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dc brush motor drivers ( 36 v max ) bd62 3x xx series general description these h - bridge drivers are full bridge drivers for brush motor applications. each ic can operate at a wide range of power supply voltages (from 6 v to 3 2v), with output currents of up to 2a. mos transistors in the output stage allow pwm speed control . t he integrated vref voltage control function allows direct replacement of d iscontinued motor driver ics. these highly efficient h - bridge driver ics facilitate low - power consumption design. features ? built - in, selectable one channel or two channels configuration ? vref voltage setting pin enables pwm duty control ? cross- conduction prevention circuit ? four protection circuits provided: ocp, ovp, tsd a nd uvlo applications vtr; cd/dvd player s; audio - visual equipment ; optical disc drive s; pc peripheral s; oa equipment s key specifications supply voltage range: 36 v(max) maximum output current: 0.5a / 1.0a / 2.0a output on - resistanc e: 1.5 / 1.5 / 1.0 pwm input frequency range : 20 khz to 100khz standby current : 0a ( typ ) operating temperature range : - 40 c to + 85 c packages w (typ) x d(typ) x h(max) sop8 5.00mm x 6.20mm x 1.71mm hsop25 13 .60mm x 7.80mm x 2.11mm hsop - m28 1 8.50 mm x 9.9 0mm x 2. 4 1mm hrp7 9.395mm x 10.540mm x 2.005mm ordering information b d 6 2 3 x x x x - x x part n umber package f : sop8 fp : hsop25 fm : hsop - m28 hfp : hrp7 packaging and forming specification e2: embossed taping (sop8/hsop25/hsop- m28) tr: embossed taping (hrp7) lineup rating voltage (max) channels o utput current (max) package ordering part number 36v 1ch 0.5a sop8 reel of 2 5 00 bd6230f -e2 1.0a hrp7 reel of 2 0 00 bd6231hfp - tr sop8 reel of 2 5 00 bd6231f -e2 2.0a hrp7 reel of 2 0 00 bd6232hfp - tr hsop25 reel of 2 0 00 bd6232fp -e2 2ch 1.0a hsop25 reel of 2 0 00 bd6236fp -e2 hsop - m28 reel of 15 00 bd6236 fm -e2 2.0a hsop - m28 reel of 15 00 bd6237fm -e2 hrp7 (pd=1.60w) sop8 (pd=0.69w) hsop25( (pd=1.45w) (note) pd : mounted on a 70mm x 70mm x 1.6mm glass - epoxy board. hsop - m28 (pd=2.20w) pro duct structure silicon monolithic integrated circuit this product has no designed protection against radioactive rays. 1/ 24 tsz02201 - 0p2p0b300090 -1-2 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 datashee t downloaded from: http:///
bd623x xx series data s heet block diagrams / p in configuration s / pin descriptions bd6230f / bd6231f fig ure 1. bd6230f / bd6231f fig ure 2. sop8 (top view) bd6231hfp / bd6232hfp fig ure 3. bd6231hfp / bd6232hfp fig ure 4. hrp 7 (top view) bd6232fp fig ure 5. bd6232fp fig ure 6. hsop25 (top view) table 1 bd6230f/bd6231f pin no. pin name function 1 out1 driver output 2 vcc power suppl y 3 vcc power supply 4 fin control input (forward) 5 rin control input (reverse) 6 vref duty setting pin 7 out2 driver output 8 gnd ground ( note ) use all vcc pin by the same voltage . table 2 bd6231hfp/bd6232hfp pin no. pin name function 1 vref duty setting pin 2 out1 driver output 3 fin control input (forward) 4 gnd ground 5 rin control input (reverse) 6 out2 driver output 7 vcc power supply fin gnd ground table 3 bd6232fp pin no. pin name function 1,2 out1 driver output 6 gnd small signal ground 7,8 rnf power stage ground 12,13 out2 driver output 17 v ref duty setting pin 19 rin control input (reverse) 20 fin control input (forward) 21 vcc power supply 22,23 vcc power supply fin gnd ground ( note ) all pins not descri bed above are nc pins. note: use all vcc pin by the same voltage . out1 vcc vcc fin gnd out2 vref rin vref out1 fin gnd rin out2 vcc out1 out1 gnd nc nc nc gnd rnf rnf nc nc nc out2 out2 nc nc gnd vcc vcc vcc fin rin nc vref nc nc nc 3 2 7 1 4 5 ctrl protect fin rin vcc vcc out1 out2 8 gnd 6 vref duty 7 6 2 3 5 ctrl protect fin rin vcc out1 out2 4 gnd 1 vref duty fin gnd 21 22 12 1 20 19 ctrl protect fin rin vcc vcc out1 out2 8 rnf 17 vref duty 6 gnd 2 13 7 23 fin gnd 2/ 24 tsz02201 - 0p2p0b300090 -1-2 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 downloaded from: http:///
