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  42376-0114 Datasheet PDF File

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    42376-0114

Molex Electronics Ltd.
Part No. 42376-0114
Description 2.54mm (.100) Pitch KK Header, Breakaway, Right Angle, 9 Circuits, Tin (Sn) Plating
File Size 301.60K  /  12 Page

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Amphenol Communications Solutions
Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    42376-0018

Molex Electronics Ltd.
Part No. 42376-0018
Description 2.54mm (.100") Pitch KK Header, Breakaway, Right Angle, 18 Circuits, Tin (Sn) Plating
File Size 301.83K  /  12 Page

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Amphenol Communications Solutions
Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs 　 　

Official Product Page

    42376-0012

Molex Electronics Ltd.
Part No. 42376-0012
Description 2.54mm (.100") Pitch KK Header, Breakaway, Right Angle, 12 Circuits, Tin (Sn) Plating
File Size 301.83K  /  12 Page

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Amphenol Communications Solutions
Part No. 10114828-10114LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 14 Positions
Tech specs 　 　

Official Product Page

    42376-0013

Molex Electronics Ltd.
Part No. 42376-0013
Description 2.54mm (.100") Pitch KK Header, Breakaway, Right Angle, 13 Circuits, Tin (Sn) Plating
File Size 301.83K  /  12 Page

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Amphenol Communications Solutions
Part No. 10114830-10114LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 14 Positions
Tech specs 　 　

Official Product Page

    42376-0053

Molex Electronics Ltd.
Part No. 42376-0053
Description 2.54mm (.100") Pitch KK垄莽 Header, Breakaway, Right Angle, 18 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Plating, Mating Pin Length 9.17mm (.361")
File Size 301.86K  /  12 Page

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Amphenol Communications Solutions
Part No. 10114868-T0J-20DLF
Description XCede® High Speed Backplane Connectors, Right polarized guide header module with key.
Tech specs 　 　

Official Product Page

    42376-0051

Molex Electronics Ltd.
Part No. 42376-0051
Description 2.54mm (.100") Pitch KK垄莽 Header, Breakaway, Right Angle, 16 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Plating, Mating Pin Length 9.17mm (.361")
File Size 301.86K  /  12 Page

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Amphenol Communications Solutions
Part No. 77315-401-14LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 14 Positions 2.54 mm (0.100in) Pitch, Right Angle
Tech specs 　 　

Official Product Page

    42376-0049

Molex Electronics Ltd.
Part No. 42376-0049
Description 2.54mm (.100") Pitch KK Header, Breakaway, Right Angle, 14 Circuits
File Size 301.86K  /  12 Page

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Amphenol Communications Solutions
Part No. 10114868-00J-20DLF
Description XCede® High Speed Backplane Connectors, 2 wall header.
Tech specs 　 　

Official Product Page

    42376-0047

Molex Electronics Ltd.
Part No. 42376-0047
Description 2.54mm (.100") Pitch KK Header, Breakaway, Right Angle, 12 Circuits
File Size 301.86K  /  12 Page

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Amphenol Communications Solutions
Part No. 10114868-10J-20DLF
Description XCede® High Speed Backplane Connectors, 4 wall header.
Tech specs 　 　

Official Product Page

    42376-0016

Molex Electronics Ltd.
Part No. 42376-0016
Description 2.54mm (.100") Pitch KK Header, Breakaway, Right Angle, 16 Circuits, Tin (Sn) Plating
File Size 301.83K  /  12 Page

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Amphenol Communications Solutions
Part No. 10072354-F01-14ULF
Description Minitek®, Wire to Board Connectors, Shrouded Header - Through Mount Pin-in-Paste - Double row - 14 Positions - 2mm (0.079inch) - Right Angle
Tech specs 　 　

Official Product Page

    42376-0046

Molex Electronics Ltd.
Part No. 42376-0046
Description 2.54mm (.100") Pitch KK Header, Breakaway, Right Angle, 11 Circuits
File Size 301.86K  /  12 Page

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Amphenol Communications Solutions
Part No. 10114826-00011LF
Description 1.25mm Wire to Board Housing, 11 Positions
Tech specs 　 　

Official Product Page

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