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  71764-0114 Datasheet PDF File

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    SICK AG
Part No. 6050114
Description INDUCTIVE PROXIMITY SENSORS

File Size 1,282.25K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    201143B

Integrated Technology Future
Part No. 201143B
Description SAW Bandpass Filter

File Size 175.12K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    201146B

Integrated Technology Future
Part No. 201146B
Description SAW Bandpass Filter

File Size 174.83K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114828-10114LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 14 Positions
Tech specs    

Official Product Page

    201142C

Integrated Technology Future
Part No. 201142C
Description SAW Bandpass Filter

File Size 176.19K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114830-10114LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 14 Positions
Tech specs    

Official Product Page

    HOKURIKU ELECTRIC INDUSTRY CO.,LTD
Part No. E011400
Description Flat Chip Resistors

File Size 80.02K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114508-D0J-20DLF
Description XCede® High Speed Backplane Connectors, Left polarizing guide module with key feature.
Tech specs    

Official Product Page

    TV0114B

TAI-SAW TECHNOLOGY CO., LTD.
Part No. TV0114B
Description SMD 8.2x6.0 Baby Monitor VCO

File Size 160.35K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114828-10102LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 2 Positions
Tech specs    

Official Product Page

    HOKURIKU ELECTRIC INDUSTRY CO.,LTD
Part No. E011409
Description Surge Current Chip Resistor

File Size 222.33K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114868-L0J-10DLF
Description XCede® High Speed Backplane Connectors, 3 wall left header.
Tech specs    

Official Product Page

    HOKURIKU ELECTRIC INDUSTRY CO.,LTD
Part No. E011420
Description Recommended Pad Dimension

File Size 111.14K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114508-00J-20DLF
Description XCede® High Speed Backplane Connectors, 2 wall header.
Tech specs    

Official Product Page

   
Part No. S6D0114
Description 132 RGB X 176 DOT 1-CHIP DRIVER IC WITH INTERNAL GRAM FOR 262,144 Colors TFT-LCD

File Size 1,951.23K  /  143 Page

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Amphenol Communications Solutions

Part No. 10114492-008LF
Description HPCE R/A REC 32P24S
Tech specs    

Official Product Page

    HOKURIKU ELECTRIC INDUSTRY CO.,LTD
Part No. E011401
Description Flat Type Low Resistance Chip Resistor

File Size 164.62K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114868-10J-10DLF
Description XCede® High Speed Backplane Connectors, 4 wall header.
Tech specs    

Official Product Page

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