bd623x xx series data s heet block diagrams / p in configuration s / pin descriptions - c ontinued bd6236fp fig ure 7. bd6236fp fig ure 8. hsop25 (top view) table 4 bd6236fp pin no. pin name function 1 out1a driver output 3 rnfa po wer stage ground 6 out2a driver output 8 gnd small signal ground 9 vrefa duty setting pin 10 rina control input (reverse) 11 fina control input (forward) 12 vcc power supply 13 vcc power supply 14 out1b driver output 16 rnfb power stage ground 19 out2b driver output 20 gnd small signal ground 21 vrefb duty setting pin 22 rinb control input (reverse) 23 finb control input (forward) 24 vcc power supply 25 vcc power supply fin gnd ground ( note ) all pins not descri bed above are nc pins. note: use all vcc pin by the same voltage. out1a nc gnd rnfa nc nc out2a nc gnd vrefa rina fina vcc vcc vcc vcc gnd finb rinb vrefb gnd out2b nc nc rnfb nc out1b 24 25 11 10 ctrl protect fina rina vcc vcc 3 rnfa 9 vrefa duty 1 out1a 6 out2a 20 gnd 12 13 23 22 ctrl protect finb rinb vcc vcc 16 rnfb 21 vrefb duty 14 out1b 19 out2b 8 gnd fin gnd 3/ 24 tsz02201 - 0p2p0b300090 -1-2 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 downloaded from: http:///
bd623x xx series data s heet block diagrams / p in configuration s / pin descriptions - c ontinued bd6236fm fig ure 9. bd6236fm fig ure 10 . hsop - m28 (top view) table 5 bd6236fm pin no. pin name function 1 out1a driver output 3 rnfa power stage ground 6 out2a driver output 8 gnd small signal ground 9 vrefa duty setting pin 10 rina control input (reverse) 11 fina control input (forward) 12 vcc power supply 14 vcc power supply 15 out1b driver output 17 rnfb power stage ground 20 out2b driver output 22 gnd small signal ground 23 vrefb duty setting pin 24 rinb control input (reverse) 25 finb control input (forward) 26 vcc power supply 28 vcc power supply fin gnd ground ( note ) all pins not desc ri bed above are nc pins. note: use all vcc pin by the same voltage. out1a nc gnd rnfa nc nc out2a nc gnd vrefa rina fina vcc nc vcc vcc nc gnd vcc finb rinb vrefb gnd nc out2b nc nc rnfb nc out1b 26 28 11 10 ctrl protect fina rina vcc vcc 3 rnfa 9 vrefa duty 1 out1a 6 out2a 22 gnd 12 14 25 24 ctrl protect finb rinb vcc vcc 17 rnfb 23 vrefb duty 15 out1b 20 out2b 8 gnd fin gnd 4/ 24 tsz02201 - 0p2p0b300090 -1-2 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 downloaded from: http:///
bd623x xx series data s heet block diagrams / p in configuration s / pin descriptions - continued bd6237fm fig ure 11 . bd6237fm fig ure 12 . hsop - m28 (top view) table 6 bd6237fm pin no. pin name function 1,2 out1a driver output 3,4 rnf a power stage ground 6,7 out2a driver output 8 gnd small signal ground 9 vrefa duty setting pin 10 rina control input (reverse) 11 fina control input (forward) 12 vcc power supply 13,14 vcc power supply 15,16 out1b driver output 17,18 rnfb power stage ground 20,21 out2b driver output 22 gnd small signal ground 23 vrefb duty setting pin 24 rinb control input (reverse) 25 finb control input (forward) 26 vcc power supply 27,28 vcc powe r supply fin gnd ground ( note ) all pins not descri bed above are nc pins. note: use all vcc pin by the same voltage. out1a out1a gnd rnfa rnfa nc out2a out2a gnd vrefa rina fina vcc vcc vcc vcc vcc gnd vcc finb rinb vrefb gnd out2b out2b nc rnfb rnfb out1b out1b 26 28 11 10 ctrl protect fina rina vcc vcc 3 rnfa 9 vrefa duty 2 out1a 6 out2a 22 gnd 12 14 25 24 ctrl protect finb rinb vcc vcc 17 rnfb 23 vrefb duty 16 out1b 20 out2b 8 gnd fin gnd 1 7 4 27 13 15 21 18 5/ 24 tsz02201 - 0p2p0b300090 -1-2 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 downloaded from: http:///
