu120 919a 78 2014-8-16 8 www.kersemi.com

tr 16.3 ( .641 ) 15.7 ( .619 ) 8.1 ( .318 ) 7.9 ( .312 ) 12.1 ( .476 ) 11.9 ( .469 ) feed direction feed direction 16.3 ( .641 ) 15.7 ( .619 ) trr trl notes : 1. controlling dimension : millimeter. 2. all dimensions are shown in millimeters ( inches ). 3. outline conforms to eia-481 & eia-541. notes : 1. outline conforms to eia-481. 16 mm 13 inch 2014-8-16 9 www.kersemi.com

repetitive rating; pulse width limited by max. junction temperature. starting t j = 25c, l = 1.24mh, r g = 25 ? , i as = -14a.
pulse width 400s; duty cycle 2%. this only applies for i-pak, l s of d-pak is measured between lead and center of die contact r is measured at

contact factory for mounting information limited by tjmax. see figs. 14, 15, 17a, 17b for repetitive avalanche information when d-pak mounted on 1" square pcb (fr-4 or g-10 material) . for recommended footprint and soldering techniques refer to application note #an-994 refer to d-pak package for part marking, tape and reel information. ! "#

2014-8-16 10 www.kersemi.com

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