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  42376-0114 Datasheet PDF File

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    11-40-4322 1140-4322 001140-4322 0011-40-4322

Molex Electronics Ltd.
Part No. 11-40-4322 1140-4322 001140-4322 0011-40-4322
Description Conductor Anvil

File Size 15.98K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0011-40-4324 001140-4324

Molex Electronics Ltd.
Part No. 0011-40-4324 001140-4324
Description Insulation Anvil

File Size 16.05K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    0011-40-2192 1140-2192 001140-2192

Molex Electronics Ltd.
Part No. 0011-40-2192 1140-2192 001140-2192
Description Terminator Die

File Size 19.91K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114828-10114LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 14 Positions
Tech specs    

Official Product Page

    001140-2193 0011-40-2193

Molex Electronics Ltd.
Part No. 001140-2193 0011-40-2193
Description Terminator Die

File Size 20.08K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114830-10114LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 14 Positions
Tech specs    

Official Product Page

    0011-40-4204 001140-4204

Molex Electronics Ltd.
Part No. 0011-40-4204 001140-4204
Description Conductor Anvil

File Size 15.98K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114508-D0J-20DLF
Description XCede® High Speed Backplane Connectors, Left polarizing guide module with key feature.
Tech specs    

Official Product Page

    0011-40-4209 001140-4209

Molex Electronics Ltd.
Part No. 0011-40-4209 001140-4209
Description Insulation Anvil

File Size 11.51K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114828-10102LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 2 Positions
Tech specs    

Official Product Page

    201148B

Integrated Technology Future
Part No. 201148B
Description SAW Bandpass Filter

File Size 174.81K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114868-L0J-10DLF
Description XCede® High Speed Backplane Connectors, 3 wall left header.
Tech specs    

Official Product Page

    LP80114

Polyfet RF Devices
Part No. LP80114
Description RF POWER LDMOS TRANSISTOR

File Size 50.59K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114508-00J-20DLF
Description XCede® High Speed Backplane Connectors, 2 wall header.
Tech specs    

Official Product Page

   
Part No. S6D0114
Description 132 RGB X 176 DOT 1-CHIP DRIVER IC WITH INTERNAL GRAM FOR 262,144 Colors TFT-LCD

File Size 1,951.23K  /  143 Page

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Amphenol Communications Solutions

Part No. 10114492-008LF
Description HPCE R/A REC 32P24S
Tech specs    

Official Product Page

    201146B

Integrated Technology Future
Part No. 201146B
Description SAW Bandpass Filter

File Size 174.83K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114868-10J-10DLF
Description XCede® High Speed Backplane Connectors, 4 wall header.
Tech specs    

Official Product Page

For 42376-0114 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

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