bd623x xx series data s heet absolute maximum ratings (ta=25 c , all voltag es are with respect to ground ) parameter symbol rating unit supply voltage v cc 36 v output current i omax 0.5 (note 1) / 1.0 (note 2) / 2.0 (note 3) a all other input pins v in - 0.3 to v cc v operating temperature t opr - 40 to +85 c storage temperature tstg - 55 to +150 c power dissipation pd 0.68 (note 4) / 1.6 (note 5) / 1.45 (note 6) / 2.2 (note 7) w junction temperature tjmax 150 c (note 1) bd6230. do not exceed pd or aso. (note 2) bd6231 / bd6236. do not exceed pd or aso. (note 3) bd6232 / bd6237 . do not exceed pd or aso. (note 4) sop8 package. mounted on a 70mm x 70mm x 1.6mm glass - epoxy board. derate by 5.5mw/ c for ta above 25 c . (note 5) hrp7 package. mounted on a 70mm x 70mm x 1.6mm glass - epoxy board. derate by 12.8mw/ c f o r ta above 25 c . (n ote 6) hsop25 package. mounted on a 70mm x 70mm x 1.6mm glass - epoxy board. derate by 11.6mw/ c for ta above 25 c . (note 7) hsop - m28 package. mounted on a 70mm x 70mm x 1.6mm glass - epoxy board. derate by 17.6mw/ c for ta above 25 c . caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circu it between pins. therefore, it is important to consider circuit prote ction measures, such as adding a fuse, in case the ic is op era ted over the absolute maximum ratings. recommended operating condition s (ta=25 c ) parameter symbol rating unit supply voltage v cc 6 to 32 v vref voltage v ref 3 to 32 v electrical c haracteristics (unless otherwise specified, ta=25 c and v cc =v ref =24v) parameter symbol limit unit conditions min typ m ax supply current (1ch) i cc 0.8 1.3 2.5 ma forward / reverse / brake supply current (2ch) i cc 1.3 2.0 3.5 ma forward / reverse / brake stand - by current i stby - 0 10 a stand - by input high voltage v ih 2.0 - - v input low voltage v il - - 0.8 v input bias current i ih 30 50 100 a v in =5.0v output on - resistance (note 8) r on 1.0 1.5 2.5 ? i o ut =0.25a , vertically total output on - resistance (note 9) r on 1.0 1.5 2.5 ? i o ut =0.5a , vertically total output on - resistance (note 10 ) r on 0.5 1.0 1.5 ? i o ut =1.0a , vertically total vref bias current i vref - 10 0 + 10 a v ref =v cc carrier frequency f pwm 20 25 35 khz v ref =18v i nput frequency range f max 20 - 100 khz fin / rin (note 8) bd6230 (note 9) bd6231 / bd6236 (note 10 ) bd6232 / bd6237 6/ 24 tsz02201 - 0p2p0b300090 -1-2 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 downloaded from: http:///
bd623x xx series data s heet typical performance curves (reference data ) 0.5 1.0 1 .5 2.0 2.5 6 12 18 24 30 36 supply voltage: vcc [v] circuit current: icc [ma] 85c 25c - 40c supply voltage : v cc [v] fig ure 13 . supply current vs supply voltage (1ch) supply current : i cc [ma] 1.0 1.5 2 .0 2.5 3.0 6 12 18 24 30 36 supply voltage: vcc [v] circuit current: icc [ma] 85c 25c - 40c supply voltage : v cc [v] fig ure 1 4. supply current vs supply voltage (2 ch) supply current : i cc [ma] 0.0 0.2 0.4 0.6 0.8 1.0 0 6 12 18 24 30 36 input voltage: vin [v] input bias current: iih [ma] _ 85c 25c -40c input voltage : v in [v] figure 1 6. input bias current vs input voltage input bias current : i ih [ma] -0.5 0.0 0 .5 1.0 1.5 0.8 1.2 1.6 2 input voltage: vin [v] internal logic: h/l [-] _ -40c 25c 85 c -40c 25c 85 c input voltage : v in [v] figure 15. internal logic vs input voltage ( input threshold voltage ) internal logic : h/l [ -] 7/ 24 tsz02201 - 0p2p0b300090 -1-2 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 downloaded from: http:///
bd623x xx series data s heet typical per formance curves (reference data ) - continued -10 -5 0 5 10 0 6 12 18 24 30 36 input voltage: vref [v] input bias current: ivref [a] -40c 25c 85c figure 1 7 . vref input bias current vs input voltage input voltage : v ref [v] 10 20 30 40 6 12 18 24 30 36 supply voltage: v cc [v] oscillation frequency: f pwm [khz] 85c 25c - 40c supply voltage : v cc [v] fig ure 19. oscillation frequency vs supply voltage (vcc C carrier frequency) oscillation frequency : f pwm [khz] 0 3 6 9 4.5 5 5.5 6 supply voltage: v cc [v] internal signal: release [v] _ 85c 25c -40c supply voltage : v cc [v] fig ure 20. internal signal vs supply voltage (under voltage lock out ) internal signal : release [v] input bias current : i vref [a] 0.0 0.2 0.4 0.6 0.8 1.0 0 0.2 0.4 0.6 0.8 1 input voltage: v ref / v cc [v] switching duty: d [ton/t] _ -40c 25c 85c input voltage : v ref /v cc [v] fig ure 18. switching duty vs input voltage (vref C duty, v cc =24v) switching duty : d [ton/t] 8/ 24 tsz02201 - 0p2p0b300090 -1-2 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 downloaded from: http:///
bd623x xx series data s heet typical performance curves (reference data ) - continued 0 12 24 36 48 36 40 44 48 supply voltage: v cc [v] internal signal: release [v] -40c 25c 85 c supply voltage : v cc [v] fig ure 21. internal signal vs supply voltage (over voltage protection ) internal signal : release [v] -0.5 0.0 0.5 1.0 1.5 125 150 175 200 junction temperature: t j [c] internal logic: h/l [-] junction temperature : tj [c] fig ure 22. internal logic vs junction temperature (thermal shutdown ) internal logic : h/l [ -] -0.5 0.0 0 .5 1.0 1.5 2 2.5 3 3.5 4 load current / iomax: normalized internal logic: h/l [-] 85c 25c - 40c load current/i omax : normalized fig ure 23. internal logic vs load current (over- current protection, h side) internal logic : h/l [ -] -0.5 0.0 0 .5 1.0 1.5 1 1.25 1.5 1.75 2 load current / iomax: normalized internal logic: h/l [-] 85c 25c - 40c load current/i omax : normalized fig ure 24. internal l ogic vs load current (over- current protection, l side) internal logic : h/l [ -] 9/ 24 tsz02201 - 0p2p0b300090 -1-2 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 downloaded from: http:///
bd623x xx series data s heet typical performance curves ( reference data) C continued 0 0.2 0 .4 0.6 0.8 0 0.1 0.2 0.3 0.4 0.5 output current: i out [a] output voltage: v cc -v out [v] 85c 25c - 40c output current : i out [a] fig ure 25. output voltage vs output current (output high voltage, bd62 30 ) output voltage : v cc -v out [v] 0 0.4 0 .8 1.2 1.6 0 0.2 0.4 0.6 0.8 1 output current: i out [a] output voltage: v cc -v out [v] 85c 25c - 40c output current : i out [a] fig ure 26. output voltage vs output current (output high voltage, bd62 31/36 ) output voltage : v cc -v out [v] 0 0.5 1 1.5 2 0 0.4 0.8 1.2 1.6 2 output current: i out [a] output voltage: v cc -v out [v] 85c 25c -40c output current : i out [a] fig ure 27. output voltage vs output current (output high voltage, bd62 32/37 ) output voltage : v cc -v out [v] 0 0.5 1 1.5 2 0 0.1 0.2 0.3 0.4 0.5 output current: i out [a] output voltage:v cc- v out [v] -40c 25c 85c output current : i out [a] fig ure 28. output voltage vs output cu rrent (high side body diode, bd62 30 ) output voltage : v cc -v out [v] 10 / 24 tsz02201 - 0p2p0b300090 -1-2 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 downloaded from: http:///
bd623x xx series data s heet typical performance curves (reference data) C continued 0 0.5 1 1.5 2 0 0.2 0.4 0.6 0.8 1 output current: i out [a] output voltage:v cc- v out [v] -40c 25c 85c 0 0.5 1 1.5 2 0 0.4 0.8 1.2 1.6 2 output current: i out [a] output voltage:v cc- v out [v] -40c 25c 85c output current : i out [a] output current : i out [a] fig ure 3 0. output voltage vs output current (high side body diode, bd62 32/37 ) fig ure 29. output voltage vs output current (high side body diode, bd62 31/36 ) 0 0.2 0 .4 0.6 0.8 0 0.1 0.2 0.3 0.4 0.5 output current: i out [a] output voltage: v out [v] 85c 25c - 40c output current : i out [a] fig ure 3 1. output voltage vs output current (out put low voltage, bd62 30 ) output voltage : v out [v] 0 0.4 0.8 1.2 1.6 0 0.2 0.4 0.6 0.8 1 output current: i out [a] output voltage: v out [v] 85c 25c -40c outpu t current : i out [a] fig ure 3 2. output voltage vs output current (output low voltage, bd62 31/36 ) output voltage : v out [v] output voltage : v cc -v out [v] output voltage : v cc -v out [v] 11 / 24 tsz02201 - 0p2p0b300090 -1-2 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 downloaded from: http:///
bd623x xx series data s heet typical performance curves (re ference data ) - continued 0 0.5 1 1.5 2 0 0.4 0.8 1.2 1.6 2 output current: i out [a] output voltage: v out [v] 85c 25c -40c output current : i out [a] fig ure 3 3. output voltage vs output current (output low voltage, bd623 2 /3 7) output voltage : v out [v ] 0 0.5 1 1.5 2 0 0.1 0.2 0.3 0.4 0.5 output current: i out [a] output voltage: vout [v] -40c 25c 85c output current : i out [a] fig ure 3 4. output voltage vs output current (low side body diode, bd62 30 ) output voltage : v out [v] 0 0.5 1 1.5 2 0 0.2 0.4 0.6 0.8 1 output current: i out [a] output voltage: vout [v] -40c 25c 85c output current : i out [a] fig ure 35 . output voltage vs output current ( low side body diode, bd6231/36) output voltage : v out [v] 0 0.5 1 1.5 2 0 0.4 0.8 1.2 1.6 2 output current: i out [a] output voltage: vout [v] -40c 25c 85c output current : i out [a] fig ure 3 6. output voltage vs output current ( low side body diode, bd623 2 /3 7) output voltage : v out [v] 12 / 24 tsz02201 - 0p2p0b300090 -1-2 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 downloaded from: http:///
bd623x xx series data s heet application information 1. d escription of functions (1) operation modes table 7 logic table mode fin rin vref out1 out2 operation a l l x hi -z (note) hi -z (note) stan d- by (idling) b h l vcc h l forward (out1 > out2) c l h vcc l h reverse (out1 < out2) d h h x l l brake (stop) e pwm l vcc h pwm __________ forward (pwm control mode a ) f l pwm vcc pwm __________ h reverse (pwm control mode a) g h pwm vcc pwm __________ l forward (pwm control mode b ) h pwm h vcc l p wm __________ reverse (pwm control mode b) i h l option h pwm __________ forward ( vref control) j l h option pwm __________ h reverse (vref control) (note) hi - z : a ll output transistors are off . n ote that this is the state of the connected diodes , which differs from that of the mechanical relay. x : don t care mode (a) stand - by mode stand - by operates independently with the vref pin voltage. in stand - by mode, all in ternal circuits are turned o f f, including the output power transistors. m otor output goes to high impedance. when the system is switch ed to stand - by mode while the motor is running, the system enters an idling state because of the body diodes . however, whe n the system switches to stand - by from any other mode (except the brake mode ) , the control logic remains in the high state for at least 50 s before shutting down all circuits. mode (b) forward mode this operating mode is defined as the forward rotation of the motor when the out1 pin is high and out2 pin is low. when the motor is connected between the out1 and out2 pin s , the current flows from out1 to out2. to operat e in this mode, connect the vref pin to the vcc pin. mode (c) reverse mode this operating mode is defined as the reverse rotation of the motor when the out1 pin is low and out2 pin is high . when the motor is connected between the out1 and out2 pin s , the current flows from out 2 to out 1 . to operat e in this mode, connect the vref pin to the vcc pin . mode (d) brake mode this operating mode is used to quickly stop the motor (short circuit brake). it differs from the stand - by mode b ecause the internal control circuit is operat ing in the brake mode. please switch to stand - by mode (rather than the brake mode) to save power and reduce consumption. ( a) stand - by mode ( b) forward mode ( c) reverse mode ( d) brake mode fi g ure 37 . four basic operations ( output stage ) m on off off on m off on on off m off on off on off off off off m 13 / 24 tsz02201 - 0p2p0b300090 -1-2 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 downloaded from: http:///
bd623x xx series data s heet mo de (e),(f) pwm control mode a the rotational speed of the motor can be controlled by the duty cycle of the pwm signal fed to the fin pin or the rin pin. in this mode, the high side output is fixed and the low side output is switching , c orresponding to the input signal. the state of the output toggles between "l" and "hi - z". the frequency of the input pwm signal can be between 20khz and 100khz. the circuit may not operate properly for pwm frequencies below 20khz and above 100khz. note that control may not be at tained by switching on duty at frequencies lower than 20khz, since the operation functions via the stand - by mode. to operate in this mode, connect the vref pin to the vcc pin. in addition, establish a current path for t he recovery current from the motor, by connect ing a bypass capacitor (10 f or higher is recommended) between vcc and ground. control input : h control input : l fig ure 38 . pwm control mode a operation ( output stage ) fig ure 39 . pwm control mode a operation ( timing chart ) mode (g),(h) pwm control mode b the rotational speed of the motor can be controlled by the duty cycle of the pwm signal fed to the fin pin or the rin pin. in this mode, the low side output is fixed and the high side output is switching , c orresponding to the input signal. the state of the output toggles between "l" and "h" . the frequency of the input pwm signal can be between 20khz and 100khz. the circuit may not operate properly for pwm frequencies below 20khz and above 100khz. to operate in this mode, connect the vref pin to the vcc pin. in addition, establish a curren t path for the recovery current from the motor, by connect ing a bypass capacitor (10 f or higher is recommended) between vcc and ground. control input : h control input : l fig ure 40 . pwm control mode b operation ( output stage ) fig ure 41 . pwm control mode b operation ( timing chart ) f i n rin out1 out2 f i n rin out1 out2 m on off off on m on off off off m on off off on m on off off off 14 / 24 tsz02201 - 0p2p0b300090 -1-2 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 downloaded from: http:///
bd623x xx series data s heet mode (i),(j) vref control mode the built - in vref duty cycle conversion circuit provides a duty cycle corresponding to the voltage of the vref pin and the vcc voltage. this function offers the same level of control as the high voltage output setting function in previous models. the duty cycle is calculated by the following equation. [ ] [ ] v v v v duty cc ref / for example, if vcc voltage is 24 v and vref pin voltage is 18 v, the duty cycle is about 75 percent. h owever, please note that the duty cycle might be limited by the range of the vref pin voltage (refer to the r ecommended operating conditions, shown on page 6 ). the pwm carrier frequency in this mode is 25khz (nominal), and the switching operation is the same as the pwm control modes. when operating in this mode, do not input a pwm si gn al to the fin an d rin pins. in addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10 f or more is recommended) between vcc and ground. fig ure 4 2. vref control operation ( timing chart ) (2) cross- conduction protection circuit in the full bridge output stage, when the upper and lower transistors are turned on at the same time during high to low or low to hig h transition, a n inrush current flows from the power supply to ground, resulting to a loss . this circuit eliminates the inrush current by providing a dead time (about 400ns, nominal) during the transition . (3) output protection circuits (a) under voltage lock out (uvlo) circuit to ensure the lowest power supply voltage necessary to operate the controller , and to prevent under voltage ma lfunction s , a uvlo circuit has been built into this driver . when the power supply voltage falls to 5.0v (nominal) or below , the co ntroller forces all driver outputs to high impedance. when the voltage rises to 5.5v (nominal) or above , the uvlo circuit ends the lockout operation and returns the chip to normal operation. (b) over voltage protection (ovp) circuit when the power supply voltage exceeds 45 v (nominal), the controller forces all driver outputs to high impedance . the ovp circuit is released and its operation ends when the voltage drops back to 40 v (nominal) or below . this protection circuit does not work in the stand - by mode. als o , note that this circuit is supplementary, and thus if it is asserted, the absolute maximum rating will have been exceeded. therefore, do not continue to use the ic after this circuit is activated, and do not operate the ic in an environment where activat ion of the circuit is assumed. vcc vref f i n rin out1 out2 0 15 / 24 tsz02201 - 0p2p0b300090 -1-2 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 downloaded from: http:///
bd623x xx series data s heet (c) thermal shutdown (tsd) circuit the tsd circuit operates when the junction temperature of the driver exceeds the preset temperature (175 c nominal). at this time, the controller forces all driver outputs to high impedance. since thermal hy steresis is provided in the tsd circuit, the chip returns to normal operation when the junction temperature f alls below the preset temperature (150c nominal). thus, it is a self -re setting circuit. the tsd circuit is designed only to shut t he ic off to prevent thermal runaway. it is not designed to protect the ic or guarantee its operation in the presence of extreme heat. do not continue to use the ic after the tsd circ uit is activated, and do not operate the ic in an environment where activation of the circuit is assumed. (d) over - current protection (ocp) circuit to protect this driver ic from ground fault s , power supply line fault s and load short circuit s , the ocp circuit monitors the output current for the circuit s monitoring time (10 s, nom inal) . when the protection circuit detects an over -current, the controller forces all driver outputs to high impedance during the off time (290 s, nominal). the ic returns to normal operation after the off time period has elapsed (self- retur n ing type). at the two channels type, this circuit works independently for each channel. fig ure 43 . over - current protection ( timing chart ) i/o equivalent circuits fig ure 44 . fin / rin fig ure 45 . vref fig ure 46 . out1 / out2 fig ure 4 7. ou t1 / out2 (sop8/hrp7) (hsop25/hsopm28) fin vcc rin 100k 100k vref vcc 10k out1 out2 vcc gnd vcc out1 out2 rnf gnd threshold iout ct rl input internal status mon itor / timer 0 off on mon. off timer on i out 16 / 24 tsz02201 - 0p2p0b300090 -1-2 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 downloaded from: http:///
bd623x xx series data s heet operational notes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polarity can damage the ic. take pr ecautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic s power supply pin s. 2. power s upply l ines design the pcb layout pattern to provide low impedance supply lines. s eparate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block . furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. g round w iring p attern when using both small - signal and large - current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluct uations in the small - signal ground caused by large currents. also ensure that the ground traces of external c omponents do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal c onsideration should by any chance the power dissipation rating be exceeded the rise in t emperature of the chip may result in deterioration of the properties of the chip. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended o perating c onditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the conditions of each parameter . 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inru sh curren t may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capaci tance, power wiring, width of ground wiring, and routing of conn ections. 8. operation u nder s trong e lectromagnetic f ield operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction . 9. testing on a pplication b oards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or st ep. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspect ion process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter - pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the p cb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedanc e and extremely l ow capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 17 / 24 tsz02201 - 0p2p0b300090 -1-2 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 downloaded from: http:///
bd623x xx series data s heet operational notes C continued 12. regarding the i nput p in of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements i n order to keep them isolated. p - n junctions are formed at the intersection of the p layers with the n l ayers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p - n junction operates as a parasitic diode. when gnd > pin b, the p - n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore , conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substr ate) should be avoided. fig ure 48. example of monolith ic ic structure 13. area of safe operation (aso) operate the ic such that the output voltage, output current, and power diss ipation are all within the area of safe operation (aso). 14. power supply lines 2 r eturn current generated by the motor s back -emf requires countermeasures , such as providing a return current path by inserting capacitors across the power supply and gnd (10 f, ceramic capacitor is recommended) . in this case, it is important to conclusively confirm that none of the negative effects sometimes se en with electrolytic capacitors C including a capacitance drop at low temperatures - occurs. also, the connected power supply must have sufficient current absorbing capability. otherwise, the regenerate d current will increase voltage on the power supply li ne, which may in turn cause problems with the product, including peripheral circuits ex ceeding the absolute maximum rating. to help protect against damage or degradation, physical safety measures should be t aken, such as providing a voltage clamping diode across the power supply and gnd. 15. capacitor between output and ground if a large capacitor is connected between the output pin and ground pin, current from the charged capacit or can flow into the output pin and may destroy the ic when the vcc or vin pin is shorted to ground or pulled down to 0v. use a capacitor smaller than 10f between output and ground. 16. switching noise when the operation mode is in pwm control or vref control, pwm switching noi se may affect the control input pins and cause ic malfunction s. in this case, insert a pull down resistor (10k? is recommended) between each control input pin and ground. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements 18 / 24 tsz02201 - 0p2p0b300090 -1-2 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 downloaded from: http:///
bd623x xx series data s heet marking diagrams part number package part number marking bd6230f sop8 6230 bd6231hfp hrp7 bd6231hfp bd6231f sop8 6231 bd6232hfp hrp7 bd6232hfp bd6232fp hsop25 bd6232fp bd6236fp hsop25 bd6236fp bd6236fm hsop - m28 bd6236fm bd6237fm hsop/m28 bd6237fm hrp 7 (top view) part number marking lot number 1pin mark sop8 (top view) part number marking lot number 1pin mark hsop25 (top view) part number marking lot number 1pin mark hsop - m28 (top view) part number marking lot numb er 1pin mark 19 / 24 tsz02201 - 0p2p0b300090 -1-2 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 downloaded from: http:///
bd623x xx series data s heet physical dimension, tape and reel information package name sop8 (unit : mm) pkg : sop8 drawing no. : ex11 2- 5001 -1 (max 5.35 (include.burr)) 20 / 24 tsz02201 - 0p2p0b300090 -1-2 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 downloaded from: http:///
bd623x xx series data s heet physical dimensi on, tape and reel information - continued package name hsop25 max 1 3.95 (include. burr) unit mm pkg hsop25 drawing: ex139-5001 21 / 24 tsz02201 - 0p2p0b300090 -1-2 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 downloaded from: http:///
bd623x xx series data s heet physical dimension, tape and reel information - continued package name hsop - m28 max 1 8.85 (include. burr) unit mm pkg hsop - m28 drawing: ex141-5001 22 / 24 tsz02201 - 0p2p0b300090 -1-2 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 downloaded from: http:///
bd623x xx series data s heet physical dimension, tape and reel information - continued package name hrp7 23 / 24 tsz02201 - 0p2p0b300090 -1-2 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 downloaded from: http:///
bd623x xx series data s heet revision history date revision changes 10.apr.2012 001 new release 25.dec.2012 002 improved the statement in all pages. deleted status of this document in page 18. 0 9.sep .2014 003 applied the rohm standard style. improved operational notes . 24 / 24 tsz02201 - 0p2p0b300090 -1-2 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 downloaded from: http:///
datasheet datasheet notice C ge rev.002 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet datasheet notice C ge rev.002 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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